
CONTENTS
1. SAFETY.................................................................................................................................. 6
2. PACKING LIST..................................................................................................................... 9
3. GENERAL INFORMATION ............................................................................................. 10
4. MAJOR SUBSYSTEMS AND THEIR FUNCTIONS...................................................... 11
4.1 INTRODUCTION........................................................................................................... 11
4.2 DESCRIPTION............................................................................................................... 11
4.3 SINGLE UNIT MAJOR COMPONENTS...................................................................... 11
4.3.1 L-Band to Ku-Band Up-Converter Module .............................................................. 12
4.3.2 Power Amplifier Module........................................................................................... 12
4.3.3 Waveguide Assembly................................................................................................. 13
4.3.4 10 MHz REFERENCE OSCILLATOR...................................................................... 13
4.3.5 Main Controller Board............................................................................................. 13
4.3.6 Power Supply ............................................................................................................ 14
4.3.7 Cooling System.......................................................................................................... 15
4.4 SPECIFICATIONS (SINGLE UNIT)............................................................................. 18
5. INTERFACES......................................................................................................................21
5.1 RELAY INTERFACE............................................................................................................ 21
5.2 RS-232 INTERFACE...................................................................................................... 23
5.3 RS-485 INTERFACE...................................................................................................... 24
5.4 REDUNDANT INTERFACE ......................................................................................... 24
5.5 RF OUTPUT MONITOR INTERFACE ................................................................................... 24
6. UNPACKING AND INSTALLATION.............................................................................. 25
6.1 INITIAL INSPECTION .................................................................................................. 25
6.2 UNPACKING.................................................................................................................. 25
6.3 INSTALLATION............................................................................................................ 25
6.3.1 Relay, Serial Interfaces and AC Power Cables Construction .................................. 26
6.3.2 Environmental and Adequate Ventilation Considerations ....................................... 26
6.3.3 Mechanical, RF and Electrical Installation.............................................................. 27
7. PRE-POWER AND SYSTEM CHECKOUT.................................................................... 30
7.1 PRE-POWER PROCEDURES........................................................................................ 30
7.2 OPERATIONAL SETTINGS VERIFICATION ............................................................ 30
8. OPERATION........................................................................................................................ 31
8.1 INTRODUCTION........................................................................................................... 31
8.2 SAFETY CONSIDERATIONS ...................................................................................... 31
8.3 BASIC OPERATING PROCEDURE............................................................................. 31
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