ASRock Industrial iEP-5000G Series User manual

iEP-5000G Series
User Manual
Version 1.0
Published April 2022
iEP-5000G-Series
iEP-5010G-Series
User Manual

Version 1.0
Published March 2023
Copyright©2023 ASRock Industrial. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Industrial Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock Industrial. ASRock Industrial assumes no
responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock Industrial does not
provide warranty of any kind, either expressed or implied, including but not limited
to the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock Industrial, its directors, ocers, employees, or agents
be liable for any indirect, special, incidental, or consequential damages (including
damages for loss of prots, loss of business, loss of data, interruption of business
and the like), even if ASRock Industrial has been advised of the possibility of such
damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Industrial’s Website: www.asrockind.com

Important Safety Instructions
For user safety, please read and follow all instructions, Warnings, Cautions, and Notes
marked in this manual and on the associated device before handling/operating the device,
to avoid injury or damage.
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Read the Specications section of this manual for detailed information on the
recommended operating environment.
4. Disconnect the equipment from all AC outlets before cleaning. Use only a damp cloth
for cleaning. Do not use liquid or sprayed detergent.
5. Place the equipment on a reliable surface during installation. Dropping or letting the
equipment fall may cause damage.
6. Do not leave the equipment in an environment with a storage temperature of below
-40 °C (-40 °F) or above 85 °C (185 °F) as this may cause damage. e equipment should
be stored in a controlled environment
7. Ensure that the voltage of the power source is correct before connecting the equipment
to a power outlet
8. Position the power cord away from high-trac areas. Do not place anything over the
power cord
9. If the equipment is not used for a long time, disconnect the equipment from the power
source to avoid damage from transient over-voltage.
10. All cautions and warnings on the equipment should be noted.
11. To avoid electrical shock and/or damage to device:
• Keep device away from water or liquid sources.
• Keep device away from high heat or humidity.
• Keep device properly ventilated (do not block or cover ventilation openings).
• Always use recommended voltage and power source settings.
• Always install and operate device near an easily accessible electrical outlet.
• Secure the power cord (do not place any object on/over the power cord).
• Only install/attach and operate device on stable surfaces and/or recommended
mountings.
• e power cord must be connected to a socket or outlet with a ground connection.
12. If one of the following occurs, have the equipment checked by service personnel:
• e power cord or plug is damaged.
• Liquid has penetrated into the equipment.
• e equipment has been exposed to moisture.
• e equipment is malfunctioning or does not operate according to the user manual.
• e equipment has been dropped and damaged.
• e equipment shows obvious signs of breakage.

13. Never attempt to repair the device, which should only be serviced by qualied technical
personnel using suitable tools
14. Any unveried component may cause unexpected damage. To ensure correct
installation, always use the components (e.g., screws) provided in the accessory box
15. is equipment is not suitable for use in locations where children are likely to be
present.
16. e equipment should only be installed in a restricted access area.
17. Restricted Access Location : It is recommended that the device be installed only in a
server room or computer room where access is:
• Restricted to qualied service personnel or users familiar with restrictions applied
to the location, reasons therefor, and any precautions required
• Only aorded by the use of a tool or lock and key, or other means of security, and
controlled by the authority responsible for the location
DIN Rail/Wall Mount: M3x5mm Screws (for securing the mounting bracket(s) to the chassis)
VESA Mount: M4x6mm Screws (for securing the VESA bracket to the monitor)
18. is model is intended to be supplied by an UL-certied power supply (Adapter: FSP/
FSP065-RBBN3) suitable for use at TMA 40 °C (104 °F) min., and
the output is rated 19 Vdc, 3.42A min., ES1. If you need further assistance,
contact ASRock Industrial for additional information.
19. e terminal block is suitable for V+& V- for 14~28AWG. e torque value is 0.19Nm.
Use copper conductors only. Kindly note that this must be installed by a skilled person
(for iEP-5000G-010 Series only).

Replaceable batteries
CAUTION : RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT
TYPE. DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
BURN HAZARD
Hot surface! Do not touch! Touching this surface could result in bodily injury. To reduce
risk, allow the surface to cool before touching
CAUTION
e equipment is equipped with a battery-powered real-time clock circuit. ere is a risk
of explosion if a battery is incorrectly replaced. Replace only with same or equivalent
type as recommended by the manufacturer. Discard all used batteries according to the
manufacturer’s instructions.
WARNING
All interconnection to the EUT is for indoor location and therefore PoE network
interconnected to the EUT is considered as ES1/SELV for connected only to PoE network
without routing to the outside plant.
WARNING
Input voltage rated 6-36V, 8-1.81A (iEP-5000G Series)
Packing: e unit should be carried with both hands and handled with care.
Maintenance: Use only approved products or a dry applicator to clean and maintain the
surfaces.

Contact Information
If you need to contact ASRock Industrial or want to know more about ASRock
Industrial, you’re welcome to visit ASRock Industrial’s website at www.asrockind.com;
or you may contact your dealer for further information.
ASRock Industrial Incorporation
email: [email protected]m
e terms HDMI®and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Order Information 3
1.3 Optional Items 4
1.4 Product Specications 5
1.4.1 System : iEP‐5000G‐000 5
1.4.2 System : iEP‐5000G‐010 6
1.4.3 System : iEP‐5000G‐001 7
1.4.4 System : iEP‐5000G‐002 8
1.4.5 System : iEP‐5000G‐003 9
1.4.6 System : iEP‐5001G‐000 10
1.4.7 System : iEP‐5010G‐010 11
1.4.8 System : iEP‐5010G‐011 12
1.4.9 System : iEP‐5010G‐012 13
1.4.10 System : iEP‐5010G‐013 14
1.5 Block Diagram 15
Chapter 2 Product Overview 17
2.1 System Front Panel 17
2.1.1 System : iEP-5000G-000, iEP-5000G-001, iEP-5000G-002, 17
iEP-5000G-003 17
2.1.2 System : iEP-5000G-010, iEP-5010G Series 19
2.2 System Top Panel 22
2.2.1 System : iEP-5000G-000, iEP-5000G-010, iEP-5010G-010 22

2.2.2 System : iEP-5000G-001, iEP-5000G-002, iEP-5010G-011,
iEP- 5010G-012, iEP-5010G-013 24
2.3 Inside View 26
2.4 Position 26
Chapter 3 Hardware Installation 27
3.1 How to Remove the Front Cover 27
3.2 How to Install the Wi-Fi Module (2230) to the M.2 E Key
Slot (Optional) 28
3.3 How to Install the 4G LTE/5G Module (3042/3052) to
the M.2 B Key Slot (Optional) 30
3.4 How to Install the M.2 SSD with the Heasink (M.2 Key M
Socket (2280)) 32
3.5 How to Install the Memory Modules and the Heatsinks 34
3.6 How to Install the 2.5-inch Hard Drive (Optional,
for iEP-50X0G-000/010 only) 36
3.7 How to Install a Nano SIM Dard and Micro SD Card 38
3.8 How to Install the Wall Mounting Bracket (Optional) 40
3.9 How to Install the Din Rail Mounting Bracket (Optional) 42
3.10 How to Install the 5G Module Heatsink (Optional) 43
Chapter 4 Motherboard 44
4.1 Motherboard Layout 44
4.1.1 iEP-5000G MB (DSB-1000-WT) 44
4.1.2 iEP-5010G MB (DSB-1010-WT) 47
4.2 Jumpers Setup 50
4.3 Onboard Headers and Connectors 52
4.4 Expansion Slots (M.2 Sockets) 54

Chapter 5 UEFI Setup Utility 55
5.1 Introduction 55
5.1.1 Entering BIOS Setup 55
5.1.2 UEFI Menu Bar 56
5.1.3 Navigation Keys 57
5.2 Main Screen 58
5.3 Advanced Screen 59
5.3.1 CPU Conguration 60
5.3.2 Chipset Conguration 62
5.3.3 Intel(R) Time Coordinated Computing 64
5.3.4 Storage Conguration 66
5.3.5 Super IO Conguration 68
5.3.6 ACPI Conguration 70
5.3.7 USB Conguration 71
5.3.8 Trusted Computing 72
5.3.9 PSE Conguration 75
5.3.10 Serial Port Console Redirection 76
5. 3.11 External Ports Control 77
5.4 Hardware Health Event Monitoring Screen 79
5.5 Security Screen 80
5.6 Boot Screen 81
5.7 Exit Screen 82

iEP-5000G/5010G Series
PB 1
English
Chapter 1 Introduction
1.1 Package Contents
iEP-5000G-000 Series
• 1 x iEP-5000G-000/iEP-5001G-000
• 1 x 65W Adaptor with screw type
• 3 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
iEP-5000G-001 Series
• 1 x iEP-5000G-001
• 1 x 120W Adaptor with screw type
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
iEP-5000G-002 Series
• 1 x iEP-5000G-002
• 1 x 65W Adaptor with screw type
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
iEP-5000G-003 Series
• 1 x iEP-5000G-003
• 1 x 65W Adaptor with screw type
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
Because the hardware specications might be updated, the content of this documentation
will be subject to change without notice.

2 3
English
If any items are missing or appear damaged, contact your authorized dealer.
iEP-5000G-010 Series
• 1 x iEP-5010G-010
• 3 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
• 1 x Phoenix plug connector
iEP-5010G-010 Series
• 1 x iEP-5010G-010
• 3 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
• 1 x Phoenix plug connector
iEP-5010G-011 Series
• 1 x iEP-5010G-011
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
• 1 x Phoenix plug connector
iEP-5010G-012 Series
• 1 x iEP-5010G-012
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
• 1 x Phoenix plug connector
iEP-5010G-013 Series
• 1 x iEP-5010G-013
• 2 x Screws for M.2 Module
• 1 x M.2 M key (2280) Storage Heatsink
• 1 x DRAM Heatsink
• 1 x Phoenix plug connector

iEP-5000G/5010G Series
2 3
English
1.2 Order Information
Model Name PN Description
iEP-5000G-000 90PXG8D0-00000010 Basic SKU with CPU x6425RE, BASIC, DC
JACK w/ Adapter 65W, w/o DRAM Storage,
Mount
iEP-5000G-010 90PXG8D0-30000000 Basic SKU with CPU x6425RE, DC PHX
Type, w/o Adapter, DRAM, Storage, Mount
iEP-5000G-001 90PXG8D0-10000020 PoE SKU with CPU x6425RE, DC JACK w/
Adapter 120W, w/o DRAM Storage, Mount
iEP-5000G-002 90PXG8D0-20000010 5LANWIFI SKU with CPU x6425RE, DC
JACK w/ Adapter 65W, w/o DRAM Storage,
Mount
iEP-5000G-003 90PXG8D0-20004010 5LAN5G SKU with CPU x6425RE, DC
JACK w/ Adapter 65W, w/o DRAM Storage,
Mount
iEP-5001G-000 90PXG9M0-01000010 Basic SKU with CPU x6212RE, DC JACK w/
Adapter 65W, w/o DRAM Storage, Mount
iEP-5010G-010 90PXGAL0-32000000 Basic SKU with CPU x6416RE, DC PHX
Type, w/o Adapter, DRAM, Storage, Mount
iEP-5010G-011 90PXGAL0-42000000 PoE SKU with CPU x6416RE, DC PHX
Type, w/o Adapter, DRAM, Storage, Mount
iEP-5010G-012 90PXGAL0-52000000 5LANWIFI SKU with CPU x6416RE, DC
PHX Type, w/o Adapter, DRAM, Storage,
Mount
iEP-5000G-013 TBD 5LAN5G SKU with CPU x6416RE, DC PHX
Type, w/o Adapter, DRAM, Storage, Mount

4 5
English
1.3 Optional Items
Model Name PN Description
Wall Mount
Kits
13G020760000AI Attach the wall mounting brackets to the iEP-
5000G Series.
Din Rail Kits 13G020761000AI Attach the din-rail brackets to the iEP-5000G
Series and can place to the din rail.
2.5” SSD BKT
Accesories
13GSAP000000AI Attach the SSD to the SSD bracket (Basic SKU
only)
5G Module
Sink
13G07P017000AI To cool capability of the 5G module itself is not
sucient to regulate its temperature (For iEP-
5000G-000/010/003, iEP-5010G-010/013)
4G Module
Kits
14G15A004000AI
14G000035330AI
14G000035300AI
ANTENNA SUB 6G x 2pcs
SMA CABLE, L=220mm x 1pcs
SMA CABLE, L=180mm x 1pcs
5G Module
Kits
14G15A004000AI
14G000035330AI
14G000035300AI
ANTENNA SUB 6G x 4pcs
SMA CABLE, L=220mm x 1pcs
SMA CABLE, L=180mm x 3pcs
Wi-Fi
Module Kits
14G15A005000AI
14G000032200AI
ANTENNA 2dBi WSS002 2.4/5/6G x 2pcs
WIFI SMA CABLE, L=185mm x 2pcs

iEP-5000G/5010G Series
4 5
English
1.4 Product Specications
1.4.1 System : iEP‐5000G‐000
1-6-1 System : iEP-5000G-000
Processor
CPU Intel® Atom® X6425RE Quad-Core SoC
TDP 12W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion Slots
RF&Antenna 7 x Antenna Hole
M.2 1 x M.2 Key B (3042/3052) with PCIe Gen3/USB3 mode
1 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio Interface Realtek ALC897, High Deon Audio,
Mic-In, Line-Out
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
SATA 1 x 2.5" 9.5mm SATA3 SSD (Oponal)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable DC Jack for 6 to 36V DC input
Environment
Oper
Temp. -40°C ~ 70°C (-40°F~158°F) , w/ airw 0.5~0.8m/s
Storage
Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux
Frequency 1.90 GHz

6 7
English
1.4.2 System : iEP‐5000G‐010
1-6-2 System : iEP-5000G-010
Processor
CPU Intel® Atom® X6425RE Quad-Core SoC
Frequency
TDP 12W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion Slots
RF&Antenna 7 x Antenna Hole
M.2
1 x M.2 Key B (3042/3052) with PCIe Gen3/USB3
mode
1 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio Interface Realtek ALC897, High Deon Audio,
Mic-In, Line-Out
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
SATA 1 x 2.5" 9.5mm SATA3 SSD (Oponal)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable 3-pin terminal block (Phoenix type)
Environment
Oper
Temp. -40°C ~ 70°C (-40°F~158°F) , w/ airw 0.5~0.8m/s
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux
1.90 GHz

iEP-5000G/5010G Series
6 7
English
1.4.3 System : iEP‐5000G‐001
1-6-3 System : iEP-5000G-001
Processor
CPU Intel® Atom® X6425RE Quad-Core SoC
Frequency 1.90 GHz
TDP 12W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion
Slots
RF & Antenna 7 x Antenna Hole
M.21 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio
Interface Realtek ALC897, High Deon Audio, Mic-In, Line-Out
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN4 / PoE1 Intel I210-AT, supports IEEE 802.3AF PoE
LAN5 / PoE2 Intel I210-AT, supports IEEE 802.3AF PoE
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
SATA 1 x 2.5" 9.5mm SATA3 SSD (Oponal)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable DC Jack for 19 to 36V DC input
Environment
Oper
Temp. -40°C ~ 50°C (-40°F~122°F) , w/ airw 0.5~0.8m/s
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux

8 9
English
1.4.4 System : iEP‐5000G‐002
1-6-4 System : iEP-5000G-002
Processor
CPU Intel® Atom® X6425RE Quad-Core SoC
Frequency 1.90 GHz
TDP 12W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion Slots
RF & Antenna 7 x Antenna Hole
M.21 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio
Interface
Realtek ALC897, High Deon Audio, Mic-In, Line-Out
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN4 Intel I210-AT, 10/100/1000Mbps
LAN5 Intel I210-AT, 10/100/1000Mbps
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable DC Jack for 6 to 36V DC input
Environment
Oper
Temp. -40°C ~ 50°C (-40°F~122°F) , w/ airw 0.5~0.8m/s
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux

iEP-5000G/5010G Series
8 9
English
1.4.5 System : iEP‐5000G‐003
1-6-5 System : iEP-5000G-003
Processor
CPU Intel® Atom® X6425RE Quad-Core SoC
Frequency 1.90 GHz
TDP 12W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion Slots
RF & Antenna 7 x Antenna Hole
M.21 x M.2 Key B (3042/3052) with PCIe Gen3/USB3 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio Interface 
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN4 Intel I210-AT, 10/100/1000Mbps
LAN5 Intel I210-AT, 10/100/1000Mbps
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable DC Jack for 6 to 36V DC input
Environment
Oper
Temp. 
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux

10 11
English
1.4.6 System : iEP‐5001G‐000
1-6-5 System : iEP-5001G-000
Processor
CPU Intel® Atom® X6212RE Dual-Core SoC
Frequency 1.50 GHz
TDP 6W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion Slots
RF&Antenna 7 x Antenna Hole
M.2 1 x M.2 Key B (3042/3052) with PCIe Gen3/USB3 mode
1 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio Interface Realtek ALC897, High Deon Audio,
Mic-In, Line-Out with 2.5mm audio phone jack
Ethernet
LAN1 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN2 Intel MaxLinear GPY215, 10/100/1000Mbps
LAN3 Intel MaxLinear GPY215, 10/100/1000Mbps
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
SATA 1 x 2.5" 9.5mm SATA3 SSD (Oponal)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable DC Jack for 6 to 36V DC input
Environment
Oper
Temp. -40°C ~ 70°C (-40°F~158°F) , w/ airw 0.5~0.8m/s
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux

iEP-5000G/5010G Series
10 11
English
1.4.7 System : iEP‐5010G‐010
1-6-6 System : iEP-5010G-010
Processor
CPU Intel® Atom® X6416RE Quad-Core SoC
Frequency 1.70 GHz
TDP 9W
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4 3200 MHz (Support In-Band ECC)
Max Capacity 32GB
Socket Dual 260-pin SO-DIMM
Graphics
Chipset Intel® UHD Graphics for 10th Gen Intel® Processors
HDMI Up to 4096 x 2160 @ 60 Hz
VGA Up to 4096 x 2160 @ 60 Hz
Expansion
Slots
RF&Antenna 7 x Antenna Hole
M.2 1 x M.2 Key B (3042/3052) with PCIe Gen3/USB3 mode
1 x M.2 Key E (2230) with PCIe Gen3 / USB2 mode
SIM Slot 1 x Nano SIM Card
SD Slot 1 x Micro SD card (SD Card speccaon version 3.01)
Audio Interface Realtek ALC897, High Deon Audio,
Mic-In, Line-Out
Ethernet
LAN1 Intel I210-IT, 10/100/1000Mbps
LAN2 Intel I210-IT, 10/100/1000Mbps
LAN3 Intel I226-IT, 2.5G
Storage M.2 1 x M.2 2280 Key M (PCIe Gen3 / SATA3 mode)
SATA 1 x 2.5" 9.5mm SATA3 SSD (Oponal)
I/O Interface
Serial Port 3 x RS-232/422/485 (9-pin D-sub connector)
GPIO 4-bit Programmable DIO
USB 2 x USB3, 2 x USB2
 1 x Clear CMOS buon
1 x Power on Bun with LED
Security Watch Dog 255-level mer interval, set up through 
TPM TPM 2.0
Power
Requirement DC Input 1 x pluggable 3-pin terminal block (phoenix type) for
6 to 36V DC input
Environment
Oper
Temp. -40°C ~ 70°C (-40°F~158°F) , w/ airw 0.5~0.8m/s
Storage Temp. -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock Oper with SSD : 100 G, half sine 11 ms dur
Vibraon Oper with SSD : 5 Grms, 5-500 Hz, 3 axes
ESD Contact +/-8 KV, Air +/-15 KV
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety LVD
Mechanical
g Din-Rail, Wall Mount (Oponal)
Dimensions 58mm (W) x 125mm (D) x 157mm (H)
Net Weight 1.3 KG
Support
OS Windows 10, Ubuntu22.04 LTS
Real-Time
Enablement TSN, TCC support under Linux