ZTEWelink MF206A User manual

Hardware Development Guide of
Module Product
Version 2.5, 2015-06-18
MF206A

Hardware Development Guide of Module Product
All Rights reserved, No Spreading abroad without Permission of ZTEWelink I
MF206A
Legal Information
By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as
ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the
following terms, please stop using the document.
Copyright © 2013 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document
contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink,
no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or
any image, table, data or other information contained in this document.
is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are
ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE
Corporation’s registered trademark. The other products or company names mentioned in this
document are the trademark or registered trademark of their respective owner. Without the prior
written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.
The product meets the design requirements of environmental protection and personal security. The
storage, use or disposal of products should abide by the product manual, relevant contract or the laws
and regulations of relevant country.
ZTEWelink reserves the right to make modifications on the product described in this document
without prior notice, and keeps the right to revise or retrieve the document any time.
If you have any question about the manual, please consult the company or its distributors promptly.

Hardware Development Guide of Module Product
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MF206A
Revision History
Version
Date
Description
1.0
2010-11-18
Initial version
2.0
2011-3-15
Chapter 1:
1. Add the application range and compilation purpose
Chapter 2:
1. Update Table2-1
2. Add the introduction of baseband function and radio frequency;
add the frame structure
Chapter 3:
1. Add the definition of PIN I/O parameter, and provide the
description of PINs
2. Add the feature of interface PWL
Chapter 4:
1. Add the chapter
Chapter 5:
1. Update the RF sourced index and source less index
Chapter 6:
1. Update the testing standard and testing environment
Chapter 7:
1. Add the chapter
Chapter 8:
1. Add the chapter
2.1
2013-03-26
1. Modify the logo of cover and page footer
2. Modify Legal Information
3. Modify some errors in the Table 2-2 of Working Frequency Band
4. Update the Table 1-1 of Supported Document List
5. Modify the chapter of 7.7 of Recommended Upgrade Methods
6. Modify the Figure 7-1 of Main Antenna RF Connector Interface
to erase the IMEI in picture
7. Modify the test result in Table 6-6
8. Modify the name of Table 5-1 to sourceless
2013-05-31
9. Release as Version 2.1
2.2
2013-12-09
1. Modify the Figure 2-2.
2. Add the contact information

Hardware Development Guide of Module Product
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MF206A
Version
Date
Description
3. Update Document Format
2.3
2013-12-30
1. Add the profile dimensions of RF antenna console
2. Modify part 7.3 of RF Circuit Design
2.4
2014-06-30
1. Update the legal information
2. Add the NOTE in chapter 1.2
3. Update Table 1-1 of Reference Document List
4. Update Table 2-1 of Major Technical Parameters
5. Update Table 3-1 of PIN Parameters
6. Add Table 3–3 of The Mandatory Pins of Module
7. Update Figure 3-3 of SD Typical Application Circuit
8. Modify chapter 3.10 of Power-on/Power-off & Reset Signal
9. Update Figure 3-16 of Reference Circuit of Status Indicator
10. Modify chapter 4.2 of Working Current
11. Move the chapter 4.2 and 4.3 of Power-on/Power-off Flow in the
former document to chapter 3.10
12. Modify Index of RF under UMTS & GPRS/GSM/EDGE Mode
in chapter 5.1 and 5.2
13. Add the NOTE in chapter 6.3
14. Add Figure 9-1 of Recommended PCB Wielding Panel Design
15. Modify Figure 5–1 of Main Antenna RF Connector Interface
16. Modify chapter 10.2 of Furnace Temperature Curve
17. Add chapter 11 of Safety Information
18. Add the chapter 10.3 of Package System
2.5
2015-06-15
1. Add the description of Suspend and Resume of module in
chapter 3.10 &3.7
2. Update the figures of module

Hardware Development Guide of Module Product
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MF206A
Contact Information
Post
9/F, Tower A, Hans Innovation Mansion,
North Ring Rd., No.9018, Hi-Tech Industrial Park,
Nanshan District, Shenzhen. P.R.China
Web
www.ztewelink.com
Phone
[phone]
E-Mail
[email protected]m.cn
Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware
upgrades, troubleshooting tips, and press releases
Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone,
website, instant messaging, E-mail and on-site.

Hardware Development Guide of Module Product
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MF206A
Contents
1About This Document ......................................................................................13
1.1 Application Range............................................................................................................13
1.2 Purpose............................................................................................................................13
1.3 Supported & Reference Document List...............................................................................13
1.4 Abbreviations...................................................................................................................14
2Product Overview............................................................................................15
2.1 Mechanic Features............................................................................................................16
2.2 Technical Parameters........................................................................................................17
2.3 Function Overview ...........................................................................................................20
2.3.1 Baseband Function ...........................................................................................................20
2.3.2 Radio Frequency Function.................................................................................................21
3Interfaces.........................................................................................................23
3.1 Definition of PINs ............................................................................................................23
3.1.1 Definition of PIN I/O Parameters.......................................................................................23
3.1.2 PIN Configuration Diagram...............................................................................................23
3.1.3 PIN Description................................................................................................................25
3.2 Working Condition...........................................................................................................29
3.3Feature of Digital Power Level ..........................................................................................30
3.4 Power Interface ................................................................................................................30
3.4.1 Description of Power PINs ................................................................................................30
3.4.2 Requirement of Power Supply ...........................................................................................30
3.5 (U)SIM Card Interface ......................................................................................................31
3.5.1 Description of PINs ..........................................................................................................31
3.5.2 Electric Feature ................................................................................................................31
3.5.3 Application of (U)SIM Card Interface ................................................................................32
3.6 SD Card Interface.............................................................................................................32

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MF206A
3.6.1 Description of PINs ..........................................................................................................32
3.6.2 Electric Feature ................................................................................................................33
3.6.3 Application of SD Card Interface.......................................................................................33
3.7 USB2.0 Interface..............................................................................................................34
3.7.1 Description of PINs ..........................................................................................................34
3.7.2 Electric Feature ................................................................................................................34
3.7.3 Application of USB Interface.............................................................................................34
3.8 SPI (Serial Peripheral Interface) Bus Interface ....................................................................35
3.8.1 Description of PINs ..........................................................................................................35
3.8.2 Electric Feature ................................................................................................................35
3.9 I2C Bus ...........................................................................................................................36
3.9.1 Description of PINs ..........................................................................................................36
3.9.2 Electric Feature ................................................................................................................37
3.10 UART Interface................................................................................................................38
3.10.1 Description of PINs ..........................................................................................................38
3.10.2 Electric Feature ................................................................................................................38
3.11 JTAG (Joint Test Action Group) Interface ..........................................................................39
3.11.1 Description of PINs ..........................................................................................................39
3.11.2 Application of JTAG Interface...........................................................................................40
3.12 Power-on/Power-off & Reset Signal...................................................................................40
3.12.1 Description of PINs ..........................................................................................................40
3.12.2 Power-on/Power-off Flow .................................................................................................42
3.12.3 Resetting Flow .................................................................................................................43
3.13 Interactive Application Interface........................................................................................44
3.13.1 Description of PINs ..........................................................................................................44
3.13.2 Interface Application ........................................................................................................45
3.14 LED Indicator Interface ....................................................................................................45
3.14.1 Description of PINs ..........................................................................................................45
3.14.2 Interface Application ........................................................................................................46

Hardware Development Guide of Module Product
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MF206A
4Power Interface Design Guideline.....................................................................47
4.1 General Design Rules........................................................................................................47
4.2 Power Supply Requirement ...............................................................................................47
4.3 Circuit Requirements of Power Supply Output....................................................................48
4.4 Recommended Power Reference Circuit.............................................................................49
4.5 PCB Layout Guideline of Power Supply.............................................................................51
5RF Antenna Design Guide................................................................................53
5.1 Antenna Types .................................................................................................................53
5.2 Antenna RF Cable and RF Connector.................................................................................53
5.2.1 RF Connector...................................................................................................................53
5.2.2 RF Cable..........................................................................................................................56
5.3 Design of Antenna............................................................................................................57
5.3.1 Preliminary Antenna Evaluation ........................................................................................57
5.3.2 Suggested Antenna Location .............................................................................................58
5.3.3 Suggested Antenna Occupancy Space ................................................................................58
5.3.4 Matching Circuit of Antenna .............................................................................................58
5.3.5 Type of Antenna RF Cable & RF Connector.......................................................................59
5.4 Recommended Antenna Manufacturers ..............................................................................60
5.5 PCB line guidelines ..........................................................................................................60
5.6 Suggestions for EMC & ESD Design .................................................................................61
5.6.1 EMC Design Requirements ...............................................................................................61
5.6.2 ESD Design Requirements ................................................................................................62
5.7 Antenna Indexes...............................................................................................................62
5.7.1 Passive Indexes ................................................................................................................63
5.7.2 Active Indexes .................................................................................................................63
5.7.3 Test Methods for Whole-Set Antenna OTA ........................................................................64
6Electric Feature ...............................................................................................65
6.1 Power Supply...................................................................................................................65

Hardware Development Guide of Module Product
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MF206A
6.2 Working Current ..............................................................................................................65
7Technical Index of Radio Frequency.................................................................68
7.1 Index of RF under UMTS Mode ........................................................................................68
7.1.1 UMTS (WCDMA)............................................................................................................68
7.1.2 Acquiring Radio Frequency Index......................................................................................69
7.1.3 Maximum Transmission Power..........................................................................................69
7.1.4 Receiving Sensibility ........................................................................................................69
7.1.5 Spurious Emission Index...................................................................................................70
7.2 Index of RF under GPRS/GSM/EDGE Mode......................................................................70
7.2.1 Output Transmission Power...............................................................................................70
7.2.2 Receiving Sensibility ........................................................................................................71
7.2.3 Spurious Emission Index...................................................................................................71
8Related Test & Test Standard...........................................................................72
8.1 Testing Reference.............................................................................................................72
8.2 Description of Testing Environment...................................................................................73
8.3 Reliability Testing Environment ........................................................................................74
8.4 Reliability Testing Result..................................................................................................75
9Design Guide ...................................................................................................77
9.1 General Design Rule & Requirement..................................................................................77
9.2 Suggestions for PCB Wielding Panel Design ......................................................................77
9.3 Suggestions for Heat-dissipation Design.............................................................................78
9.4 Recommended Product Upgrading Plan..............................................................................79
10 Manufacturing Guide.......................................................................................80
10.1 Design of Steel Mesh........................................................................................................80
10.2 Furnace Temperature Curve ..............................................................................................81
10.3 Package System................................................................................................................83
11 Safety Information...........................................................................................85

Hardware Development Guide of Module Product
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MF206A
Figures
Figure 2–1 Product Illustration ............................................................................................15
Figure 2–2 Module Dimensions...........................................................................................16
Figure 2–3 System Connection Structure ..............................................................................21
Figure 3–1 PIN Configuration Diagram ................................................................................24
Figure 3–2 (U)SIM Card Signal Connection Circuit ...............................................................32
Figure 3–3 SD Typical Application Circuit ...........................................................................33
Figure 3–4 USB Typical Circuit Application.........................................................................35
Figure 3–5 SPI Bus Sequence Chart .....................................................................................36
Figure 3–6 I2C Reference Circuit Diagram ...........................................................................37
Figure 3–7 Module Serial Port & AP Application Processor....................................................39
Figure 3–9 Turn on the Module Using Driving Circuit............................................................41
Figure 3–10 Resetting the Module Using Driving Circuit........................................................41
Figure 3–11 Power-on Sequence Chart of Module..................................................................42
Figure 3–12 Power-off Sequence Chart of Module.................................................................43
Figure 3–13 Module Resetting Flow.....................................................................................44
Figure 3–14 Timing of Resetting Module..............................................................................44
Figure 3–16 Reference Circuit of Status Indicator..................................................................46
Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS..............................48
Figure 4–2 Add storage capacitor to Module power supply terminal.........................................49
Figure 4–3 DC/DC Switching Power Supply.........................................................................50
Figure 4–4 LDO Power Supply............................................................................................51
Figure 5–1 Main Antenna RF Connector Interface .................................................................54
Figure 5–2 Interface of Main Antenna and GPS Antenna Welding Pad.....................................54
Figure 5–3 RF Interface Testing Console ..............................................................................55
Figure 5–4 Profile Dimensions of RF antenna console............................................................55
Figure 5–5 Recommended Receptacles Mode for MF206A.....................................................57
Figure 5–6 Transition Circuit...............................................................................................59
Figure 5–7 The OTA test system of CTIA.............................................................................64
Figure 9–1 Recommended PCB Wielding Panel Design..........................................................78