
L2 Repair Document TCLCommunication Ltd.
Rev.
Go Play 7048X_A Level 2 Repair Document
Page
1.3 3/95
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Content
1Level 2 repair process ..............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1Warranty confirmation of L1.....................................................................................5
2.2Visual mechanical check..........................................................................................6
2.3Pretest........................................................................................................................9
2.4Battery Test .............................................................................................................17
3Software download .................................................................................................20
3.1 Equipments requested when download.................................................................20
3.2 Tool installation........................................................................................................21
3.3 SW download process.............................................................................................22
3.4 Download Mode........................................................................................................26
4 Disassembly and assembly........................................................................................27
4.1 ESD Safety................................................................................................................27
4.2 Disassembly tool......................................................................................................27
4.3 Disassembly process...............................................................................................28
4.4Reassembly Process ..............................................................................................44
4.5Disassembly process evaluation...........................................................................82
5Disassembly Complete...........................................................................................84
6Level 2 repair...........................................................................................................87
7PCBA exchange.......................................................................................................88
8Other component exchange...................................................................................88
9Function Test...........................................................................................................89
APPENDIX 1 Packaging Requirements ........................................................................90