akrometrix TherMoire AXP 2.0 User manual

TherMoiré AXP 2.0
User Manual

TherMoiré AXP 2.0 User Manual
Page 2 of 29 40-5000-6900 Rev. D
Akrometrix Proprietary
Information
No reproduction, adaptation,
or translation without prior
written approval.
Warranty
The information contained in
this document is subject to
change without notice.
Akrometrix makes no warranty
of any kind with respect to this
information.
Akrometrix shall not be liable
for any direct, indirect,
incidental, consequential, or
other damage alleged in
connection with the furnishing
or use of this information.
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Microsoft®, Windows®,
Excel®, and Notepad® are
registered trademarks of
Microsoft Corporation.
TherMoiré® is a registered
trademark of Akrometrix, LLC.

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Contents
1Introduction.................................................................................................................4
1.1 Overview.............................................................................................................4
1.2 Warnings and Precautions..................................................................................4
1.3 System Configuration..........................................................................................7
1.4 System Components...........................................................................................8
1.5 Technical Support.............................................................................................10
2System Set-up and Use............................................................................................11
2.1 System Set-up...................................................................................................11
2.2 System Shutdown.............................................................................................12
2.3 Replacing a Grating ..........................................................................................12
2.4 Cleaning a Grating or Glass Window ................................................................12
3Temperature Control................................................................................................14
3.1 Manual Temperature Control ............................................................................14
3.2 Automatic Temperature Control........................................................................14
3.3 Removing and Changing Samples....................................................................14
4PLC Logic Conditions..............................................................................................16
4.1 E-Stop Alarms...................................................................................................16
4.2 Lid Operation and Lockouts ..............................................................................17
4.3 Heater/Blower/Exhaust Controls.......................................................................18
5Troubleshooting .......................................................................................................20
5.1 Troubleshooting Data Acquisition......................................................................20
5.2 Troubleshooting Oven Operation......................................................................20
Appendix A - Miscellaneous Information..................................................................22
A.1 Equipment Ratings............................................................................................22
A.2 Installation and Assembly..................................................................................22
A.3 Transport...........................................................................................................23
A.4 Disassembly......................................................................................................23
A.5 Ventilation .........................................................................................................24
A.6 Maintenance......................................................................................................24
A.7 Oven Lid Interlock Bypass.................................................................................25
A.8 Oven Over-Temperature Switch........................................................................26
A.9 EMO Pushbutton...............................................................................................26
A.10 Camera Lens.....................................................................................................26
Appendix B –Blower A/C Units .................................................................................28
B.1 Overview...........................................................................................................28
B.2 Facilities Requirements.....................................................................................28

TherMoiré AXP 2.0 User Manual
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1Introduction
1.1 Overview
The Akrometrix TherMoiré AXP 2.0 is a system designed for measuring sample
surface warpage as a function of temperature. It uses a full-field, non-contact optical
technique called shadow moiré in combination with automated image processing.
Samples are measured inside a computer-controlled oven chamber with a temperature
range from ambient to 300°C.
This manual describes the system hardware of the TherMoiré AXP 2.0. Data
acquisition is described in the Surface Measurement User Manual and analysis is
described in the Surface Analysis User Manual. Surface Measurement requires system
hardware to operate and, thus, will only be installed on the AXP 2.0. Surface Analysis
may reside on the AXP 2.0 computer and/or on a remote computer.
The main body of this manual emphasizes the system hardware and its operation.
A user unfamiliar with shadow moiré and its application in the TherMoiré system is
advised to first read Akrometrix Optical Techniques and Analyses 101, and Section 1,
Troubleshooting in order to make best use of the system.
Before operating the system, the user should carefully read Section 1.2.2, which
describes safety and health hazards associated with the system. The TherMoiré AXP 2.0
system contains a high temperature oven, motorized sample stages, and electrical
systems, all with the potential to injure if used or maintained carelessly.
Sections 1.3 and 1.4 identify system components and controls. Section 2
describes basic procedures for system setup and shutdown. Section 3 describes setting
up samples for measurement under thermal test. Section 4 describes PLC logic
conditions and Section 5 describes basic troubleshooting.
Appendix A describes recommended procedures for maintenance, transport and
disassembly of the system. This section also contains equipment ratings and technical
support material. Appendix B describes the Blower system and its operation.
1.2 Warnings and Precautions
1.2.1 Warnings and Notes in this Manual
Warnings and Notes are marked throughout the manual with these icons:
Figure 1.1 Warning Icon
Figure 1.2 Note Icon
Warnings are specific health hazards for the operator or potential sources of damage
to the AXP 2.0 system. Notes highlight system limitations or automatic responses that
may require corrective action by the operator for successful operation.

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1.2.2 Health and Safety Hazards
•The AXP 2.0 system has been designed to minimize the potential for user injury.
Safety systems, including the oven and electrical enclosure interlocks, should not
be tampered with, circumvented, or left in a permanent over-ride state.
•Staring into the oven while a profile is running increases the risk of eye damage
from IR radiant energy. Even though the oven has been designed to mitigate this
risk, the TherMoiré oven requires the use of IR energy. The only sure way to
eliminate this risk is to not look into the oven while a profile is running.
•Surfaces both inside and outside the oven chamber can reach extreme
temperatures during system operation and can harm the user without proper
precautions. Care should be taken in opening the oven after a temperature cycle.
The user should only touch the oven lid by its handle or use hand protection.
Internal oven surfaces can remain at extreme temperatures even after the sample
reaches room temperature. The user should exercise care before touching the
sample, sample supports, or other internal surfaces after a temperature cycle.
•The system should notbe used with samples that can catch fire or emit toxic gases
during sample heating.
•Motorized translation of the sample support stages can create the potential for
pinch-points between moving and stationary components, especially the sample
support arms and the oven walls. Keep hands out of the oven during sample stage
translation. Keep the stage translation path free from obstruction.
•Close the oven lid carefullyto avoid catching fingers or damaging the glass grating.
•External electrical and compressed air connections must be installed safely and
meet all relevant requirements and building codes.
•Do not operate the light sources with the fiber optic bundle connectors removed
from the light source housings.
•Do not sit or stand on any part of the system enclosure, including the electrical
box. Do not place loads greater than 25 kg (55 lbs) on top of the system.
•Lock system casters when not being moved. Follow transport procedures
described in Appendix A.3 when moving system. Do not move system on surfaces
with a tilt greater than 10 degrees from horizontal.
•Special care should be used when operating the system manually or using
specialized diagnostic programs. Temperatures or motions outside the normal
range of operation may be possible under these conditions and the system should
be monitored carefully.
•Do not position the system such that the electrical interlock is inaccessible.
•MSDS data sheets for all supplied chemicals are available upon request.

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1.2.3 System Operating Precautions
•Do not install additional software on the TherMoiré computer, change computer
system settings, or upgrade system software or hardware without consulting
Akrometrix. Unauthorized modifications can cause problems in normal system
operation.
•Close the oven lids with care. Make sure there is adequate clearance between the
glass grating and sample supports or samples before closing the oven lid. If the
grating is discolored by outgassing products, clean it using rubbing alcohol or glass
cleaner before performing another temperature cycle.
•Do not touch the heating elements in the IR heater bank. Clean any debris that
falls onto the heater elements as soon as possible. Heat cycles can “bake” oils and
other organic materials onto the oven bank surfaces making them harder to clean
as more heat cycles are applied.
•The sample support should not be loaded with a sample weighing greater than 10
lbs (4.5 kg). Loads exceeding 10 lbs may cause harm to the stage motion
components.
•In order to eliminate any eye, hand, or back strain, adjust the monitor and keyboard
cart for ease and comfort of use. The monitor can be tilted and raised on its
pedestal. The cart can be raised and lowered for proper hand position on the
keyboard.
1.2.4 Warning labels used on the TherMoiré AXP 2.0
Figure 1.3 Danger High Voltage Label
Figure 1.4 Danger Arc Flash Label
These labels are mounted to the electrical panel as a reminder that the voltages
inside the enclosure are lethal.
Figure 1.5 Warning Burn Hazard Label
This label is mounted by the oven handle as a reminder that the contents of the oven
can be hot after a sample run is complete.

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1.3 System Configuration
Figure 1.6 Overall System Components

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Figure 1.7
Electrical Cabinet
Buttons
Figure 1.8 Oven Components
1.4 System Components
Every TherMoiré system consists of three main hardware components. In essence,
these components do not change for different sized TherMoiré systems. These include:
•an Oven
•a Grating and Linear Motion Stage
•a Camera and Light Source
It is important to understand the basic design and operation of these components in
order to fully utilize the system’s capabilities. See the following sections for a brief
description of each component.
1.4.1 Oven
The AXP 2.0 oven is an infrared oven consisting of both bottom and top heater
elements. The bottom heater element is composed of two zones (Figure 1.9), one inner,
and one outer. The bottom heater power to each zone can be controlled as a percentage
when running a thermal profile. The top heater elements are positioned at the front and
back of the oven, above the grating. These elements can be turned on or off and the
Glass Lid
Main Lid
Grating
Exhaust Inlets

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feedback thermocouple can be set to either TC1 or TC2, depending on how the user has
the test set up. PID control to follow an input profile is provided by a PLC unit located in
the electrical cabinet. In addition, cooling is provided by Exhaust fans which pull air out of
the oven chamber from towers on the left and right sides and through holes in the bottom
of the oven. Blower units force sub-room temperature air into the oven through holes in
front and back of the oven, below the grating. Additionally, when cooling is enabled, air
inlets in the front and back of the oven lid allow air to enter into the oven when pulled by
the exhaust. The oven is sealed so that fumes, which may be generated from samples
inside the oven, are directed out of the system exhaust.
Figure 1.9 Oven Bottom Components
Temperature control can be operated manually, or automatically, via the Thermal
Profiler software. Please see the Thermal Profiler User Manual for instructions on
automatic or manual temperature profiling.
Inner Heater
Zone
Outer Heater
Zone
Blower Outlet
Blower Outlet
(inside front
wall)
Exhaust Inlets

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1.4.2 Grating and Linear Motion Stage
In standard configuration, each AXP 2.0 system is provided with a Ronchi ruled 100
lines per inch grating. Akrometrix has found that this frequency grating provides a good
compromise between working distance and accuracy. Other grating frequencies are
available but there are trade-offs associated with their use. Please see the Akrometrix
Optical Techniques and Analyses 101 document for more details.
A linear motion stage drives the sample support up and down to achieve phase
stepping in the AXP 2.0. Two motors are used, one on each side of the oven, and are tied
together so that they move as one unit. They are attached to linear motion stages that
provide a 2 inch (5.08 cm) range of travel. Limit switches prevent the motors from
operating past the stage travel limits. Control over these motors is done exclusively using
the Surface Measurement software. Please see the Surface Measurement User Manual
for instructions on their use.
1.4.3 Camera and Light Source
The system is equipped with a single 1.4 megapixel camera to capture image data
through the oven window. This camera ispaired with a12.5 –75 mm zoom lens to provide
either a full 375 x 375 mm or variable field of view.
An LED light source feeds light to a pair of fiber optic line lights which are pointed at
the mirror on the left side of the unit. The light source should be set to maximum intensity
for shadow moiré tests and can be set to a lower intensity for DIC focusing purposes.
1.5 Technical Support
For technical support, contact Akrometrix:
Akrometrix
2700 NE Expressway
Building B, Suite 500
Atlanta, GA 30345
404-486-0880
404-486-0890 (fax)
[email protected]
http://www.akrometrix.com
When contacting Akrometrix, please provide the system serial number, the version
numbers of the Akrometrix software being used, a description of the problem or question,
and contact information for reply. If the question concerns a particular measurement or
analysis, please provide electronic copies of the phase images, reference images, and
final results and a description of data acquisition and/or analysis conditions. If theproblem
concerns changes or failure in general system operation, please describe any events or
system modifications that occurred immediately before the problem arose.

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2System Set-up and Use
2.1 System Set-up
1. Turn the AXP 2.0 system on.
a. Make sure the Main Power Disconnect switch on the right side of the unit is in
the ON position.
b. Press the Main Power switch.
c. Turn on the light source. For shadow moiré measurements, make sure that it
is set to 100% power.
2. Run Surface Measurement by clicking the Surface Measurement button in the
Studio Manager bar on the left side of the screen.A start-up splash screen appears
while the software initializes. Refer to the Surface Measurement User Manual for
operating procedures.
3. Attach the Process 1 K-type thermocouple to the sample. This thermocouple is
located at the very top position of the thermocouple connector block. Typically, this
36awg Teflon-coated thermocouple with bare junction is attached to the sample
bottom with Kapton tape and supplied thermal grease.
4. If top/bottom uniformity is of concern, Process 2 should be attached to the top of
the sample and control of the top heaters should be set to feedback from this
thermocouple. TC2 can be found just below the Process 1 thermocouple position
on the thermocouple connector block.
5. Optionally, more thermocouples can be attached to other points on the sample or
other samples. Process 3-8 can be recorded during the sample run, but do not
play a role in temperature control. The AXP 2.0 can accommodate up to 8 total
thermocouples. See Figure 1.6 for thermocouple locations.
6. Open the main lid, and position the sample between the two sample support rails.
Typically, samples should be supported on their edgesby the sample supportrails,
but test accuracy should be considered as sample deflection can and does affect
the warpage result. In general, samples should be supported as they are in the
process that is being simulated in the AXP 2.0. However, the support method
should be adjusted if it would result in significant shielding of the sample from the
IR energy produced by the heater bank. The oven heater coils will only heat what
is in direct line of sight so areas shielded by sample support structures will be
colder than those areas that are unshielded.
7. Close the main lid. The system is now ready to begin operation.
Note: Unlike the original AXP, the AXP 2.0 does not
require the user to press the Reset button in order to
resume program operation after the lid is closed.

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2.2 System Shutdown
The Main Power switch will turn off all devices in the electrical cabinet while leaving
power on for the PLC and computer. This is useful for leaving the AXP in an idle mode
without having to turn off the computer. However, the interlock/disconnect switch on the
electrical cabinet will remove all electrical energy from the AXP, the computer and monitor
as well. Before using this switch or unplugging the system from main power, close all
programs and shut down the computer. The HMI screen will go blank, indicating all power
has been removed from the unit.
Note: In the event of an emergency, press the EMO
pushbutton. This action will remove power from the
heaters, stage motors, blower, and exhaust while
leaving the PLC functional for monitoring the
temperature inside the oven and troubleshooting.
2.3 Replacing a Grating
The standard 100LPI grating can be swapped out for other frequency gratings in case
application requirements change. In order to swap gratings, the main lid of the unit must
be closed and the glass lid on the very top of the oven must be open. Pressing the Motion
Enable and Lid Release buttons together will unlock the glass lid so that it can be opened.
Once it is opened, the current grating can be lifted out by its edges, being careful to angle
it such that it does not hit the top heater reflectors. The opening between the top heaters
is sized such that the grating usually has to be lowered one side at a time.
Warning: The top heater housings and reflectors can
remain quite hot for a considerable time after a profile
finishes. TC9 mounted to the rear top heater housing
must be below 50C before the glass lid is allowed to
open.
Store unused gratings in their cases to protect them from damage.
2.4 Cleaning a Grating or Glass Window
Maintaining a clean grating when using the shadow moiré technique, or glass window
when using any of the optional measurement modules, is critical to optimizing
measurement resolution and reducing measurementnoise. Gratings and windows should
be cleaned on an as needed basis, when any forms of contamination or clouding become
apparent.
Gratings and windows should only be cleaned when below a safe to touch
temperature of 50°C. As a safety precaution, the AXP 2.0 will disable the main lid release
functionality when thermocouples 1 and 2 are above 50°C. The AXP 2.0 will disable glass
lid release functionality when thermocouples 1, 2, or 9 (attached to rear top heater
housing) are above 50°C. Keep in mind that the grating or window temperature may be
higher than these thermocouple locations.
Frequent cleaning of these surfaces is critical to avoiding staining, or more permanent
residue deposits. The grating or window should be cleaned shortly after cooling to near

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room temperature, whenever contamination is observed. Allowing a contaminated grating
or window to be heated without cleaning can lead to more permanent grating surface
stains.
Gratings and windows should be cleaned with a lint free cloth or wipe and typically
with a mild glass cleaner or 30-70% IPA solution. The etched lines in the grating surface
are not easily removed. Users are free to press firmly on the grating and wipe in multiple
directions to clean the grating surface effectively. More stubborn deposits can be taken
off with Acetone or even Oven Cleaners (typically sodium hydroxide, aka Lye). If these
products are required, be sure to exercise appropriate safety precautions including hand
and eye protection as well as adequate ventilation of the work area.
Note: Refer to the cleaning product precautions for any
personal protection equipment needed and for disposal
of soiled cloths.

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3Temperature Control
3.1 Manual Temperature Control
See the Thermal Profiler User Manual for Manual Temperature Control.
3.2 Automatic Temperature Control
Automatic temperature control is achieved through the use of a piece of Akrometrix
software called Thermal Profiler. Please see the Thermal Profiler User Manual for a
description of its procedures and usage.
3.2.1 HMI Screen
The HMI (Human Machine Interface) Screen is used primarily to display
thermocouple setpoints and values. When the Main Power switch is off, it will display
AKROMETRIX AXP 2.0. This will also be displayed if communication with the PC is lost
during a profile.
When the Main Power switch is on, and communication with Studio is active, it will
display a profile screen with dual temperatures and setpoints for profiles with active top
heating, and a single setpoint and value for TC1 when only bottom heaters are active.
Figure 3.1 HMI Profile Run Screen
There is also a diagnostic display mode that shows all active thermocouples values,
including TC9, which is permanently mounted to the rear top heater enclosure as over-
temperature protection. This mode can be entered by holding down the Motion Enable
button and pressing the Reset button.
Figure 3.2 HMI Diagnostic Screen
3.3 Removing and Changing Samples
1. Allow the oven to cool until temperatures are safe for handling.

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Warning: The AXP 2.0 oven takes time to return to
safe-handling temperatures. Use extreme caution in
handling samples as they can retain significant heat
long after the thermal cycle is complete. In addition, the
HMI screen shows the sample temperature, which may
not be an accurate indicator of the temperature of other
oven components.
2. Open the main lid while pressing the Oven Lid Release button.
3. Remove the tested sample carefully. Detach the thermocouple(s) by removing the
Kapton tape. Do not remove the thermocouple by pulling on the thermocouple wire,
which may damage the wire.
4. Set up the new sample as described in Section 2.1, Steps 3-7.
Warning: Before closing the lid, check that clearance
between the sample and grating will be maintained
after closing. Lower the sample height before closing,
if necessary. Severe sample-grating contact may
damage the grating, sample, or sample support
structure.

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4PLC Logic Conditions
In place of a standalone temperature controller the AXP 2.0 has moved to a PLC
(programmable logic controller) based control scheme. This allows more flexibility to the
overall system design and operation of the various electro and electro-mechanical
devices used for temperature control and safety protections. In this section, the logic
conditions for each device and safety precaution are described.
4.1 E-Stop Alarms
The following conditions will trip an E-Stop Alarm, shutting down power to the heaters
and stage motors. The reset light will light up solid white when in E-Stop, indicating that
the user needs to press it once the E-Stop condition has been cleared.
1. TC1 or TC2 is open (i.e. TC > 400C, condition is considered open)
2. Any active TC reads over 310C while a profile is running
Note: Installing or removing a thermocouple while a
profile is running will trip this alarm.
3. TC1 or TC2 is shorted
During an active profile, the following steps happen:
Once every ten seconds TC1 & TC2 temperature readings are saved. During this ten
second window the TCs are monitored for a change of 1° for TC1 or 0.1° for TC2. If this
change does not happen a 60 second timer is started. If this timer expires then the TC is
considered shorted. The timer is cleared any time both TC1 & TC2 have made their
prescribed change in the 10 second window.
TC1 is checked when the lower heaters are running, the difference in temperature
from setpoint is larger than 5°, and the combined heater output is > 55%. TC2 is checked
when the upper heaters are running, are being controlled by TC2, the difference in
temperature from setpoint is larger than 10°, and the combined heater output is > 55%.
4. EMO pushbutton depressed. This pushbutton serves as the means for the user
to activate an emergency shutdown of the machine. With this button pressed, the
heaters, stage motors, blower and exhaust will not function. However, the PLC is
still alive such that temperature information can be obtained for troubleshooting.
Once this button is pressed it will need to be twisted to release.
5. Over-temperature switch mounted in the back right corner of oven. This switch will
de-energize the heaters, blowers, and exhaust when the inner walls of the oven
reach a temperature over 150C. Pressing the reset button willclear the alarm when
this switch temperature is cooled below 110C.
4.1.1 Resetting an E-Stop condition
1. Allow internal oven temperatures to fall below the temperatures indicated above.
The Emergency Stop condition cannot be reset until this occurs.

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Warning: Objects within the oven may remain
dangerously hot even after the over-temp controller
unlocks the oven.
2. Press the Reset button on the front control panel.
4.2 Lid Operation and Lockouts
Unlike its predecessor, the AXP 2.0 now has two lid opening mechanisms. These are
known as the Main lid and Glass lid. The Main lid is used for day to day sample setup and
testing while the Glass lid is used for grating swaps, module installations, and
maintenance/troubleshooting.
Both heater power and motion system power are cut when either of these lids are
open. However, holding down the Motion Enable button will re-establish power to the
motion system in case it is needed while a lid is open.
4.2.1 Main Lid
The main lid is opened by pressing the Lid Release button. The lid interlock will be
locked closed in the following conditions to protect the operator and equipment:
1. TC1 or TC2 > 50°C (lockout can be defeated if either of these thermocouples are
unplugged)
2. Glass lid open (reset light will blink)
Note: The lid cannot be opened (using the Lid Release
button) until TC1 or TC2 fall below 50°C. In the event
the operator needs emergency access to the oven, the
oven lid interlock can be opened with a mechanical
over-ride key.
4.2.2 Glass Lid
The glass lid is opened by pressing the Lid Release and Motion Enable buttons at
the same time. While this lid is open the Reset light will flash. Because the top heaters
can remain much hotter than the sample long after it has returned to room temperature,
a 9th thermocouple is attached to the frame of the back top heater to monitor its
temperature. The glass lid will lock under the following conditions:
1. TC1 or TC2 > 50°C (lockout can be defeated if either of these thermocouples are
unplugged)
2. TC9 > 40°C
3. Main lid open (reset light will blink)

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Note: The glass lid cannot be opened (using the Lid
Release and Motion enable buttons) until TC1 and TC2
fall below 50°C, and TC9 falls below 40°C. In the event
the operator needs emergency access to the oven, the
oven lid interlock can be opened with a mechanical
over-ride key.
4.3 Heater/Blower/Exhaust Controls
4.3.1 Heating/Cooling Mode
Because some of the logic for the Exhaust/Blower is dependent on whether the
system is currently supposed to be heating or cooling, the following definitions for those
modes are defined. This definition is based on a comparison between the last setpoint
(SP) and the current setpoint.
1. If the last SP < current SP then the mode is heating.
2. If the last SP > current SP then the mode is cooling.
3. If the last SP = current SP then the mode is not changed.
4. At the end of a profile the mode is set to cooling.
Also, because the PID will force the output on after an extreme time of not meeting
the setpoint, the heater outputs are forced off if in cooling mode and TC1 > SP.
4.3.2 Heaters
The top heaters should most typically be controlled by TC2 attached to the top of the
sample under test. Alternatively, they can be controlled by TC1. This setting is chosen
during profile setup. Also, unlike the bottom heater bank, the top heaters are run in On/Off
mode.
1. If TC2 is the feedback
a. On when TC2 < Upper SP + Offset
b. Off when TC2 > Upper SP + Offset
2. If TC1 is the feedback
a. On when TC1 < Upper SP + Offset
b. Off when TC1 > Upper SP + Offset
For safety precautions to both the operator and equipment, the top heaters will be
turned off:
1. While TC9 > 350°C (or 375°C when running Studio 8.5 PLC code)
2. Or if they run continuously for more than 8 minutes. This timer restarts from zero
every time the heater is turned on.
The bottom heater is divided into two zones with two PID loops. Feedback for both
zones is TC1. If TC1 goes 2°C above the current setpoint the max allowed power output

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is cut by 75%. Also, when the Exhaust turns off the max allowed power output is cut by
75% for 10 seconds.
4.3.3 Exhaust
The following conditions apply to Exhaust on/off commands. Anytime the Exhaust
turns on, the damper valve on the back of the system opens.
During a profile depressing the Exhaust pushbutton will behave differently depending
on whether the profile is in heating or cooling mode.
1. In Heating mode the Exhaust will run when TC1 > SP+6°C
2. In Cooling mode the Exhaust will run when TC1 > SP+4°C or TC1 < 50°C
During a profile the Exhaust on command will only run when TC1 > SP-3°C. If a profile
is not running, the Exhaust simply turns on and off when the pushbutton is depressed.
The Exhaust pushbutton light will turn on or off depending on the conditionals above.
4.3.4 Blower
The following conditions apply to Blower on/off commands. Anytime the Blower turns
on, the Exhaust will also run to prevent fumes from going anywhere but the facility
Exhaust. While a profile is running, the Blower will not turn on if the profile is in heating
mode. It will also not turn on if power output to the heaters is over 50%.
The Blower will turn on in the following conditions, either from the pushbutton being
depressed or the Blower command in a profile:
1. TC1 > SP+15 and run until TC1 < SP-2°C
2. If the lower heater SP < 50°C
If a profile is not running, the Blower simply turns on and off when the pushbutton is
depressed. Once the Blower has turned off it will not restart for 7 seconds to prevent
excessive wear and tear on the compressors and large current draw from the facility
power. The Blower pushbutton light will turn on or off depending on the conditionals
above.
4.3.5 PLC Troubleshooting
If the system is plugged in, the Main Power Disconnect is on, and the PLC is up and
running, the Main Power switch light will come on when the Main Power button is
depressed. If it does not, the PLC has probably crashed or died. To reset the PLC, the
Main Power Disconnect needs to be turned off for about 15 seconds and then back on.

TherMoiré AXP 2.0 User Manual
Page 20 of 29 40-5000-6900 Rev. D
5Troubleshooting
5.1 Troubleshooting Data Acquisition
As with any measurement system, the AXP 2.0 has its limitations. These limitations
exist because:
1. The shadow moiré technique with phase stepping analysis is sensitive to the
optical properties of the samples measured, and
2. The desired thermal profile (generated on a production tool, such as a
conveyorized reflow furnace) may be difficult to reproduce in a small thermal
chamber where the sample position is fixed.
The optical and analytical limitations of the system include:
•Failure to obtain good fringe phase information.
•Loss of resolution on samples with a wide range of reflectivity.
The thermal limitations of the system include:
•Temperature gradients across/through the sample.
•Limits on heating and cooling ramp rates.
5.2 Troubleshooting Oven Operation
5.2.1 Minimizing Temperature Gradients
An important goal in many industrial thermal processes is achieving uniform
temperatures across the product. Minimizing thermal gradients in the AXP 2.0 is now
made easier by the addition of top side radiant heaters. However, the top side heaters
have finite power and transmission of their energy through the grating is somewhat
blocked. As a result, achieving good thermal uniformity can require some creativity for
samples that are thick or have poor thermal conductivity. In general, the use of high
radiant flux sources rather than forced convection heating in TherMoiré systems
originated from the need to duplicate the high ramp rates of belt reflow ovens. There are
three simple approaches to reducing top-to-bottom thermal gradients:
1. Use the Top/Bottom Uniformity heating mode in Thermal Profiler:
This mode applies 100% power to the bottom outer heater zone and 0% to the inner,
sacrificing some heating rate. As a result, IR energy is bounced off of the grating and IR
reflective coating on the lid glass and onto the top of the sample under test.
2. Reduce Ramp Rates:
The highest ramp rates for heating tend to cause non-equilibrium temperature
distributions because of finite conduction rates of heat throughout the part under test.
More gradual temperature profiles allow the heat to spread through the part, thus reducing
top-to-bottom gradients.
3. Increase Sample-Grating Distance
The distance between the grating and the sample affects the top-to-bottom
temperature gradient. A narrow gap enhances cooling of the top sample surface through