Advantech ROM-DB3900 User manual

User Manual
ROM-DB3900
Development Board for
RTX v2.0 Modules

ROM-DB3900 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2014
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. Information provided in this manual is intended to be accurate and reliable. How-
ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-
ments of the rights of third parties, which may result from its use.
Acknowledgements
ARM is trademarks of ARM Corporation.
Freescale is trademarks of Freescale Corporation.
Microsoft Windows are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants to you, the original purchaser, that each of its products will be
free from defects in materials and workmanship for two years from the date of pur-
chase.
This warranty does not apply to any products which have been repaired or altered by
persons other than repair personnel authorized by Advantech, or which have been
subject to misuse, abuse, accident or improper installation. Advantech assumes no
liability under the terms of this warranty as a consequence of such events.
Because of Advantech’s high quality-control standards and rigorous testing, most of
our customers never need to use our repair service. If an Advantech product is defec-
tive, it will be repaired or replaced at no charge during the warranty period. For out-
of-warranty repairs, you will be billed according to the cost of replacement materials,
service time and freight. Please consult your dealer for more details.
If you think you have a defective product, follow these steps:
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages you get when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain an RMA (return merchandize
authorization) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a fully-completed Repair and Replacement
Order Card and a photocopy proof of purchase date (such as your sales receipt)
in a shippable container. A product returned without proof of the purchase date
is not eligible for warranty service.
5. Write the RMA number visibly on the outside of the package and ship it prepaid
to your dealer.
Part No. 2006B39001 Edition 2
Printed in Taiwan December 2014

iii ROM-DB3900 User Manual
Declaration of Conformity
FCC Class B
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installa-
tion. This equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful inter-
ference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interfer-
ence to radio or television reception, which can be determined by turning the equip-
ment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

ROM-DB3900 User Manual iv
Warnings, Cautions and Notes
Packing List
Before installation, please ensure the following items have been shipped.
Optional Accessories
Warning! Warnings indicate conditions, which if not observed, can cause personal
injury!
Caution! Cautions are included to help you avoid damaging hardware or losing
data. e.g.
There is a danger of a new battery exploding if it is incorrectly installed.
Do not attempt to recharge, force open, or heat the battery. Replace the
battery only with the same or equivalent type recommended by the man-
ufacturer. Discard used batteries according to the manufacturer's
instructions.
Note! Notes provide optional additional information.
9696M39000E RTX 2.0 Carrier board ROM-DB3900 1
9696ED2000E debug adapter board 1
1700021882-01 LVDS backlight cable 1
1700021883-01 LVDS cable 1
1700021941-01 SATA power 1
1700004711 SATA signal 1
1700019076 USB OTG to Type A female 1
1700019077 USB OTG to Type A male 1
1701100300 F Cable IDE#3 10P-2.54/D-SUB 9P(M) 30cm for UART and
CAN 2
1700021861-01 USB 4 pin to Type A Cable 1
1700022373-01 Debug port cable for ROM-3420 1
1700019474 A Cable D-SUB 9P(F)/D-SUB 9P(F) RS232/RS485 100c 1
2026390000 China RoHS ROM-DB3900 Electronic Pollution 1st 1
Part No. Description
9696MEG510E Daughter board for audio codec
9696MX5300E Daughter board for system bus
9680015491 PCIe to miniPCIe adapter card
96LEDK-
A070WV40NB1 7" LCD AUO G070VW01 V0 w/o touch

v ROM-DB3900 User Manual
RTX 2.0 CPU Boards
For more information please refer to "Advantech Baseboard Check List" and "Evalu-
ation Board Reference Schematic".
You can download "Advantech Baseboard Check List" and "Evaluation Board Refer-
ence Schematic" from http://www.advantech.com
Safety Instructions
1. Read these safety instructions carefully.
2. Keep this User Manual for later reference.
3. Disconnect this equipment from any AC outlet before cleaning. Use a damp
cloth. Do not use liquid or spray detergents for cleaning.
4. For plug-in equipment, the power outlet socket must be located near the equip-
ment and must be easily accessible.
5. Keep this equipment away from humidity.
6. Put this equipment on a reliable surface during installation. Dropping it or letting
it fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. DO NOT COVER THE OPENINGS.
8. Make sure the voltage of the power source is correct before connecting the
equipment to the power outlet.
9. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage by transient overvoltage.
12. Never pour any liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If one of the following situations arises, get the equipment checked by service
personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment does not work well, or you cannot get it to work according to
the user's manual.
The equipment has been dropped and damaged.
The equipment has obvious signs of breakage.
15. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT WHERE THE
STORAGE TEMPERATURE MAY GO BELOW -20° C (-4° F) OR ABOVE 60° C
(140° F). THIS COULD DAMAGE THE EQUIPMENT. THE EQUIPMENT
SHOULD BE IN A CONTROLLED ENVIRONMENT.
Part No. Description
ROM-3420CD-MDA1E Freescale i.mx6 Dual core 1GHz with 1GB memory (0~60C)
ROM-3420WD-MDA1E Freescale i.mx6 Dual core 1GHz with 1GB memory(-40~85C)
ROM-3420CQ-MDA1E Freescale i.mx6 Quad core 1GHz with 1GB memory(0~60C)
ROM-3420WQ-MDA1E Freescale i.mx6 Quad core 1GHz with 1GB memory(-40~85C)

ROM-DB3900 User Manual vi
16. CAUTION: DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY
REPLACED. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE
RECOMMENDED BY THE MANUFACTURER, DISCARD USED BATTERIES
ACCORDING TO THE MANUFACTURER'S INSTRUCTIONS.
The sound pressure level at the operator's position according to IEC 704-1:1982 is
no more than 70 dB (A).
DISCLAIMER: This set of instructions is given according to IEC 704-1. Advantech
disclaims all responsibility for the accuracy of any statements contained herein.
Safety Precaution - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from
damage.
To avoid electrical shock, always disconnect the power from your PC chassis
before you work on it. Don't touch any components on the CPU card or other
cards while the PC is on.
Disconnect power before making any configuration changes. The sudden rush
of power as you connect a jumper or install a card may damage sensitive elec-
tronic components.

vii ROM-DB3900 User Manual
Contents
Chapter 1 General Introduction ...........................1
1.1 Introduction ...............................................................................................2
1.2 Product Specification ................................................................................2
Chapter 2 H/W Installation....................................3
2.1 Module Form Factor..................................................................................4
2.2 Environmental Specifications....................................................................4
2.3 ROM-DB3900 Appearance .......................................................................4
2.3.1 ROM-DB3900 Overview ...............................................................4
2.3.2 I/O Connectors..............................................................................5
2.4 Connectors, Jumper settings, Switches and LEDs...................................5
2.4.1 Rear I/O panel...............................................................................5
Table 2.1: External IO Connector................................................5
Table 2.2: DCIN (DC-Jack, +19V power input)............................5
Table 2.3: COM01A (UART0, 4 WIRE).......................................6
Table 2.4: COM01B (UART1, 4 WIRE).......................................6
Table 2.5: VGA (VGA).................................................................7
Table 2.6: HDMI (HDMI)..............................................................7
Table 2.7: RJ45+USB (RJ-45 & USB 1/2)...................................8
Table 2.8: PHONE_JACK (Audio output)....................................8
2.4.2 Internal I/O....................................................................................9
Table 2.9: Internal IO Connectors ...............................................9
2.4.3 Connectors..................................................................................11
Table 2.10:PCIE_SLOT0 (PCIex1 connector1)..........................11
Table 2.11:PCIE_SLOT1 (PCIex1 connector2)..........................12
Table 2.12:SATA (SATA connector)...........................................13
Table 2.13:SATA_PWR (SATA Power connector).....................13
Table 2.14:LVDS (LVDS 24-bit) .................................................14
Table 2.15:LVDS_BKLT (LVDS backlight power) ......................14
Table 2.16:USB_OTG (USB OTG).............................................14
Table 2.17:SD (SD slot)..............................................................15
Table 2.18:BR2032HOLDER (CR-2032)....................................15
2.4.4 Jumpers......................................................................................15
Table 2.19:JP2201 (GPIO/Keypad selection for GPIO0/10) ......15
Table 2.20:JP2202 (GPIO/Keypad selection for GPIO1/11) ......15
Table 2.21:JP2203 (GPIO/Keypad selection for GPIO2/12) ......16
Table 2.22:JP2204 (GPIO/Keypad selection for GPIO3/13) ......16
Table 2.23:JP2205 (GPIO/Keypad selection for GPIO4/14) ......16
Table 2.24:JP2206 (GPIO/Keypad selection for GPIO5/15) ......16
Table 2.25:JP2207 (GPIO/Keypad selection for GPIO6/16) ......16
Table 2.26:JP2208 (GPIO/Keypad selection for GPIO7/17) ......17
Table 2.27:JP2208 (GPIO8).......................................................17
Table 2.28:JP22 (GPIO9)...........................................................17
Table 2.29:JP1801~JP1804, JP1901~JP1904 (UART 120om ter-
minal resister)...........................................................17
Table 2.30:JP1101 (EDP_HPD for LVDS) .................................18
Table 2.31:JP1601 (SATA-DOM Jumper, default 2-3)...............18
Table 2.32:JP1701 (CAN0 bus, 120OM terminal resistor) .........18
Table 2.33:JP1702 (CAN1 bus, 120OM terminal resistor) .........18
Table 2.34:COM_SEL0/1/2/3 (UART0/1/2/3 function selection..19
Table 2.35:(UART1, 2wires).......................................................19
Table 2.36:(UART3, 2wires).......................................................20
Table 2.37:CAM0 (Camera 1, MIPI)...........................................20

ROM-DB3900 User Manual viii
Table 2.38:CAM2 (Camera 2, MIPI)........................................... 21
Table 2.39:GPIO (GPIO)............................................................ 21
Table 2.40:JP2301 (External WDT) ........................................... 22
Table 2.41:FAN (System FAN)................................................... 22
Table 2.42:AUDIO (I2S0, audio codec)...................................... 22
Table 2.43:SPI1 (SPI1) .............................................................. 23
Table 2.44:SPI0 (SPI0) .............................................................. 23
Table 2.45:LVDS_BK_SLT (LVDS backlight selection) ............. 23
Table 2.46:LVDS_VDD_SLT1 (LVDS VDD Power selection).... 23
Table 2.47:LVDS_VDD_SLT2 (LVDS VDD Power selection2).. 24
Table 2.48:CAN0 (CAN bus 0)................................................... 24
Table 2.49:CAN0 (CAN bus 0)................................................... 24
Table 2.50:RTXA Connector...................................................... 25
Table 2.51:RTXB Connector...................................................... 26
Table 2.52:RTXC Connector...................................................... 27
Table 2.53:RTXD Connector...................................................... 28
Table 2.54:SYSTEM BUS.......................................................... 29
2.4.5 Switches and buttons.................................................................. 30
Table 2.55:SW2 (Boot selection)................................................ 30
Table 2.56:SW3 (Reset button).................................................. 31
Table 2.57:SW5 (Sleep button).................................................. 31
Table 2.58:SW4 (Power button, CPU) ....................................... 31
Table 2.59:SW6 (LID Switch)..................................................... 31
2.4.6 LEDs........................................................................................... 31
2.4.7 PCB Footprint of Board to Board Connector .............................. 32
2.4.8 Module Board Installation........................................................... 32
Chapter 3 Advantech Services..........................33
3.1 RISC Design-in Services ........................................................................ 34
3.2 Contact Information................................................................................. 37
3.3 Technical Support and Assistance.......................................................... 38
3.4 Global Service Policy.............................................................................. 38
3.4.1 Warranty Policy........................................................................... 38
3.4.2 Warranty Period.......................................................................... 38
3.4.3 Repairs under Warranty.............................................................. 38
3.4.4 Exclusions from Warranty........................................................... 39
3.5 Repair Process ....................................................................................... 39
3.5.1 Obtaining an RMA Number......................................................... 39
3.5.2 Returning the Product for Repair................................................ 39
3.5.3 Service Charges......................................................................... 40
3.5.4 Repair Report ............................................................................. 41
3.5.5 Custody of Products Submitted for Repair ................................. 41
3.5.6 Shipping Back to Customer........................................................ 41

Chapter 1
1General Introduction
This chapter gives background
information on the ROM-DB3900.
Sections include:
Introduction
Specification

ROM-DB3900 User Manual 2
1.1 Introduction
ROM-DB3900 is an evaluation carrier board designed for the Advantech RTX mod-
ule. It is compatible with RTX module ROM-3420 and has rich I/O interface for evalu-
ation and development. It supports wide range operating temperatures, and also
supports two MIPI connectors for the camera module. ROM-DB3900 is an ideal
development board for ruggedized applications, such as medical device, Industrial
control, Transportation/fleet management systems.
ROM-DB3900 comes with RISC RTX carrier board design documents: Carrier Board
Design Guide, Layout, Schematic checklist, and also the reference board schematics
ready for you to start your own carrier board design.
+19V DC in power input
2 camera input support
10 GPIO
4 UART and 2 CAN ports
1.2 Product Specification
Compatible
Module Advantech RTX 2.0 CPU Module Series
Graphic HDMI 1 HDMI TypeA LVDS 1 single channel 24-bit LVDS
VGA 1 D-Sub 15 with female connector
Ethernet 10/100/100 Mbps 1 RJ45
Storage
eMMC Onboard 4GB eMMC
EEPROM Onboard 4KB EEPROM
SD 1 SD card slot
SATA 1 SATAII Connector (with SATA-DOM support)
I/O
USB 1 USB Mini Type B (OTG), 1 USD 2.0/3.0 Type A
UART 4 UART Ports (4 wires)
Audio 1 2 port phone jack, support line-in, line-out
CAN 2 CAN 2.0B ports, Differential mode +5V
GPIO 10 GPIO Ports
I2C 2 I2C pin header
SPI 2 SPI pin header
Camera input 2 MIPI connectors
System Bus 1 PC104 Connector (Address:31 bits, Data: 16 bits)
KeyPad 4x4 Keypad (share pin with GPIO, By software setting)
I2S 1 Pin header
Expansion PCIe slot 2 PCIe x1
Power input Power + 19V DC Jack
Environment Operation 0~60°C (32~140°F)
Operating Humidity 0% ~ 90% relative humidity, non-condensing
Physical
Characteristics Dimensions 305 x 244 mm (12" x 9.6")

Chapter 2
2H/W Installation
This chapter gives mechanical
and connector information on the
ROM-DB3900 carrier board.
Sections include:
Connector Information
Mechanical Drawing
Hardware Installation

ROM-DB3900 User Manual 4
2.1 Module Form Factor
RTX form factor size, 68mm (W) x 68mm (D)
2.2 Environmental Specifications
Operating temperature: 0~60 °C (32~140°F)
The operating temperature refers to the environmental temperature for the
model.
Operating humidity: 0% ~ 90% relative humidity, non-condensing
Storage temperature: -40~85 °C
Relative humidity: 95% @ 60 °C
Weight (g): 80 g (weight of total package)
2.3 ROM-DB3900 Appearance
2.3.1 ROM-DB3900 Overview

5 ROM-DB3900 User Manual
Chapter 2 H/W Installation
2.3.2 I/O Connectors
2.4 Connectors, Jumper settings, Switches and
LEDs
2.4.1 Rear I/O panel
Table 2.1: External IO Connector
Position Description
DCIN DC Jack A
COM01A UART Port 1 B
COM01B UART Port 2 C
HDMI HDMI Port D
VGA VGA Port E
RJ45+USB GbE Ethernet Connector F
RJ45+USB USB Port 1/ 2 G
PHONE_JACK MIC Input/ Audio Output H
Table 2.2: DCIN (DC-Jack, +19V power input)
Pin Signal Pin Signal
1 +19V Shield GND

ROM-DB3900 User Manual 6
Table 2.3: COM01A (UART0, 4 WIRE)
Pin Signal Pin Signal
1 TXD485- 2 RXD/TXD485+
3 TXD/RXD485+TX 4 RXD485-
5GND 6 -
7 RTS 8 CTS
9-
Table 2.4: COM01B (UART1, 4 WIRE)
Pin Signal Pin Signal
1 TXD485- 2 RXD/TXD485+
3 TXD/RXD485+ 4 RXD485-
5GND 6 -
7 RTS 8 CTS
9-

7 ROM-DB3900 User Manual
Chapter 2 H/W Installation
Table 2.5: VGA (VGA)
Pin Signal Pin Signal
1Red 2 Green
3Blue 4 -
5 GND 6 GND
7 GND 8 GND
9+5V 10GND
11 - 12 DDC_DAT
13 HSYNC 14 VSYNC
15 DDC_CK
Table 2.6: HDMI (HDMI)
Pin Signal Pin Signal
1TMDS_D2+ 2 GND
3 TMDS_D2- 4 TMDS_D1+
5 GND 6 TMDS_D1-
7TMDS_D0+ 8 GND
9 TMDS_D0- 10 TMDS_CLK+
11 GND 12 TMDS_CLK-
13 CEC 14 -
15 CTRL_CLK 16 CTRL_DAT
17 GND 18 +5V
19 HPD

ROM-DB3900 User Manual 8
Line out: stereo, Line in: mono
Table 2.7: RJ45+USB (RJ-45 & USB 1/2)
1DA+ Pin Signal
2 DA- U1 VBUS
3 DB+ U2 D-
4 DC+ U3 D+
5DC- U4GND
6 DB- U5 SS_RX-
7 DD+ U6 SS_RX+
8DD- U7GND
L3 GBE_LINK1000# U8 SS_TX-
U9 SS_TX+
Table 2.8: PHONE_JACK (Audio output)
Pin Signal Pin Signal
1 GND 22 Audio_L
2- 23GND
3GND 24GND
4 GND 25 Audio_R
5MIC_IN

9 ROM-DB3900 User Manual
Chapter 2 H/W Installation
2.4.2 Internal I/O
Table 2.9: Internal IO Connectors
Position Description Connector type
DCIN DC-in DC POWER JACK 2.5mm 90D(M) DIP 2DC-
G213B200
COM01 COM Port D-SUB Conn. 18P 90D(M) DIP DM10151-H531-4F
HDMI HDMI HDMI Conn. 19P 0.5mm 90D(F) SMD QJ51191-
LFB4-7F
VGA VGA D-SUB Conn. 15P 90D(F) DIP 070242FR015S200ZU
RJ45+USB LAN+USB PhoneJack RJ45+USB3.0*2 32P 90D(F) DIP 05-
A00919
Phone Jack PhoneJack Audio Jack 9P 2.5mm 90D(F) DIP ABA-JAK-03
Audio Audio PIN HEADER 2x10P 2.54mm 180D(M) DIP
21N22564
LVDS LVDS B/B Conn. 40P 1.25mm 90D SMD DF13-40DP-
1.25V(91)
FAN FAN Wafer 2.54mm 3P 180D(M) DIP 22-27-2031
SATA_PWR SATA power WAFER 4P 2.5mm 180D(M) DIP 24W1161-04S10-
01T
PCIE_SLOT0 PCIE_SLOT0 PCIEXPRESS 36P 180D(F) DIP 2EG01817-D2D-DF
PCIE_SLOT1 PCIE_SLOT1 PCIEXPRESS 36P 180D(F) DIP 2EG01817-D2D-DF
SATA SATA Serial ATA 7P 1.27mm 180D(M) DIP WATM-
07DBN4A3B8
GPIO GPIO PIN HEADER 10x2P 2.0mm 180D(M) DIP 21N22050
LVDS_BKLT LVDS Backlight WAFER BOX 2.0mm 5P 180D(M) DIP WO/Pb JIH
VEI
SW3 Reset button TACT SW STS-091 SMD 4P H=3.8mm

ROM-DB3900 User Manual 10
SW4 Power button TACT SW STS-091 SMD 4P H=3.8mm
SW5 Sleep button TACT SW STS-091 SMD 4P H=3.8mm
SW6 Wake up button TACT SW STS-091 SMD 4P H=3.8mm
SPI0 SPI0 PIN HEADER 2x4P 2.54mm 180D(M) DIP 210-92-
04GB02
SPI1 SPI1 PIN HEADER 2x4P 2.54mm 180D(M) DIP 210-92-
04GB02
SW2 Boot selection DIP SW EDG104S DIP 4P Radial SPST
COM3 COM3 BOX HEADER 5x2P 2.54mm 180D(M) DIP 23N6960-
10S10
COM2 COM2 BOX HEADER 5x2P 2.54mm 180D(M) DIP 23N6960-
10S10
CAN1 CAN1 BOX HEADER 5x2P 2.54mm 180D(M) DIP 23N6960-
10S10
CAN0 CAN0 BOX HEADER 5x2P 2.54mm 180D(M) DIP 23N6960-
10S10
USB_OTG USB OTG MINI USB 5P 180D(F) SMD UH51543-CS7-7F
SD SD SD CARD 9P 90D(F) SMD WK2192C-S3D-7H
System_Bus SYSTEMBUS PCB SKT 30x4P 2.00mm 180D(F) DIP 264-40303-02
I2C0 I2C0 WAFER BOX 2.0mm 4P 180D(M) W/LOCK
A2001WV2-4P
I2C1 I2C1 WAFER BOX 2.0mm 4P 180D(M) W/LOCK
A2001WV2-4P
RTXA,RTXB,
RTXC,RTXD RTX B2B Connector B/B Conn. 50x2P 0.5mm 180D(M) SMD AXK500137YG
Table 2.9: Internal IO Connectors

11 ROM-DB3900 User Manual
Chapter 2 H/W Installation
2.4.3 Connectors
Table 2.10: PCIE_SLOT0 (PCIex1 connector1)
Pin Signal Pin Signal
B1 +12V A1 +12V
B2 +12V A2 +12V
B3 +12V A3 +12V
B4 GND A4 GND
B5 PCIE_A_CK A5 PCIE_A_JTAG2
B6 PCIE_A_DAT A6 PCIE_A_JTAG3
B7 GND A7 PCIE_A_JTAG4
B8 +3V A8 PCIE_A_JTAG5
B9 PCIE_A_JTAG1 A9 +3V
B10 +3V A10 +3V
B11 +3V A11 PWRGD
Mechanical Key
B12 Reserved A12 GND
B13 GND A13 PCIE_A_REFCK+
B14 PCIE_A_TX+ A14 PCIE_A_REFCK-
B15 PCIE_A_TX- A15 GND
B16 GND A16 PCIE_A_RX+
B17 +3V A17 PCIE_A_RX-
B18 GND A18 GND

ROM-DB3900 User Manual 12
Table 2.11: PCIE_SLOT1 (PCIex1 connector2)
Pin Signal Pin Signal
B1 +12V A1 +12V
B2 +12V A2 +12V
B3 +12V A3 +12V
B4 GND A4 GND
B5 PCIE_B_CK A5 PCIE_B_JTAG2
B6 PCIE_B_DAT A6 PCIE_B_JTAG3
B7 GND A7 PCIE_B_JTAG4
B8 +3V A8 PCIE_B_JTAG5
B9 PCIE_B_JTAG1 A9 +3V
B10 +3V A10 +3V
B11 +3V A11 PWRGD
Mechanical Key
B12 Reserved A12 GND
B13 GND A13 PCIE_B_REFCK+
B14 PCIE_B_TX+ A14 PCIE_B_REFCK-
B15 PCIE_B_TX- A15 GND
B16 GND A16 PCIE_B_RX+
B17 +3V A17 PCIE_B_RX-
B18 GND A18 GND