Yamaha EMX 2000 User manual

POWERED MIXER
£^2000
SERVICE MANUAL
CONTENTSC g
SPECIFICATIONS(f^^^tt^) 2
PANELLAYOUT(/\':f;H/^7'5 F) 6
CIRCUIT BOARD LAYOUT(H-'> K) 9
DIMENSIONS(^;iil) 9
BLOCK DIAGRAM &LEVEL DIAGRAM
(7"P 'y 77"7A) 10
DISASSEMBLY PROCEDURE 11
1C BLOCK DIAGRAM(IC7"P 7^Hl) 13
CIRCUIT BOARDS('>- FKISil) 14
INSPECTIONS 20
PARTS LIST
,
,YAMAHA CORP.
PA 011386 HAMAMATSU, JAPAN
1.95K-998 ®Printed in Japan ’97.12
19971220 -128000

EMX2000
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-
stood by the users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may result in per-
sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.
IMPORTANT: This presentation or sale of this manual to any individual or firm does not constitute authorization, certifi-
cation, recognition of any applicable technical capabilities, or establish aprincipal-agent relationship of
any form.
The data provided is belived to be accurate and applicable to the unitls) indicated on the coyer. The research engineering, and
service departments of Yamaha are continualiy striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor's Service Division.
WARNING: Static discharges can destroy expensive components. Discharge any static electricity you body may have
accumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to
this buss.)
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
to the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COD/IPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!
Avoid proionged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handiing
food.
WARNING
Components having special characteristics are marked ^and must be replaced with parts having specification equal
to those originally installed.
1

EMX2000
SPECIFICATIONS
•General specifications
Maximum output power STEREO: 200 W+200 W/4£l @0.5% THD at 1kHz
BRIDGE: 400 W/80 @0.5% THD at 1kHz
20 Hz~20 kHz +1 dB, -3 dB
@1Woutput into 8Q
(SPEAKER OUT)
All channel Gain controls at minimum.
Frequency response 20 Hz~20 kHz +1 dB, -3 dB
@+4 dB output into 6000
(ST OUT. MONO OUT, EFFECT
SEND, MONITOR OUT)
All channel Gain controls at minimum.
Less than 0.5% @20 Hz~20 kHz, 100 Woutput into 40 (SPEAKER OUT)
Total harmonic distortion Less than 0.3% @20 Hz~20 kHz, +1 4dB output into 6000
(ST OUT, MONO OUT, EFFECT SEND, MONITOR OUT)
-1 28 dB equivalent input noise
-63 dB residual output noise (SPEAKER OUT)
-95 dB residual output noise (ST OUT, MONO OUT, EFFECT SEND, MONITOR OUT)
Hum &noise -87 dB ST master/MONO master fader at maximum level and all
(Average, Rs=150O) (ST OUT, MONO OUT) channel fader at minimum.
(with 20 Hz~20 kHz BPF) -64 dB (68 dB S/N) ST master/MONO master fader and 1channel fader at maxi-
(ST OUT, MONO OUT) mum level. And 1channel Gain control at maximum.
-80 dB Master fader at maximum level and all channel level controls
(EFFECT SEND, MONITOR OUT) at minimum.
91 dB MIC IN to SPEAKER OUT (CH 1~8)
64 dB MIC IN to ST OUT (CH 1-8)
Maximum voltage gain 38 dB LINE IN to ST OUT
38 dB ST IN to ST OUT (CH 1~8)
(CH9/10, 11/12)
70 dB MIC IN to EFFECT SEND (CH 1~8)
64 dB MIC IN to MONITOR OUT (CH 1~8)
Crosstalk at 1kHz -70 dB adjacent input, -70 dB input to output
MIC IN gain control 44 dB variable
HIGH 10 kHz shelving*
Input channel equalization MID 2.5 kHz peaking
LOW 100 Hz shelving*
*Turn over/roll off frequency of shelving: 3dB below maximum variable level.
Meters 13 points LED meter
CH peak indicators Red LED on each channel Ills when POST EQ signal reaches the level -3 dB below clipping.
Limiter Comp. :THD>0.5%
LIMIT indicators Lit when THD>0.5%
Graphic equaiizer 7bands (125, 250, 500, Ik, 2k, 4k, 8k Hz), +12 dB Maximum
Internai digitai effect 16 programs
Foot switch Digital effect mute: on/off
Phantom power +48 Vis supplied to electrically balanced inputs.
Option FC5
USA and Canada 120 V AC 60 Hz
Power requirement Europe 240 VAC 50 Hz
Other 230 VAC 50 Hz
Power consumption 210W
Dimensions (WxHxD) 480x125x454 mm
Weight 14 kg
2

EMX2000
•Input specifications
Input terminals Gain
trim
Actuai load
impedance
For use with
nominal
Input level
Connectors on mixer
Sensitivity^ Max. before dip
MIC INPUT
(1-8)
MAX
MIN 5kn 50~600n Mies -60 dB (775 pV)
-16 dB (123 mV)
-40 dB (7.75 mV)
+4 dB (1.23 V) XLR-3-31 type^
LINE INPUT
(1-8)
MAX
MIN 50 kO 600Q Lines -34 dB (15.5 mV)
+10 dB (2.45 V)
-14 dB (155 mV)
+30 dB (24.5 V) PHONE JACK (TRS)2
ST INPUT
(9-12)
MAX
MIN 10 kO 6000 Lines -34 dB (15.5 mV)
+10 dB (2.45 V)
-14 dB (155 mV)
+30 dB (24.5 V) PHONE JACK^
ST SUB IN (1,2) 10 kO 6000 Lines +4 dB (1.23 V) +20 dB (7.75 V)
TAPE IN (L, R) 10 kn 6000 Lines -10 dBV (316 mV) +10 dBV (3.16 V) PHONO JACK
CH INSERT IN (1-4) 10 kO 6000 Lines 0dB (775 mV) +20 dB (7.75 V) PHONE JACK (1/0)3
POWER AMP IN (L, R) 10 kO 6000 Lines +4 dB (1.23 V) +18 dB (6.16 V) PHONE JACK®
1.Sensitivity is the lowest level that can produce an output of +4 dB (1.23 V) or the nominal output level when the unit is set at maximum gain.
2. XLR type connectors and PHONE JACKS (TRS) (T=HOT, R=COLD, S=GND) are balanced.
3. PHONE JACKS are unbalanced.
•In these specifications when dB represents aspecific voltage, 0dB is referenced to 0.775 Vrms, 0dBV is referenced to 1Vrms.
•Output specifications
Output terminal Actual source
impedance For use with
nominal
Output level Connectors on
mixer
Nominal Max. before cliping
STOUT1,2(L7R) 75fi 6000 Lines +4dB(1.23 V) +20 dB (7.75 V)
PHONE JACK^
MONO OUT 750 6000 Lines +4 dB (1.23 V) +20 dB (7.75 V)
EFFECT SEND 750 6000 Lines +4 dB (1.23 V) +20 dB (7.75 V)
MONITOR OUT 1,2 750 6000 Lines +4 dB (1 .23 V) +20 dB (7.75 V)
REC OUT (L/R) 6000 10 kO Lines -10 dBV (31 6mV) +10 dBV (3.16 V) PHONO JACK
CH INSERT OUT (1-4) 6000 10kO Lines 0dB (775 mV) PHONE JACK^
PHONES/
C. R.OUT
for PHONES 1000 400 Phones 3mW ST PHONE JACK^
for C. R. OUT 10 kO Lines +4 dB (1.23 V) +20 dB (7.75 V)
SPEAKER OUT 1,2 (L/R) 0.10 4/80 Speaker 200 W/40 200 W/40 PHONE JACK^
BRIDGE OUT 0.10 80 Speaker 400 W/80 400 W/80
1.PHONE JACKS are balaned.
•In these specifications when dB represents aspecific voltage, 0dB is referenced to 0.775 Vrms, 0dBV is referenced 1Vrms.
Specifications are subject to change without prior notice.
3

EMX2000
/^A&y -T X'
(Rs=150O, 20Hz~20kHz BPF)
h-^dkHz)
MIC hp-;k
A* 5" +>-ik-r P7-f
IJ 5,^ ^-
LIMIT-f >V'r-‘5‘-
'J-y'7 <
77k^-f 75^
7r >kA^S
t~fy 3>
A^WJvl-S(WXHXD)
stereo: 200W+200W/4Q @0.5% THD (1kHz)
bridge: 400W/8Q @0.5% THD(lkHz)
20Hz~20kHz +1 dB, -3dB @1 W, 8Q
(SPEAKER OUT)
20Hz~20kHz +1dB, -3dB @+4dB, 600 Q
(ST OUT, MONO OUT, EFFECT SEND, MONITOR OUT) kP-Jk:®/J'.UA.Uk
<0.5% @20Hz~20kHz, 100W, 4D (SPEAKER OUT)
<0.3% @20Hz~20kHz. +14dB, 6000 (ST OUT, MONO OUT, EFFECT SEND, MONITOR OUT)
-128dBA*^K7 <X\-63dB^® 7<X'(SPEAKER OUT)
-95dB^S7 <A(ST OUT, MONO OUT, EFFECT SEND, MONITOR OUT)
-87dB
(ST OUT, MONO OUT)
-64dB
(68dB S/N)
(ST OUT, MONO OUT)
ST/M0N0vX^f-7i-^T-:ftAU^7k
+># .Ik7 I—:g/J\ UA.VU
ST/MONOV77-7I-;i/
i9^ +>t~-'k'ir'r>p> kP--'k:gAu-x;i/
77 7-7I-
-80dB
(EFFECT SEND, MONITOR OUT)
91dB MIC IN-SPEAKER OUT (CHI ~8)
64dB MIC IN-ST OUT (CH1~8)
38dB LINE IN-ST OUT (CH1~8)
38dB ST IN-ST OUT (CH9/1 0,11/1 2)
70dB MIC IN-EFFECT SEND (CHI-8)
64dB MIC IN-MONITOR OUT (CHI -8)
70dBA*CHFa1.70dBAtti*rBl
44dBoJ^
HIGH 10kHzvi>(kfc:'>77'f 7"
MID 2.5kHz t’- 4>77 -ry
LOW 100Hzvi-'kt:'>77'f 7
*'>i/Lb:'>77'f7’W7->^-/<-/P-/k^7|l)i!fSi:gA^^ilCj#U3dB
T*''-3/cd<'f >k
13^< >kLED7-7-
+>t-/KD<K7 kEQff^)!)A7 U77t'>7^HU-3dBi::T#lC;^n-
P>7’:THDS0.5%
7|->:THDS0.5%
7/N" >k' (1 25, 250, 500, 1k, 2k, 4k, 8kHz)
wAc[r^'li±12dB
XV 7/n 7i7 kSa. —k:^ >X^
7
+48V(/\'7>7A*)
100V AC 50/60HZ, 200W
480X125X454mm

EMX2000
•Atiitm
(f-T >
h'JA A* >' 5AJL A*L- a: JL 34; ^5! -
g*7>7U7T’L'A'Jl/
MIC INPUT
(1~8)
MAX 5k fi 50—6000 Mies -60dB(775/iV) -40dB(7.75mV) XLR-3-31 5; T
MIN -16dB(l23mV) +4dB (1.23V)
LINE INPUT
(1~8)
MAX 6000 Lines -34dB(15.5mV) -14dB(155mV) 7t>9’-vy?(TRSy
+1OdB(2.45V) +30dB (24.5V)
ST INPUT
(9~12)
MAX 10kQ 6000 Lines -34dB(15.5mV) -14dB(155mV)
MIN +1 OdB(2.45V) +30dB (24.5V)
ST SUB IN(1, 2) 10kO 6000 Lines +4dB (1.23V) +20dB (7.75V)
TAPE IN (UR) -10dBV(316mV) +10dBV (3.16V) RCAe>->'+ y7
CH INSERT IN(1~4) 10kO 6000 Lines 0dB(775mV) +20dB (7.75V) 74->-»y 5'(l/0)3
POWER AMP IN(L/R) 10kQ 6000 Lines +4dB(1.23V)" +18dB(6.16V)
1. xnmm^±y'!
2.
3. r>.'''9>;^i!
4. POWER AMP IN VRtIi^MAX (+4) CO#-*-
•OdB =0.775Vrms, OdBV=1Vrms
w* a*ua:
yi~j\'
ST OUT 1,2 (UR) 750 6000 Lines +4dB (1.23V) +20dB (7.75V)
74->'»y7'
MONO OUT 750 6000 Lines +4dB (1.23V) +20dB (7.75V)
EFFECT SEND 750 6000 Lines +4dB (1.23V) +20dB (7.75V)
MONITOR OUT 1,2 750 6000 Lines +4dB (1.23V) +20dB (7.75V)
REC OUT(L/R) 6000 lOkO Lines -10dBV(316mV) +10dBV(3.16V) RCAfV-y-f y7
CH INSERT OUT (1-4) 6000 lOkO Lines 0dB(775mV) +20dB (7.75V) 7T>'»y7'
PHONES/C. R. OUT for PHONES
for C. R. OUT 100Q 400 Phones 3mW lOOmW ST7 T>'7+ y7'
lOkO Lines +4dB (1.23V) +20dB (7.75V)
SPEAKER OUT 1,2 (UR) 0.1 Q4/80 Speaker 200W/40 200W/40 7.>-»y7'
BRIDGE OUT 0.10 80 Speaker 400W/8Q 400W/80
1.
•0dB=0.775Vims, OdBV=lVrms.
ip“p^iity£ LTv> tto
5

EMX2000
PANEL LAYOUTC/N^T-^H/^J-^ h)
•Front panel(7 P>

EMX2000
®GAIN control
@A/B switch (Channels 9/10~11/12 only)
(D PEAK indicator
®Equalizer controls (HIGH, MID, LOW)
(D Monitor 1/2 controis (MON1 1/2)
(D Effect controi (EFFECT)
@PAN (panpot) control (Channels 1~8)
®BAL (balance) control (Channels 9/10~11/12)
®PFL (pre-fader listen) switch
®Channel fader
dJ) MON1 1(monitor 1) control
®MONI 2(monitor 2) control
®ST (stereo) control
(0 PFL (pre-fader listen) switch
©MON1 1(monitor 1) fader
®MONI 2(monitor 2) fader
®EFFECT fader
©ST 1(stereo 1) fader
©MONO (monaural) fader
®AFL (after fader listen)
@ST (stereo) controi
®PFL (pre-fader iisten) switch
©MONi 1/2 (monitor 1/2) control
®ST (stereo) control
©Effect selector
®ON switch
®Effect controi
©Graphic equaiizer
©ON switch
®LIMITER indicator
®LEVEL controis
©Power amp select switch
©Peak level indicator
@POWER indicator
®PHANTOM (+48V) switch and indicator
®PHONES/C.R.OUT (headphones/controi
room out) control
®ST 2(stereo 2) control
©GAIN =]>hP-;u
11/12
©PEAK (HIGH, MID, LOW)
®MONI 1/2 (=E-^-l/2) =]>hP-;u
©EFFECT (I7i^^h) =l>FP-;i/
©PAN (/\°>) P>hP-/l/
©BAL (/\'7>7) (^ +>4^/l/9/10~ 11/12)
©PFL {-y'jy
©MONM (^“7-1) P>hP-/l/
©MONI2 (^-7-2) P>FP-;i/
©ST (7-T-U:t) P>LP-;i/
0PFL (7°U7i-7'-';'y7»
©MONM (^-^-1) 7i-^r-
©MONI2 (^-7-2) 7i-7'-
©EFFECT (I7i7h) 7i-5r'-
©ST1 (X7^U:t1)
©MONO (^7 7/1/) 7i-4/-
©AFL (Ty^-7x--Si‘-'JyX»
©ST (XxUt) P> KP-/1/
©PFL {zf'J7x-‘$^-'Jy7»
©MONI 1/2 {^-7-V2) P>hP-/U
©ST P>hP-;u
©X7i7 h-trU77-
©ON U»
@X7i7 FP> hP-;u
@ON (t»
©LIMITER 7-
©LEVEL p^FP-;!/
®/'(7-y>7°mm7'r'y^
©POWER'Oy-J— 7-
©PHANTOM (+48V)
©PHONES/C.R.OUT (^y K7 >/P >FP-;L
;u-A7’7 F) p> FP-/U
®ST2 (XxU:t2) P>FP-/F
7

EMX2000
•Rear Panel OJ
0SPEAKERS(speaker output)jacks ©SPEAKERS (X
©POWER switch ©POWER X-T -y 5^
•Input/Output Panel(-< >7°'X h/7'i’
0Channel input jacks (MIC, LINE) 1~8
©INS I/O (insert) jacks 1~4
©Channel input jacks 9~12A
Channel input jacks 9~12B
0ST SUB 1(stereo sub 1) jacks
ST SUB 2(stereo sub 2) jacks
®TAPE jacks
®P.AMP IN (power amp input) jacks
©REC (record) jacks
®ST 1(stereo 1)jacks
ST 2(stereo 2) jacks
®MON1 1(monitor 1) jack
MONI 2(monitor 2) jack
®MONO (monaural) jack
©EFFECT jack
®PHONES/C-R OUT
(headphones/control room out) jack
®FOOT SW (foot switch) jack
(MIC> LINE) 1~8
©lNSI/0 (OD— h)
©^-^ 9~12 A
9~12 B
0STSUB1 (XxU7j-9-:?'1)
ST SUB 2(XxU^-9-72)
©TAPE (7-7°)
©P.AMP IN (/n°7-7>7'A*)
©REC (m-K)
©ST1 (X7U^1)
ST2 (X7U^2)
©MONI 11)
MONI 2(^-^-2)
©MONO (^7 7/U)
©EFFECT (i7i7Ktii*) mJ-
©PHONES/C-R OUT
(A7 K77t->/3> l'P--'l'/l'-A77
©FOOTSW (X-yFX^'y^^)

EMX2000
CIRCUIT BOARD LAYOUT(ZL- y
DIMENSIONS('1';£li])
W: 480 Unit ;mm

EMX2000
BLOCK &LEVEL DIAGRAM (7 7^T<f^Jx)
10

EMX2000
DISASSEMBLY PROCEDURE
1.MAIN Circuit Board
1-1. Remove the six (6) screws marked [90] and the six (6)
screws marked [100]. Then the panel assembly can be
removed. (Figl)
1-2. Remove the six (6) screws marked [P70]. Then the
shield plate can be removed. (Fig. 2,Fig, 3,Fig. 4)
1-3. Remove the all knobs from the panel assembly. (Fig.l)
1-
4. Remove the eighteen (18) screws marked [P50], the
fourteen (14) screws marked [P40] and the thirty-two
(32) hexagonal nuts marked [A]. Then the MAIN
circuit board can be removed. (Fig. 1
)
2. DSP Circuit Board
2-
1. Remove the panel assembly. (See procedure 1-1)
2-2. Remove the four (4) screws marked [P210]. Then the
shield cover of the DSP circuit board can be removed.
(Fig. 4)
2-3. Remove the two (2) screws marked [PI 70]. Then the
DSP circuit board can be removed. (Fig. 4)
1. MAIN h
1-1. [90](D^'y 64^t[100]CO:^'y Panel
Ass’y (01)
1-2. [P70](D^ V6^4-^1-LT. 'y-JU
Lite (02, 03, 04)
1-3. PanelAss’yOy (0 I)
1-
4. [P50]C0^->' l8$i: [P40]cO;7^ V14;$:^ [A]tf0/^:^
t-y hi: 32e^^!1-LT MAIN v-
tto (01)
2. DSP h
2-
1. PanelAss’y (1-1 S#M)
2-2. [P210]COT-v 4^:^^LT, DSP
(04)
2-3. [P170]COTv2^*;Sfi.LT, DSP
h
i) ^
Ltto (04)
[A] :Hexagonal Nut(A^:^ 7h)
[90] :Bind Head Tapping Screw-B 3.0X6
MFZN2BL(EP600230)-l-M'-r> KB^'T h
[P40] :Flat Head Tapping Screw-B 3,0X25
MFZN2BL (VV069200) -FlfflB 4h
[P50] :Bonding Tapping Screw-B 3.0X8
MFZ2BL(VN413300)#>x-f h
(Fig. 1)
MFZN2BL(EP600230)-f-A'f >KB^"f F
[P210] ;Bind Head Tapping Screw-B 3.0X6
MFZN2BL(EP600230)+/H> KB^rT F
(Fig. 4)
[1 00] :Bind Head TApping Screw-B 403X8
MFZN2BL(E6340290)
[P170] ;Bind Head TApping Screw-B 3.0X6
MFZN2BL(EP600230)-F/W> F'B^rT F
(Fig. 3)
[B50] :Bind Head Screw SP3.0X8
MFZN2Y(E6330290)+/W >
[B60] :Bind Head Screw SP3.0X12
MFZN2Y(VB76800)-F/':'I' >F'd'Y- v
[B1 10A]1 :Bind Head Tapping Screw-B 3.0X6
[B110B]] MFZN2Y(EP600230)+M--T >K
(Fig. 5)

EMX2000
3. POWER 1/5 Circuit Board
3-1. Remove the panel assembly. (See procedure 1-1)
3-
2. Remove the fifteen (15) screws marked [B60] and the
four (4) screws.marked [B50]. Then the POWER 1/5
circuit board can be removed. (Fig.5)
4. POWER 2/5 Circuit Board
4-
1. Remove the panel assembly. (See procedure 1-1)
4-
2. Remove the screw marked [R30A] and the five (5)
hexagonal nuts marked [B]. Then the POWER 2/5
circuit board can be removed. (Fig. 6)
5. POWER 3/5 Circuit Board
5-
1.Remove the panel assembly. (See procedure 1-1
)
5-2. Remove the POWER 2/5 circuit board. (See procedure
4-2)
5-
3. Remove the two (2) screws marked [R30B]. Then the
POWER 3/5 circuit board can be removed. (Fig. 7)
6. POWER 4/5 Circuit Board
6-
1.Remove the panel assembly. (See procedure 1-1
)
6-2. Remove the screw marked [BllOA]. Then the
POWER 4/5 circuit board can be removed. (Fig. 5)
3. POWER 1/5 h
3-1. Panel Ass’y (1-1
3-
2. [B60]OT<i/ 15 ^[B50] (7) T' v4
POWER 1/5 1-0 (0 5)
4. POWER 2/5 *>-
F
4-
1. Panel Ass’y S-fX 051- LSto (1-1
4-
2. [R30]cOt'>'lt^i;[B]<7)7’^:ftt 7^^5fl51- LT.
POWER2/5 V- hS-fX“)51-LSto (0 6)
5. POWER 3/5 '>-h
5-
1. Panel Ass’y 1)51- LS to
5-2. POWER 2/5 ^®1) 51- LSto(4-2 :®#M)
5-
3. [R30](7)tv 2tl4r51-L7:, POWER 3/5
(07)
6. POWER 4/5
6-
1. PanelAss’y ^fXl)51-LSto (l-\
6-2. [B110]Ot V1t:^51-tt, POWER 4/5 b^
mALt-fo (05)
7.
POWER 5/5 Circuit Board
7-1. Remove the panel assembly. (See procedure 1-1)
7-2. Remove the screw marked [BllOB]. Then the
POWER 5/5 circuit board can be removed. (Fig. 5)
8.
POWER Transformer
8-1. Remove the panel assembly. (See procedure 1-1)
8-2. Remove the center bolt of the power transformer.
Then the power transformer can be removed. (Fig. 5)
•Rear Assembly(outside view)
7’Ass'y<i'Mi>
[B] ;Hexagonal Nut(7\^7-y b)
[R30A] :Bonding Tapping Screw-B 3.0X8
MFZN2BL(VN413300)*'>7-'<>^B^f'f b
(Fig. 6)
•Rear Assembly(inside view)
U7Ass'y<[*3li)
[R30B] :Bonding Tapping Screw-B 3.0X8
MFZN2BL(VN413300)#>x-f >yB^^'f b
(Fig. 7)
7. POWER 4/5 '>~h
7-1. Panel Ass’y 1) 51- Ltto (1-1
7-
2. [BllOlOtv 1:$:S•51L.-C^ POWER5/5 V-b
mALt-fo (05)
8. POWER
8-
1. Panel Ass’y *lfXl)51-L4to (1-1
8-2. b^51- LPOWER byV)AL tto
(0 5)
Instaiiation of Transformer( bv VXiT)®!#)
REAR
side.
(ZEA'e>3#icoii®(?!itfe)«7P> b:^[S]'^isnt5)
12

EMX2000
1C BLOCK DIAGRAM (IC7 P7
•NJM2082L (XN796A00)
•NJM4556AL (XP844A00)
•NJM4558L (XM922A00)
•AJM4580L (XF195A00)
Dual Operational Amplifier
OUT -IN »IN -V *IN -IN OUT »V
AAA 8 B H'
•M5229P (XG203A00)
7SEGMENTS GRAPHIC EQUALIZER
Vcc
QND
+Vcc
OUTPUT
INVERTED
INPUT
NON-INVERTEO
INPUT
NF7
IN7
NFB
IN6
•NJM2068L-D (XM356A00) •BA682A (XS046A00)
Dual Operational Amplifier
XIK JHiKsKi)'
+V-IN -V -IN +V
OUT +IN +(N OUT
AAA B B e
Vcc Vc1 Vc2 Vc3 Vc4 VcS Vc6 Vc7 Vc8 Vc9 Vc10 Veil Vc12
13

EMX2000 EMX2000
CIRCUIT BOARDS('>- hSISHI)
•MAIN Circuit Board (MAIN h)
Contents(
S
•MAIN Circuit Board 14
(MAIN y- h)
•POWER 1/5 Circuit Board ... 16
(POWER 1/5 V- h)
•POWER 2/5 Circuit Board ... 17
(POWER 2/5 V- h)
•POWER 3/5 Circuit Board ... 17
(POWER 3/5 h)
•POWER 4/5 Circuit Board ... 17
(POWER 4/5 V- h)
•POWER 5/5 Circuit Board ... 17
(POWER 5/5 y- h)
•DSP Circuit Board 118
(DSP y- M)
•DSP Circuit Board 218
(DSPy-i'2)
•DSP Circuit Board 318
(DSPy-h3)
•DSP Circuit Board 418
(DSPy- S4)
'LED installation (LED<7)IRt;#W)
MAIN circuit board
(MAIN V- L) -LED spacer
(LED y- -)
3NA-VZ36150 A
Component side (SuailJ) 15

EMX2000 EMX2000
•POWER 1/5 Circuit Board(POWER 1/5>- h)
Component side
•IC1 03, IC1 04 installation •D307 installation
3NA-V270350 ^
1N^—J
R:
1.5-2
Uw
11
R:2~3
Component side (nBpp'fllJ)
•POWER 4/5 Circuit Board •POWER 5/5 Circuit Board
(POWER 4/5>- h) (POWER 5/5>- h)
Component side (gBS-fi) Component side (SB^pilU)

EMX2000
•DSP Circuit Board 1(DSP>- h-1)
Component side °aii)
•DSP Circuit Board 2(DSP>- h2)
Component side (SBppfflU)
^The one of the four DSP Circuit Boards above is installed.
^DSP V- ti*' 118

EMX2000
•DSP Circuit Board 3(DSP>- 1-3)
Component side (SB
•DSP Circuit Board 4(DSP>- 1-4)
Component side (nBop'fSJ)
3NA-VZ36160
19

EMX2000
INSPECTIONS
1Mixer Part
1-1. Setting Conditions
Setting conditions are as follows unless otherwise specified.
1-1-1. Measuring Instruments
Low Frequency Oscillator: Balance output. Output Impedance =150 ohms
Oscilloscope: Input Impedance is greater than or equal to 100 kohms
Level Meter: Input Impedance is greater than or equal to 100 kohms
Note:
1.Use abalance input-type measuring instrument.
2. Apply DIN low-pass filter when measuring the noise level.
3. 0dBs =0.775V
1-1-2. Control Panel Setting
CH INPUT (CH1-CH8) Section
GAIN trim
EQ (HIGH, MID, LOW) gain control
Monitor (1,2) level control
EFFECT level control
PAN control
Fader
PFL switch
Stereo input (9/10,1 1/12)
A/B switch
GAIN trim
EQ (HIGH, MID, LOW) gain control
Monitor (1,2) level control
EFFECT level control
PAN control
Fader
PFL switch
ST SUB IN (1,2)
ST level control
MONITOR (1,2) level control
PFL switch
TAPE IN
ST level control
PFL switch
DIGITAL EFFECT
ON/OFF switch
PROGRAM select switch
MINIMUM/MAXIMUM level control
ST level control
MONITOR (1,2) level control
MASTER
ST GRAPHIC EQUALIZER control
GRAPHIC EQUALIZER ON switch
STl ,MONO, MONlTOR(l ,2), EFFECT fader
ST2, PHONES/C.R. level control
STl ,MONO, MONlTOR(l ,2), EFFECT PFL switch
POWER AMP
POWER AMP switch
POWER AMP (L/BRIDGE, R) level control
PHANTOM
PHANTOM switch
Minimum
Center
Maximum
Maximum
Center
Maximum
OFF
A
Minimum
Center
Maximum
Maximum
Center
Maximum
OFF
Maximum
Maximum
OFF
Maximum
OFF
OFF
1
Maximum
Maximum
Maximum
Center
OFF
Maximum
Maximum
OFF
STL-STR
Minimum
OFF
1-1 -3. Input and Output Load
Input Signal
Load
CHANNEL INSERT OUT:
REC OUT:
IkHz, sine wave (Rs =150 ohms)
10kohms
10kohms
20

EMX2000
ST1,2:
MONO:
MONITOR (1,2):
EFECT:
PHONES/C.R.:
600 ohms
600 ohms
600 ohms
600 ohms
40 ohms
1-2. Mixer Part Inspections
1-2-1. Gain
Gain of each output should be as shown in the table below.
Table 1: INPUT CHI -CHS [Units :dBs]
Input Input GAIN INS STl, 2OUT MONO MONIl, 2EFFECT REC OUT PHONES/
Terminal Level trim OUT *2 (L.R) OUT OUT OUT (L, R) C.R. OUT *3
-60 MAX 0+/-2 +1 +1-2 +4 +1-2 +4 +1-2 +10 +1-2 -10.8 +/-2 -1.5+/-2
MIC -16 MIN +1 +/-2
STl(L) *1
-34 MAX +1 +/-2
LINE STl(L) *1
+10 MIN +1 +/-2
STl(L) *1
INS IN 0+1 +1-2
*2 STl(L) *1
*1:Measure display output only.
*2:Measure CH1-4 only.
*3:Turn the PEL switch for the signal input channel to “ON
Table 2:INPUT CH9/10,! 1/12 [Units :dBs;
Input Input A/B GAIN STl OUT MONIL2 EFFECT PHONES/
Terminal Level switch trim (L,R) OUT OUT C.R. OUT *2
A-L/MONO +1 +/-2 +7 +1-2 +13 +1-2 -1.5+/-2
A-R -34 MAX +1 +1-2
STl(R) *1
+1 +1-2
MONIl *1 +1 +1-2 -1.5+/-2
A-L/MONO
A+1 +1-2
+10 MIN ST1(L)*1
A-R +1+/-2
STl(R) *1
B-L -34 MAX +1 +1-2
BSTl(L) *1
B-R +10 MIN +1 +1-2
STl(R) *1
*1:Measure display output only.
*2:Turn the PEL switch for the signal input channel to “ON”
Table 3:INPUT ST SUB IN [Units :dBs^
Input Input STl OUT STl OUT MONIL2 PHONES/
Terminal Level (L) (R) OUT C.R. OUT*l
L/MONO mm +4 +1-2 +4 +1-2 +7 +/-2 -1.5+/-2
L+4 +1-2 +1 +1-2 -1.5+/-2
1:Turn the PEL switch for the signal input SUB IN to “ON”.
21