Wavecom Wireless CPU Q24NG Instruction Manual

WM_
Wireless CPU Q24NG
Customer Design Guideline
Revision: 001
Date: June 2006

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WM_PRJ_Q24NG_PTS_002-001 June 2006
Wireless CPU Q24NG
Customer Design Guideline
Reference: WM_PRJ_Q24NG_PTS_002
Revision: 001
Date: June 2006
Powered by the Wavecom Operating System and Open AT®

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Document Information
Level Date History of the evolution
001 04/05/2006 Creation (Preliminary version)

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Overview
This document gives recommendations for Wireless CPU Q24NG sub-
series integration in an application and particularly:
• The baseband design rules and typical implementation examples,
• The RF design rules and typical implementation examples
• The mechanical constraints for module fitting,
• The PCB routing recommendations,
• The Test and download recommendations.
It also gives some part references and suppliers.
The Q24NG is available under 4 versions of GSM/GPRS Class 10 quad-
band versions:
• Q24 Classic: EGSM 900/1800/850/1900 MHz version with 32 Mb of
Flash memory and 16 Mb of PSRAM (32/16), T° range [-20°C / +55°C]-
Full ETSI specification-
• Q24 Plus: EGSM/GPRS 900/1800/850/1900 MHz version with 32 Mb of
Flash memory and 16 Mb of PSRAM (32/16) T° range [-20°C / +55°C] -
Full ETSI specification-
• Q24 Extended: EGSM/GPRS 900/1800/850/1900 MHz version with 32
Mb of Flash memory and 4Mb of SRAM (32/4) extended T° range [-
40°C / +85°C]
• Q24 Automotive: EGSM/GPRS 900/1800/850/1900 MHz version with
32 Mb of Flash memory and 4Mb of PSRAM (32/4) extended T° range
[-40°C / +85°C]
o This version is dedicated to automotive applications.
Please be aware that some of the interfaces provided by the Wireless
CPU Q24NG sub-series cannot be handled when using the module driven
by AT commands.
This symbol is used to indicate the interfaces not available with
AT commands.
AAA
TTT
These functions then have to be managed externally i.e using the main
processor of the application.

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WM_PRJ_Q24NG_PTS_002-001 June 2006
Contents
Document Information......................................................................... 2
Overview ............................................................................................. 3
Contents.............................................................................................. 4
Table of Figures................................................................................... 7
Cautions .............................................................................................. 9
Trademarks ......................................................................................... 9
Copyright ............................................................................................ 9
1References................................................................................ 10
1.1 References documents ......................................................................... 10
1.1.1 WAVECOM reference document ................................................... 10
1.1.2 General reference document ......................................................... 10
1.2 List of abbreviations ............................................................................. 11
2General description................................................................... 14
2.1 Overall dimensions ............................................................................... 14
2.2 Power consumption ............................................................................. 14
2.3 Capability ............................................................................................. 14
2.4 External RF connections ....................................................................... 14
2.5 SIM interface connections .................................................................... 15
2.6 RoHS compliance ................................................................................. 15
3Baseband Design ...................................................................... 16
3.1 Power supply and ground design rules................................................. 16
3.1.1 Electrical constraints ..................................................................... 16
3.1.2 Design Requirements.................................................................... 18
3.1.2.1 Risk......................................................................................... 18
3.1.2.2 General design rules ............................................................... 18
3.1.2.3 Battery integration ................................................................. 19
3.1.2.4 External DC power supply....................................................... 19
3.1.3 PCB routing constraints ................................................................ 20

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3.1.3.1 Power supply routing Constraints........................................... 20
3.1.3.2 Application ground plane and shielding connection ................ 20
3.1.3.3 Decoupling of power supply signals ....................................... 20
3.2 Digital I/O and peripheral implementation ............................................. 21
3.2.1 Electrical information for digital I/O ............................................... 21
3.2.2 LCD interface ................................................................................ 21
3.2.2.1 SPI bus ................................................................................... 21
3.2.2.2 I2C........................................................................................... 22
3.2.3 SPI Auxiliary bus........................................................................... 22
3.2.4 Keyboard interface ........................................................................ 22
3.2.5 Main serial link (UART1) ............................................................... 23
3.2.6 SIM interface ................................................................................ 26
3.2.6.1 SIM 3V management .............................................................. 26
3.2.6.2 SIM 1.8 V / 3 V management .................................................. 28
3.2.6.3 SIM 3 V / 5 V management ..................................................... 29
3.3 Analog I/O implementation ................................................................... 30
3.3.1 Analog to Digital Converter (ADC) inputs ...................................... 30
3.3.2 Audio interface.............................................................................. 31
3.3.2.1 Microphone inputs.................................................................. 31
3.3.2.1.1 General ................................................................................. 31
3.3.2.1.2 Recommended characteristics for the microphones .............. 31
3.3.2.1.3 Main Microphone Inputs (MIC2) ........................................... 32
3.3.2.1.4 Auxiliary Microphone Inputs (MIC1)...................................... 32
3.3.2.2 Speaker outputs...................................................................... 35
3.3.2.2.1 Common speaker output characteristics ............................... 35
3.3.2.3 Buzzer Output......................................................................... 36
3.3.2.4 Routing constraints................................................................. 36
3.4 Battery charging interface..................................................................... 37
3.4.1 General information ...................................................................... 37
3.4.2 Interface description ..................................................................... 37
3.5 ON / ~OFF ............................................................................................ 38
3.6 BOOT signal (optional).......................................................................... 39
3.7 Reset signal (~RST) .............................................................................. 40
3.8 External Interrupt (~INTR)..................................................................... 40
3.9 VCC output ........................................................................................... 41
3.10 VCC_RTC (Real Time Clock Supply) ....................................................... 41
3.10.1 General ......................................................................................... 41
3.10.2 Typical implementation................................................................. 42
3.10.2.1 Capacitor ................................................................................ 42
3.10.2.2 Super Capacitor ...................................................................... 42
3.10.2.3 Battery cell with regulator ....................................................... 43
3.10.2.4 .Non Rechargeable battery ...................................................... 43
4Radio design ............................................................................. 44
4.1 Antenna characteristics ........................................................................ 44
4.2 Antenna implementation ...................................................................... 44
4.2.1 Recommendations ........................................................................ 44
4.2.2 RF connection ............................................................................... 45

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5Mechanical specifications ........................................................ 47
6PCB design ............................................................................... 48
6.1 General design rules ............................................................................. 48
6.2 Design rules for application manufacturing........................................... 48
6.3 Recommendation for lead free soldering ............................................... 48
6.4 Power supply ....................................................................................... 48
6.5 Pads design.......................................................................................... 49
7EMC recommendations............................................................. 50
8Firmware upgrade..................................................................... 51
8.1 Recommendations ................................................................................ 51
8.2 Nominal upgrade procedure ................................................................. 51
8.3 Backup procedure................................................................................. 52
9Embedded testability ................................................................ 53
10 Part references and suppliers ................................................... 56
10.1 General Purpose Connector .................................................................. 56
10.2 SIM Card Reader .................................................................................. 56
10.3 Microphone .......................................................................................... 56
10.4 Speaker ................................................................................................ 57
10.5 Antenna Connections ........................................................................... 57
10.5.1 Antenna pad ................................................................................. 57
10.5.2 IMP connector (RF board to board) ............................................... 57
10.5.3 UFL connector............................................................................... 57
10.5.4 MMS connector ............................................................................ 58
10.6 GSM antenna ....................................................................................... 58

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Table of Figures
Figure 1: Typical power supply voltage in GSM mode ............................. 16
Figure 2: Maximal voltage ripple (Uripp) vs Frequency in GSM & DCS, To
be confirmed ...................................................................................... 18
Figure 3: Burst simulation circuit ............................................................. 19
Figure 4: Example of SPI Bus typical implementation .............................. 22
Figure 5: Example of keyboard implementation ....................................... 23
Figure 6: Example of RS232 level shifter implementation......................... 24
Figure 7: Example of Serial Link interface implementation ....................... 25
Figure 8: Example of 3V SIM Socket implementation............................... 26
Figure 9: 1.8 V / 3 V SIM interface implementation example .................... 28
Figure 10: 3 V / 5 V SIM interface implementation example ..................... 29
Figure 11: Example of ADC input implementation.................................... 30
Figure 12: Microphone decoupling capacitor ........................................... 31
Figure 13: Example of main microphone MIC2 implementation (differential
connection) ........................................................................................ 32
Figure 14: MIC1 inputs (differential connection) ...................................... 33
Figure 15: MIC1 inputs (single-ended connection)................................... 34
Figure 16: Speaker outputs (differential mode)......................................... 35
Figure 17: Speaker outputs (single-ended connection)............................. 35
Figure 18: Example of Buzzer implementation ......................................... 36
Figure 19: Example of battery implementation......................................... 37
Figure 20: BOOT pin connection.............................................................. 39
Figure 21: ∼RST pin connection ............................................................... 40
Figure 22: RTC Supplied by a capacitor ................................................... 42
Figure 23: RTC supplied by a super capacitor.......................................... 42
Figure 24: RTC supplied by a battery cell with regulator.......................... 43
Figure 25: RTC supplied by a non rechargeable battery ........................... 43
Figure 26: Antenna connection................................................................ 45
Figure 27: Antenna cable preparation (drawing not to scale) ................... 46
Figure 28: Maximum bulk occupied on the application board .................. 47

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Figure 29: Pads design ...................................................................... 49
Figure 30: Example of serial link routing for downloading........................ 53
Figure 31: Download cable schematics (1/2) ........................................... 54
Figure 32: Download cable schematics (2/2) ........................................... 55

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WM_PRJ_Q24NG_PTS_002-001 June 2006
Cautions
This platform contains a modular transmitter. This device is used for
wireless applications. Note that all electronics parts and elements are ESD
sensitive.
Information provided herein by WAVECOM is accurate and reliable.
However no responsibility is assumed for its use and any of such
WAVECOM information is herein provided “as is” without any warranty of
any kind, whether express or implied.
General information about WAVECOM and its range of products is
available at the following internet address: http://www.wavecom.com
Trademarks
®, WAVECOM®, Wireless CPU®, Open AT®and certain other trademarks
and logos appearing on this document, are filed or registered trademarks
of Wavecom S.A. in France or in other countries. All other companies
and/or product names mentioned may be filed or registered trademarks of
their respective owners.
Copyright
This manual is copyrighted by WAVECOM with all rights reserved. No part
of this manual may be reproduced in any form without the prior written
permission of WAVECOM. No patent liability is assumed with respect to
the use of their respective owners.