Advantech ROM-DB7501 User manual

User Manual
ROM-DB7501
Development Board for Qseven
2.0 Modules

ROM-DB7501 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2017
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to improve the products described in this manual at any time without notice. No part
of this manual may be reproduced, copied, translated, or transmitted in any form or
by any means without the prior written permission of Advantech Co., Ltd. All informa-
tion provided in this manual is intended to be accurate and reliable. However, Advan-
tech Co., Ltd. assumes no responsibility for its use, nor for any infringements of the
rights of third parties that may result from its use.
Acknowledgements
ARM is trademarks of ARM Corporation.
NXP is trademarks of Qualcomm Corporation.
Microsoft Windows are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers are billed according to the cost of replacement materials,
service time, and freight. Please consult your dealer for more details.
If you believe your product is defective, follow the steps below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages received when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any relevant information readily available.
3. If your product is diagnosed as defective, obtain an return merchandize authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number on the outside and ship the package prepaid to your
dealer.
Part No. 2006750100 Edition 1
Printed in Taiwan May 2017

iii ROM-DB7501 User Manual
Declaration of Conformity
FCC Class B
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installa-
tion. This equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful inter-
ference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interfer-
ence to radio or television reception, which can be determined by turning the equip-
ment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Warnings, Cautions, and Notes
Warning! Warnings indicate conditions that if not observed may cause personal
injury.
Caution! Cautions are included to help prevent hardware damage and data loss.
For example,
“Batteries are at risk of exploding if incorrectly installed. Do not attempt
to recharge, force open, or heat the battery. Replace the battery only
with the same or equivalent type recommended by the manufacturer.
Discard used batteries according to the manufacturer's instructions.”
Note! Notes provide additional optional information.

ROM-DB7501 User Manual iv
Packing List
Before installation, please ensure that the items listed below have been shipped.
Optional Accessories
Qseven 2.0 CPU Boards
For more information please refer to the Advantech baseboard checklist and evalua-
tion board reference schematic, both of which can be downloaded from http://
com.advantech.com/
9696750100E Qseven 2.0 carrier board 1
9696ED2000E Debug adapter board 1
1700021882-01 LVDS backlight cable 1
1700021883-01 LVDS cable 1
1700021941-01 SATA power 1
1700004711 SATA signal 1
1700019076 USB OTG to Type A female 1
1700019077 USB OTG to Type A male 1
1701100300 F cable IDE#3 10P-2.54/D-SUB 9P(M) 30 cm for UART 1
1700022373-01 Debug port cable for ROM-7421 1
1700002204 USB pin header to USB Type A 1
Part Number Description
96PSA-A36W12R1 Adapter 100-240V 36W 12V 3A
170203183C Power cord 3P (EU), 183 cm
170203180A Power cord 3P (UK), 183 cm
1700008921 Power cord 3P (PSE), 183 cm
EWM-W142F01E 802.11 b/g/n, AR9287, 2T2R, full-size mini PCIe
968EMW0093 Telit HE910-D mini PCIE
1750007156-01 Cellular/GPS SMA short jack (9.5 mm) L = 100 mm (3G cable)
1750007050-01 Wi-Fi RP-SMA short SMA jack (9.5 mm) to U.FL_100 mm (Wi-Fi
cable)
1750000318 EMI antenna 2DBI 2.4GHz SMA (Wi-Fi antenna)
1750005865 Antenna L = 10.9 cm 500 hm AN8921F-5701SM (3G antenna)
9680015491 PCIe to mini PCIe adapter card
9696MEG510E ROM-EG51 audio codec board
Part Number Description
ROM-7421CE-MDA1E NXP i.MX6 dual plus Qseven 2.0 module (0 ~ 60 degree)
ROM-7421CU-MEA1E NXP i.MX6 quad plus Qseven 2.0 module (0 ~ 60 degree)
ROM-7421CE-MDA1E NXP i.MX6 dual plus Qseven 2.0 module (-40 ~ 85 degree)
ROM-7421CU-MEA1E NXP i.MX6 quad plus Qseven 2.0 module (-40 ~ 85 degree)

v ROM-DB7501 User Manual
Safety Instructions
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Disconnect the equipment from all AC outlets before cleaning. Use a damp cloth
for cleaning. Do not use liquid or spray detergents.
4. For pluggable equipment, the power outlet socket should be located near the
equipment and easily accessible.
5. Protect this equipment from humidity.
6. Place the equipment on a reliable surface during installation. Dropping or letting
the equipment fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. Do not cover the openings.
8. Ensure that the voltage of the power source is correct before connecting the
equipment to the power outlet.
9. Position the power cord away from high-traffic areas. Do not place anything over
the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage from transient overvoltage.
12. Never pour liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If one of the following occurs, have the equipment checked by service person-
nel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment is malfunctioning or does not work according to the user
manual.
The equipment has been dropped and damaged.
The equipment shows obvious signs of breakage.
15. Do not store this equipment in an environment where the temperature fluctuates
below -20 °C (-4 °F) or above 60 °C (140 °F) as this may cause damage. The
equipment should be stored in a controlled environment.
16. CAUTION: The battery is at risk of exploding if incorrectly installed. Replace
only with the same or equivalent type as recommended by the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
17. The sound pressure level at the operator position does not exceed 70 dB (A) in
accordance with the IEC 704-1:1982 specifications.
DISCLAIMER: These instructions are provided in accordance with the IEC 704-1.
Advantech disclaims all responsibility for the accuracy of any statements contained
herein.

ROM-DB7501 User Manual vi
Safety Precautions - Static Electricity
Follow these simple precautions to protect yourself from harm and prevent damage
to the equipment.
To avoid electrical shock, always disconnect the power from the PC chassis
before manual handling. Do not touch any components on the CPU card or
other cards when the device is powered on.
Disconnect the power before adjusting the configuration. The sudden rush of
power as a jumper is connected or a card installed may damage sensitive elec-
tronic components.

vii ROM-DB7501 User Manual
Contents
Chapter 1 General Introduction ...........................1
1.1 Introduction ............................................................................................... 2
1.2 Product Specifications............................................................................... 2
1.3 Block Diagram........................................................................................... 3
Chapter 2 H/W Installation....................................5
2.1 Module Form Factor.................................................................................. 6
2.2 Environmental Specifications .................................................................... 6
2.3 ROM-DB7501 Overview............................................................................ 6
2.4 Connectors, Jumpers, Switches, and LEDs.............................................. 7
2.4.1 Rear I/O Panel .............................................................................. 7
Table 2.1: External I/O Connectors ............................................. 7
Table 2.2: DC-In 1 (DC-Jack, +12V Power Input) ....................... 7
Table 2.3: CN8A (CAN) ............................................................... 7
Table 2.4: CN8B (UART0, 4 Wires)............................................. 8
Table 2.5: CN1 (HDMI)................................................................ 8
Table 2.6: CN2 (RJ-45 & USB 1/2).............................................. 9
Table 2.7: Audio 1 (Audio Output) ............................................... 9
Table 2.8: DIO1 (GPIO)............................................................. 10
2.4.2 Internal I/O .................................................................................. 10
Table 2.9: Internal I/O Connector .............................................. 11
2.4.3 Connectors.................................................................................. 12
Table 2.10:CN16 (PCIe x1 Connector 1).................................... 12
Table 2.11:SATA1 (SATA Connector)........................................ 13
Table 2.12:SATAPWR1 (SATA Power Connector) .................... 13
Table 2.13:Module 1 (MXM Connector) ..................................... 14
Table 2.14:LVDS 1 (24 bit) ......................................................... 16
Table 2.15:LVDS 2 (24 bit) ......................................................... 17
Table 2.16:LVDS_BK_PWR 1 (LVDS Backlight Power) ............ 17
Table 2.17:LVDS_BK_PWR 2 (LVDS Backlight Power) ............ 18
Table 2.18:USB_OTG 1 (USB OTG).......................................... 18
Table 2.19:SD1 (SD Slot) ........................................................... 18
Table 2.20:BAT1 (Lithium-Ion Battery Power Input)................... 19
Table 2.21:BH1 (CR-2032)......................................................... 19
2.4.4 Jumpers ...................................................................................... 19
Table 2.22:SATADOM_PWR (SATA-DOM Jumper, Default 2-3) ..
..................................................................................19
Table 2.23:COM1 (UART1, 4 Wire)............................................ 20
Table 2.24:CN28 (Reserved for GPIO3, Multi Pin)..................... 20
Table 2.25:CN29 (Reserved for CAN, Multi Pin) ........................ 20
Table 2.26:CN13 (Reserved for EC, Programming Pin)............. 20
Table 2.27:I2S_CN1 (I2S0, Audio Codec).................................. 21
Table 2.28:SPI1 (SPI1)............................................................... 21
Table 2.29:LVDS_BL1 (LVDS Backlight Selection).................... 21
Table 2.30:LVDS_BL2 (LVDS Backlight Selection).................... 22
Table 2.31:LVDS_VDD1 (LVDS VDD Power Selection) ............ 22
Table 2.32:LVDS_VDD3 (LVDS VDD Power Selection) ............ 22
Table 2.33:LVDS_VDD2 (LVDS VDD Power Selection2) .......... 22
Table 2.34:LVDS_VDD4 (LVDS VDD Power selection2)........... 22
2.4.5 Switches and Buttons ................................................................. 23
Table 2.35:SW1 (Reset Button).................................................. 23
Table 2.36:SW2 (Sleep Button).................................................. 23
Table 2.37:SW3 (Power Button, CPU) ....................................... 23

ROM-DB7501 User Manual viii
2.4.6 Hardware Installation .................................................................. 23
Chapter 3 Advantech Services.......................... 25
3.1 RISC Design-in Services ........................................................................ 26
3.2 Contact Information................................................................................. 29
3.3 Technical Support and Assistance.......................................................... 30
3.4 Global Service Policy .............................................................................. 30
3.4.1 Warranty Policy........................................................................... 30
3.4.2 Warranty Period.......................................................................... 30
3.4.3 Repairs Under Warranty ............................................................. 30
3.4.4 Exclusions From Warranty.......................................................... 31
3.5 Repair Process ....................................................................................... 31
3.5.1 Obtaining an RMA Number......................................................... 31
3.5.2 Returning the Product for Repair................................................ 31
3.5.3 Service Charges ......................................................................... 32
3.5.4 Repair Report ............................................................................. 33
3.5.5 Custody of Products Submitted for Repair ................................. 33
3.5.6 Shipping Back to the Customer .................................................. 33

Chapter 1
1General Introduction
This chapter gives background
information for ROM-DB7501.
Introduction
Specifications

ROM-DB7501 User Manual 2
1.1 Introduction
ROM-DB7501 is an evaluation carrier board designed for the Advantech Qseven
module. It is compatible with ROM-7421 and has rich I/O interface for evaluation and
development. It supports wide range operating temperatures, 2 power input inter-
faces (one of them is designed for lithium-ion battery). ROM-DB7501 is an ideal
development board for mobile applications, such as portable device, industrial tablet
or HMI systems.
ROM-DB7501 released with RISC Qseven carrier board design documents: Carrier
Board Design Guide, Layout, Schematic checklist, and also the reference board
schematics ready for you to start your own carrier board design.
2 x power inputs (12V DC-in) and 1 x lithium battery
8 x GPIO
1 x 4-wire UART, 4 x USB, 1 x CAN bus
1.2 Product Specifications
Compatible
Module Advantech Qseven 2.0 CPU modules
Graphics HDMI 1 HDMI Type A
LVDS 1 dual 24-bit LVDS
Ethernet 10/100/100 Mbps 1 RJ45
Storage SD 1 SD card slot
SATA 1 SATA II connector (with SATA-DOM support)
I/O
USB 2 USB 2.0 Type A (host), 1 min USB Type AB (OTG),
2 USB 2.0 pin header
Serial 2 COM ports
Audio 1 1/8 audio jack (I2S HD audio), 1 SPDIF pin header
CAN 1 CAN 2.0 B ports, differential mode +5V
GPIO 8 GPIO ports
I2C 2 I2C pin header
SPI 1 SPI pin header
Expansion PCIe slot 1 PCIe x1
Input Power Power 2 power inputs (+12V DC-jack, lithium-ion battery)
Environment Operation 0 ~ 60 °C (32 ~ 140 °F)
Operating humidity 5 ~ 95% relative humidity, non-condensing
Physical
Characteris-
tics
Dimensions 170 x 170 mm (mini-ITX)

3 ROM-DB7501 User Manual
Chapter 1 General Introduction
1.3 Block Diagram

ROM-DB7501 User Manual 4

Chapter 2
2H/W Installation
This chapter provides mechanical
information and describes the
connectors on the ROM-DB7501
carrier board.
Connector Information
Mechanical Drawing
Hardware Installation

ROM-DB7501 User Manual 6
2.1 Module Form Factor
Qseven form factor size, 70 x 70 mm (W x D)
2.2 Environmental Specifications
Operating temperature: 0 ~ 60 °C (32 ~ 140 °F)
Operating humidity: 5 ~ 95% relative humidity, non-condensing
Storage temperature: -40 ~ 85 °C
Relative humidity: 95% @ 60 °C
Total weight: 380 g
2.3 ROM-DB7501 Overview

7 ROM-DB7501 User Manual
Chapter 2 H/W Installation
2.4 Connectors, Jumpers, Switches, and LEDs
2.4.1 Rear I/O Panel
Table 2.1: External I/O Connectors
Position Description
DCIN1 DC jack
CN8 RS-232 and CAN bus
DIO1 GPIO connector
CN1 HDMI port
CN2 Ethernet/ USB port 1/2
Audio1 Mic input/audio output
Table 2.2: DC-In 1 (DC-Jack, +12V Power Input)
Pin Signal Pin Signal
1 +12V Shield GND
Table 2.3: CN8A (CAN)
Pin Signal Pin Signal
1- 2 CAN0_D-
3- 4 -
5GND 6 -
7CAN_D+ 8 -
9+5V

ROM-DB7501 User Manual 8
Table 2.4: CN8B (UART0, 4 Wires)
Pin Signal Pin Signal
1- 2 Rx
3Tx 4 -
5GND 6 -
7 RTS 8 CTS
9-
Table 2.5: CN1 (HDMI)
Pin Signal Pin Signal
1TMDS_D2+ 2 GND
3 TMDS_D2- 4 TMDS_D1+
5 GND 6 TMDS_D1-
7TMDS_D0+ 8 GND
9 TMDS_D0- 10 TMDS_CLK+
11 GND 12 TMDS_CLK-
13 CEC 14 -
15 CTRL_CLK 16 CTRL_DAT
17 GND 18 +5V
19 HPD

9 ROM-DB7501 User Manual
Chapter 2 H/W Installation
Table 2.6: CN2 (RJ-45 & USB 1/2)
Pin Signal Pin Signal
1CT 2 MDI0+
3 MDI0- 4 MDI1+
5 MDI1- 6 MDI2+
7MDI2 8 MDI3+
9 MDI3- 10 GND
11 Active LED- 12 Active LED+
13 Link 1000- 14 Link 100-
15 +5V 16 USB port 2-
17 USB port 2+ 18 GND
19 +5V 20 USB port 1-
21 USB port 1+ 22 GND
1TMDS_D2+ 2 GND
3 TMDS_D2- 4 TMDS_D1+
5 GND 6 TMDS_D1-
7TMDS_D0+ 8 GND
9 TMDS_D0- 10 TMDS_CLK+
11 GND 12 TMDS_CLK-
13 CEC 14 -
15 CTRL_CLK 16 CTRL_DAT
17 GND 18 +5V
19 HPD
Table 2.7: Audio 1 (Audio Output)
Pin Signal Pin Signal
1GND 2 -
3- 4 -
5Mic-In 6 -
7 Audio_L 8 -
9 Audio_R

ROM-DB7501 User Manual 10
2.4.2 Internal I/O
Table 2.8: DIO1 (GPIO)
Pin Signal Pin Signal
1 GPIO0 2 GPIO1
3 GPIO2 4 GPIO3
5 GPIO4 6 GPIO5
7 GPIO6 8 GPIO7
9GND

11 ROM-DB7501 User Manual
Chapter 2 H/W Installation
Table 2.9: Internal I/O Connector
Position Description Connector Type
USB0 USB port 0 Pin header 2 x 5, 2.54 mm 180D (M) yellow
CN16 PCIe x1 connector 1 PCI Express 36P 180D (F) DIP 2EG01817-
D2D-DF
SATADOM_
PWR1
SATA-DOM jumper (power +5V
pin 7)
Pin header 3 x 1P, 2.0 mm 180D (M) DIP 2000-
13 WS
SATA1 SATA connector Serial ATA 7P 1.27 mm 180D (M) DIP WATM-
07DBN4A3B8
SATAPWR1 SATA power connector Wafer 4P 2.5 mm 180D (M) DIP 24W1161-
04S10-01T
COM1 UART1 (RS232, 4 wires) Box header 5x2P 2.54 mm 180D (M) DIP
23N6960-10S10
CN13 Reserved for EC programming Box header 5x2P 2.54mm 180D (M) DIP
23N6960-10S10
MODULE1 MXM connector
I2C1 I2C pin header Wafer box 2.0 mm 4P 180D (M) with lock
A2001WV2-4P
I2S_CN1 Audio codec connector Pin header 2 x 10P 2.54 mm 180D (M) DIP
21N22564
SPI1 SPI connector 1 Pin header 2 x 4P 2.54 mm 180D (M) SMD
21N22564
SW1 Reset button TACT SW STS-091 SMD 4P H = 3.8 mm
SW2 Sleep button TACT SW STS-091 SMD 4P H = 3.8 mm
SW3 Power button TACT SW STS-091 SMD 4P H = 3.8 mm
LVDS1 LVDS (24 bit) B/B Conn. 40P 1.25 mm 90D SMD DF13-
40DP-1.25V(91)
LVDS_BK_P
WR1 LVDS backlight power Wafer box 2.0 mm 5P 180D (M) DIP WO/Pb JIH VEI
LVDS_BK_P
WR2 LVDS backlight power Wafer box 2.0 mm 5P 180D (M) DIP WO/Pb JIH VEI
LVDS_BL2 LVDS backlight selection
(+12V/5V)
Pin header 3 x 1P 2.54 mm 180D (M) DIP 205-
1x3GS
LVDS_BL1 LVDS backlight selection
(+12V/5V)
Pin header 3 x 1P 2.54 mm 180D (M) DIP 205-
1x3GS
LVDS_VDD1 LVDS VDD power selection
(+3.3V/+5V)
Pin header 3 x 1P 2.0 mm 180D (M) DIP 2000-
13 WS
LVDS_VDD2 LVDS VDD power selection2
(+12V)
Pin header 2 x 1P 180D (M) square 2.0 mm
DIP W/O Pb
LVDS_VDD3 LVDS VDD power selection
(+3.3V/+5V)
Pin header 3 x 1P 2.0 mm 180D (M) DIP 2000-
13 WS
LVDS_VDD4 LVDS VDD power selection 2
(+12V)
Pin header 2 x 1P 180D (M) square 2.0 mm
DIP W/O Pb
USB_OTG1 USB OTG Mini USB 5P 180D (F) SMD UH51543-CS7-7F
BAT1 Lithium-ion battery power input Wafer 8P 2.54 mm 180D (M) DIP A2543WV2-
8P (6 ~ 8.4 V recommended)
BH1 CR-2032 connector Battery holder 24.9*23.4*8.9 CR2032
BH800.4GG
SD1 SD socket SD CONN 9P 90D(F) SMD DM1AA-SF-
PEJ(82)
CN18 Power button connector Pin header 2 x 1P 180D (M) square 2.0 mm
DIP

ROM-DB7501 User Manual 12
2.4.3 Connectors
CN19 Reset button connector Pin header 2 x 1P 180D (M) square 2.0 mm
DIP
CN20 Sleep button connector Pin header 2 x 1P 180D (M) square 2.0 mm
DIP
PWRLED 1 Power LED connector Pin header 2 x 1P 180D (M) 2.54 mm DIP
JP1 Terminal resistor for CAN bus Pin header 2 x 1P 180D (M) square 2.0 mm
DIP
SATALED1 SATA LED connector Pin header 2 x 1P 180D (M) 2.54 mm DIP
Table 2.10: CN16 (PCIe x1 Connector 1)
Pin Signal Pin Signal
B1 +12V A1 +12V
B2 +12V A2 +12V
B3 +12V A3 +12V
B4 GND A4 GND
B5 PCIE_A_CK A5 PCIEX_A_JTAG2
B6 PCIE_A_DAT A6 PCIEX_A_JTAG3
B7 GND A7 PCIEX_A_JTAG4
B8 +3V A8 PCIEX_A_JTAG5
B9 PCIEX_A_JTAG1 A9 +3V
B10 +3V A10 +3V
B11 +3V A11 PWRGD
Mechanical Key
B12 Reserved A12 GND
B13 GND A13 PCIE_A_REFCK+
B14 PCIE_A_X_TX+ A14 PCIE_A_REFCK-
B15 PCIE_A_X_TX- A15 GND
B16 GND A16 PCIE_A_X_RX+
B17 +3V A17 PCIE_A_X_RX-
B18 GND A18 GND