Vishay TSSP57P38 User manual

TSSP57P38
www.vishay.com Vishay Semiconductors
Rev. 2.2, 30-Mar-2021 1Document Number: 82480
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IR Detector for Mid Range Proximity Sensor
LINKS TO ADDITIONAL RESOURCES
DESCRIPTION
The TSSP57P38 is a compact infrared detector module for
proximity sensing application. It receives 38 kHz modulated
signals and has a peak sensitivity of 940 nm.
The length of the detector’s output pulse varies in proportion
to the amount of light reflected from the object being
detected.
FEATURES
• Height of 0.8 mm
• Up to 2 m for proximity sensing
• Receives 38 kHz modulated signal
• Photo detector and preamplifier in one package
• Low supply current
• Shielding against EMI
• Visible light is suppressed by IR filter
• Insensitive to supply voltage ripple and noise
• Supply voltage: 2.5 V to 5.5 V
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING CODE
Taping:
TSSP57P38TT1 - top view taped, 1800 pcs/reel
APPLICATIONS
• Object approach detection for activation of displays and
user consoles, signaling of alarms, etc.
• Simple gesture controls
• Differentiation of car arrival, static, car departure in
parking lots
• Reflective sensors for toilet flush
• Navigational sensor for robotics
BLOCK DIAGRAM PROXIMITY SENSING
22531-1
Product Page
3
3
3
D
D
D
3
D
3D Models
Calculators
Marking
33 kΩ
2, 3, 6,
7, 8
4, 5
1
VS
OUT
Demo-
GND
pass
AGCInput
PIN
Band
dulator
Control circuit
16833_20
+3 V
IR emitter
+3 V
38 kHz
Out to
μC
TSSP57P38
Envelope
signal

TSSP57P38
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Rev. 2.2, 30-Mar-2021 2Document Number: 82480
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Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
PARTS TABLE
Carrier
frequency 38 kHz TSSP57P38
Package Belobog
Pinning 1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm) 3.95 W x 3.95 H x 0.8 D
Mounting SMD
Application Proximity sensors
Special options • Extended temperature range: www.vishay.com/doc?82738
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +6 V
Supply current IS5mA
Output voltage VO-0.3 to (VS+ 0.3) V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb ≤85 °C Ptot 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS2.5 - 5.5 V
Supply current VS= 5 V, Ee= 0 ISD 0.55 0.7 0.9 mA
Ev= 40 klx, sunlight ISH -0.8-mA
Receiving distance
Direct line of sight,
IR diode TSAL6200,
IF= 50 mA, test signal see Fig. 1
d-18-m
Output voltage low IOSL = 0.5 mA, Ee= 0.7 mW/m2,
test signal see Fig. 1 VOSL - - 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo< tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min. -0.20.4mW/m
2
Maximum irradiance tpi - 5/fo< tpo < tpi + 6/fo,
test signal see Fig. 1 Ee max. 50 - - W/m2
Directivity Angle of
half receiving distance ϕ1/2 -±75- deg

TSSP57P38
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Rev. 2.2, 30-Mar-2021 3Document Number: 82480
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 3 - Frequency Dependance of Responsivity
Fig. 4 - Sensitivity in Bright Ambient
Fig. 5 - Sensitivity vs. Supply Voltage Disturbances
Fig. 6 - Output Pulse Width vs. Irradiance
E
e
T
t
* tpi 10/f0is recommended for optimal function
VO
VOH
VOL t
16110_4
Optical Test Signal
(IR diode TSAL6200, IF= 0.4 A, 30 pulses, f = f0, t = 10 ms)
Output Signal
td
1)
t
po 2)
1)
7/f0<td<15/f0
2)
tpi - 5/f0<tpo < tpi + 6/f0
tpi *
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1 1 10 10
2
10
3
10
4
E
e
- Irradiance (mW/m
2
)
t
po
- Output Pulse Width (ms)
Input Burst Length
Output Pulse Width
λ= 950 nm,
Optical Test Signal, Fig.1
0
0.1
0.0
0.2
0.4
0.6
0.8
0.9
1.0
25 30 45 50
f/f
0
- Relative Frequency
E /E - Rel. Responsivity
e min. e
4035
0.1
0.3
0.5
0.7
f = f0± 5 %
Δf (3 dB) = f0/10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01 0.1 1 10 100
Ee- Ambient DC Irradiance (W/m2)
Ee min. - Threshold Irradiance (mW/m2)
Correlation with Ambient Light Sources:
10 W/m2= 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2= 8.2 kLx (Daylight, T = 5900 K)
Wavelength of Ambient
Illumination:
λ
= 950 nm
4.5
5.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1 10 100 1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
Ee min. - Threshold Irradiance (mW/m2)
f = f
0
f = 20 kHz
f = 30 kHz
f = 100 Hz
f = 10 kHz
22088
0
20
40
60
80
100
120
140
160
180
200
0.1 1 10 100
t
po
- Output Pulse Width (ms)
E
e
- Irradiance (mW/m
2
)
Burst length = 300 ms, f = fO

TSSP57P38
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Rev. 2.2, 30-Mar-2021 4Document Number: 82480
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Fig. 7 - Sensitivity vs. Ambient Temperature
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
Fig. 9 - Max. Rate of Bursts
Fig. 10 - Angle Characteristic
Fig. 11 - tpo vs. Distance
Fig. 12 - Dynamic Range of Sensor vs. tpi
Tamb - Ambient Temperature (°C)
Ee min. - Sensitivity (mW/m2)
0
0.05
0.10
0.15
0.20
0.40
-30 -10 10 30 50 70 90
0.30
0.25
0.35
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 800 850 900 950 1000 1050 1150
λ- Wavelength (nm)
S(λ)rel - Relative Spectral Sensitivity
1100
0
100
200
300
400
500
800
0 40 80 120 18020 60 100 140
tpi (ms)
trepeat min. (ms)
600
700
160
0
0.2
0.4
0.6
0.8
1.0
1.2
-90 90
Angle (°)
70503010-10-30-50-70
Relative Response Distance
Directivity Characteristic of a
Reective Sensor using
VSMB1940X01 and TSSP57P38
Response Distance (m)
tpo (ms)
0
20
40
60
80
100
120
0.0 0.2 0.4 0.6 0.8 1.0 1.2
IF= 100 mA
IF= 50 mAIF= 30 mA
IF= 10 mA
Emitter: VSMB1940X01
t
pi
(ms)
dmax./dmin.
0
1
2
3
4
5
6
7
10 20 30 40 110 1201009080706050

TSSP57P38
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Rev. 2.2, 30-Mar-2021 5Document Number: 82480
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The typical application of the TSSP57P38 is a reflective sensor with analog information contained in its output. Such a sensor
is evaluating the time required by the AGC to suppress a quasi continuous signal. The time required to suppress such a signal
is longer when the signal is strong than when the signal is weak, resulting in a pulse length corresponding to the distance of an
object from the sensor. This kind of analog information can be evaluated by a microcontroller. The absolute amount of reflected
light depends much on the environment and is not evaluated. Only sudden changes of the amount of reflected light, and
therefore changes in the pulse width, are evaluated using this application.
Example of a signal pattern:
Example for a sensor hardware:
There should be no common window in front of the emitter and receiver in order to avoid crosstalk by guided light through the
window.
The logarithmic characteristic of the AGC in the TSSP57P38 results in an almost linear relationship between distance and pulse
width. Ambient light has also some impact to the pulse width of this kind of sensor, making the pulse shorter.
Optical signal
Response of the
TSSP57P38
(strong reflection)
trepeat = 500 ms
tpi = 120 ms, 38 kHz
Response of the
TSSP57P38
(weak reflection)
Emitter
TSAL6200
IR Receiver
TSSP57P38
Separation to avoid
crosstalk by stray light inside
the housing

TSSP57P38
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Rev. 2.2, 30-Mar-2021 6Document Number: 82480
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PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
Notes
(1) Optically effective area
(2) Pins connected internally. It is not necessary to connect externally
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specifications
Proposed pad layout from
component side
(dim. for reference only)
(3.95)
(3.95)
(0.35)
(0.8)
(2.75)
(3)
(4 x)
(4x)
0.55
(0.95)
0.55
(1.8)
0.75± 0.05
4 x 0.75 = 3
0.35± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
0.475
(0.4)
0.8
0.15
Pinning from topview
GND
GND
Out
Vs
(Vs) (GND)
(GND) (GND)
1 2 3 4 5
8 7 6
Pin 1 identification
(2)
(2) (2) (2)
3.95
3.95
(2.75)
(1.9)
(3.4)
marking area
Pin 1 Identification
(1)
(1)
(1)

TSSP57P38
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Rev. 2.2, 30-Mar-2021 7Document Number: 82480
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
TAPING VERSION TSSP57P38 DIMENSIONS in millimeters
max. 120 s max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0 300
Axis Title
2nd line
Temperature (°C)
Time (s)
25020015010050
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
Tape and reel dimensions:
Partsmounted
Empty trailer 200 mm min.
Empty leader 400 mm min.
Direction of pulling out
Unreel direction
Ø 60 min.
Ø Y
2 ± 0.5
Label posted here
coming out from reel
Tape position
(12.4)
18.4 max.
Ø 13 ± 0.2
Ø 21 ± 0.8
100 mm min. with cover tape
X 2:1
(2)
(1.75)
(5.5)
12 ± 0.3
(8) (4)
(Ø 1.5)
(0.3)
(1.2)
Technical drawings
according to DIN
specications
Not indicated tolerances± 0.1Drawing-No.: 9.700-5347.01-4
Issue: 2; 07.03.18
Reel size “Y”
TT1 Ø 180 ± 2 = 1800 pcs.
Leader and trailer tape:

TSSP57P38
www.vishay.com Vishay Semiconductors
Rev. 2.2, 30-Mar-2021 8Document Number: 82480
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OUTER PACKAGING
The sealed reel is packed into a pizza box.
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final
packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to
warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
CARTON BOX DIMENSIONS in millimeters
THICKNESS WIDTH LENGTH
Pizza box (Panhead, Heimdall, and Belobog)
(taping in reels) 50 340 340
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17
Thickness
Width
22127
Length

TSSP57P38
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Rev. 2.2, 30-Mar-2021 9Document Number: 82480
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DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC®standard J-STD-020 level 3 label is included
on all dry bags.
EIA JEDEC standard J-STD-020 level 3 label
is included on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (Example)
Aluminum bag
Label
Reel
15973
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
a) Mounted within:___________________hours of factory conditions
≤30°C/60% RH, or
b) Stored per J-STD-033
If blank, see adjacent bar code label
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
This bag contains
MOISTURE-SENSITIVE DEVICES
Caution
If blank, see adjacent
bar code label
3
LEVEL
260
168
22650
22178

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Revision: 01-Jan-2021 1Document Number: 91000
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