Vincotech flow2 User manual

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
1 of 25
02
Soldering option for Press-fit
17.02.2014
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T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
Handling Instruction
for flow 2 packages
It is valid for all type of flow2 modules:
12/13 mm & 17 mm housing, solder & Press fit pins

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
2 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
Table of Contents
1General instructions ............................................................................................................................................. 4
2Specification for PCBs ........................................................................................................................................... 4
2.1 Specification for modules with Press-fit pins ..........................................................................................................4
2.2 Specification for modules with solder pins .............................................................................................................5
2.3 Specification for modules with Press-fit pins that are going to be soldered...........................................................5
2.4 PCB cutouts for insulating ribs, screwing holes.......................................................................................................6
2.4.1 For 17 mm type module (Press-fit and solder pins).......................................................................................6
2.4.2 For 12/13 mm type module (Press-fit and solder pins) .................................................................................6
2.4.2.1 OPTION 1: Mounted on module with distance of 13 mm ....................................................................6
2.4.2.2 OPTION 2: Mounted on module with distance of 12 mm ....................................................................7
2.5 Recommended PCB-thicknesses and mounting heights for module types.............................................................8
2.5.1 For 17 mm type module ................................................................................................................................8
2.5.1.1 Option 1: Without spacers ...................................................................................................................8
2.5.1.2 Option 2: With spacers .........................................................................................................................8
2.5.2 For 12/13 mm type module ...........................................................................................................................9
2.5.2.1 Mounting with distance of 13 mm .......................................................................................................9
2.5.2.2 Mounting with distance of 12 mm .....................................................................................................10
3Specification for base plate ................................................................................................................................ 11
4Specification for heat sinks................................................................................................................................. 13
5Specification for thermal interface materials ..................................................................................................... 13
5.1 OPTION 1: thermal paste.......................................................................................................................................13
5.2 OPTION 2: Pre applied thermal interface material ...............................................................................................13
6Specification for fastening screws to the heat sink ............................................................................................. 13
7Press in process (Press-fit pin modules only) ...................................................................................................... 14
7.1 Press in tool ...........................................................................................................................................................14
7.1.1 Supporting tool ............................................................................................................................................15
7.1.2 Press in top tool in case of module without thermal interface material. ....................................................16
7.1.3 Press-in top tool in case of module with thermal interface material ..........................................................17
7.2 Press in process parameters..................................................................................................................................18
7.2.1 The basic requirement for the press in process: .........................................................................................18
7.3 Process control parameters ..................................................................................................................................18
8Press-out process for modules with Press-fit pins .............................................................................................. 20
8.1 Press-out tool ........................................................................................................................................................20
8.2 Press-out process characteristics ..........................................................................................................................22
8.2.1 Press-out process parameters .....................................................................................................................23
8.3 Disassembling by hand ..........................................................................................................................................23
9Recommendation for soldering .......................................................................................................................... 24
9.1 Wave soldering of modules with solder pins ........................................................................................................24
9.2 Hand soldering parameters ...................................................................................................................................25
10 ESD protection.................................................................................................................................................... 25
11 Environmental conditions................................................................................................................................... 25
12 Disclaimer .......................................................................................................................................................... 25

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
3 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
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New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
Table of Figures
Figure 1: Module with PCB and heat sink ............................................................................................................4
Figure 2: Solder pin diameter ...............................................................................................................................5
Figure 3: PCB’s Cutout for 17 mm type modules .................................................................................................6
Figure 4: PCB’s cutout for 12/13 mm type module when the PCB distance is 13 mm ........................................6
Figure 5: PCB’s cutout for 12/13 mm type module when the PCB distance is 12 mm ........................................7
Figure 6: Scratch dimensions.............................................................................................................................11
Figure 7: Polished base plate.............................................................................................................................12
Figure 8: Discoloration of base plate..................................................................................................................12
Figure 9: Fingerprint on the base plate...............................................................................................................12
Figure 10: Recommended tooling for the press in process................................................................................14
Figure 11: Recommended hole and cutout dimensions for bottom part of press-in tool....................................15
Figure 12: Press in tool Top part........................................................................................................................16
Figure 13: Press in tool Top part with recommended face for thermal grease covered base plate...................17
Figure 14: Press-in depth in PCB.......................................................................................................................18
Figure 15: Typical press-in diagram of a module with 20 pins...........................................................................19
Figure 16: Exploded view of the Press-out tool..................................................................................................20
Figure 17: Working position of the press-out tool...............................................................................................21
Figure 18: Recommended dimensions of the upper tool....................................................................................21
Figure 19: Recommended dimensions of the lower tool....................................................................................22
Figure 20: Force-path curve of the press-out process .......................................................................................23
Figure 21: Cutting edge......................................................................................................................................23
Figure 22: Platedthrough hole, good soldering ..................................................................................................24
Figure 23: Typical profile for wave soldering......................................................................................................24

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
4 of 25
02
Soldering option for Press-fit
17.02.2014
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29.10.2013
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Ver
Alteration
Date
Des. / Mod.
Appr.
1 General instructions
The flow2 type modules have to be mounted to a PCB. The electrical connections between
module and PCB can be made by soldering or by Press-fit technology. The module has to
be fixed to a heat sink. It is required to fix the PCB to the heat sink by threaded spacer or by
the module itself with its towers (see details in Section 2.5).
Figure 1: Module with PCB and heat sink
During assembly the pins are not to be drawn or pushed more than ±0.2 mm or loaded with
a force bigger than 35 N (except during pressing-in of Press-fit pins). The special design of
the Press-fit pins prevents higher than 0.1 mm deformation of pins during pressing-in
process.
The tension of the pin must not exceed ±5 N at a maximum substrate temperature of 100 C.
2 Specification for PCBs
Printed board material meets the requirements of IEC 61249-2-7.
The maximum number of conductive layers is not limited.
2.1 Specification for modules with Press-fit pins
The module can be screwed to the PCB after the press in with 4 screws of type
BN82428 (D=2.5 mm and L=6 mm). Mounting torque: 0.4 Nm
Printed board thickness must not be less than 1.6 mm (thinner PCB has to be tested
on request).
PCB should be covered with solder mask on both sides.
Plated Through-Hole specification for Press-fit pin:
oHole dimension prior to plating: 1.6 +/-0.025 mm
oThickness of the PTH wall > 25 μm Cu
oPlated hole final dimension: 1.45 +0.09/-0.06 mm
oMinimum Cu width of the annular ring > 0.1 mm
oPosition tolerance 0.05 mm
Plating material:
oSn > 0.5 μm
PCB
Module
Module backside
Heatsink

Flow2 packages
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Handling Instruction
Flow2-P-*-HI
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Soldering option for Press-fit
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The PCB can be disassembled and reused 2 more times.
oAu 0.05 - 0.2 μm over 2.5 –5 μm Ni
The PCB can be used only once!
(Other plating has to be tested on request.)
Minimum distance between the edge of the PCB and the centre of the pin hole: 4 mm
Minimum distance between the centre of the pin hole and the component on the
PCB: 4 mm
2.2 Specification for modules with solder pins
The module must be screwed to the PCB with 4 screws (type BN82428, D=2.5 mm
and L=6 mm) before soldering the pins into the PCB. Mounting torque: 0.4 Nm.
After screwing all pins must be soldered into the PCB. The hole diameters on the
PCB has to be designed according to the soldering pin diameter which is 1±0.05
mm. For further dimensions or 3D model please contact your local sales manager.
Figure 2: Solder pin diameter
2.3 Specification for modules with Press-fit pins that are going to be
soldered
In case the Press-fit pin is soldered instead of pressing in the recommended PCB hole
diameter is 1.85 ±0.1mm. It has to be taken into consideration that the annular ring has to
be designed according to the standards for through hole components if soldering of Press-fit
modules is expected.

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
6 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
2.4 PCB cutouts for insulating ribs, screwing holes
2.4.1 For 17 mm type module (Press-fit and solder pins)
Figure 3: PCB’s Cutout for 17 mm type modules
2.4.2 For 12/13 mm type module (Press-fit and solder pins)
2.4.2.1 OPTION 1: Mounted on module with distance of 13 mm
Figure 4: PCB’s cutout for 12/13 mm type module when the PCB distance is 13 mm

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
7 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
2.4.2.2 OPTION 2: Mounted on module with distance of 12 mm
washer DIN125A M2.5 should be used together with screw BN82428
Figure 5: PCB’s cutout for 12/13 mm type module when the PCB distance is 12 mm

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
8 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
2.5 Recommended PCB-thicknesses and mounting heights for module
types
The distance between the top surface of the heat sink and the bottom plane of the PCB is
defined by the module size: 17 mm or 12/13 mm. For fixing the PCB spacers can be used
(press-fit pin modules only). The number and the position of the fixing points depend on the
design of the circuit, location of different masses like capacitors or inductors and the
environment of the system. General recommendation can not be given. The recommended
heights of these spacers are given on the following sections.
2.5.1 For 17 mm type module
2.5.1.1 Option 1: Without spacers
for Press-fit and solder pin modules
2.5.1.2 Option 2: With spacers
for Press-fit pin modules only
Mounting height
with the module as
spacer
PCB thickness (minimum
thickness applies to
press-fit pin modules
only)
Mounting height with
spacer in case of
using recommended
press-in tool (see
Section 7.1)
PCB thickness

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
9 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
2.5.2 For 12/13 mm type module
2.5.2.1 Mounting with distance of 13 mm
2.5.2.1.1 Option 1 :Without spacers
for Press-fit and solder pin modules
2.5.2.1.2 Option 2: With spacers
for Press-fit pin modules only
Mounting height
with the module as
spacer
Mounting height with
spacer in case of
using recommended
press-in tool (see
Section 7.1)
PCB thickness
PCB thickness (minimum
thickness applies to
press-fit pin modules
only)

Flow2 packages
copyright Vincotech
Handling Instruction
Flow2-P-*-HI
Page
10 of 25
02
Soldering option for Press-fit
17.02.2014
Őri A
Bauer Gy
01
New document
29.10.2013
Zs.Gyimóthy
T. Gyetvai
Ver
Alteration
Date
Des. / Mod.
Appr.
2.5.2.2 Mounting with distance of 12 mm
2.5.2.2.1 Option 1: Without spacers
for Press-fit and solder pin modules
Option 2: With spacers
for Press-fit pin modules only
Mounting height
with the module as
spacer
Mounting height with
spacer in case of
using recommended
press-in tool (see
Section 7.1)
PCB thickness
PCB thickness (minimum
thickness applies to
press-fit pin modules
only)