Wavecom Gr64 Installation and operating instructions

PPLICATION NOTE

GR/GS64 SIM

Interface

Reference:

I_DEV_Gx64_APN_013

Revision: 001

Date: February 14, 2007

Trademarks

®, WAVECOM®, WISMO®, Open AT®, Wireless CPU®, Wireless Microprocessor®and certain

other trademarks and logos appearing on this document, are filed or registered trademarks

of Wavecom S.A. in France or in other countries. All other company and/or product names

mentioned may be filed or registered trademarks of their respective owners.

be reproduced in any form without the prior written permission of WAVECOM.

No patent liability is assumed with respect to the use of the information contained herein.

No Warranty

WAVECOM publishes this manual without making any warranty as to the content contained

herein. Further Wavecom Inc reserves the right to make modifications, additions and

deletions to this manual due to typographical errors, inaccurate information, or

improvements to programs and/or equipment at any time and without notice. Such changes

will, nevertheless be incorporated into new editions of this manual.

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 2/13

Table of Contents

1Introduction ............................................................................................ 4

1.1 NOTATION ............................................................................................................... 4

1.2 ABBREVIATIONS ........................................................................................................ 5

1.3 SIM TYPES................................................................................................................. 5

1.4 PIN CONNECTIVITY ................................................................................................... 6

2Interfacing the SIM .................................................................................. 7

2.1 INSERTION AND REMOVAL ........................................................................................ 7

2.2 SCHEMATIC CONSIDERATIONS .................................................................................. 8

2.2.1 SIMVCC............................................................................................................. 9

2.2.2 SIMCLK ............................................................................................................. 9

2.2.3 SIMDAT........................................................................................................... 10

3Type Approval....................................................................................... 11

3.1 ELECTRICAL TEST CASES ......................................................................................... 11

3.1.1 VCC ................................................................................................................ 11

3.1.2 RST................................................................................................................. 11

3.1.3 CLK................................................................................................................. 11

3.1.4 IO ................................................................................................................... 11

3.2 TEST CONNECTIONS ............................................................................................... 12

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 3/13

1Introduction

This application note introduces guidelines associated with the selection of

components, design, and interfacing methods for a solution using the GR/GS64 line

of Wireless CPUs. While it is not intended to be an exhaustive coverage of the topic of

GSM SIM design, these guidelines provide factors that affect the versatility, final

quality and ease of type approval of applications using one of the GR/GS64 Wireless

CPUs.

1.1 Notation

The following symbols and admonition notation are used to draw the reader’s

attention to notable or crucially-important information.

Note

Draws the readers attention to pertinent, useful or interesting

information

NOTE

Tip

Provides advice, suggestions, guidance or recommendations which

augment the formal text

TIP

Caution

Cautionary information must be heeded, it draws the readers

attention to the need for understanding, care or watchfulness in

relation to the information provided

CAUTION

Warning

Notes marked warning must be heeded, they alert readers to

precautionary measures, risks, hazards or safety information which

directly effects equipment function, warranty or personnel safety

WARNING

Danger

This information must be heeded, it identifies information and

cautionary behaviour that otherwise ignored could result in

catastrophic equipment failure, bodily injury or death

DANGE

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 4/13

1.2 Abbreviations

Abbreviation Description

EMC Electro Magnetic Compatibility

SIM Subscriber Identity Module

1.3 SIM Types

The table below gives a list of vendors for SIM-cards, their logotype and foot prints.

Vendor Logotype Connection pattern

Axalto

GEMPlus

G&D

M-Systems

Text says “M.MAR”

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 5/13

Vendor Logotype Connection pattern

Oberthur

ORGA

1.4 Pin Connectivity

•C1: VCC

•C2: RST

•C3: CLK

•C5: GND

•C6: VPP (Only used by service provider)

•C7: IO

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 6/13

2Interfacing the SIM

This section describes how to interface the SIM and lists things to look out for when it

comes to component layout and routing. This is very important for type approval,

since the required testing is very stringent.

2.1 Insertion and removal

The SIM should preferably be inserted and removed when the module is powered off.

Removing an active SIM can permanently damage the SIM.

Removing the SIM while data is transferred can cause the loss of data

and in worst case permanently damage the SIM.

CAUTION

The SIMDET signal in the system connector can be used to indicate

whether the SIM is going to be removed if it is linked to a mechanical

lid covering the SIM-holder. The SIM can then safely be shut down

before it is possible for the user to remove it from the holder.

TIP

The best solution for the SIM is if it is mounted in a location which

requires the Wireless CPU to be powered off before accessing the SIM

is possible. One option for this is behind the battery requiring the

user to remove the battery before access to the SIM is provided.

TIP

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

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SIM Interface

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2.2 Schematic considerations

To make the design optimal and provide a flexible design for the type approval

process it is beneficial to add optional components.

Figure 1: Recommended component provisions

Depending on the implementation transorbs might be needed to pass EMC-tests. It is

important to realise that the inherent capacitance of the transorbs placed on SIMDAT

and SIMCLK must be very low. The transorbs used on SIMVCC and SIMRST on the

other hand can have very high inherent capacitance without causing a problem.

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 8/13

2.2.1 SIMVCC

The SIMVCC-signal has a built-in 470nF capacitor inside the Wireless CPU. This

capacitance might not be enough, and it might not add the capacitance where it is

really needed. Provision for a capacitor (CVCC) ranging between 1uF to 10uF or more

should be made available as close to the SIM-holder as possible. This will enable

easier type approval passing of the VCC and IO test cases (27.17.2.1).

Provide the capability of adding capacitance on SIMVCC as close to

the SIM-holder as possible. The pad layout should support capacitors

up to 10uF.

TIP

2.2.2 SIMCLK

The SIMCLK-line is a CMOS driver from the Wireless CPU to the application. In case

the application adds inductance in the trace from SIMCLK of the system connector to

C3 of the SIM-holder, the application might experience over and/or under shoot

problems when running test cases (27.17.2.3). This can be taken care of by adding a

series resistance as close to the system connector as possible. The resistor should be

in the 10 ohm to 100 ohm range, but the required value might differ depending on

the application implementation.

Provide the capability of adding an extra series resistor 10ohm to

100ohm close to the system connector to overcome possible over

and/or under shoot problems.

TIP

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 9/13

2.2.3 SIMDAT

The SIMDAT-line has a built-in 10k pull-up resistor implemented inside the Wireless

CPU. This pull-up resistance might not be enough to pass the IO type approval test

cases (27.17.2.5) depending on the application implementation. The application

should provide the capability of adding a pull-up resistor (RIO) from SIMDAT to

SIMVCC as close to the SIM-holder C7-pin as possible. The resistor can be in the

range from 6.8k and up. The resistance needed depends on the added capacitance

from the system connector SIMDAT-pin to the C7-pin of the SIM-holder. The CVCC

capacitor added on SIMVCC will help alleviate this problem also.

The maximum current in the SIMDAT-line is limited to 1mA peak. If

the current exceeds that, even for a very short time (ns range) the

type approval test will fail. If this happens the RIO value should be

increased.

CAUTION

Provide the capability of adding capacitance on SIMVCC as close to

the SIM-holder as possible. The pad layout should support capacitors

up to 10uF.

Also provide the capability of adding an extra pull-up resistor ≥6.8k

in case the application adds capacitance. This will improve the rise-

time.

TIP

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 10/13

3Type Approval

3.1 Electrical test cases

The electrical test cases are specified in §27.17 of the ETSI 3GPP TS 51010-1

specification. The attached link points to the 51010-1 specification archive within

ETSI.

(http://www.3gpp.org/ftp/Specs/archive/51_series/51.010-1/)

3.1.1 VCC

The SIM supply voltage is tested by the 27.17.2.1 e) test cases. If any of these test

cases fail it is most likely due to too high impedance in the trace, causing the high

voltage to go below minimum. This can be solved by adding a capacitor as close to

the SIM-holder as possible (see 2.2.1 above).

3.1.2 RST

The RST signal is tested by the 27.17.2.2 e) test cases. These should not fail.

3.1.3 CLK

The CLK signal is tested by the 27.17.2.3 e) test cases. These tests could fail due to

over and under shoot issues caused by trace inductance. This ringing can be limited

by adding a small serial resistance close to the Wireless CPU system connector (see

2.2.2 above).

3.1.4 IO

The IO signal is tested by the 27.17.2.5 e) test cases. These tests could fail due to

high capacitance caused by trace capacitance. This can be solved by adding a pull-up

resistance to SIMVCC close to the SIM-holder (see 2.2.3 above).

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.

Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable

SIM Interface

Page: 11/13

3.2 Test connections

The SIM type approval test equipment can be connected to the application in two

different ways:

1. Paddle

2. Flying leads

The test facility will most likely perform all tests using the paddle. This is the most

realistic and easiest way to test the device. This test method does have its draw-

backs; the connections are worsened over time and if the paddle is not replaced every

so often the test cases might start to cause false failures. If this occurs it is best to

request that they use the flying lead method instead. This method entails the test

equipment to solder down onto the SIM-holder leads (soldered onto the solder pads

of the SIM-holder, not the pins on the holder that connects to the SIM-card). This

method eliminates bad connection problems of the paddle method.

GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.