ADC HiGain HTC-319 List 1 User manual

HiGain
HiGain
TT
T
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RR
LOOPBACK
LOOPTHRU
SHORT
OPEN
SIDE1
SIDE1
SIDE1
SIDE1
FIELD
FIELD
FIELD
FIELD
SIDE2
SIDE2
SIDE2
SIDE2
C. O.
C. O.
C. O.
C. O.
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INSTALLATION GUIDE
Test Card HTC-319 List 1
Product Catalog: 100-319-200-03
CLEI: T1DQABVJ

100-319-200-03, Issue 3
ii September 9, 1999 HTC-319 List 1
Revision History of This Guide
To order copies of this document, use document catalog number
100-319-200-03.
Copyright
September 9, 1999
© 1999 ADC DSL Systems, Inc. All rights reserved.
Trademark Information
ADC is a registered trademark of ADC Telecommunications, Inc. HiGain is a
registered trademark of ADC DSL Systems, Inc. No right, license, or interest to such
trademarksis granted hereunder,andyou agree that no suchright, license,or interest
shall be asserted by you with respect to such trademark.
Other product names mentioned in this practice are used for identification purposes
only and may be trademarks or registered trademarks of their respective companies.
Disclaimer of Liability
Informationcontained in this documentis company private to ADCDSL Systems,Inc.,
and shall not be modified, used, copied, reproduced or disclosed in whole or in part
without the written consent of ADC.
Contents herein are current as of the date of publication. ADC reserves the right to
change the contents without prior notice. In no event shall ADC be liable for any
damages resulting from loss of data, loss of use, or loss of profits, and ADC further
disclaims any and all liability for indirect, incidental, special, consequential or other
similar damages. This disclaimer of liabilityapplies to all products, publications and
services during and after the warranty period.
Issue Release Date Revisions Made
03 August 5, 1996 Initial Release
02 September 9, 1999 Added CLEI code
03 April 10, 2002 ADC Rebranding

100-319-200-03, Issue 3 Using This Manual
HTC-319 List 1 September 9, 1999 iii
USING THIS MANUAL
Three types of messages, identified by icons, appear in text.
UNPACK AND INSPECT YOUR SHIPMENT
Upon receipt of the equipment:
•Unpack each container and inspect the contents for signs of damage. If
theequipmenthas beendamagedintransit,immediatelyreporttheextent
of damage to the transportation company and to ADC DSL Systems, Inc.
Order replacement equipment, if necessary.
•Check the packing list to ensure complete and accurate shipment of each
listed item. If the shipment is short or irregular, contact ADC DSL
Systems, Inc. as described in Product Support on page 8. If you must
store the equipment for a prolonged period, store the equipment in its
original container.
Notes contain information about special circumstances.
Cautions indicate the possibility of personal injury or
equipment damage.
The Electrostatic Discharge (ESD) symbol indicates that a
deviceorassemblyissusceptibletodamagefromelectrostatic
discharge.

Table of Contents 100-319-200-03, Issue 3
iv September 9, 1999 HTC-319 List 1
TABLE OF CONTENTS
Overview________________________________________________1
Features ....................................................................................1
Test Card ..................................................................................2
Installation ______________________________________________3
Testing a Circuit__________________________________________3
Appendix A - Specifications ________________________________6
Appendix B - Glossary_____________________________________7
Appendix C - Product Support______________________________8
Certification and Warranty _________________Inside Back Cover
LIST OF FIGURES
1.HTC-319 List 1 Test Card ......................................................................2
2.HTC-319 List 1 Test Connections..........................................................5
LIST OF TABLES
1.Test Connections.....................................................................................4

100-319-200-03, Issue 3 Overview
HTC-319 List 1 September 9, 1999 1
OVERVIEW
This practice describes the ADCHiGainTest Card HTC-319 List 1. The
HTC-319 provides a convenient method of testing Central Office (CO) and
Field Tip and Ring transmit and receive pairs from any standard T1-239
repeater slot.
FEATURES
•Four-position slider switch (S1) that allows you to select the kind of test
you wish to perform on the transmit (XMT) and receive (RCV) Tip and
Ring pairs on CO and field circuits:
–Loop Back (metallic)
–Loop Thru
–Short
–Open
•Test points that provide access to Tip and Ring circuits (CO and field),
frame ground, and -48 Vdc power.
•Miniature210 jacks located withinthe J1block that provideaccess toCO
and field Tip and Ring circuit sides.
•Current-limiting resistorin series with -48 Vdctest point protects power
circuit from accidental shorting.
•Designed to extend beyond the front plane of the shelf or enclosure into
which the HTC-319 is inserted to permit easy access to its test points.

Overview 100-319-200-03, Issue 3
2 September 9, 1999 HTC-319 List 1
TEST CARD
Test points on the HTC-319 (Figure 1) provide access to each circuit under
test as well as to circuitground, frame ground, and -48 Vdc, if available. The
number of each test point corresponds to the edge connector pin of the circuit
under test. A 47 kΩresistor connected between the -48 Vdc source and the
test point limits current in case of accidental shorting.
The four-position testslider switch (S1) selects which test (Loop Back, Loop
Thru, Short, or Open) is to be performed on CO and field circuits. The Open
switch position effectively provides a splitting access to one pair of the CO
and field sides and the 210 jacks. The Loop Back or Loop Thru switch
positions allow you to use the two miniature 210 jacks located within the J1
block. All tests are run on both side 1 and side 2. Refer to “Testing a Circuit”
on page 3 for further information.
Figure 1. HTC-319 List 1 Test Card
LOOP
BACK
LOOP
THRU
SHORT
FIELD
SIDE 2
FIELD
SIDE 1
SIDE 1
TT
TT
RR
RR
CIR -48V
R1
TP2
TP1 TP6
CO
CO
TP9
FIELD
FIELD
FRM
GND
SIDE 2
OPEN
HTC-319 L1
TEST CARD
TT
T
T
T
T
T
T
T
T
T
T
T
T
T
T
RR
LOOP BACK
LOOP THRU
SHORT
OPEN
SIDE 1
SIDE 1
SIDE 1
SIDE 1
FIELD
FIELD
FIELD
FIELD
SIDE 2
SIDE 2
SIDE 2
SIDE 2
C. O.
C. O.
C. O.
C. O.
R
R
R
R
R
R
R
R
R
R
R
R
R
R
S1 switch Circuit schematic
A
L
S1 positions
Test points Miniature 210 jacks Connector pins

100-319-200-03, Issue 3 Installation
HTC-319 List 1 September 9, 1999 3
INSTALLATION
1Insert the HTC-319 into the shelf slot for the channel you want to test.
2Push the card all the way into the slot until the card is firmly seated.
TESTING ACIRCUIT
Use the HTC-319 to test circuits, as follows:
1Set the slider switch S1 to the type of test you want to perform (Loop
Back, Loop Thru, Short, or Open).
2Connect to test points as applicable. The connections of Tip and Ring
pairs of CO and field circuits for each setting of the switch are listed in
Table 1 on page 4 and illustrated in Figure 2 on page 5. (Pin numbers
correspond to the edge connector pins for each circuit.)
3Perform the selected test.
4Monitor the circuits at the corresponding test points on the card.
5Repeat steps 1 through 4 as required.
Allwiring externaltotheproductshould follow the provisions
of the current edition of the National Electrical Code.

Testing a Circuit 100-319-200-03, Issue 3
4 September 9, 1999 HTC-319 List 1
Table 1. Test Connections
Connect Pin Number To Pin Number
Loopback - This switch position connects the following circuits
CO Tip ACO Tip B
CO Ring 1CO Ring 2
Field Tip FField Tip K
Field Ring 6Field Ring 9
Loopthru - This switch position connects the following circuits
CO Tip AField Tip F
CO Ring 1Field Ring 6
CO Tip BField Tip K
CO Ring 2Field Ring 9
Short - This switch position connects the following circuits
CO Tip ACO Ring 1
CO Tip BCO Ring 2
Field Tip FField Ring 6
Field Tip KField Ring 9
Open - This switch position removes all connections between the circuits

100-319-200-03, Issue 3 Testing a Circuit
HTC-319 List 1 September 9, 1999 5
Figure 2. HTC-319 List 1 Test Connections
LOOP
BACK
LOOP
THRU
SHORT
FIELD
SIDE 2
FIELD
SIDE 1
SIDE 1
TT
TT
RR
RR
CIR -48V
R1
TP2
TP1
T
est point 1
(TP1)
TP6
CO
CO
TP9
FIELD
FIELD
FRM
GND
SIDE 2
OPEN
HTC-319 L1
TEST CARD
PairGain
TT
T
T
T
T
T
T
T
T
T
T
T
T
T
T
RR
LOOP BACK
LOOP THRU
SHORT
OPEN
SIDE 1
SIDE 1
SIDE 1
SIDE 1
FIELD
FIELD
FIELD
FIELD
SIDE 2
SIDE 2
SIDE 2
SIDE 2
C. O.
C. O.
C. O.
C. O.
R
R
R
R
R
R
R
R
R
R
R
R
R
R
LOOP BACK
LOOP THRU
SHORT
OPEN
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
SIDE 1
SIDE 1
SIDE 1
SIDE 1
SIDE 2
SIDE 2
SIDE 2
SIDE 2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
F
6
K
9
F
6
K
9
F
6
K
9
F
6
K
9
To/fro
m
field
equipm
To/from
CO
equipment
J
5
8
Frame ground
Circuit ground
-48V
F
LOOP
BACK
LOOP
THRU
SHORT
FIELD
SIDE 2
FIELD
SIDE 1
SIDE 1
TT
TT
RR
RR
CIR -48V
R1
TP2
TP1
Test point 1
(TP1)
TP6
CO
CO
TP9
FIELD
FIELD
FRM
GND
SIDE 2
OPEN
HTC-319 L1
TEST CARD
TT
T
T
T
T
T
T
T
T
T
T
T
T
T
T
RR
LOOP BACK
LOOP THRU
SHORT
OPEN
SIDE 1
SIDE 1
SIDE 1
SIDE 1
FIELD
FIELD
FIELD
FIELD
SIDE 2
SIDE 2
SIDE 2
SIDE 2
C. O.
C. O.
C. O.
C. O.
R
R
R
R
R
R
R
R
R
R
R
R
R
R
LOOP BACK
LOOP THRU
SHORT
OPEN
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
Tip
Tip
Ring
Ring
SIDE 1
SIDE 1
SIDE 1
SIDE 1
SIDE 2
SIDE 2
SIDE 2
SIDE 2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
Tip
Tip
Ring
Ring
A
B
1
2
F
6
K
9
F
6
K
9
F
6
K
9
F
6
K
9
To/from
field
equipment
To/from
CO
equipment
J
5
8
Frame ground
Circuit ground
-48 V
F

Appendix A - Specifications 100-319-200-03, Issue 3
6 September 9, 1999 HTC-319 List 1
APPENDIX A - SPECIFICATIONS
Mounting STS high-density shelf
Operating Temperature 40 °F to + 149 °F (-40 °C to + 65 °C)
Operating Humidity 5% to 95% (non-condensing)
Dimensions and Weight
Height: 4.8 in. ( 12.19 cm)
Width: 0.6 in. (1.52 cm)
Depth: 13.6 in. (34.54 cm)
Weight: 1.3 lb. (0.59 kg)