Vishay TSSP57P38TT2 User manual

TSSP57P38
www.vishay.com Vishay Semiconductors
Rev. 1.5, 29-Jul-14 1Document Number: 82480
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IR Detector for Mid Range Proximity Sensor
DESCRIPTION
The TSSP57P38 is a compact infrared detector module for
proximity sensing application. It receives 38 kHz modulated
signals and has a peak sensitivity of 940 nm.
The length of the detector’s output pulse varies in proportion
to the amount of light reflected from the object being
detected.
ORDERING CODE
Taping:
TSSP57P38TT1 - top view taped
TSSP57P38TT2 - top view taped
FEATURES
• Height of 0.8 mm
• Up to 2 m for proximity sensing
• Receives 38 kHz modulated signal
• 940 nm peak wavelength
• Photo detector and preamplifier in one package
• Low supply current
• Shielding against EMI
• Visible light is suppressed by IR filter
• Insensitive to supply voltage ripple and noise
• Supply voltage: 2.5 V to 5.5 V
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Safety switches for garage door, elevator door, gates, and
industrial light curtains
• Reflective sensors for toilet, urinal, faucet and hand dryer,
and towel dispenser
• Navigational sensor for robotics
• Sensor for large format touch panels
• Object detection in vending machines, parking lots,
ATM’s, and many others
BLOCK DIAGRAM APPLICATION CIRCUIT
22531-1
PARTS TABLE
Carrier frequency 38 kHz TSSP57P38
Package Belobog
Pinning 1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm) 3.95 W x 3.95 H x 0.8 D
Mounting SMD
Application Proximity sensors
33 kΩ
2, 3, 6,
7, 8
4, 5
1
VS
OUT
Demo-
GND
pass
AGCInput
PIN
Band
dulator
Control circuit
16833_20
+ 3 V
IR emitter
+ 3 V
38 kHz
Out to
μC
TSSP57P38
Envelope
signal

TSSP57P38
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Rev. 1.5, 29-Jul-14 2Document Number: 82480
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Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +6 V
Supply current IS5mA
Output voltage VO-0.3 to (VS+ 0.3) V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb ≤85 °C Ptot 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS2.5 5.5 V
Supply current VS= 5 V, Ee= 0 ISD 0.55 0.7 0.9 mA
Ev= 40 klx, sunlight ISH 0.8 mA
Receiving distance
Direct line of sight,
IR diode TSAL6200,
IF= 250 mA, test signal see fig. 1
d40m
Output voltage low IOSL = 0.5 mA, Ee= 0.7 mW/m2,
test signal see fig. 1 VOSL 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo< tpo < tpi + 6/fo,
test signal see fig. 1
Ee min. 0.2 0.4 mW/m2
Maximum irradiance tpi - 5/fo< tpo < tpi + 6/fo,
test signal see fig. 1 Ee max. 50 W/m2
Directivity Angle of half receiving distance ϕ1/2 ± 75 deg
E
e
T
t
* tpi 10/f0is recommended for optimal function
VO
VOH
VOL t
16110_4
Optical Test Signal
(IR diode TSAL6200, IF= 0.4 A, 30 pulses, f = f0, t = 10 ms)
Output Signal
td
1)
t
po 2)
1)
7/f0<td<15/f0
2)
tpi - 5/f0<tpo < tpi + 6/f0
tpi *
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1 1 10 10
2
10
3
10
4
E
e
- Irradiance (mW/m
2
)
t
po
- Output Pulse Width (ms)
Input Burst Length
Output Pulse Width
λ= 950 nm,
Optical Test Signal, Fig.1
0
0.1

TSSP57P38
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Rev. 1.5, 29-Jul-14 3Document Number: 82480
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Fig. 3 - Frequency Dependance of Responsivity
Fig. 4 - Sensitivity in Bright Ambient
Fig. 5 - Sensitivity vs. Supply Voltage Disturbances
Fig. 6 - Output Pulse Width vs. Irradiance
Fig. 7 - Sensitivity vs. Ambient Temperature
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
0.0
0.2
0.4
0.6
0.8
0.9
1.0
25 30 45 50
f/f
0
- Relative Frequency
E /E - Rel. Responsivity
e min. e
4035
0.1
0.3
0.5
0.7
f = f0± 5 %
Δf (3 dB) = f0/10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01 0.1 1 10 100
Ee- Ambient DC Irradiance (W/m2)
Ee min. - Threshold Irradiance (mW/m2)
Correlation with Ambient Light Sources:
10 W/m2= 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2= 8.2 kLx (Daylight, T = 5900 K)
Wavelength of Ambient
Illumination:
λ
= 950 nm
4.5
5.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1 10 100 1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
Ee min. - Threshold Irradiance (mW/m2)
f = f
0
f = 20 kHz
f = 30 kHz
f = 100 Hz
f = 10 kHz
22088
0
20
40
60
80
100
120
140
160
180
200
0.1 1 10 100
t
po
- Output Pulse Width (ms)
E
e
- Irradiance (mW/m
2
)
Burst length = 300 ms, f = fO
Tamb - Ambient Temperature (°C)
Ee min. - Sensitivity (mW/m2)
0
0.05
0.10
0.15
0.20
0.40
-30 -10 10 30 50 70 90
0.30
0.25
0.35
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 800 850 900 950 1000 1050 1150
λ- Wavelength (nm)
S(λ)rel - Relative Spectral Sensitivity
1100

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Rev. 1.5, 29-Jul-14 4Document Number: 82480
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Fig. 9 - Max. Rate of Bursts
Fig. 10 - Angle Characteristic
Fig. 11 - tpo vs. Distance
Fig. 12 - Dynamic Range of Sensor vs. tpi
The typical application of the TSSP57P38 is a reflective sensor with analog information contained in its output. Such a sensor
is evaluating the time required by the AGC to suppress a quasi continuous signal. The time required to suppress such a signal
is longer when the signal is strong than when the signal is weak, resulting in a pulse length corresponding to the distance of an
object from the sensor. This kind of analog information can be evaluated by a microcontroller. The absolute amount of reflected
light depends much on the environment and is not evaluated. Only sudden changes of the amount of reflected light, and
therefore changes in the pulse width, are evaluated using this application.
Example of a signal pattern:
0
100
200
300
400
500
800
0 40 80 120 18020 60 100 140
tpi (ms)
trepeat min. (ms)
600
700
160
0
0.2
0.4
0.6
0.8
1.0
1.2
-90 90
Angle (°)
70503010-10-30-50-70
Relative Response Distance
Directivity Characteristic of a
Reective Sensor using
VSMB1940X01 and TSSP57P38
Response Distance (m)
tpo (ms)
0
20
40
60
80
100
120
0.0 0.2 0.4 0.6 0.8 1.0 1.2
IF= 100 mA
IF= 50 mAIF= 30 mA
IF= 10 mA
Emitter: VSMB1940X01
t
pi
(ms)
dmax./dmin.
0
1
2
3
4
5
6
7
10 20 30 40 110 1201009080706050
Optical signal
Response of the
TSSP57P38
(strong reflection)
trepeat = 500 ms
tpi = 120 ms, 38 kHz
Response of the
TSSP57P38
(weak reflection)

TSSP57P38
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Rev. 1.5, 29-Jul-14 5Document Number: 82480
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Example for a sensor hardware:
There should be no common window in front of the emitter
and receiver in order to avoid crosstalk by guided light
through the window.
The logarithmic characteristic of the AGC in the TSSP57P38
results in an almost linear relationship between distance and
pulse width. Ambient light has also some impact to the pulse
width of this kind of sensor, making the pulse shorter.
PACKAGE DIMENSIONS in millimeters
Emitter
TSAL6200
IR Receiver
TSSP57P38
Separation to avoid
crosstalk by stray light inside
the housing
0.8
0.15
3.95
3.95
(2.75)
0.55
(0.95)
0.55
(1.8)
Pinning from Topview
GND GND
Out Vs (Vs) (GND) (GND) (GND)
0.75± 0.05
4 x 0.75 = 3
0.35± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
(1.9)
(3.4)
Not indicated tolerances ± 0.1
specifications
according to DIN
technical drawings
All dimensions in mm
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
marking area
Drawing refers to following types: TSOP37... / TSOP57...
Proposed pad layout from
component side
(dim. for reference only)
(3.95)
(3.95)
(0.35)
(0.8)
(2.75)
(3)
(4 x)
(4x)
1 2 3 4 5
8 7 6
0.475
(0.4)
Pin 1 Identification
Pin 1 Identification
optically effective area
(1)
(1)
(2)
(2) (2) (2)
(2) Pins connected internally.
It is not necessary to
connect externally.
(1)
(1)

TSSP57P38
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Rev. 1.5, 29-Jul-14 6Document Number: 82480
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ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Note
(1) MOQ: minimum order quantity
ORDERING INFORMATION
ORDERING CODE PACKAGING VOLUME (1) REMARKS
TSSP57P38TT1 Tape and reel MOQ: 1800 pcs 3.95 mm x 3.95 mm x 0.75 mm
TSSP57P38TT2 MOQ: 7000 pcs
0
50
100
150
200
250
300
0 50 100 150 200 250 300
t (s)
T (°C)
255 °C
240 °C
245 °
C
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 20 s
max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s
max. 2 cycles allowed
19800

TSSP57P38
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Rev. 1.5, 29-Jul-14 7Document Number: 82480
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TAPING VERSION TSSP57P38 DIMENSIONS in millimeters
Leader and trailer tape:
Partsmounted
Empty trailer 200 mm min.
Empty leader 400 mm min.
Direction of pulling out
Unreel direction
Ø 60 min.
Ø Y
2 ± 0.5
Label posted here
coming out from reel
Tape position
(12.4)
18.4 max.
Ø 13 ± 0.2
Ø 21 ± 0.8
100 mm min. with cover tape
X 2:1
Tape and reel dimensions:
(2)
(1.75)
(5.5)
12 ± 0.3
(8) (4)
(Ø 1.5)
(0.3)
Reel size "Y"
TT1 Ø 180 ± 2 = 1800 pcs.
TT2 Ø 330 ± 2 = 7000 pcs.
(1.2)
Technical drawings
according to DIN
specications
Not indicated tolerances± 0.1Drawing-No.: 9.700-5347.01-4
Issue: 1; 14.11.11

TSSP57P38
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Rev. 1.5, 29-Jul-14 8Document Number: 82480
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LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC®standard J-STD-020 level 3 label is included
on all dry bags.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (Finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description -18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted byACC -
Packed byPCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
Long bar code top Type Length
Item-number N8
Plant-code N2
Sequence-number X3
Quantity N8
Total length -21
Short bar code bottom Type Length
Selection-code X3
Data-code N3
Batch-number X10
Filter -1
Total length -17
Aluminum bag
Label
Reel
15973

TSSP57P38
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Rev. 1.5, 29-Jul-14 9Document Number: 82480
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EIA JEDEC standard J-STD-020 level 3 label
is included on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (Example)
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
a) Mounted within:___________________hours of factory conditions
≤30°C/60% RH, or
b) Stored per J-STD-033
If blank, see adjacent bar code label
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
This bag contains
MOISTURE-SENSITIVE DEVICES
Caution
If blank, see adjacent
bar code label
3
LEVEL
260
168
22650
22178

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