Vishay TSSP570 H Series User manual

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 1Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IR Receiver Modules for Remote Control Systems
LINKS TO ADDITIONAL RESOURCES
DESCRIPTION
The TSSP570.. is a compact infrared detector module for
presence sensing applications. It receives 38 kHz
modulated signals and has a peak sensitivity of 940 nm.
This component has not been qualified according to
automotive specifications.
FEATURES
• Presence sensor: up to 2 m distance,
find more info at: www.vishay.com/doc?49009
• Light barrier: up to 12 m distance, TSAL6200
with IF= 50 mA,
find more info at: www.vishay.com/doc?49650
• Fast proximity: up to 2 m range at 5 ms
response time,
find more info at: www.vishay.com/doc?82741
• Supply voltage: 2.0 V to 5.5 V
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Reflective sensors for hand dryers, towel or soap
dispensers, water faucets, toilet flush
• Vending machine fall detection
• Security and pet gates
• Person or object vicinity switch
• Fast proximity sensors for toys, robotics, drones, and
other consumer and industrial uses
DESIGN SUPPORT TOOLS
•3D models
•Window size calculator
BLOCK DIAGRAM
22531
2
2
53
1
Product Page
Marking
33 kΩ
VS
OUT
Demo-
GND
pass
AMPInput
PIN
Band dulator
4, 5
1
2, 3,
6, 7, 8
20445-7

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 2Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MECHANICAL DATA
Pinning:
1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
ORDERING CODE
Taping:
TSSP570..TT1 - top view taped, 1800 pcs/reel
PRESENCE SENSING
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
23209
1
2
3
4
5
6
7
8
+3 V
IR emitter
+3 V
38 kHz
Envelope
signal
Out to
µC
IR detector
PARTS TABLE
Carrier frequency 38 kHz TSSP57038
56 kHz TSSP57056
Package Belobog
Pinning 1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm) 3.95 W x 3.95 H x 0.8 D
Mounting SMD
Application Presence sensors, fast proximity sensors
Special options • Extended temperature range: www.vishay.com/doc?82738
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +6 V
Supply current IS5mA
Output voltage VO-0.3 to (VS+ 0.3) V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb ≤85 °C Ptot 10 mW

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 3Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 3 - Output Function
Fig. 4 - Output Pulse Diagram
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply current (pin 3) Ev= 0, VS= 3.3 V ISD 0.25 0.35 0.45 mA
Ev= 40 klx, sunlight ISH -0.45- mA
Supply voltage VS2.0 - 5.5 V
Transmission distance Ev= 0, test signal see Fig. 1,
IR diode TSAL6200, IF= 50 mA d-8-m
Output voltage low (pin 1) IOSL = 0.5 mA, Ee= 2 mW/m2,
test signal see Fig. 1 VOSL - - 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 4/fo< tpo < tpi + 4/fo,
test signal see Fig. 1
Ee min. -0.71.2mW/m
2
Maximum irradiance
Pulse width tolerance:
tpi - 4/fo< tpo < tpi + 4/fo,
test signal see Fig. 1
Ee max. 30 - - W/m2
Directivity Angle of
half transmission distance ϕ1/2 -±75- °
Ee
T
tpi (1)
t
VO
VOH
VOL
t
Optical Test Signal
(IR diode TSAL6200, 30 pulses, f = f0, T = 10 ms)
Output Signal
td(2) tpo (3)
(2) 7/f0< td< 13/f0
(3) tpi - 4/f0< tpo < tpi + 4/f0
16110-12
(1) tpi ≥ 10/f0
10
100
1000
10000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1 10 1000 100 000
Axis Title
1st line
2nd line
2nd line
tpo - Output Pulse Width (ms)
Ee- Irradiance (mW/m2)
Output pulse width
Input burst length
λ=950nm,
optical test signal, Fig. 1
E
e
t
V
O
V
OH
V
OL
t
600 µs 600 µs
t = 60 ms
t
on
t
off
94 8134
Optical Test Signal
Output Signal, (see Fig. 4)
10
100
1000
10000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1 1 10 100 1000 10 000
Axis Title
1st line
2nd line
2nd line
ton, toff - Output Pulse Width (ms)
Ee- Irradiance (mW/m2)
ton
toff
λ=950nm,
optical test signal, Fig. 3

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 4Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 5 - Frequency Dependence of Responsivity
Fig. 6 - Sensitivity vs. Ambient Temperature
Fig. 7 - Sensitivity vs. Supply Voltage
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
Fig. 9 - Horizontal Directivity
The typical application of this device is a reflective or beam
break sensor with active low “detect” or “no detect”
information contained in its output. The TSSP570.. is also
suitable for fast (~ 15 ms) proximity sensor applications for
ranges between 10 cm and 2 m, if a burst pattern with
variable intensity is used.
Example for a sensor hardware:
There should be no common window in front of the emitter
and detector in order to avoid crosstalk via guided light
through the window.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.7 0.9 1.1 1.3
f/f0- Relative Frequency16925
f = f
0
± 5 %
Δf(3 dB) = f
0
/10
E
e min.
/E
e
- Relative Responsivity
10
100
1000
10000
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
-30 -10 10 30 50 70 90
Axis Title
1st line
2nd line
2nd line
Ee min. - Threshold Irradiance (mW/m2)
Tamb - Ambient Temperature (°C)
10
100
1000
10000
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
123456
Axis Title
1st line
2nd line
2nd line
Ee min. - Threshold Irradiance (mW/m2)
VS- Supply Voltage (V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 800 850 900 950 1000 1050 1150
λ- Wavelength (nm)
S(λ)rel - Relative Spectral Sensitivity
1100
Axis Title
2nd line
2nd line
2nd line
Vertical
drel. - Relative Transmission Distance
1.0
0.9
0.7
0.8
30°
50°
40°
80°
0.6 0.4 0.200.40.2 0.6
20°10°0°
60°
70°
21947
Emitter
TSAL6200
IR detector
Separation to avoid crosstalk
by stray light inside the housing

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 5Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
Notes
(1) Optically effective area
(2) Pins connected internally. It is not necessary to connect externally
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specifications
Proposed pad layout from
component side
(dim. for reference only)
(3.95)
(3.95)
(0.35)
(0.8)
(2.75)
(3)
(4 x)
(4x)
0.55
(0.95)
0.55
(1.8)
0.75± 0.05
4 x 0.75 = 3
0.35± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
0.475
(0.4)
0.8
0.15
Pinning from topview
GND
GND
Out
Vs
(Vs) (GND)
(GND) (GND)
1 2 3 4 5
8 7 6
Pin 1 identification
(2)
(2) (2) (2)
3.95
3.95
(2.75)
(1.9)
(3.4)
marking area
Pin 1 Identification
(1)
(1)
(1)

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 6Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
19800
10
100
1000
10000
0
50
100
150
200
250
300
0 50 100150200250300
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
max. 120 s max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 7Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING VERSION TSSP57038 DIMENSIONS in millimeters
Tape and reel dimensions:
Parts mounted
Empty trailer 200 mm min.
Empty leader 400 mm min.
Direction of pulling out
Unreel direction
Ø 60 min.
Ø Y
2 ± 0.5
Label posted here
coming out from reel
Tape position
(12.4)
18.4 max.
Ø 13 ± 0.2
Ø 21 ± 0.8
100 mm min. with cover tape
X 2:1
(2)
(1.75)
(5.5)
12 ± 0.3
(8) (4)
(Ø 1.5)
(0.3)
(1.2)
Technical drawings
according to DIN
specications
Not indicated tolerances ± 0.1Drawing-No.: 9.700-5347.01-4
Issue: 2; 07.03.18
Reel size “Y”
TT1 Ø 180 ± 2 = 1800 pcs.
Leader and trailer tape:

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 8Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OUTER PACKAGING
The sealed reel is packed into a pizza box.
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final
packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to
warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
CARTON BOX DIMENSIONS in millimeters
THICKNESS WIDTH LENGTH
Pizza box (Panhead, Heimdall, and Belobog)
(taping in reels) 50 340 340
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17
Thickness
Width
22127
Length

TSSP570..
www.vishay.com Vishay Semiconductors
Datasheet Values Refer to PCN-OPT-1224-2022
Rev. 2.4, 16-Aug-2022 9Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC®standard J-STD-020 level 3 label is included
on all dry bags.
EIA JEDEC standard J-STD-020 level 3 label
is included on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (example)
Aluminum bag
Label
Reel
15973
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
a) Mounted within:___________________hours of factory conditions
≤30°C/60% RH, or
b) Stored per J-STD-033
If blank, see adjacent bar code label
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
This bag contains
MOISTURE-SENSITIVE DEVICES
Caution
If blank, see adjacent
bar code label
3
LEVEL
260
168
22650
22178

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Revision: 01-Jan-2022 1Document Number: 91000
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