Wurth Elektronik MDC901-EVKHB User manual

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on the page 20 Page 1
MDC901-EVKHB
Technical Manual
MDC901 200V GaN Gate Driver Half-Bridge Evaluation Board
Integrated High-Side and Low-Side GaN Gate Driver
For the current version of this Technical Manual and accompanying
product documentation, visit mindcet.com
Scan the QR code for a direct link to the latest MDC901 documentation.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 2
WARNING: ONLY qualified personnel* should handle this board!
WARNING: Electrical Shock Hazard - Hazardous high voltage may be
present on the board during the test and even brief contact during
operation may result in severe injury or death. Follow all locally approved
safety procedures when working around high voltage.
Never leave the board operating unattended. After board is de-energized,
only first touch the board once all capacitors are discharged.
CAUTION: PCB Surfaces may become hot during operation! Do not touch
board during operation or for 10 minutes following proper power down of
the board.
CAUTION: This product contains parts that are ESD sensitive. Follow
proper ESD handling procedures when handling the evaluation board and
do not apply excessive voltages to the power supplies, the bus voltages,
signal inputs or outputs.
*Qualified personnel (skilled persons) is defined as an individual with relevant technical education, training,
or experience to enable perceiving risks and avoiding hazards occurring during use of this product (Source:
IEEE 82079-1 3.36)
For safe and proper use,
follow these instructions.
Keep them for future reference.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 3
Table of Contents
Introduction................................................................................................................................................4
Overview.....................................................................................................................................................5
Board Block Diagram ..................................................................................................................................8
Board Handling Instructions & Quick Start.................................................................................................9
Dead Time Control Conditions .................................................................................................................11
Temperature Measurements ...................................................................................................................13
EVB Operation Conditions........................................................................................................................14
Performance Evaluation...........................................................................................................................16
Storage Conditions ...................................................................................................................................17
Appendix...................................................................................................................................................18
Cautions and Warnings............................................................................................................................19
Important Notice......................................................................................................................................20
Contact Information.................................................................................................................................21

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 4
Introduction
The MDC901-EVBHB evaluation board is
designed to allow the user to simply and flexibly
evaluate the MDC901 200V GaN gate driver in a
half bridge configuration. The evaluation board
utilizes GaN System’s 100V enhancement mode
HEMTs and Würth Elektronik components. The
kit provides complete out-of-the-box testing
capabilities for quick implementation. At a PCB
size of 80x90mm², the evaluation board is
compact and is accompanied with all required
components to directly begin testing.
This Technical Manual serves the purpose in
providing the kit contents, the EVB schematics
and circuit designs, an EVB handling guide,
measurement conditions and techniques, and
board results.
Evaluation Kit Contents
To enable direct MDC901 evaluation, the evaluation kit contains the necessary hardware for out-of-the-box
testing capability. The MDC901-EVKHB includes:
Quantity
Component Description
1
MDC901-EVBHB Half-bridge evaluation board
1
Heatsink & fan assembly w/ thermal interface material
(Alpha Heatsink type FSR30-15M32-0T2S1ZL)
1
Plexiglass protection cover
4
Electric power cable w/ crimped ring connector
4
Connectors (screws, washers, and nuts)
1
Coaxial BNC cable to PWM
(BNC Plug to 0.64mm Square Pin Sockets Hirschmann
933844001)
4
M3 Spacer stud set
1
EVB Terms of Use manual
1
Reusable storage box
External Equipment
Further equipment is needed for evaluating the EVB, specifically:
Non-conductive, clean working surface
High power, high voltage DC supply
Low power, low voltage DC power supply
PWM function generator (e.g. arbitrary waveform generator)
Oscilloscope or DMM
Resistive load
Figure 1: MDC901-EVBHB 100V Half-bridge GaN evaluation board,
top view

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 5
Overview
The evaluation board (EVB) is designed in a half bridge configuration for step-down conversion. One
MinDCet MDC901 GaN gate driver is present driving two GaN Systems GS61008P 100V enhancement mode
high mobility transistors (e-HEMT).
The EVB is broken down into blocks for description purposes, as displayed in Figure 2.
MDC901 200V GaN Gate Driver
The MDC901 gate driver IC is a QFN56 7x7mm² package for precise driving of the GaN transistors.
For specifications and more information, refer to the most recent datasheet at
https://www.mindcet.com/asic-products
100V E-Mode GaN Transistors
(2) GaN Systems GS61008P enhancement mode GaN HEMTs, with a VDS rating of 100V, are present
on board as high and low side power switches in the half-bridge. The GS61008P has a size of 7.5 x 4.6 x
0.51mm³ and RDS(ON) of 8 mΩ. The GaN HEMTs leverage GaN’s properties for high power densities with high
voltage breakdown and high switching frequency.
For specifications and more information, refer to the most recent datasheet at
https://www.gansystems.com/gan-transistors/gs61008p
GaN Half-Bridge Solution Size
The entire GaN half-bridge, including the (2) GaN HEMTs, (1) MDC901 gate driver, and required
surrounding passives, has a highly compact footprint of 20x21mm².
Figure 2: EVB layout description based, labeled by key aspects

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 6
12V Fan Power Supply
The VDRM MAGI³C Power Module from Würth Elektronik provides a regulated 12V output, suppling
the fan socket as well as the MDC901 itself.
For specifications and more information, refer to the most recent datasheet at https://www.we-
online.de/powermodules
Inductor & Input/output Capacitor Bank
For direct EVB evaluation purposes, a 1.4µH Würth Elektronik inductor and the fitting input/output
capacitors were selected for a buck converter topology, designed for high current applications up to 30A
output current.
Input Pins
The Inputs table describes the jumper position for the default IC state, which is for automatic dead
time control.
Pin #
Pin Name
Default State
Function
-
ENABLE
+5V
General enable for gate driver functionality
1
MLS_sel
+5V
Digital PWM input controlling HS and LS driver functions.
See CAUTION: Dead time must be monitored by an
oscilloscope in manual dead time mode to avoid
HS/LS overlap
Four operating modes are available for MDC901 operation,
defined by MHS_sel and MLS_sel state, described in the
truth table in Table 1.
Table 1 for mode description & truth table
2
MHS_sel
GND
Digital PWM input controlling HS and LS driver functions.
See CAUTION: Dead time must be monitored by an
oscilloscope in manual dead time mode to avoid
HS/LS overlap
Four operating modes are available for MDC901 operation,
defined by MHS_sel and MLS_sel state, described in the
truth table in Table 1.
Table 1 for mode description & truth table
3
Dis_ILD
GND
Digital PWM input controlling HS and LS driver functions.
See CAUTION: Dead time must be monitored by an
oscilloscope in manual dead time mode to avoid
HS/LS overlap
Four operating modes are available for MDC901 operation,
defined by MHS_sel and MLS_sel state, described in the
truth table in Table 1.
Table 1 for mode description & truth table
4
VinHS
PWM (0/5V)
Digital PWM input controlling HS and LS drivers. Function
reflected in Table 1
5
VinLS
GND
Digital PWM input controlling HS and LS drivers. Function
reflected in Table 1
6
TgapOff_4
GND
Digital dead-time generation tuning input for feed forward
turn-on delay.
7
TgapOff_3
GND
Digital dead-time generation tuning input for feed forward
turn-on delay.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 7
8
TgapOff_2
GND
Digital dead-time generation tuning input for feed forward
turn-off delay.
9
ZVS_IN
GND
Digital input for feedforward dead-time generation. Active
high.
10
TgapOn_4
GND
Digital dead-time generation tuning input for feed forward
turn-on delay.
11
TgapOn_3
GND
Digital dead-time generation tuning input for feed forward
turn-on delay.
12
TgapOn_2
GND
Digital dead-time generation tuning input for feed forward
turn-on delay.
13
DTselect
GND
Digital input for selection of feedforward dead-time
generation. Active high.
For more information on the pin functions, refer to the MDC901 datasheet.
Output Pins
Pin #
Pin Name
Function
1
TEMPOUT
IC chip temperature (MDC901 internal sensor). Measure voltage and
calculate temperature according to Section “Temperature Measurement”
2
NTC_In
Board temperature. Measure resistance between NTC_In and NTC_Out to
calculate temperature according to Section “Temperature Measurement”
3
NTC_Out
Board temperature at NTC, placed just below MDC901. See NTC_In.
4
UVLS
Digital output, undervoltage on the LS supplies (both regulated as
preregulated supply levels). Will give a low output in case of undervoltage
condition.
5
UVHS
Digital output, undervoltage on the HS supplies (both regulated as
preregulated supply levels). Will give a low output in case of undervoltage
condition.
6
PP_Alarm
Open-drain output, for detecting push-pull errors in the gate sensing.
Active low.
7
TMGateHS
Digital signal, gate feedback of high-side driver
8
TMGateLS
Digital signal, gate feedback of low-side driver
9
VDD_LOGIC
Digital 5V linear regulator. Can drive limited external resistive loads, but
should not be loaded capacitively.
For more information on the pin functions, refer to the MDC901 datasheet.
Vin, Vbus and Vout
Vin is connected to the low voltage power supply and has an allowable input range of 15-42V. Vbus is
connected to the high power, high voltage power supply and with an intended input range of 0-48V. Vout is
the stepped down, outgoing power, connected to the (electronic) load with a voltage range of 0 to Vbus.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 8
Other Board Features
Test pin probe points are installed for Vbus, Vout, and GND for waveform and efficiency measurements. For
higher power loss situations, there is a 30x30mm² heat sink and fan assembly with thermal interface
material applied, which can be fastened to the back of the PCB using the integrated spring pin system.
Further information on operating conditions for safe handling of the EVB can be found in EVB Operation
Conditions.
Power Good indicators, which are individually labelled LEDs, signal the presence of power for the 5V supply
(to the IC), the 12V fan supply and Vbus. When the LED illuminates, voltage is present on the corresponding
supply.
Board Block Diagram
The EVB layout has been simplified to a block diagram in Figure 3 to demonstrate the primary electrical
connections on the board, centered around the functionality of the MDC901 GaN gate driver.
For the full MDC901-EVBHB schematics, please refer to the EVB Schematic section within the Appendix.
.
Figure 3: Evaluation board simplified block diagram

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 9
Board Handling Instructions & Quick Start
When operating the evaluation board for the first time, please follow the procedure to ensure safe
handling and proper EVB usage.
Before board operation, refer to the EVB Operation Conditions Section to determine whether the fan/heat
sink assembly (hereby referred to as fan assembly) is required. If yes, install fan assembly to the back of the
EVB by removing the protective film from the thermal interface material, then proceed to insert the push-
pins through the mounting holes from the EVB backside. Plug fan connector into the fan socket on PCB
front side (Figure 2, block 4) to power the fan on.
In the instance that tests are to be conducted under conditions both with and without the fan assembly, it
is highly recommended to first conduct all non-fan assembly tests followed by higher power test with the
fan assembly installed, as the thermal interface material is difficult to remove.
Figure 4: Standard EVB setup with external supply connections in automatic dead time mode
Preparations: Electrical and Mechanical Setup
1. Setup a clean and organized working environment on a non-conductive surface.
2. Setup the external equipment
a. Power supply Vbus at 0V
b. Power supply Vin at a voltage between 15V and 42V.
c. (electronic) load initialized to 0A
d. PWM generator (e.g. AWG) square wave with Vpp= 5V (high impedance)
A
V
-
+
Vin
15..42V
+
-Vbus
A
R(electronic) load
IOut DMM
Ibus DMM
VOut DMM
VVBus DMM
PWM
5Vpp
Fan supply (optional)
e.g.: 300kHz 5% duty cycle
GND
GND
GND
GND
Kelvin
GND

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 10
3. Install the plastic spacer studs in each corner of the
EVB
a. 4 cm studs on the PCB bottom side
b. 2 cm studs on the top side
4. Connect the power cables:
a. Ring terminals to the PCB using the included
bolt + washer + nut (according to Figure 5)
b. Free end to the power supply/load (with
appropriate connector on bare-end as
necessary). Vbus to high voltage power
supply, Vout to (electronic) load
5. Connect the Vin supply cable
a. Ferule to the PCB terminal block Vin
b. Banana connector to the power supply
6. Connect the coaxial cable
a. BNC connector to AWG
b. Female header to VinHS for BUCK mode
7. Install the plexiglass cover on the spacer studs
Powering Up: General-Sequence
1. Check if the desired setpoint is within the limits of temperature, current and voltage (see Dead time
Control Condition)
2. Ensure all preparations (previous section) were properly completed. (see previous section)
3. Verify the LED status
a. PG 5V: ON
b. PG 12V: ON
c. PG Vbus: OFF
4. Setup the desired jumper combinations (refer to Dead Time Control Conditions)
a. Dead-time: automatic or manual
b. Switching mode: buck/boost - synchronous/ asynchronous
c. Enable pin to 5V
5. Set the PWM signal to the desired frequency and duty cycle. (if not regulated in closed loop)
6. Increase Vbus while monitoring Vout. (only continue when the output is as expected)
7. Increase the output load current while monitoring Vout.
8. Lower Vbus and Iout back to zero when finished
Measurement Example: Buck Mode with Auto Dead-Time
1. Follow this guidance as an add-on for the previous section “powering-up: general-sequence”
2. Setup jumpers like in the image:
a. Auto dead time: DT-select=GND (pull down makes this unnecessary)
b. Buck mode: MLS_SEL=5V (MHS_SEL=GND - pull down makes this unnecessary)
3. Set the PWM frequency to 300kHz and duty cycle to 25%
4. Increase the voltage of Vbus to 48V
5. Verify whether the output voltage is 12V
6. Increase the load current up to 5A and measure Vbus, Ibus, Vout and Iout
7. Power down Vbus to 0V and the load current Iout to 0A
Figure 5: Power cables connector assembly

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 11
Power Down & Disconnect Procedure
1. Slowly power down Vbus voltage back to zero and turn off
2. Shut down the PWM function generator
3. Wait at least 5 minutes (with fan on) or 10 minutes (without fan assembly installed) after operation
for EVB to fully de-energize and cool down
4. Shut down low voltage power supply
5. Disconnect coaxial cable
6. Disconnect the power cables from high voltage supply (with supply off)
7. Disconnect the input supply (Vin) from low voltage power supply (supply is off)
8. Disconnect cables from EVB as desired (EVB can fit into storage container with cables still attached)
Essential Rules for Operation
Organize a safe environment to minimize the risk of an electric shock or fire.
Prepare your measurements by checking the graphs and calculating the expected values (see EVB
Operation Conditions)
Never leave the setup unattended
Never disable the external PWM while Vbus is high
Immediately switch off Vbus when safety limits are exceeded
Measuring the temperature of the chip and board is a highly recommended safety feature
The Vbus input voltage should never exceed 100V including ringing!
Helpful Information
The converter exemplifies the best performance in the 100kHz to 1MHz switching frequency range
A 0% or 100% duty cycle are non-switching situations of conversion
Perform tests first without the heat sink/fan assembly heat sink as removal of the heat sink after
installation may damage the thermal adhesive
Automatic dead-time is conservative and results in a higher power loss compared to a well-tuned
manual dead time
Manual dead time requires user verification by oscilloscope measurements
Powering down Vbus with an active load current may de-energize quicker as the capacitors are
drained
Dead Time Control Conditions
The MDC901 has different built-in dead time control options for optimizing device performance for high
efficiency.
Automatic Dead time
The default jumper positions described in the Default State column of the Input Pins table provides the
configuration for automatic dead time. This mode will monitor the gate voltages of HS respectively LS
switches, to guarantee a break-before-make operation of HS and LS GaN transistor. In this condition the
dead time is ensured, but cannot be controlled, and is longer than what can be achieved in manual dead
time mode.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 12
Manual Dead time Selection
CAUTION: Dead time must be monitored by an
oscilloscope in manual dead time mode to avoid
HS/LS overlap
Four operating modes are available for MDC901 operation, defined by MHS_sel and MLS_sel state,
described in the truth table in Table 1.
Table 1: Truth table for mode selection
mode
select
synch/async
buck/boost
sync buck
PWM=VinHS
sync boost
PWM=VinLS
transparent
VinLS &
VinHS
MHS_sel
0
0
1
1
MLS_sel
0
1
0
1
Figure 6: Synchronous buck mode example with placed jumpers
Figure 6 displays an example of the EVB configured for manual dead time in synchronous buck mode
(determined by the MHS_sel and MLS_sel state, as well as the jumpers on
disILD and DTselect according to Table 1).
TgapOn is the time between the LS falling and HS rising as shown here:
TgapOff is the reverse situation to TgapOn from HS off to LS switching on.
DTselect
+9ns
TgapOn2
+18ns
TgapOn3
+36ns
TgapOn4
ZVSin
+9ns
TgapOff2
+18ns
TgapOff3
+36ns
TgapOff4
VinLS
VinHS
disILD
MHS_sel
MLS_sel
PWM
Placed
jumpers
LS HS
HS LS
TgapOff=2.8ns + …
TgapOn=2.8ns + …

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 13
The input pins jumper positions for TgapOn<2:4>, and TgapOff<2:4> determine the respective total dead
time according to the following equations:
        
       
Where Table 1Table 2 defines the amount of dead time for each pin input.
Table 2: Dead time adjustment variable values
The listed TgapOn/Off dead time adjustment values are theoretical and can differ to experimental results.
For the example in Figure 6, the placed jumpers result in a dead time of TgapOn=2.8ns + 9ns=11.8ns and
TgapOff=11.8ns.
Temperature Measurements
In addition to the on-board temperature sensor of the MDC901 IC, the evaluation board offers a second
temperature measurement point in the proximity of the MDC901 IC and GaN HEMTs. The board
temperature sensor is a NTC thermistor placed just below the MDC901, serving as a confirmation point of
the IC temperature and provides insight into the GaN half-bridge temperature.
For the board temperature, measure the resistance (R) of the 4k7 thermistor with a high impedance
(>100MΩ) DMM between output pins 2 and 3.
The following equation converts the measured resistance value R to temperature:
Pin State
TgapOn2 /TgapOff2
TgapOn3/TgapOff3
TgapOn4/TgaOff4
+5 / open
9ns
18ns
36ns
GND
0ns
0ns
0ns
  
󰇡
󰇢 
󰇟󰇠

Ω
 
Figure 7: Board and internal IC temperature sensing measurement

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 14
The gate driver IC temperature is calculated based on the measured voltage between output pin 1 and
GND, according to:
EVB Operation Conditions
Operating conditions are conditions under which operation of the EVB is intended to be functional.
Safe usage: total power loss (Ploss) to prevent overheating and damage to EVB
Ploss= 26W max WITH heatsink+fan
Ploss= 6W max WITHOUT heatsink
CAUTION: First confirm Ploss levels at lower operating conditions,
then continue to higher power levels / switching frequencies
Parameter
Symbol
Min.
Recommended
Max.
Unit
Notes
Vin
15
42*
V
Vbus
0
-
50
V
Absolute max of 100V including
ringing
Fsw (PWM)
0
100 to 1000
1000
kHz
Iout
0
-
30
A
Board temperature
-
-
90
°C
Do not exceed 90°C on any
component under operating
conditions
All voltage values are referenced respective to GND.
Inductor losses
The power inductor used in the MDC901-EVBHB board is a Würth Elektronik type 7443630140, with a
saturation current of 60A.
Depending on the operating conditions used on the EVB, the inductor will exhibit AC power losses,
depending on DC and AC current conditions, which will also contribute to the overall dissipation on the
board.
This inductor was characterized using the MADMIX system. Figure 8 depicts the losses depending on the
frequency and ripple current.
The ripple current will depend on the following equation (is the duty cycle).
 󰇛  󰇜

   
 󰇟󰇠
Pin=VBus * IBus
Pout = VOut * IOut
Ploss = Pin - Pout

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 15
Based on the ripple current and the graph in Figure 8, the AC losses can be determined. The DC losses are
Joule losses, defined by
  
Figure 8: AC losses of the power inductor on the EVB
Figure 9 depicts the inductor losses in a few typical applications, Vbus =48V +- 25% to Vout = 3.3V & 12V
Figure 9: AC losses of the power inductor on the EVB in a few typical conversion ratio applications
0,1
1,0
1,E+05 1,E+06 1,E+07
Pac [W]
frequency [Hz]
measured AC power loss of 1.4 µH WE 7443630140
0,1
1
10
1,E+05 1,E+06
Pac [W]
frequency [Hz]
60V to 12V
48V to 12V
36V to 12V
60V to 3.3V
48V to 3.3V
36V to 3.3V

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 16
Performance Evaluation
Electrical &Thermal Results
EVB performance was evaluated in a step-down conversion of 48 to 12 V application, sweeping over a
switching frequency range from 300 to 700 kHz and an output current (Iout) from 0.5 A to 30 A, with the
heatsink attached and fan turned on.
Efficiency
Peak efficiency is obtained at 500kHz, at 96.5%, keeping the output voltage constant at 12V.
Power Losses
The efficiency can be represented by the power loss value, which is key in defining the board operating
range and the necessity of installing the heatsink and fan assembly.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 17
MDC901 Die Temperature
The MDC901 die temperature can be monitored during efficiency measurements, as described in
Temperature Measurements.
Storage Conditions
The EVB is best stored in the original packaging under room temperature with dry conditions. After testing
and proper de-energizing/cool-down time, the EVB can be placed in the large compartment of the foam
insert (the EVB spacer studs align with the holes in the foam to better secure the EVB during storage and
transportation). Normal ESD handling precautions, including for storage, apply.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 18
Appendix
EVB Schematic
Bill of Materials
Available upon request, please contact [e-mail]
PCB Design / Gerber Files
For assistance in accelerating the design-in phase, the EVB layout files are available upon request. For the
most recent version, please contact [email protected]

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 19
Cautions and Warnings
The following conditions apply to all goods within the product series of MinDCet NV
General:
All recommendations according to the general technical usage and specifications of this guide have to be complied with.
The usage and operation of the product within ambient conditions which probably alloy or harm the component surface
has to be avoided.
The responsibility for the applicability of customer specific products and use in a particular customer design is always
within the authority of the customer. All technical specifications for standard products do also apply for customer
specific products.
Residual washing varnish agent that is used during the production to clean the application might change the
characteristics of the body, pins or termination. The washing varnish agent could have a negative effect on the long-
term function of the product.
Direct mechanical impact to the product shall be prevented as the material of the body, pins or termination could flake
or in the worst case it could break. As these devices are sensitive to electrostatic discharge customer shall follow proper
IC Handling Procedures.
Customer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-
related requirements concerning its products, and any use of MinDCet NV components in its applications,
notwithstanding any applications-related information or support that may be provided by MinDCet NV. Customer
represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate
dangerous consequences of failures, monitor failures and their consequences lessen the likelihood of failures that might
cause harm and take appropriate remedial actions. Customer will fully indemnify MinDCet NV and its representatives
against any damages arising out of the use of any MinDCet NV components in safety-critical applications.
Product specific:
Follow all instructions mentioned in the MDC901 datasheet and this technical manual, especially:
All products are supposed to be used before the end of the period of 12 months based on the product date-code.
Violation of the technical product specifications such as exceeding the absolute maximum ratings will void the
warranty. It is also recommended to return the body to the original packaging (ESD bag) and reseal the package.
ESD prevention methods need to be followed for manual handling and processing by machinery.

MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com
Attention: Please refer to Evaluation Kit Important Notice on page 20 Page 20
Important Notice
The Technical Manual is based on our knowledge and experience of typical requirements concerning these
areas. It serves as general guidance and should not be construed as a commitment for the suitability for
customer applications by MinDCet NV (hereafter referred to as MDC). The information in the Application
Note is subject to change without notice. This document and parts thereof must not be reproduced or copied
without written permission, and contents thereof must not be imparted to a third party nor be used for any
unauthorized purpose. MinDCet NV and are not liable for application assistance of any kind. Customers may
use MDC’s assistance and product recommendations for their applications and design. The responsibility for
the applicability and use of MDC Products in a particular customer design is always solely within the authority
of the customer. Due to this fact it is up to the customer to evaluate and investigate, where appropriate, and
decide whether the device with the specific product characteristics described in the product specification is
valid and suitable for the respective customer application or not. The technical specifications are stated in
the current datasheet of the products. Therefore the customers shall use the datasheets and are cautioned
to verify that datasheets are current. The current data sheets can be downloaded at www.mindcet.com.
Customers shall strictly observe any product-specific notes, cautions and warnings. MDC reserves the right
to make corrections, modifications, enhancements, improvements, and other changes to its products and
services. MDC DOES NOT WARRANT OR REPRESENT THAT ANY LICENSE, EITHER EXPRESS OR IMPLIED, IS
GRANTED UNDER ANY PATENT RIGHT, COPYRIGHT, MASK WORK RIGHT, OR OTHER INTELLECTUAL PROPERTY
RIGHT RELATING TO ANY COMBINATION, MACHINE, OR PROCESS IN WHICH MDC PRODUCTS OR SERVICES
ARE USED. INFORMATION PUBLISHED BY WE REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE A LICENSE FROM MDC TO USE SUCH PRODUCTS OR SERVICES OR A WARRANTY OR
ENDORSEMENT THEREOF. MDC products are not authorized for use in safety-critical applications, or where
a failure of the product is reasonably expected to cause severe personal injury or death. Moreover, MDC
products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear
control, submarine, transportation (automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network etc. Customers shall inform MDC about the intent
of such usage before design-in stage. In certain customer applications requiring a very high level of safety
and in which the malfunction or failure of an electronic component could endanger human life or health,
customers must ensure that they have all necessary expertise in the safety and regulatory ramifications of
their applications. Customers acknowledge and agree that they are solely responsible for all legal, regulatory
and safety-related requirements concerning their products and any use of MDC products in such safety-
critical applications, notwithstanding any applications-related information or support that may be provided
by MDC. CUSTOMERS SHALL INDEMNIFY MDC AGAINST ANY DAMAGES ARISING OUT OF THE USE OF MDC
PRODUCTS IN SUCH SAFETY-CRITICAL APPLICATIONS.
The following conditions apply to all goods within the product range of MinDCet NV:
1. General Customer Responsibility
Some goods within the product range of MinDCet NV contain statements regarding general suitability for certain
application areas. These statements about suitability are based on our knowledge and experience of typical
requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about
the suitability for a customer application. The responsibility for the applicability and use in a particular customer design
is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where
appropriate to investigate and decide whether the device with the specific product characteristics described in the
product specification is valid and suitable for the respective customer application or not. Accordingly, the customer is
cautioned to verify that the datasheet is current before placing orders.
2. Customer Responsibility related to Specific, in particular Safety-Relevant Applications
It has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end
of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated
within the range of the specifications. In certain customer applications requiring a very high level of safety and especially
in customer applications in which the malfunction or failure of an electronic component could endanger human life or