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Contents
1INTRODUCTION............................................ 1
1.1 OVERVIEW........................................................................................................................................ 1
1.2 KEY FEATURES................................................................................................................................. 2
1.3 INTERFACE....................................................................................................................................... 3
2PRODUCT INSTALLATION ................................... 4
2.1 INSTALLATION PREPARATION ........................................................................................................... 4
2.2 HARDWARE INSTALLATION ............................................................................................................... 5
3TECHNICAL SPECIFICATIONS ............................... 6
3.1 ELECTRICAL SPECIFICATIONS ........................................................................................................... 6
3.2 OPERATION CONDITION.................................................................................................................... 6
3.3 DIMENSIONS.................................................................................................................................... 6
3.4 PIN DEFINITION(TOP VIEW)........................................................................................................ 7
3.5 PCB PACKAGING ............................................................................................................................. 8
4HARDWARE DESIGN ........................................ 9
4.1 DESIGN IN CONSIDERATIONS ............................................................................................................ 9
4.2 AVOID POWER CONNECTION........................................................................................................... 10
4.3 ANTENNA....................................................................................................................................... 10
4.4 SERIAL PORT ................................................................................................................................. 11
5DISASSEMBLY............................................ 12
6PACKAGE ................................................ 12
6.1 PRODUCT LABEL DESCRIPTION....................................................................................................... 12
6.2 PACKAGE DESCRIPTION.................................................................................................................. 12
7CLEAN................................................... 14
8REFLOW SOLDERING ...................................... 14