Yamaha EMX 660 User manual

1
EMX660
SERVICE MANUAL
PA 011519
20000608-74800 1.45K-479 Printed in Japan 2000.06
HAMAMATSU, JAPAN
CONTENTS
SPECIFICATIONS ................................................ 3/5
DIMENSIONS ............................................................ 6
PANEL LAYOUT .................................... 7
BLOCK & LEVEL DIAGRAM
......................................... 10
CIRCUIT BOARD LAYOUT ............... 11
DISASSEMBLY PROCEDURE ............................ 12
LSI PIN DESCRIPTION .............................. 15
IC BLOCK DIAGRAM ................................. 17
INSPECTIONS ....................................................... 18/23
TROUBLE SHOOTING ............... 28
PARTS LIST
OVERALL CIRCUIT DIAGRAM
CIRCUIT BOARDS
POWERED MIXER
This document is printed on chlorine free (ECF) paper with soy ink.
本资料由ＯＫＸＩＡ视听皮带资源库ｗｗｗ．ｏｋｘｉａ．ｃｎ提供

EMX660
22
IMPOR TANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-
stood by the users, and have therefore not been restated.
WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in per-
sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.
IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-
cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of
any form.
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor’s Service Division.
WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have
accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to
this bus.)
IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
to the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.
2

3
EMX660
SPECIFICATIONS
General specifications
• 0 dB=0.775 Vrms
Maximum output power 300 W + 300 W/4ohms @0.5% THD at 1 kHz (POWER AMP OUT 1, 2) 215 W + 215 W/8ohms @0.5% THD at 1 kHz (POWER AMP OUT 1, 2)
600 W/8ohms @0.5% THD at 1 kHz (BRIDGE)
Frequency response 20 Hz~20 kHz +1 dB, –3 dB @1 W output into 8ohms (POWER AMP OUT)
20 Hz~20 kHz +1 dB, –3 dB @+4 dB output into 10 kohms (MAIN OUT, MONITOR OUT, EFFECT SEND)
Total harmonic distortion Less than 0.5% @20 Hz~20 kHz, 150 W output into 4ohms (POWER AMP OUT 1, 2)
Less than 0.3% @20 Hz~20 kHz, +14 dB output into 10 kohms (MAIN OUT, MONITOR OUT, EFFECT OUT)
Hum & noise
(Average, Rs=150Ω)
(with 20 Hz~20 kHz BPF)
–124 dB equivalent input noise, –65 dB residual output noise (POWER AMP OUT)
–88 dB residual output noise (MAIN OUT, MONITOR OUT, EFFECT SEND)
–79 dB (83 dB S/N)
MAIN OUT, MONITOR OUT Master level control at nominal level and all channel level controls at minimum.
–69 dB (73 dB S/N)
MAIN OUT, MONITOR OUT Master level control at nominal level and 1 channel level control at nominal level.
–75 dB (79 dB S/N)
EFFECT SEND Master level control at nominal level and all channel level controls at minimum.
–69 dB (73 dB S/N)
EFFECT SEND Master level control at nominal level and 1 channel level control at nominal level.
Maximum voltage gain
(PAD: OFF)
88 dB CH IN (Lo-Z) to POWER AMP OUT (CH1~4)
66 dB CH IN (Lo-Z) to MAIN OUT, MONITOR OUT (CH1~4)
72 dB CH IN (Lo-Z) to EFFECT OUT (CH1~4)
48 dB CH IN (Lo-Z) to REC OUT (CH1~4)
56 dB CH IN (Hi-Z) to MAIN OUT, MONITOR OUT (CH1~4)
26 dB AUX IN to MAIN OUT
24 dB TAPE IN to MAIN OUT
66 dB MIC IN to MAIN OUT, MONITOR OUT (CH5•6)
26 dB LINE IN to MAIN OUT, MONITOR OUT (CH5)
46 dB INST IN to MAIN OUT, MONITOR OUT (CH6)
Crosstalk at 1 kHz 65 dB adjacent input, 65 dB input to output
Input channel equalization
±15 dB Maximum
HIGH 12 kHz shelving*
MID 2.5 kHz peaking
LOW 80 Hz shelving*
* Turn over/roll-off frequency of shelving: 3 dB below maximum variable level.
Meters 5 POINTS LED METER (–10, –5, 0, +3, +6 dB) (MAIN OUT, MONITOR OUT)
Graphic equalizer 7 bands (125, 250, 500, 1 k, 2 k, 4 k, 8 kHz), ±12 dB Maximum (MAIN OUT, MONITOR OUT)
Internal digital effect 8 types (VO.ECHO 1, VO.ECHO 2, VO.REV.1, VO.REV.2, HALL 1, HALL 2, ROOM, PLATE)
Phantom power +15 V is supplied to electrically balanced inputs for powering condenser microphones via 2.4 kohms
current limiting/isolation resisters.
Limiter Comp. :THD≥0.5% (POWER AMP OUT)
LIMIT indicators Turns on. :THD≥0.5% (POWER AMP OUT)
Protection Circuit (Power Amp.) POWER Switch on/off Mute, DC Detection, Temp (Heatsink Temp≥90˚C)
Foot switch (FC-5) DIGITAL EFFECT MUTE : on/off
Power requirement USA and Canada 120 V AC 60 Hz Europe 230 V AC 50 Hz
Other 240 V AC 50 Hz
Power consumption 250 W
Dimensions (WxHxD) 497×275×275 mm
Weight 17 kg

EMX660
4
Input specifications
Output specifications
• All output jacks are unbalanced.
• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.
For European Model
Purchaser/User Information specified in EN55103-1 and EN55103-2.
Inrush Current: 56A
Conformed Environment: E1,E2,E3 and E4
Input connectors PAD Actual load
impedance Nominal impedance
Input level Connector
type
Sensitivity
1
1. Sensitivity is the lowest level that can produce an output of +4 dB (1.23V) or the nominal output level when the unit is set at maximum gain.
(All level controls are at maximum position.)
2. Balanced (T=Hot, R=Cold, S=Gnd)
3. Unbalanced
• 0 dB=0.775 Vrms, 0 dBV=1 Vrms.
Nominal level Max. before
cliping
CH INPUT (Lo-Z)
(CH1~4) OFF 3 kohms
50~600ohms
Mics –62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31 type
2
ON 600ohms Lines –32 dB (19.5 mV) –20 dB (77.5 mV) +10 dB (2.45 V)
CH INPUT (Hi-Z)
(CH1~4) OFF 10 kohms
50~600ohms
Mics –52 dB (1.95 mV) –40 dB (7.75 mV) –10 dB (245 mV) Phone jack
(TRS)
2
ON 600ohms Lines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V)
MIC INPUT (CH5•6) 3 kohms
50~600ohms
Mics –62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31 type
2
LINE INPUT (CH5) (1, 2) 10 kohms 600ohms Lines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack
3
INST INPUT (CH6) (1, 2) 470 kohms 1 kohms –42 dB (6.16 mV) –30 dB (24.5 mV) 0 dB (0.775 V) Phone jack
3
AUX IN 10 kohms 600ohms Lines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack
3
TAPE IN (1, 2) 10 kohms 600ohms Lines –22 dBV (79.4 mV) –10 dBV (316 mV) +17.8 dBV (7.76 V) RCA phono
jack
3
Output connectors Actual source
impedance Nominal impedance
Output level Connector type
Nominal Max. before cliping
POWER AMP OUT (1•2) (A, B) 0.1ohms 4/8ohms Speaker 60 W/4ohms (300 W/4ohms) Phone jack
BRIDGE OUT 0.1ohms 8ohms Speaker 120 W/8ohms (600 W/8ohms) Phone jack
MAIN OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75 V) Phone jack
MONITOR OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75V) Phone jack
EFFECT OUT 600ohms 10 kohms Lines +4 dB (1.23 V) +20 dB (7.75V) Phone jack
REC OUT (1, 2) 600ohms 10 kohms Lines –10 dBV (316 mV) +10 dBV (3.16 V) RCA phono jack

5
EMX660

EMX660
6
H:275
D:275
259
W:497
487
45.5 380 45.5 16
(45.5) (45.5)
168
(67.5)
15057.5
DIMENSIONS
Units: mm

7
EMX660
1
2
3
4
5
Equalizer controls (HIGH, MID, LOW)
Monitor controls (MONI)
Effect control (EFFECT)
Level control (LEVEL)
Pad switch (PAD) (Channel 1-4 only)
Control panel
PANEL LAYOUT
PAD
HIGH
MID
LOW
MONI
EFFECT
LEVEL
1
1
–15 +15
–15 +15
–15 +15
010
010
010
1
2
3
4
5
Channel section
DIGITAL
EFFECT
ON
VO. ECHO 1
VO. ECHO 2
VO. REV. 1
VO. REV. 2
HALL. 1
HALL. 2
ROOM
PLATE
MONITOR
MASTER
EFFECT RTN
+6
+3
0
–5
–10
+12
•
6
•
0
•
6
•
–12
+12
•
6
•
0
•
6
•
–12
125 250 500 1k 2k 4k 8k
010
TAPE IN
010 010
6
7
9 10
8
12
11
6
7
Effect select switch and indicator
DIGITAL EFFECT ON switch and indicator
DIGITAL EFFECT section MONITOR section
8
9
10
11
12
Graphic equalizer
EFFECT RTN control
TAPE IN control
MASTER control
Peak level indicator

EMX660
8
13
14
15
16
17
18
Graphic equalizer
EFFECT RTN control
AUX IN control
TAPE IN
MASTER control
Peak level indicator
MAIN
MASTER
TAPE IN
AUX INEFFECT RTN
+6
+3
0
–5
–10
+12
•
6
•
0
•
6
•
–12
+12
•
6
•
0
•
6
•
–12
125 250 500 1k 2k 4k 8k
010010010 010
13 18
17
16
15
14
POWER AMP
12
LIMITER
MAIN
BRIDGE
MAIN
MONITOR
MAIN
MAIN
2A MPs
300W 300W
19
20
POWER
ON
OFF
PHANTOM
21
22
MAIN section
POWER AMP section
POWER indicator & PHANTOM section
19
20
LIMITER indicator
Power amp select switch
21
22
POWER indicator
PHANTOM switch

9
EMX660
1
2
3
4
5
6
Hi-Z, Lo-Z input jacks
MIC, LINE, INST input jacks
Effect output jack (EFFECT OUT)
Foot switch jack (FOOT SW)
External input jacks (AUX IN/TAPE IN)
External output jacks
(REC OUT/MONI-TOR/MAIN)
Rear panel
Input/Output panel
INPUT OUTPUT
MONITOR
MAIN
AUX IN
REC
OUT
TAPE
IN
EFFECT OUT
FOOT SW
12
11
22
12
LINEHi-Z INST
MIC MICLo-Z
Hi-Z
Lo-Z
Hi-Z
Lo-Z
Hi-Z
Lo-Z
SEE REAR PANEL CAUTION
EEEngine
1 2 3456
1
2
Speaker output jacks (POWER AMP 1 A/B,
POWER AMP 2 A/B,BRIDGE)
Power switch
SPEAKERS
POWER BABA
POWER AMP 1
BRIDGE
POWER AMP 2
ON / OFF
12

EMX660
10
BLOCK & LEVEL DIAGRAM
2 1 3 4
IC703 IC703
IC601 IC603 IC603
1
4
4 3 1 2 3 1
2 2 4 3 1
2 3
5 3
2 3
IC902
IC706 3
57
5
7 1
1
7
IC601
8
IC501
12 1
2 4 3 1 2 4 3 1
33
1
2
3
2 4 3
2
1
7
5
IC501
IC301(CH3,4)
IC101(CH1,2)
75
1
IC901
31
IC901
7
6 7
IC704
5 7
IC705
2 4 3 1
IC801
2 4 3 1
CN901
CN301
IC704
3 1
IC705
3 1 IC701
CN301
IC706
31
CN901
1
2 4 3
KEC-92542
CN101
CN101
IC201
57
CN101
CN101
IC101
57
MIX
SUB
PWR

11
EMX660
CIRCUIT BOARD LAYOUT
transformer
Power
PWR 1/3
PWR 1/3
PWR 2/3
MIX
MIX
SUB

EMX660
12
DISASSEMBLY PROCEDURE
Fig.1
PowerPower
transformertransformer
Power
transformer
[50] [P130] [P130]
[P130]
[P40]
[P130]
[P110]
[P110]
[P110]
[P40]
[30]
[P90][P90] Hexagonal nut[P90]
[30]
[70] [70]
[R180]
[R180]
MIX
SUB
2 SUB circuit board
2-1 Remove the panel assembly. (See Procedure 1.)
2-2 Remove the shield case. (See Procedure 1.)
2-3 Remove the SUB circuit board from the seven(7)
spacer supports marked [P110].(Fig. 1)
1 MIX circuit board
1-1 Remove the six (6) screws marked [30].The panel
assembly can then be removed. (Fig. 1)
1-2 Remove the four (4) screws marked [P130].The
shield case can then be removed.(Fig. 1)
1-3 Remove the forty-three (43) knobs, the thirteen (13)
special hexagonal nuts and the thirteen (13) screws
marked [P90]. (Fig. 1)
1-4 Remove the twelve (12) screws marked [P40].The
MIX circuit board can then be removed. (Fig. 1)
Right side view Front panel Left side view
Rear panel
[30]: Bind Head Screw 4.0X8 MFZN2BL (EG340360)
[50]: Bind Head Screw SP 5.0X10 MFZN2BL (VU688100)
[70]: Bind Head Screw 4.0X8 MFZN2BL (EG340360)
[P40]: Hexagonal Button Screw-P 3X25 MFZNBL (V3289800)
[P90]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[P130]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[R180]: Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190)

13
EMX660
Fig.2
3 PWR 1/3 circuit board
3-1 Remove the panel assembly. (See Procedure 1.)
3-2 Remove the two (2) connectors from the power
transformer and the six (6) screws marked [70].The
rear assembly can then be removed. (Fig. 1)
3-3 Remove the six (6) screws marked [R180].The
power unit can then be removed. (Fig. 1)
3-4 Remove the sixteen (16) screws marked [R90].TR
support angle A/B can then be removed. (Fig. 2)
3-5 Remove the six (6) screws marked [R40].The PWR
circuit board 1/3 can then be removed. (Fig. 2)
[R90]
[R40]
[R90]
[R40]
[R90] [R90]
PWR 1/3
4 PWR 2/3 circuit board
4-1 Remove the panel assembly. (See Procedure 1.)
4-2 Remove the rear assembly. (See Procedure 3.)
4-3 Remove the screw marked [R210] and the five (5)
“special screws b”.The PWR 2/3 circuit board can
then be removed. (Fig. 3)
5 PWR 3/3 circuit board
5-1 Remove the panel assembly. (See Procedure 1.)
5-2 Remove the rear assembly. (See Procedure 3.)
5-3 Remove the two (2) screws marked [R150] and then
remove the PWR 3/3 circuit board with the switch
bracket. (Fig. 3)
5-4 Remove the two (2) screws marked [R140] and the
screw marked [R150a] from the switch bracket.The
PWR 3/3 circuit board can then be removed.(Fig.3)
[R40]: Bind Head Screw SP 3.0X8 MFZN2Y (EG330290)
[R90]: Bind Head Tapping Screw-B 3.0X12 MFZN2BL (VQ074600)
Power unit

EMX660
14
Fig.3
[R210]
[R120]
MotorMotor fanfan
Hexagonal nut
[R120]
[R150]
Motor fan
[R140][R150a][R150]
Power unit
PWR 3/3 PWR 2/3
7 Power transformer
7-1 Remove the panel assembly. (See Procedure 1.)
7-2 Remove the rear assembly. (See Procedure 3.)
7-3 Remove the four (4) screws marked [50].The power
transformer can then be removed. (Fig. 1)
6 Motor fan
6-1 Remove the panel assembly. (See Procedure 1.)
6-2 Remove the rear assembly. (See Procedure 3.)
6-3 Remove the power unit.(See Procedure 3.)
6-4 Remove the two (2) screws marked [R120].The
motor fan can then be removed.(Fig. 3)
Front panel
[R120]: Bind Head Screw 3.0X30 ZMC2BL (VT520200)
[R140]: Bind Head Screw 3.0X8 MFZN2BL (VB659000)
[R150a]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[R150]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[R210]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)

15
EMX660
LSI PIN DESCRIPTION
1 ED2 I/O 51 HX/SDA I/O/Z Host Interface Data Output/I2C Bus Data
2 ED3 I/O External Memory and I/O Data Bus 52 /EMPTY O/Z CMEM Update Buffer and HR Resistor Empty Flag Output
3 ED4 I/O 53 AXLR2 I Audio Data Transmitt Unit 2/3 Left and Right Channel Frame Frequency Signal
4 ED5 I/O 54 AR1 I Audio Data Receive Unit 1 Data Input
5 ED6 I/O 55 AR2 I Audio Data Receive Unit 2 Data Input
6 ED7 I/O 56 HRBCK/SA0 I Host Interface Receive Clock / I2C Bus Address 0
7 VSS - Ground 57 HR/SA1 I Host Interface Data Input/ I2C Bus Address 1
8 VDD - Power Supply 58 HRS/SA2 I Host Interface Receive Data Frame Frequency Signal/ I2C Bus Address 2
9 CLKM0 I Clock Mode 59 VSS - Ground
60 VDD - Power Supply
10 CLKM1 I 61 HXBCK/SCL I Host Interface Transmitt Clock/ I2C Bus Clock
11 TMS I TAP(Test Access Port) Mode Select 62 HXS/SA3 I Host Interface Transmitt Data Frame Frequency Signal/ I2C Bus Address 3
12 TDI I TAP Data Input 63 /CS/SA4 I Host Interface Chip Select/ I2C Bus Address 4
13 TCK I TAP Clock 64 HBCKS/SA5 I HRBCK/HXBCK Active Edge Select/ I2C Bus Address 5
14 CLKIN I Master Clock 65 I2CSEL I Host Interface Mode Select
15 VSS - Ground 66 VSS - Ground
16 VDD - Power Supply 67 VDD - Power Supply
17 CLKO O Machine Clock Output 68 AXBC1 I Audio Data Transmitt Unit 1 bit Clock
18 EA12/ED8 I/O 69 AXBC2 I Audio Data Transmitt Unit 2/3 bit Click
19 EA13/ED9 I/O External SRAM and ROM Address Bus/ External DRAM and I/O Data Bus 70 AXLR1 I Audio Data Transmitt Unit 1 Left and Right Channel Frame Frequency Signal
20 EA14/ED10 I/O 71 DIV8 O Machine Clock Output then 8 min.
21 EA15/ED11 I/O 72 /LAV O Ruch ALU Overflow Frag Output
22 VSS - Ground 73 /LMV O Ruch MAC Overflow Frag Output
23 VDD - Power Supply 74 /DRDY O/Z Host Interface Transmitt Data Ready Frag Output
24 EA16/ED12 I/O 75 EMU0 I/O/Z Emurator Interrupt 0
25 EA17/ED13 I/O External SRAM and ROM Address Bus/ External DRAM and I/O Data Bus 76 EMU1 I/O/Z Emurator Interrupt 1
26 EA18/ED14 I/O 77 TDO O/Z TAP(Test Access Port) Data Output
27 EA19/ED15 I/O 78 DIV512 O Machine Clock then512 min.
28 EA4/ED16 I/O 79 ARLR1 I Audio Data Receive Unit 1 Left and Right Channel Frame Frequency Signal
29 EA5/ED17 I/O External Memory Address Bus/ External I/O Data Bus 80 ARLR2 I Audio Data Receive Unit 2 Left and Right Channel Frame Frequency Signal
30 EA6/ED18 I/O 81 HDIR/SA6 I Host Interface Data Format Select/ I2C Bus Address 6
31 EA7/ED19 I/O 82 SEL5V3V I Input Level Control
32 VSS - Ground 83 /MUTE I Mute Control
33 VDD - Power Supply 84 /TRST I TAP(Test Access Port) Reset
34 EA8/ED20 I/O 85 /RS I Hardware Reset
35 EA9/ED21 I/O External Memory Address Bus/ External I/O Data Bus 86 VSS - Ground
36 EA10/ED22 I/O 87 VDD - Power Supply
37 EA11/ED23 I/O 88 /IOE O External I/O Enable
38 TEST0 I 89 /RAS/SRCS O External DRAM Low Address Strove/External SRAM Chip Select
39 TEST1 I Test Mode Control 90 /CAS/SROE O External DRAM Culumn Address Strove/External SRAM Output Enable
40 TEST2 I 91 /ROME O External ROM Enable
41 TEST3 I 92 /WE O External Memory and I/O Wright Enable
42 /BIO I Separate Control Input 93 EA0 O
43 /INT1 I Interrupt 1 94 EA1 O External Memory and I/O Address Bus
44 ARBC1 I Audio Data Receive Unit 1 bit Clock 95 EA2 O
45 ARBC2 I Audio Data Receive Unit 2 bit Clock 96 EA3 O
46 AX1 O Audio Data Transmitt Unit 1 Data Output 97 VSS - Ground
47 AX2 O Audio Data Transmitt Unit 2 Data Output 98 VDD - Power Supply
48 AX3 O Audio Data Transmitt Unit 3 Data Output 99 ED0 I/O External Memory and I/O Data Bus
49 VSS - Ground 100 ED1 I/O
50 VDD - Power Supply
PIN NAME I/O FUNCTION
NO. PIN NAME I/O FUNCTION NO.












ZFX-2 (XY297A00) DSP















SUB: IC306


































1 min. 3fold 5fold PLL BYPASS
CLKM0 0 1 0 1
CLKM1 0 0 1 1
Z: High inpedance

EMX660
16
1 VINL I ADC Analog input, L ch 15 VOUTL O DAC Analog Output, L ch
2 Vcc1 - ADC Analog Power Supply 16 LRCIN I Sampling Clock Input (fs)
3 AGND1 - ADC Analog Ground 17 BCKIN I Bit Clock Input
4 VREFL - ADC Reference decuple, L ch 18 DIN I Audio Data Input
5 VREFR - ADC Reference Decuple, R ch 19 DOUT O Audio Data Output
6 VINR I ADC Analog input, R ch 20 XTI I Crystal Oscillator Input, External System Clock Input
7 CINPR - ADC Unch areasing Filter Capacitor (+), R ch 21 XTO O Crystal Oscillator Output
8 CINNR - ADC Unch areasing Filter Capacitor (-), R ch 22 CLKIO I/O Crystal Oscillator Buffer Output, Externak System Clock Input
9 CINNL - ADC Unch areasing Filter Capacitor (-), L ch 23 VDD - Digital Power Supply
10 CINPL - ADC Unch areasing Filter Capacitor (+), L ch 24 DGND - Digital Ground
11 VCOM - DAC Center Power Supply Decuple 25 FMT2 I Audio Data Format 2 (1)
12 VOUTR O DAC Analog Output, R ch 26 FMT1 I Audio Data Format 1 (1)
13 AGND2 DAC Analog Ground 27 FMT0 I Audio Data Format 0 (1)
14 VCC2 - DAC Analog Power Supply 28 RSTB I Reset Input, Active ”L”
PIN NAME I/O FUNCTION
NO. PIN NAME I/O FUNCTION NO.
PCM3001E (XY282A00) ADA SUB: IC305

17
EMX660
IC BLOCK DIAGRAM
NJM2068L-D(XM356A00)
NJM4558L-D(XQ212A00)
N5238AP(XM085A00)
MIX: IC101, IC102, IC301, IC302, IC501,
IC502, IC601, IC603, IC703, IC704,
IC705, IC706, IC901
SUB: IC101, IC201, IC304
OP AMP
M5229P(XG203A00)
MIX: IC701, IC801
7Seg Grafic
TC74HCU04AP(IG142200)
SUB: IC302
Inverter
BA6137(XA534A00)
MIX: IC702, IC802
LED Driver
TC74HC138AP(IR013800)
MIX: IC902
DECO-8
1
2
3
4
5
6
7
A
B
Select
Enable
Output
B
CC
G2A G2A
G2B G2B
G1 G1
Y7 Y7
16
15
14
13
12
11
10
Vcc
Y0Y0
Y1Y1
Y2Y2
Y3 Output Y3
Y4Y4
Y5Y5
8
GND 9Y6
A
Y6
D1
+++++
+
Constant
Current
Circuit
1
D2
2
D3
3
D4
4
GND
5
D5
6
Amp
Output
7
IN
8
VCC
9
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
IN1
IN2
IN3
IN4
IN5
NF1
NF2
NF3
NF4
NF5
-Vcc
GND
+Vcc
OUTPUT
INVERTED
INPUT
NON-INVERTED
INPUT
NF7
NF6
IN7
IN6
-+
-+
-+
-+
-+
-+
-+
-+
47k
560
47k
560
47k
560
47k
560
47k
47k
47k
47k
560
10k
10k
1
A
2345678
IN —V
+ IN
OUT
AAA
+ VIN
+ IN OUT
B
BB
+
B
+
1
2
3
4
5
6
7
1A
1Y
2A
2Y
3A
3Y
Vss
14
13
12
11
10
9
8
VDD
6A
6Y
5A
5Y
4A
4Y

EMX660
18
INSPECTIONS
1. Measuring Instruments
Low Frequency Oscillator: Balance Output, Output Impedance = 150 ohms
Oscilloscope: Input Impedance 100 kohms
Level Meter: Input Impedance 100 kohms
Note: Use a balance input measuring instrument
: Signal level 0 dBs = 0.775V
2. Mixer Part
2-1 Setting Conditions
Setting conditions are as follows unless otherwise specified.
2-2 Input and Output Load
Input Signal: 1 kHz, sine wave (Rs = 150 ohms)
Load: All output terminals have a 10 k ohms load
2-3 Control Panel Setting
Channel Input (CH1-CH4) Section
EQ (HIGH, MID, LOW) level controls: Center
MONITOR level control: Maximum
EFFECT level control: Maximum
LEVEL: Maximum
PAD: OFF
Channel Input (CH5-CH6) Section
EQ (HIGH, MID, LOW) level controls: Center
MONITOR level control: Maximum
EFFECT level control: Maximum
LEVEL: Maximum
EFFECT Section
DIGITAL EFFECT ON switch OFF
MAIN Section
GRAPHIC EQUALIZER (7 band) Fader: Center
EFFECT RTN level control: Maximum
AUX IN: Maximum
TAPE IN: Maximum
MASTER (MAIN): Maximum
MONITOR Section
GRAPHIC EQUALIZER (7 band) Fader: Center
EFFECT RTN level control: Maximum
TAPE IN Level control: Maxmum
MASTER (MAIN) level control: Maximum
Others
PHANTOM ON/OFF switch OFF
POWER AMP switch MAIN/MONITOR
>
=
>
=

19
EMX660
2-4 Gain
Each output gain should be as shown in the table below.
2-5 Frequency Response
When the input signal frequency is set to 20 Hz and 20 kHz in Tables 1, each output terminal level should fall within
the range of +1 and -3 dB, using 1 kHz as the reference.
2-6 Equalizer Characteristics
When LOW, MID, HIGH GAIN VR's of CH1-6 are moved, the output level in each frequency obtained at MAIN OUT
and MONITOR OUT should be in the range shown in the table below, using the output level at the center click position
as reference. If the output level is not within the range as shown in the table, vary the specified frequency of the input
signal within ±20% range and check that the output level as shown in the table below can be obtained.
Table 2 [Units: dBs]
EQ Controls GAIN Frequency Response
LOW Maximum 80 Hz +12 ±2
Minimum +12 ±2
MID Maximum 2.5 kHz +14 ±2
Minimum
HIGH Maximum 12 kHz +12 ±2
Minimum +12 ±2
2-7 Graphic Equalizer Characteristics
When setting of the fader of the graphic equalizer is varied to the maximum and minimum positions, the output response
for each frequency obtained at MAIN OUT and MONITOR OUT should be in the range shown in the table below using
the output level at the center click position as a standard.
If the output level is not within the range as shown in the table, vary the specified frequency of the input signal within
±20% range and check that the output level as shown in the table below can be obtained.
Table 3 [Units: dBs]
Input signal frequency and Fader name
125 Hz 250 Hz 500 Hz 1 kHz 2 kHz 4 kHz 8 kHz
Response Maximum +12
±
±
2
Minimum -12 2
Table 1 [Units: dBs]
Input Terminal Input Level
Lo-z
MIC
Hi-Z
LINE
INST
AUX
TAPE
+4±2
+4±2
+4±2
+4±2
+4±2
+4±2
REC OUTMAIN OUT
-32
-32(PAD ON)
-52
-22
-42
-22
-22
+4±2
-
-
-
-
-
+4±2
-
-
-
-
-
+13.8±2
-
-
-
-
-
MONITOR OUT EFFECT OUT
- 14 ±2
2-8 Meter LED
When the MAIN OUT and MONITOR OUT output levels are as shown in the table below, each corresponding
METER LED light should light up.
Table 4 LED Name Lighting Level
+6 +10 ±2
+3 +7 ±2
0+4±2
-5 -1 ±2
-10 -6 ±2.5
[Units: dBs]

EMX660
20
2-9 Distortion
Set each volume control of the INPUT section and MASTER section to Nominal in Tables 1. When each output
except the REC OUT level reaches +14 dBs, the distortion ratio should be less than 0.3 %.
2-10 Maximum Output Level
In the states of 2-9, the maximum output levels of MAIN OUT, MONITOR OUT and EFFECT OUT should be
+20 dBs with a distortion of less than 1%.
2-11 Equivalent Input Noise
With the level volume of the channel being measured only set to the maximum position and those of other channels
set to the minimum position and the input terminals of Lo-z and MIC shorted with 150ohms, check that the noise
level at MAIN OUT is -58dBs or less (but -56dBs or less for CH6). If the noise level exceeds the specified value,
check the converted input noise level at each channel. The acceptable level is -124dBs or less for CH1 to CH5 and
-122 dBs or less for CH6. (Use DIN AUDIO FILTER.)
2-12 Residual Noise
Set all the input level controls at minimum in the states of 2-3. When the MASTER and EFFECT OUT level
controls in the MAIN and MONITOR section are changed to maximum or minimum, the residual noise should be
as shown in the table below.
Table 5 [Unit: dBs]
MASTER VOLUME MAIN OUTPUT MONITOR OUT EFFECT OUT
Maximum -71
Minimum -88
2-13 Phantom Power
Connect a load resistance of 2.7 K ohm (more than 1W) between pins 1 and 2 of both the Lo-z IN and the MIC IN
input terminals, then short between pins 2 and 3 of the Lo-z IN and the MIC IN input terminal.
When the PHANTOM switch is turned on, +10 ±1.5 V should be obtained between both ends of the load resistance.
2-14 Digital Effect
Turn on the power while pressing VO.ECHO1 and ON switches simultaneously and check that the ON LED light
flashes. Input a -42dBs/1KHz signal to the CH6 INST, set the EFFECT level control and LEVEL control to the
maximum position, and also set MASTER and EFFECT volumes of the MONITOR to the maximum position. Then
check the signal level at the MONITOR OUT by selecting the PGM switch as described in Table 6 below.
Check that the LED light lights up when each PGM switch is selected.
Also, check that the EFFECT is applied when the music source (vocal, etc.) is input.
2-15 Stability
When a capacitor of 10 µF to 0.1 uF is connected in parallel to the loading resistor at each SPEAKER OUT
terminal, or when all VR and EQ control volumes are set to MAX , there should be no abnormality; for example,
there should be no oscillation. Especially, check that no oscillation occurs even if the EQ HIGH is at maximum.
-73-71
-88
Table 6 [Unit: dBs]
Operation
Press ON SW.
Set LEVEL control to min. position.
-
-
Depress FOOT SW.
-
-
-
Check for: (at MONITOR OUT)
No output (-53dBs or less) [DIN AUDIO]
-53dBs or less [DINdBsDIO]
Output obtained
Output not obtained (-53dBs or less) [DIN AUDIO]
-30dBs or less [DIN AUDIO] and full output are repeated every time FOOT SW is depressed.
Output not obtained (-53dBs or less) [DIN AUDIO]
4.2 ±1dB attenuated from full output
+10 ±3dBs of full output
PGM Switch
VO. ECHO1
VO. ECHO2
VO.REV.1
VO.REV.2
HALL1
HALL2
ROOM
PLATE