TUYA TYLC8 User manual

TYLC8
Device Development > Module > Wi-Fi Module
Version: 20200624
Online Version

Contents
Contents
1 Product Overview 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Main Application Areas . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Change History 3
3 Module Interfaces 4
3.1 Dimensions and Footprint . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Interface Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Definition of the Test Points . . . . . . . . . . . . . . . . . . . . . . . 6
4 Electrical Parameters 8
4.1 Absolute Electrical Parameters . . . . . . . . . . . . . . . . . . . . . 8
4.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Power Consumption of Wi-Fi Transmission . . . . . . . . . . . . . . . . 9
4.4 Working Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 RF Features 11
5.1 Basic RF Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 TX Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 RX Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Information of Antennas 14
6.1 Type of Antennas . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2 Reducing Antenna Interference . . . . . . . . . . . . . . . . . . . . . 14
6.3 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.4 Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . . . 16
6.5 Production Instructions . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.6 Recommended Oven Temperature Curve . . . . . . . . . . . . . . . . 17
6.7 Storage Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7 Statement 21
i

1 PRODUCT OVERVIEW
1 Product Overview
TYLC8 is a low-power embedded Wi-Fi module developed by Hangzhou Tuya In-
formation Technology Co., Ltd. It consists of a highly integrated wireless radio fre-
quency chip, ESP8285, and a few peripheral devices. It also has a built-in Wi-Fi
network protocol stack and abundant library functions. TYLC8 embeds a low-power
32-bit CPU, 1Mbyte of flash memory, 50KB of SRAM and a wealth of peripheral re-
sources.
As an RTOS platform, TYLC8 integrates all the function libraries of the Wi-Fi MAC and
the TCP/IP protocol. Based on these function libraries, users can develop different
embedded Wi-Fi products to meet their own needs.
1.1 Features
• The built-in low-power 32-bit CPU doubles as an application processor.
–The basic frequency of the CPU supports 80MHz and 160MHz.
• Working voltage: 3.0V-3.6V
• Peripheral：3×GPIOs
• Wi-Fi connectivity
–802.11 b/g/n
–Channel：[email protected]
–Supporting the security mode of WPA/WPA2
–Under the mode of 802.11b, the maximum output power: +20dBm
–Supporting the operating mode of STA/AP/STA+AP
–Supporting both Smart Config and AP network distribution methods (in-
cluding Android and IOS devices)
–Soldering internal Ceramic antenna, gain 2.5dBi
–Operating temperature: -20 ℃ to 105 ℃
1.2 Main Application Areas
• Intelligent building
• Smart home/ home appliances
• Smart socket, smart LED
• Industrial wireless control
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1 PRODUCT OVERVIEW
• Baby monitor
• Webcam
• Smart bus
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2 CHANGE HISTORY
2 Change History
No. Date
Change
Description
Version After
Change
1 2019-7-22 This is the first
release.
2.0.0
2 2019-10-12 Update dimension 2.0.1
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3 MODULE INTERFACES
3 Module Interfaces
3.1 Dimensions and Footprint
TYLC8 has 2 rows of pins with the pin pitch being 2mm. The TYLC8 dimensions (W x
Lx H) are 16.5±0.35 mm x 11±0.35 mm x 1±0.15 mm. The PCB thickness is 1±0.1
mm.
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3 MODULE INTERFACES
3.2 Interface Pin Denition
Pin No. Symbol I/O Type Function
1 GPIO14 I/O Use as GPIO,
which is
connected to
MTMS (pin 9) on
the internal
2 VCC P Power input pin
3.3 V
3 GPIO12 I/O Use as GPIO,
which is
connected to
MTDI (pin10) on
the internal
4 GND P Power supply
reference ground
pin
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3 MODULE INTERFACES
Pin No. Symbol I/O Type Function
5 GPIO13 I/O Use as GPIO,
which is
connected to
MTCK (pin12) on
the internal
Note:
• “P” represents the power pin,
• “I/O” represents the input and output pin.
3.3 Denition of the Test Points
Pin No. Symbol IO Type Function
- TP1 I/O GPIO2, use to
check log
- TP 2 I/O GPIO0;Testing the
module
production.
- TP3 RST Hardware reset
pin; Cannot clear
the distribution
network
information of
Wi-Fi.
- TP4 U0TXD User serial port;
Information
output from the
serial port can be
used for testing
the module
production.
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3 MODULE INTERFACES
Pin No. Symbol IO Type Function
- TP5 U0RXD User serial port;
Information
output from the
serial port can be
used for testing
the module
production.
Note:
• Test points are not recommend to use
• RST just for reset，cannot clear the distribution network information of Wi-Fi
• U0TXD as user Serial port will print information when the module power on，
users can ignore
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4 ELECTRICAL PARAMETERS
4 Electrical Parameters
4.1 Absolute Electrical Parameters
Parameter Description Min Max Unit
Ts Storage
temperature
-40 125 ℃
VCC Supply
voltage
-0.3 3.6 V
Electrostatic
discharge
voltage
（Human body
model）
TAMB-25℃ - 2 KV
Electrostatic
discharge
voltage
（Machine
model）
TAMB-25℃ - 0.5 KV
4.2 Operating Conditions
Parameter Description Min Typical Max Unit
Ta Operating
tempera-
ture
-20 - 105 ℃
VCC Operating
voltage
3.0 3.3 3.6 V
VIL IO low-level
input
-0.3 - VCC*0.25 V
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4 ELECTRICAL PARAMETERS
Parameter Description Min Typical Max Unit
VIH IO
high-level
input
VCC*0.75 - VCC V
VOL IO low-level
input
- - VCC*0.1 V
VoH IO
high-level
input
VCC*0.8 - VCC V
Imax IO drive
current
- - 12 mA
4.3 Power Consumption of Wi-Fi Transmission
Symbol Parameter Typical Unit
Mode Rate Transmit
power
Tx 11b 11Mbps +17dBm 220 mA
Tx 11g 54Mbps +15dBm 110 mA
Tx 11n MCS0 +14dBm 120 mA
Tx 11n MCS7 +13dBm 100 mA
RX 802.11b 11 Mbit/s Constant
receiving
76 mA
RX 802.11g 54 Mbit/s Constant
receiving
76 mA
RX 802.11n MCS7 Constant
receiving
76 mA
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4 ELECTRICAL PARAMETERS
4.4 Working Current
Working
Mode
Working
State,Ta=25℃ Average Max Unit
Easy mode Wi-Fi indicator
flashes
quickly.
80 151 mA
Hotspot mode Wi-Fi indicator
flashes
slowly.
90 451 mA
Network
connection
Wi-Fi indicator
is always on.
58.5 411 mA
Network
disconnection
Wi-Fi indicator
is always off.
80 430 mA
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5 RF FEATURES
5 RF Features
5.1 Basic RF Features
Parameter Description
Working frequency 2.412~2.484GHz
Wi-Fi standard IEEE 802.11b/g/n(Channel 1-14)
Rate of data transmission 11b:1,2,5.5, 11 (Mbps)
11g:6,9,12,18,24,36,48,54(Mbps)
11n:HT20 MCS0~7
Type of antenna Internal antenna soldered
5.2 TX Performance
Parameter Min Typical Max Unit
Average
output
power of
RF，
802.11b
CCK Mode
11M - 17 - dBm
Average
output
power of
RF,802.11g
OFDM
Mode
54M - 14 - dBm
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5 RF FEATURES
Parameter Min Typical Max Unit
Average
output
power of
RF,802.11n
OFDM
Mode
MCS7 - 12 - dBm
Frequency
error
- -10 - 10 ppm
EVM under
802.11b
CCK, 11
Mbit/s,
17.5 dBm
–15 dB
EVM under
802.11g
OFDM, 54
Mbit/s,
15.0 dBm
–29 dB
EVM under
802.11n
OFDM,
MCS7, 14.0
dBm
–30 dB
5.3 RX Performance
Parameter Min Typical Max Unit
PER<8%，
RX
Sensitivity，
802.11b
CCK Mode
1M - -91 - dBm
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5 RF FEATURES
Parameter Min Typical Max Unit
PER<10%，
RX
Sensitivity，
802.11g
OFDM
Mode
54M - -75 - dBm
PER<10%，
RX
Sensitivity，
802.11n
OFDM
Mode
MCS7 - -72 - dBm
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6 INFORMATION OF ANTENNAS
6 Information of Antennas
6.1 Type of Antennas
They are internal antennas soldered to the ANT pad of the module.
6.2 Reducing Antenna Interference
When an external antenna is soldered to the Wi-Fi module, to optimize the Wi-Fi
performance, it is recommended that the distance between the antenna part and
the other metal parts be at least 10 mm.
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6 INFORMATION OF ANTENNAS
6.3 Mechanical Dimensions
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6 INFORMATION OF ANTENNAS
6.4 Recommended PCB Layout
6.5 Production Instructions
1. Preferentially use the wave soldering machine to solder the module, which
is recommended for Tuya-developed modules that are vertically inserted into
PCBs. Use hand soldering only when there is no operational wave soldering
machine. Complete soldering within 24 hours after the module is unpacked. If
not, vacuum pack the module again.
2. Required materials for soldering:
• Wave soldering machine
• Wave soldering fixture
• Constant-temperature iron
• Wave solder bar, wire, and flux
• Oven temperature tester
Baking equipment
• Cabinet oven
• Anti-static heat-resistant trays
• Anti-static heat-resistant gloves
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6 INFORMATION OF ANTENNAS
3. Bake the module if any of the following conditions is met:
• The vacuum package is damaged before the module is unpacked.
• The package does not contain a humidity indicator card (HIC).
• After the module is unpacked, the HIC shows that the 30% and higher rate
circles are pink.
• Production is not completed within 72 hours after the module is unpacked.
4. Baking settings:
• Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack
mode
• Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
• Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
• Production ready temperature after natural cooling: < 36°C
• Number of baking times: 1
• Rebaking condition: Production is not completed within 72 hours after bak-
ing.
5. Do not wave solder modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads
are exposed to the air for over three months, they will be oxidized severely and
dry joints or solder skips may occur. Tuya is not liable for such problems and
consequences.
6. Throughout the production process, take electrostatic discharge (ESD) protec-
tive measures.
7. For a good product quality, ensure that the following items meet requirements:
• Flux amount
• Wave height
• Amount of tin dross and copper in the solder pot
• Wave soldering fixture window and thickness
• Oven temperature curve for wave soldering
6.6 Recommended Oven Temperature Curve
Set the oven temperature to a value recommended for wave soldering. The peak
temperature is 260±5°C.
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6 INFORMATION OF ANTENNAS
Soldering temperature recommendations：
Suggestion of
wave soldering
furnace
temperature
curve -
Hand soldering
temperature
recommendations -
Pre-heat
temperature
80-130℃ Soldering
temperature
360℃±20℃
Pre-heat time 75-100S Soldering time <3S/point
Wave contact
time
3-5S NA NA
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