WAGO-I/O-SYSTEM 750 Table of Contents 3
750-481/003-000 2AI RTD Ex i
Manual
V 1.4.0 HW-Version 07, SW-Version 41
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Table of Contents
1Notes about this Documentation................................................................. 5
1.1 Validity of this Documentation................................................................. 5
1.2 Copyright................................................................................................... 5
1.3 Symbols..................................................................................................... 6
1.4 Number Notation....................................................................................... 8
1.5 Font Conventions ...................................................................................... 8
2Important Notes ........................................................................................... 9
2.1 Legal Bases ............................................................................................... 9
2.1.1 Subject to Changes ............................................................................... 9
2.1.2 Personnel Qualifications....................................................................... 9
2.1.3 Use of the WAGO-I/O-SYSTEM 750 in Compliance with
Underlying Provisions.......................................................................... 9
2.1.4 Technical Condition of Specified Devices......................................... 10
2.2 Safety Advice (Precautions).................................................................... 11
3Device Description ..................................................................................... 13
3.1 View ........................................................................................................ 15
3.2 Connectors............................................................................................... 16
3.2.1 Data Contacts/Internal Bus................................................................. 16
3.2.2 Power Jumper Contacts/Field Supply ................................................ 17
3.2.3 CAGE CLAMP®Connectors ............................................................. 18
3.3 Display Elements .................................................................................... 19
3.4 Operating Elements................................................................................. 19
3.5 Schematic Diagram ................................................................................. 20
3.6 Technical Data ........................................................................................ 21
3.6.1 Device Data ........................................................................................ 21
3.6.2 Supply................................................................................................. 21
3.6.3 Communication .................................................................................. 21
3.6.4 Inputs .................................................................................................. 22
3.6.5 Explosion Protection .......................................................................... 23
3.6.6 Connection Type ................................................................................ 23
3.6.7 Climatic Environmental Conditions................................................... 24
3.7 Approvals ................................................................................................ 25
3.8 Standards and Guidelines........................................................................ 26
4Process Image ............................................................................................. 29
4.1 Configuration for Pt Resistance Sensors................................................. 29
4.2 Configuration for Ni Resistance Sensors ................................................ 31
4.3 Configuration for Resistance Measuring ................................................ 33
4.4 Configuration for Potentiometer Measuring ........................................... 34
5Mounting..................................................................................................... 35
5.1 Mounting Sequence................................................................................. 35
5.2 Inserting and Removing Devices ............................................................ 36
5.2.1 Inserting the I/O Module .................................................................... 36
5.2.2 Removing the I/O Module.................................................................. 37
6Connect Devices ......................................................................................... 38
