ZTEWelink MF206A User manual

Hardware Development Guide of
Module Product
Version 2.5, 2015-06-18
MF206A

Hardware Development Guide of Module Product
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MF206A
Legal Information
By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as
ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the
following terms, please stop using the document.
Copyright © 2013 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document
contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink,
no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or
any image, table, data or other information contained in this document.
is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are
ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE
Corporation’s registered trademark. The other products or company names mentioned in this
document are the trademark or registered trademark of their respective owner. Without the prior
written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.
The product meets the design requirements of environmental protection and personal security. The
storage, use or disposal of products should abide by the product manual, relevant contract or the laws
and regulations of relevant country.
ZTEWelink reserves the right to make modifications on the product described in this document
without prior notice, and keeps the right to revise or retrieve the document any time.
If you have any question about the manual, please consult the company or its distributors promptly.

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MF206A
Revision History
Version
Date
Description
1.0
2010-11-18
Initial version
2.0
2011-3-15
Chapter 1:
1. Add the application range and compilation purpose
Chapter 2:
1. Update Table2-1
2. Add the introduction of baseband function and radio frequency;
add the frame structure
Chapter 3:
1. Add the definition of PIN I/O parameter, and provide the
description of PINs
2. Add the feature of interface PWL
Chapter 4:
1. Add the chapter
Chapter 5:
1. Update the RF sourced index and source less index
Chapter 6:
1. Update the testing standard and testing environment
Chapter 7:
1. Add the chapter
Chapter 8:
1. Add the chapter
2.1
2013-03-26
1. Modify the logo of cover and page footer
2. Modify Legal Information
3. Modify some errors in the Table 2-2 of Working Frequency Band
4. Update the Table 1-1 of Supported Document List
5. Modify the chapter of 7.7 of Recommended Upgrade Methods
6. Modify the Figure 7-1 of Main Antenna RF Connector Interface
to erase the IMEI in picture
7. Modify the test result in Table 6-6
8. Modify the name of Table 5-1 to sourceless
2013-05-31
9. Release as Version 2.1
2.2
2013-12-09
1. Modify the Figure 2-2.
2. Add the contact information

Hardware Development Guide of Module Product
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MF206A
Version
Date
Description
3. Update Document Format
2.3
2013-12-30
1. Add the profile dimensions of RF antenna console
2. Modify part 7.3 of RF Circuit Design
2.4
2014-06-30
1. Update the legal information
2. Add the NOTE in chapter 1.2
3. Update Table 1-1 of Reference Document List
4. Update Table 2-1 of Major Technical Parameters
5. Update Table 3-1 of PIN Parameters
6. Add Table 3–3 of The Mandatory Pins of Module
7. Update Figure 3-3 of SD Typical Application Circuit
8. Modify chapter 3.10 of Power-on/Power-off & Reset Signal
9. Update Figure 3-16 of Reference Circuit of Status Indicator
10. Modify chapter 4.2 of Working Current
11. Move the chapter 4.2 and 4.3 of Power-on/Power-off Flow in the
former document to chapter 3.10
12. Modify Index of RF under UMTS & GPRS/GSM/EDGE Mode
in chapter 5.1 and 5.2
13. Add the NOTE in chapter 6.3
14. Add Figure 9-1 of Recommended PCB Wielding Panel Design
15. Modify Figure 5–1 of Main Antenna RF Connector Interface
16. Modify chapter 10.2 of Furnace Temperature Curve
17. Add chapter 11 of Safety Information
18. Add the chapter 10.3 of Package System
2.5
2015-06-15
1. Add the description of Suspend and Resume of module in
chapter 3.10 &3.7
2. Update the figures of module

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MF206A
Contact Information
Post
9/F, Tower A, Hans Innovation Mansion,
North Ring Rd., No.9018, Hi-Tech Industrial Park,
Nanshan District, Shenzhen. P.R.China
Web
www.ztewelink.com
Phone
[phone]
E-Mail
[email protected]m.cn
Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware
upgrades, troubleshooting tips, and press releases
Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone,
website, instant messaging, E-mail and on-site.

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MF206A
Contents
1About This Document ......................................................................................13
1.1 Application Range............................................................................................................13
1.2 Purpose............................................................................................................................13
1.3 Supported & Reference Document List...............................................................................13
1.4 Abbreviations...................................................................................................................14
2Product Overview............................................................................................15
2.1 Mechanic Features............................................................................................................16
2.2 Technical Parameters........................................................................................................17
2.3 Function Overview ...........................................................................................................20
2.3.1 Baseband Function ...........................................................................................................20
2.3.2 Radio Frequency Function.................................................................................................21
3Interfaces.........................................................................................................23
3.1 Definition of PINs ............................................................................................................23
3.1.1 Definition of PIN I/O Parameters.......................................................................................23
3.1.2 PIN Configuration Diagram...............................................................................................23
3.1.3 PIN Description................................................................................................................25
3.2 Working Condition...........................................................................................................29
3.3Feature of Digital Power Level ..........................................................................................30
3.4 Power Interface ................................................................................................................30
3.4.1 Description of Power PINs ................................................................................................30
3.4.2 Requirement of Power Supply ...........................................................................................30
3.5 (U)SIM Card Interface ......................................................................................................31
3.5.1 Description of PINs ..........................................................................................................31
3.5.2 Electric Feature ................................................................................................................31
3.5.3 Application of (U)SIM Card Interface ................................................................................32
3.6 SD Card Interface.............................................................................................................32

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MF206A
3.6.1 Description of PINs ..........................................................................................................32
3.6.2 Electric Feature ................................................................................................................33
3.6.3 Application of SD Card Interface.......................................................................................33
3.7 USB2.0 Interface..............................................................................................................34
3.7.1 Description of PINs ..........................................................................................................34
3.7.2 Electric Feature ................................................................................................................34
3.7.3 Application of USB Interface.............................................................................................34
3.8 SPI (Serial Peripheral Interface) Bus Interface ....................................................................35
3.8.1 Description of PINs ..........................................................................................................35
3.8.2 Electric Feature ................................................................................................................35
3.9 I2C Bus ...........................................................................................................................36
3.9.1 Description of PINs ..........................................................................................................36
3.9.2 Electric Feature ................................................................................................................37
3.10 UART Interface................................................................................................................38
3.10.1 Description of PINs ..........................................................................................................38
3.10.2 Electric Feature ................................................................................................................38
3.11 JTAG (Joint Test Action Group) Interface ..........................................................................39
3.11.1 Description of PINs ..........................................................................................................39
3.11.2 Application of JTAG Interface...........................................................................................40
3.12 Power-on/Power-off & Reset Signal...................................................................................40
3.12.1 Description of PINs ..........................................................................................................40
3.12.2 Power-on/Power-off Flow .................................................................................................42
3.12.3 Resetting Flow .................................................................................................................43
3.13 Interactive Application Interface........................................................................................44
3.13.1 Description of PINs ..........................................................................................................44
3.13.2 Interface Application ........................................................................................................45
3.14 LED Indicator Interface ....................................................................................................45
3.14.1 Description of PINs ..........................................................................................................45
3.14.2 Interface Application ........................................................................................................46

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MF206A
4Power Interface Design Guideline.....................................................................47
4.1 General Design Rules........................................................................................................47
4.2 Power Supply Requirement ...............................................................................................47
4.3 Circuit Requirements of Power Supply Output....................................................................48
4.4 Recommended Power Reference Circuit.............................................................................49
4.5 PCB Layout Guideline of Power Supply.............................................................................51
5RF Antenna Design Guide................................................................................53
5.1 Antenna Types .................................................................................................................53
5.2 Antenna RF Cable and RF Connector.................................................................................53
5.2.1 RF Connector...................................................................................................................53
5.2.2 RF Cable..........................................................................................................................56
5.3 Design of Antenna............................................................................................................57
5.3.1 Preliminary Antenna Evaluation ........................................................................................57
5.3.2 Suggested Antenna Location .............................................................................................58
5.3.3 Suggested Antenna Occupancy Space ................................................................................58
5.3.4 Matching Circuit of Antenna .............................................................................................58
5.3.5 Type of Antenna RF Cable & RF Connector.......................................................................59
5.4 Recommended Antenna Manufacturers ..............................................................................60
5.5 PCB line guidelines ..........................................................................................................60
5.6 Suggestions for EMC & ESD Design .................................................................................61
5.6.1 EMC Design Requirements ...............................................................................................61
5.6.2 ESD Design Requirements ................................................................................................62
5.7 Antenna Indexes...............................................................................................................62
5.7.1 Passive Indexes ................................................................................................................63
5.7.2 Active Indexes .................................................................................................................63
5.7.3 Test Methods for Whole-Set Antenna OTA ........................................................................64
6Electric Feature ...............................................................................................65
6.1 Power Supply...................................................................................................................65

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MF206A
6.2 Working Current ..............................................................................................................65
7Technical Index of Radio Frequency.................................................................68
7.1 Index of RF under UMTS Mode ........................................................................................68
7.1.1 UMTS (WCDMA)............................................................................................................68
7.1.2 Acquiring Radio Frequency Index......................................................................................69
7.1.3 Maximum Transmission Power..........................................................................................69
7.1.4 Receiving Sensibility ........................................................................................................69
7.1.5 Spurious Emission Index...................................................................................................70
7.2 Index of RF under GPRS/GSM/EDGE Mode......................................................................70
7.2.1 Output Transmission Power...............................................................................................70
7.2.2 Receiving Sensibility ........................................................................................................71
7.2.3 Spurious Emission Index...................................................................................................71
8Related Test & Test Standard...........................................................................72
8.1 Testing Reference.............................................................................................................72
8.2 Description of Testing Environment...................................................................................73
8.3 Reliability Testing Environment ........................................................................................74
8.4 Reliability Testing Result..................................................................................................75
9Design Guide ...................................................................................................77
9.1 General Design Rule & Requirement..................................................................................77
9.2 Suggestions for PCB Wielding Panel Design ......................................................................77
9.3 Suggestions for Heat-dissipation Design.............................................................................78
9.4 Recommended Product Upgrading Plan..............................................................................79
10 Manufacturing Guide.......................................................................................80
10.1 Design of Steel Mesh........................................................................................................80
10.2 Furnace Temperature Curve ..............................................................................................81
10.3 Package System................................................................................................................83
11 Safety Information...........................................................................................85

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MF206A
Figures
Figure 2–1 Product Illustration ............................................................................................15
Figure 2–2 Module Dimensions...........................................................................................16
Figure 2–3 System Connection Structure ..............................................................................21
Figure 3–1 PIN Configuration Diagram ................................................................................24
Figure 3–2 (U)SIM Card Signal Connection Circuit ...............................................................32
Figure 3–3 SD Typical Application Circuit ...........................................................................33
Figure 3–4 USB Typical Circuit Application.........................................................................35
Figure 3–5 SPI Bus Sequence Chart .....................................................................................36
Figure 3–6 I2C Reference Circuit Diagram ...........................................................................37
Figure 3–7 Module Serial Port & AP Application Processor....................................................39
Figure 3–9 Turn on the Module Using Driving Circuit............................................................41
Figure 3–10 Resetting the Module Using Driving Circuit........................................................41
Figure 3–11 Power-on Sequence Chart of Module..................................................................42
Figure 3–12 Power-off Sequence Chart of Module.................................................................43
Figure 3–13 Module Resetting Flow.....................................................................................44
Figure 3–14 Timing of Resetting Module..............................................................................44
Figure 3–16 Reference Circuit of Status Indicator..................................................................46
Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS..............................48
Figure 4–2 Add storage capacitor to Module power supply terminal.........................................49
Figure 4–3 DC/DC Switching Power Supply.........................................................................50
Figure 4–4 LDO Power Supply............................................................................................51
Figure 5–1 Main Antenna RF Connector Interface .................................................................54
Figure 5–2 Interface of Main Antenna and GPS Antenna Welding Pad.....................................54
Figure 5–3 RF Interface Testing Console ..............................................................................55
Figure 5–4 Profile Dimensions of RF antenna console............................................................55
Figure 5–5 Recommended Receptacles Mode for MF206A.....................................................57
Figure 5–6 Transition Circuit...............................................................................................59
Figure 5–7 The OTA test system of CTIA.............................................................................64
Figure 9–1 Recommended PCB Wielding Panel Design..........................................................78

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MF206A
Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel.......................................80
Figure 10–2 Furnace Temperature Curve Reference Diagram..................................................82
Figure 10–3 The dimensions of Package tray.........................................................................83
Figure 10–4 Package process of modules..............................................................................84

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MF206A
Tables
Table 1–1 Reference Document List.....................................................................................14
Table 1–2 Abbreviation List................................................................................................14
Table 2–1 Major Technical Parameters.................................................................................18
Table 2–2 Working Frequency Band ....................................................................................21
Table 3–1 PIN Parameters...................................................................................................23
Table 3–2 PIN Interface Definition ......................................................................................25
Table 3–3 Mandatory Pins of Module...................................................................................28
Table 3–4 Working Condition .............................................................................................29
Table 3–5 Power Level Range of Digital Signal.....................................................................30
Table 3–6 Definition & Description of (U)SIM Card Signal Group..........................................31
Table 3–7 Definition of SD Card Signal Interface ..................................................................32
Table 3–8 Definition of SPI Signal.......................................................................................35
Table 3–9 Definition of UART Signal ..................................................................................38
Table 3–10 Definition of JTAG Signal .................................................................................39
Table 3–11 Power-on/Power-off Time..................................................................................43
Table 3–12 Interactive Application Interface.........................................................................44
Table 3–13 Definition of LED PIN Signal.............................................................................45
Table 3–14 Definition of Indicator Status..............................................................................46
Table 5–1 The Cable Consumption ......................................................................................56
Table 5–2 Passive Indexes of Main Antennas on PAD Products...............................................63
Table 5–3 ZTEWelink Indexes for Mobile Terminal Devices ..................................................63
Table 6–1 Input Voltage .....................................................................................................65
Table 6–2 Averaged standby DC power consumption.............................................................65
Table 6–3 Averaged idle mode DC power consumption..........................................................66
Table 6–4 Averaged DC power consumption in working state .................................................66
Table 7–1 Maximum Transmission Power ............................................................................69
Table 7–2 Reference Table of Receiving Sensitivity...............................................................69
Table 7–3 Spurious Emission Index......................................................................................70
Table 7–4 Output Transmission Power of GSM850/900/1800/1900 (GMSK)............................70

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MF206A
Table 7–5 Reference Table of Receiving Sensitivity...............................................................71
Table 8–1 Testing Standard.................................................................................................72
Table 8–2 Testing Environment...........................................................................................73
Table 8–3 Testing Instrument & Device................................................................................74
Table 8–4 Reliability Features .............................................................................................74
Table 8–5 Temperature Testing Result Under Windless Environment.......................................75
Table 8–6 High/Low-temperature Running & Storage Testing Result.......................................75
Table 10–1 Curve Temperature Curve Parameter Setting........................................................81

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MF206A
1About This Document
1.1 Application Range
This document is applicable as the hardware development guide of MF206A WCDMA module products. The
user can design the product according to the requirement and guidance in this document. It is only applicable for
the hardware application and development of MF206A WCDMA module products.
1.2 Purpose
This document provides the hardware solutions and development fundamentals for a product with the
ZTEWelink module. By reading this document, the user can have an overall knowledge of MF206A and a clear
understanding of the technical parameters. With this document, the user can successfully fulfill the application
and development of wireless 3G Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests
and related testing standards, service function implementation flow, RF performance indexes and a guide on the
design of user circuits, to provide the user with a complete design reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 10 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality
1.3 Supported & Reference Document List
Besides the hardware development document, ZTEWelink also provides the board operation guide, software
development guide and upgrading plan guide of MF206A. Table 1–1 is the list of supported documents.

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MF206A
Table 1–1Reference Document List
NO.
Document Name
1
ZTEWelink LGAType ⅡModule Dev Board User Guide.pdf
2
ZTEWelink Software Development Guide of Module
Products.pdf
3
AT Commands reference guide for ZTEWelink WCDMA
Modules.pdf
4
ZTEWelink SMT & Baking User Guide of Module Products.pdf
1.4 Abbreviations
Table 1–2 is a list of abbreviations involved in this document, as well as the English full names.
Table 1–2Abbreviation List
Abbreviations
Full Name
AP
Another name of DTE
BER
Bit Error Rate
DL
Downlink
DPCH
Dedicated Physical Channel
ESD
Electro-Static discharge
ECT
Electric Connector Technology CO.,LTD
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
I/O
Input/output
LED
Light Emitting Diode
PWL
Power Level
SIM
Subscriber Identification Module
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
UMTS
Universal Mobile Telecommunication System
WCDMA
Wideband Code Division Multi Access

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MF206A
2Product Overview
MF206A is a wireless Internet module with LGA interface. A rich set of internet protocols and abundant
functions extend the applicability of the module to a wide range of M2M applications such as metering, tracking
systems, security solutions, routers, wireless POS, mobile computing devices, PDAs, tablet PC and so on. The
features of module are described as below.
1. It can support UMTS 850(900)/1900/2100MHz frequency band, and GSM/GPRS/EDGE
850/900/1800/1900MHz frequency band.
2. It can provide high-speed data access service under the mobile environment.
3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V), USB2.0 interface, UART
interface, SD2.0 interface, power-on/power-off, and resetting.
Figure 2–1Product Illustration
Note: The figures above are just for reference.

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MF206A
2.1 Mechanic Features
MF206A is a 108-pin LGA encapsulation module. Except for the signal PIN, there are many dedicated
heat-dissipation ground wielding panel to improve the grounding performance, mechanical strength and
heat-dissipation performance. There are altogether 30 heat-dissipation ground wielding panels, evenly
distributed at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm, and the height is
2.5+/-0.2mm. The location of PIN 1 is identified by the ground wielding panel with an inclination at the bottom,
and its angle orientates to the top welding panel of the corresponding module. Figure 2–2 is a figure about the
dimensions of module, and the unit of dimensions is mm.
Figure 2–2 Module Dimensions

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MF206A
(Top View)
2.2 Technical Parameters
The major features of module can be described from the aspects of mechanic feature, base band, radio frequency,
technical standard and environment feature. Table 2-1 is a list of the major technical parameters and features
supported by module.

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MF206A
Table 2–1Major Technical Parameters
Name
Item
Specifications
Mechanical
Feature
Dimensions
36mm * 26mm * (2.5+/-0.2)mm
Weight
About 5.5g
Encapsulation type
LGA package(108 Pin)
Baseband
Processor architecture
ARM 9 architecture
(U)SIM/SIM
Standard 6 PIN SIM card interface
Support 3V SIM card and 1.8V SIM card
Memory
32MByte NAND Flash/128MByte DDR
USB interface
USB 2.0 HIGH SPEED, the data transfer rate can reach up to 480
Mbps.
Can be used for AT command communication, data transmission,
GNSS NMEA output, software debug and firmware upgrade
UART interface
Used for AT command, data transmission or Diag service
And can be switch by the command of +UART
Maximum power
consumption
2.2W note1
Power Supply
The range of voltage supply is 3. 4V-4.2V, and the typical value
is3.8V
Working current note2
Peak current
≤2A (3.8V)
Average normal working current
≤500mA(3.8V)
Average normal working current
(without services)
≤75mA
Standby current
≤5mA (3.8V)
RF
GSM band
EDGE/GPRS/GSM Quad-band: GSM850, EGSM900, DCS1800,
PCS1900.
UMTS band
UMTS: 2100/1900/850(900)MHz
RxDiv band
NAnote3
Max. Transmitter Power
UMTS2100/1900/850(900): Power Class 3 (+24 +1/-3dBm)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26 -4/+3dBm)
Receiving sensitivity
WCDMA2100: ≤-106.7dBm
WCDMA1900/850: ≤-104.7dBm

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MF206A
Name
Item
Specifications
WCDMA900: ≤-103.7dBm
GSM850/900/1800/1900: ≤-102dBm
Main antenna interface
Support
Receive diversity (GPS)
antenna interface
Support the GPS wielding panel interface, don’t support the diversity
antenna interface .We don’t provide the antenna, and the antenna is
provided by the third party.
Technical
Standard
Data rate
GSM CS: UL 9.6kbps/DL 9.6kbps
GPRS: Multi-slot Class 10
EDGE: Multi-slot Class 12
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA PS: UL 384kbps/DL 384kbps
HSDPA: DL 3.6Mbps
GPRS type
Class B
3GPP protocol
R99,R5
Other protocols
Support embedded TCP /UDP protocols
Support PPP protocol
Support the protocols PAP (Password Authentication Protocol) and
CHAP (Challenge Handshake Authentication Protocol) usually used
for PPP connections.
Operating system
Windows XP (SP2 and later)
Windows Vista
Windows 7
WinCE5.0/6.0 (X86 and ARM)
Linux
Android 2.x / 4.x
Environment
Feature note4
Normal Working
Temperature
-30 to 75°C
Storage Temperature
-45 to 90°C
Humidity
5%~ 95%
Application
RAS dialup
Support
GPS/AGPS
Support
SMS
Support Text and PDU mode.
Point to point MO and MT.
SMS Status Report & SMS centre address setting