Wavecom GR64 Installation and operating instructions

A
PPLICATION NOTE
GR/GS64 SIM Interface
Reference:
W
I_DEV_Gx64_APN_013
Revision: 001
Date: February 14, 2007

Trademarks
®, WAVECOM®, WISMO®, Open AT®, Wireless CPU®, Wireless Microprocessor®and certain
other trademarks and logos appearing on this document, are filed or registered trademarks
of Wavecom S.A. in France or in other countries. All other company and/or product names
mentioned may be filed or registered trademarks of their respective owners.
Copyright
This manual is copyrighted by WAVECOM with all rights reserved. No part of this manual may
be reproduced in any form without the prior written permission of WAVECOM.
No patent liability is assumed with respect to the use of the information contained herein.
No Warranty
WAVECOM publishes this manual without making any warranty as to the content contained
herein. Further Wavecom Inc reserves the right to make modifications, additions and
deletions to this manual due to typographical errors, inaccurate information, or
improvements to programs and/or equipment at any time and without notice. Such changes
will, nevertheless be incorporated into new editions of this manual.
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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Table of Contents
1Introduction ............................................................................................ 4
1.1 NOTATION ............................................................................................................... 4
1.2 ABBREVIATIONS ........................................................................................................ 5
1.3 SIM TYPES................................................................................................................. 5
1.4 PIN CONNECTIVITY ................................................................................................... 6
2Interfacing the SIM .................................................................................. 7
2.1 INSERTION AND REMOVAL ........................................................................................ 7
2.2 SCHEMATIC CONSIDERATIONS .................................................................................. 8
2.2.1 SIMVCC............................................................................................................. 9
2.2.2 SIMCLK ............................................................................................................. 9
2.2.3 SIMDAT........................................................................................................... 10
3Type Approval....................................................................................... 11
3.1 ELECTRICAL TEST CASES ......................................................................................... 11
3.1.1 VCC ................................................................................................................ 11
3.1.2 RST................................................................................................................. 11
3.1.3 CLK................................................................................................................. 11
3.1.4 IO ................................................................................................................... 11
3.2 TEST CONNECTIONS ............................................................................................... 12
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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1Introduction
This application note introduces guidelines associated with the selection of
components, design, and interfacing methods for a solution using the GR/GS64 line
of Wireless CPUs. While it is not intended to be an exhaustive coverage of the topic of
GSM SIM design, these guidelines provide factors that affect the versatility, final
quality and ease of type approval of applications using one of the GR/GS64 Wireless
CPUs.
1.1 Notation
The following symbols and admonition notation are used to draw the reader’s
attention to notable or crucially-important information.
Note
Draws the readers attention to pertinent, useful or interesting
information
NOTE
Tip
Provides advice, suggestions, guidance or recommendations which
augment the formal text
TIP
Caution
Cautionary information must be heeded, it draws the readers
attention to the need for understanding, care or watchfulness in
relation to the information provided
CAUTION
Warning
Notes marked warning must be heeded, they alert readers to
precautionary measures, risks, hazards or safety information which
directly effects equipment function, warranty or personnel safety
!
WARNING
Danger
This information must be heeded, it identifies information and
cautionary behaviour that otherwise ignored could result in
catastrophic equipment failure, bodily injury or death
DANGE
R
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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1.2 Abbreviations
Abbreviation Description
EMC Electro Magnetic Compatibility
SIM Subscriber Identity Module
1.3 SIM Types
The table below gives a list of vendors for SIM-cards, their logotype and foot prints.
Vendor Logotype Connection pattern
Axalto
GEMPlus
G&D
M-Systems
Text says “M.MAR”
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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Vendor Logotype Connection pattern
Oberthur
ORGA
1.4 Pin Connectivity
•C1: VCC
•C2: RST
•C3: CLK
•C5: GND
•C6: VPP (Only used by service provider)
•C7: IO
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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2Interfacing the SIM
This section describes how to interface the SIM and lists things to look out for when it
comes to component layout and routing. This is very important for type approval,
since the required testing is very stringent.
2.1 Insertion and removal
The SIM should preferably be inserted and removed when the module is powered off.
Removing an active SIM can permanently damage the SIM.
Removing the SIM while data is transferred can cause the loss of data
and in worst case permanently damage the SIM.
CAUTION
The SIMDET signal in the system connector can be used to indicate
whether the SIM is going to be removed if it is linked to a mechanical
lid covering the SIM-holder. The SIM can then safely be shut down
before it is possible for the user to remove it from the holder.
TIP
The best solution for the SIM is if it is mounted in a location which
requires the Wireless CPU to be powered off before accessing the SIM
is possible. One option for this is behind the battery requiring the
user to remove the battery before access to the SIM is provided.
TIP
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SIM Interface
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2.2 Schematic considerations
To make the design optimal and provide a flexible design for the type approval
process it is beneficial to add optional components.
Figure 1: Recommended component provisions
Depending on the implementation transorbs might be needed to pass EMC-tests. It is
important to realise that the inherent capacitance of the transorbs placed on SIMDAT
and SIMCLK must be very low. The transorbs used on SIMVCC and SIMRST on the
other hand can have very high inherent capacitance without causing a problem.
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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2.2.1 SIMVCC
The SIMVCC-signal has a built-in 470nF capacitor inside the Wireless CPU. This
capacitance might not be enough, and it might not add the capacitance where it is
really needed. Provision for a capacitor (CVCC) ranging between 1uF to 10uF or more
should be made available as close to the SIM-holder as possible. This will enable
easier type approval passing of the VCC and IO test cases (27.17.2.1).
Provide the capability of adding capacitance on SIMVCC as close to
the SIM-holder as possible. The pad layout should support capacitors
up to 10uF.
TIP
2.2.2 SIMCLK
The SIMCLK-line is a CMOS driver from the Wireless CPU to the application. In case
the application adds inductance in the trace from SIMCLK of the system connector to
C3 of the SIM-holder, the application might experience over and/or under shoot
problems when running test cases (27.17.2.3). This can be taken care of by adding a
series resistance as close to the system connector as possible. The resistor should be
in the 10 ohm to 100 ohm range, but the required value might differ depending on
the application implementation.
Provide the capability of adding an extra series resistor 10ohm to
100ohm close to the system connector to overcome possible over
and/or under shoot problems.
TIP
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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2.2.3 SIMDAT
The SIMDAT-line has a built-in 10k pull-up resistor implemented inside the Wireless
CPU. This pull-up resistance might not be enough to pass the IO type approval test
cases (27.17.2.5) depending on the application implementation. The application
should provide the capability of adding a pull-up resistor (RIO) from SIMDAT to
SIMVCC as close to the SIM-holder C7-pin as possible. The resistor can be in the
range from 6.8k and up. The resistance needed depends on the added capacitance
from the system connector SIMDAT-pin to the C7-pin of the SIM-holder. The CVCC
capacitor added on SIMVCC will help alleviate this problem also.
The maximum current in the SIMDAT-line is limited to 1mA peak. If
the current exceeds that, even for a very short time (ns range) the
type approval test will fail. If this happens the RIO value should be
increased.
CAUTION
Provide the capability of adding capacitance on SIMVCC as close to
the SIM-holder as possible. The pad layout should support capacitors
up to 10uF.
Also provide the capability of adding an extra pull-up resistor ≥6.8k
in case the application adds capacitance. This will improve the rise-
time.
TIP
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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3Type Approval
3.1 Electrical test cases
The electrical test cases are specified in §27.17 of the ETSI 3GPP TS 51010-1
specification. The attached link points to the 51010-1 specification archive within
ETSI.
(http://www.3gpp.org/ftp/Specs/archive/51_series/51.010-1/)
3.1.1 VCC
The SIM supply voltage is tested by the 27.17.2.1 e) test cases. If any of these test
cases fail it is most likely due to too high impedance in the trace, causing the high
voltage to go below minimum. This can be solved by adding a capacitor as close to
the SIM-holder as possible (see 2.2.1 above).
3.1.2 RST
The RST signal is tested by the 27.17.2.2 e) test cases. These should not fail.
3.1.3 CLK
The CLK signal is tested by the 27.17.2.3 e) test cases. These tests could fail due to
over and under shoot issues caused by trace inductance. This ringing can be limited
by adding a small serial resistance close to the Wireless CPU system connector (see
2.2.2 above).
3.1.4 IO
The IO signal is tested by the 27.17.2.5 e) test cases. These tests could fail due to
high capacitance caused by trace capacitance. This can be solved by adding a pull-up
resistance to SIMVCC close to the SIM-holder (see 2.2.3 above).
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable
SIM Interface
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3.2 Test connections
The SIM type approval test equipment can be connected to the application in two
different ways:
1. Paddle
2. Flying leads
The test facility will most likely perform all tests using the paddle. This is the most
realistic and easiest way to test the device. This test method does have its draw-
backs; the connections are worsened over time and if the paddle is not replaced every
so often the test cases might start to cause false failures. If this occurs it is best to
request that they use the flying lead method instead. This method entails the test
equipment to solder down onto the SIM-holder leads (soldered onto the solder pads
of the SIM-holder, not the pins on the holder that connects to the SIM-card). This
method eliminates bad connection problems of the paddle method.
GR/GS64 Application Note This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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SIM Interface
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SIM Interface
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GR/GS64 Application Note
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable
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