Becom CM-BF527 Instructions for use

CM-BF527
Hardware User Manual
Version 8

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
2| 33
BECOM Systems GmbH
Gutheil-Schoder-Gasse 17
1230 Wien
AUSTRIA
[e-mail]
http://systems.becom-group.com
CM-BF527 –Hardware User Manual
Template No.: 900-520 Rev A
Publication date: February 4, 2020
Subject to change without notice. Errors excepted.
This document is protected by copyright. All rights reserved. No part of this document may be reproduced or
transmitted for any purpose in any form or by any means, electronically or mechanically, without expressly
written permission by
BECOM Systems.
Windows is a registered trademark of Microsoft.

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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Table of Contents
1Introduction...............................................................................................................................................................................................................................6
1.1 Overview................................................................................................................................................................................................................................6
1.2 Key Features................................................................................................................................................................................................................. 8
1.3 Applications.................................................................................................................................................................................................................. 8
2General Description ............................................................................................................................................................................................................9
2.1 Functional Description .........................................................................................................................................................................................9
2.2 Boot Mode......................................................................................................................................................................................................................9
2.3 Memory Map ..............................................................................................................................................................................................................10
2.3.1 Core Module Memory...................................................................................................................................................................................10
2.3.2 Board modifications.........................................................................................................................................................................................11
2.3.3 Externally Addressable Memory (on connector) ...................................................................................................................12
3Specifications.........................................................................................................................................................................................................................13
3.1 Electrical Specifications.....................................................................................................................................................................................13
3.1.1 Maximum Ratings .............................................................................................................................................................................................13
3.1.2 Operating Conditions....................................................................................................................................................................................13
3.1.3 ESD Sensitivity.....................................................................................................................................................................................................14
4Connector Description ...................................................................................................................................................................................................15
4.1 Connector X1...............................................................................................................................................................................................................15
4.2 Connector X2..............................................................................................................................................................................................................17
5Application Information................................................................................................................................................................................................19
5.1 Supply Voltage Decoupling ...........................................................................................................................................................................19
5.2 Reset circuit .................................................................................................................................................................................................................19
5.3 Application Example Schematics............................................................................................................................................................ 20
5.3.1 RJ45 schematic.................................................................................................................................................................................................. 20
5.3.2 Ethernet and JTAG ...........................................................................................................................................................................................21
5.3.3 Stand-alone Ethernet based MPEG Webcam..........................................................................................................................22
6Mechanical Outline ..........................................................................................................................................................................................................24
6.1 Top View........................................................................................................................................................................................................................24
6.2 Bottom View..............................................................................................................................................................................................................24

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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6.3 Side View ......................................................................................................................................................................................................................25
6.4 Footprint........................................................................................................................................................................................................................25
6.5 Connectors ..................................................................................................................................................................................................................26
7Support.......................................................................................................................................................................................................................................27
7.1 General Support......................................................................................................................................................................................................27
7.2 Board Support Packages..................................................................................................................................................................................27
7.3 Blackfin® Software Support ..........................................................................................................................................................................27
7.3.1 BLACKSheep® OS .............................................................................................................................................................................................27
7.3.2 LabVIEW...................................................................................................................................................................................................................27
7.3.3 uClinux.......................................................................................................................................................................................................................27
7.4 Blackfin®Design Services.................................................................................................................................................................................27
7.4.1 Upcoming Products and Software Releases ............................................................................................................................27
8Ordering Information......................................................................................................................................................................................................28
9Dependability........................................................................................................................................................................................................................29
9.1 MTBF .................................................................................................................................................................................................................................29
10 Product History....................................................................................................................................................................................................................30
10.1 Version Information .............................................................................................................................................................................................30
10.1.1 CM-BF527-C-C-Q50S32F8 (CM-BF527) ..........................................................................................................................................30
10.1.2 CM-BF527-C-C-Q50S64F8 (CM-BF527-64SD) ....................................................................................................................30
10.2 Anomalies.....................................................................................................................................................................................................................30
11 Document Revision History........................................................................................................................................................................................31
12 List of Abbreviations.......................................................................................................................................................................................................32
AList of Figures and Tables ...........................................................................................................................................................................................33

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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© BECOM Systems GmbH 2020
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
BECOM Systems makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. BECOM Systems specifically disclaims any implied warranty of merchantability or fitness
for a particular purpose.
BECOM Systems takes no liability for any damages and errors causing of the usage of this board. The user of this
board is responsible by himself for the functionality of his application. He is allowed to use the board only if he
has the qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact BECOM Systems
www.becom-group.com

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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1Introduction
The CM-BF527 is optimized on performance and functionality. The module integrates processor, RAM, flash,
external peripheral controllers and power supply at a size of 31.5x36.5mm! It is based at the high performance
ADSP-BF527 from Analog Devices. The Core-Module is designed for commercial usage (commercial temperature
range). It addresses 32MByte SDRAM via its 16bit wide SDRAM bus and has an onboard NOR-flash of 8MByte. The
processor features a built in USB-OTG 2.0 unit and there is an extra Ethernet physical transceiver onboard.
1.1 Overview
Figure 1-1 shows the main components of the Core Module CM-BF527
32/64*
MByte
SD-RAM
60 Pin Expansion Connector A
USB2.0
OTG on
BF527
BF527
600 MHz
Dynamic
Core Voltage
Control
60 Pin Expansion Connector B
Low Voltage
Reset Ethernet
Physical
8 MByte
Flash
Figure 1-1: Main components of the CM-BF527 Core Module
*Version dependent (see chapter 8.1)
•Analog Devices Blackfin Processor ADSP-BF527
oADSP-BF527KBCZ with 600MHz
•32 MB SDRAM
o32MByte SDRAMUVersion (see chapter 8.1)
▪SDRAM Clock up to 133MHz
▪MT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V)
oU64MByte SDRAMUVersion (see chapter 8.1)
▪SDRAM Clock up to 143MHz
▪IS42S16320B-7BL (8M x16x4, 512Mbit at 3.3 V)

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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•8 MB of Byte-Addressable Flash
o32MByte SDRAMUVersion (see chapter 8.1)
▪PF48F2000P0ZBQ0 (4Mx16, 64Mbit at 3.3V; addressable by 4 banks, 2MB each,
controlled over GPIOs)
▪Additional flash memory can be connected through the expansion board as parallel
Flash using asynchronous chip select lines or as a SPI flash.
o64MByte SDRAMUVersion (see chapter 8.1)
▪PF48F3000P0ZBQE (addressable by 4 banks, 2MB each, controlled over GPIOs)
▪Additional flash memory can be connected through the expansion board as parallel
Flash using asynchronous chip select lines or as a SPI flash.
•Ethernet Physical Transceiver KSZ8041
•Low Voltage Reset Circuit
Resets module if power supply goes below 2.93 V for at least 140 ms
•Dynamic Core Voltage Control
oAllows adjusting of the core voltage by setting software registers on the Blackfin processor
oCore voltage range: 0.8 –1.2V
•Expansion Connector A
oData Bus
oAddress Bus
oControl Signals
oUSB2.0 OTG
oEthernet Pins
•Expansion Connector B
oPG (0..15) SPI, UART, SPORT, GPIO
oJTAG
oTWI (I2C compatible)
oPower
oPPI (Parallel Port Interface)
oBoot Mode
oGPIO’s

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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1.2 Key Features
•The CM-BF527 is a low-cost compact core module and measures only 36x31mm
•Allows quick prototyping of product that comes very close to the final design
•Reduces development costs, faster time to market
•Very cost effective for small and medium volumes
1.3 Applications
•Mobile Embedded Device
•Network connected embedded system
•Industrial control
•Voice over IP (VoIP)
•Multi-media application processor
•Multi-media accessories - e.g. docks
•Networked audio
•Instrumentation
•Imaging

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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2General Description
2.1 Functional Description
32/64*
MByte
SDRam
8 MByte
Flash
BF527
up to
600MHz
Dynamic
Core Voltage
Control
Low Voltage
Reset
20 Bit Address Bus
16 Bit Data Bus
Ethernet
Physical
Clock
Mem. Control, Ethernet, USB2.0 OTG
Data & Address Bus
Clock-out Boot Mode, JTAG, PPI, SPORT, UART, SPI, TWI,
GPIO
3V3 Power , Reset
Figure 2-1: Detailed block diagram
*Version dependent (see chapter 8.1)
Figure 2-1 shows a detailed block diagram of the CM-BF527 module. Besides the SDRAM control pins and the pins
used by the Ethernet physical transceiver (port H) the CM-BF527 has all other pins of the Blackfin processor on its
two main 60 pin connectors.
A special feature of the CM-BF527 Core Module is the on-board physical Ethernet transceiver from Microchip
(KSZ8041).
Dynamic voltage control allows reduction of power consumption to a minimum adjusting the core voltage and
the clock frequency dynamically in accordance to the required processing power. A low voltage reset circuit
guarantees a power on reset and resets the system when the input voltage drops below 2.93V.
2.2 Boot Mode
By default, the boot mode = 0000 (BMODE3 = low, BMODE2 = low, BMODE1 = low, BMODE0 = low). All BMODE
pins have internal pull-down resistors.

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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Switch Settings
BM[3..0]
Boot Mode
Description
0000
0 (default)
Idle - No boot Reserved
0001
1
Boot from 8- or 16-bit external flash memory
0010
2
Boot from 16-bit asynchronous FIFO.
0011
3
Boot from serial SPI memory (EEPROM or flash)
0100
4
Boot from SPI host device
0101
5
Boot from serial TWI memory (EEPROM/flash)
0110
6
Boot from TWI host
0111
7
Boot from UART0 Host
1000
8
Boot from UART1 Host
1001
9
Reserved
1010
10
Boot from SDRAM
1011
11
Boot from OTP memory
1100
12
Boot from 8-bit NAND flash via NFC using PORTF data pins
1101
13
Boot from 8-bit NAND flash via NFC using PORTH data pins
1110
14
Boot from 16-Bit Host DMA
1111
15
Boot from 8-Bit Host DMA
Table 2-1: Boot mode description
Connect BMODE0 to VCC and leave BMODE1, BMODE2 and BMODE3 pins open for Boot Mode 0001 equals to 8- or
16-bit PROM/FLASH boot mode. This is the default boot mode of the BLACKSheep® OS and uClinux.
Note
Boot Modes 8-15 are not supported with the DEV-BF5xx-DALite or EVAL-BF5xx
2.3 Memory Map
2.3.1 Core Module Memory
The maximum addressable memory size of a single asynchronous memory bank from the Blackfin processor is
2MB. In order to be able to use more than just 2MB on a single bank, 2 GPIOs are used to select which 2MB
section of flash is visible in the memory window of the Blackfin processor. This frees up the remaining banks for
the user.

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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Memory Type
Start Address
End Address
Size
Comment
FLASH 1)
PH9 Flag Low
PG11 Flag Low
0x20000000
0x201FFFFF
2MB
¼ of 8MB Flash,
IS29GL256-70DLEB
FLASH 1)
PH9 Flag High
PG11 Flag Low
0x20000000
0x201FFFFF
2MB
¼ of 8MB Flash,
IS29GL256-70DLEB
FLASH 1)
PH9 Flag Low
PG11 Flag High
0x20000000
0x201FFFFF
2MB
¼ of 8MB Flash,
IS29GL256-70DLEB
FLASH 1)
PH9 Flag High
PG11 Flag High
0x20000000
0x201FFFFF
2MB
¼ of 8MB Flash,
IS29GL256-70DLEB
SD-RAM
0x00000000
0x01FFFFFF
32MB
16Bit Bus, Micron
IS42S16320D-7BLI
Table 2-2: Blackfin memory assignment
Note 1) be aware that you have to unlock the flash before starting an erase process!
2.3.2 Board modifications
If one or both I O pins are needed and 4 MB or 2 MB flash memory is sufficient for your application, move the 0 Ω
resistors R26 to R24 for PG11 and R19 to R14 for PH9 from your Core Module. The flash address lines A20 and A21
are pulled low.
Figure 2-2: default GPIO routing
Warning
BECOM Systems cannot take responsibility for customer-modified boards. If you need
modifications, please request a quote at [e-mail].

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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Figure 2-3: Assembly drawing bottom view
To access more than 8MB flash memory (64MB) you can add the 0 Ω resistor array R2. But be aware to not
connect the IO pins PG10, PG9 and PG1.
Flash Address Pin
Blackfin Flag
CM Pin Number
A20
PH9
55
A21
PG11
8
A22
PG10
54
A23
PG9
7
A24
PG1
39
Table 2-3: IO pin to flash address pin assignment
2.3.3 Externally Addressable Memory (on connector)
The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
AMS Line
Start Address
End Address
Max. Size
nAMS2
0x20200000
0x202FFFFF
1MB
nAMS3
0x20300000
0x203FFFFF
1MB
Table 2-4: Externally addressable memory

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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3Specifications
3.1 Electrical Specifications
3.1.1 Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage
to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than
those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Symbol
Parameter
Min
Max
Unit
VIO
Input or output voltage
-0.5
3.6
V
VIN
Input supply voltage
3.0
5.5
V
IOH /IOL
Current per pin
0
10
mA
TAMB
Ambient temperature
-40
85
°C
TSTO
Storage temperature
-55
150
°C
TSLD
Solder temperature for 10 seconds
260
°C
φAMB
Relative ambient humidity
90
%
Table 3-1: Absolute maximum ratings
3.1.2 Operating Conditions
Symbol
Parameter
Min
Typical
Max
Unit
VIN
Input supply voltage
3.0
3.3
3.6
V
I3V31)
3.3V current
-
350
-
mA
VOH
High level output voltage
2.4
-
-
V
VOL
Low level output voltage
-
-
0.4
V
IIH
IO input current
-
-
10
µA
IOZ
Three state leakage current
-
-
10
µA
IRTC
VRTC current
-
20
-
µA
IUSB_FS
VUSB current in low/full speed mode
-
9
-
mA
IUSB_HS
VUSB current in high speed mode
-
25
-
mA
fCCLK
Core clock frequency
400
-
600
MHz
Table 3-2: Electrical characteristics
Note 1) Average load @ 25°C ambient temperature

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Hardware User Manual - CM-BF527
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3.1.3 ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can
discharge without detection. Although this product features patented or proprietary
protection circuitry, damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid performance degradation or
loss of functionality.

© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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4Connector Description
In the following tables you will find pin assignments for the Core Module connectors. Most pins are directly
connected to the Blackfin processor. If not, please read the Notes below the table.
4.1 Connector X1
Pin No.
Signal Name
Type
Function
1
VppOTP
Power1)
OTP programming voltage
2
PH11/ND_WE/ETxD3/HOST_D11
IO
NAND Interface
3
PH13/ND_BUSY/ERxCLK/HOST_D13
IO
NAND Interface
4
PH15/ND_ALE/COL/HOST_D15
IO
NAND Interface
5
CLKBUF
IO
Buffered clock (50MHz)
6
SDA
IO
I2C
7
PG9 / RSCLK0A/ TMR5 / TACI5
IO
SPORT, Timer
8
NC2) or PG11 / TMR7 / HOST_WR
IO –10k pull down
Timer
9
Vin 3V3
Power
10
Vin 3V3
Power
11
PF0 / PPID0 / DR0PRI / ND_D0A
IO
PPI data, SPORT, NAND
interface
12
PF2 / PPI D2 / RSCLK0 / ND_D2A
IO
PPI data, SPORT, NAND
interface
13
PF4 / PPI D4 / TFS0 / ND_D4A / TACLK0
IO
PPI data, SPORT, NAND
interface
14
PF6 / PPI D6 / DT0SEC / ND_D6A / TACI0
IO
PPI data, SPORT, NAND
interface
15
PF8 / PPID8 / DR1PRI
IO
PPI data, SPORT
16
PF10 / PPID10 / RFS1 / SPISEL7
IO
PPI data, SPORT
17
PF12 / PPID12 / DT1PRI / SPISEL2 / CDG
IO
PPI data, SPORT
18
PF14 / PPID14 / DT1SEC / UART1TX
IO
PPI data, SPORT, UART
19
PG6 / DT0PRIA / TMR2 / PPIFS3
IO
SPORT, Timer, PPI frame sync
20
PPIFS1 / TMR0
IO
PPI frame sync, Timer
21
PPIFS1 / TMR0
IO
PPI frame sync, Timer
22
PG13 / DMAR0 / UART1RXA / H_ADR / TACI2
IO
UART
23
PG8 / TMR4 / RFS0A / UART0RX / TACI4
IO
Timer, SPORT, UART
24
PG4 / SPIMOSI / DT0SECA
IO
SPI, SPORT
25
PG2 / SPISCK
IO
SPI clock
26
Bmode0
I - 10k pull down
Boot mode
27
GND
Power
28
TCK
I - 10k pull up
JTAG
29
TDI
I - 10k pull up
JTAG

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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Pin No.
Signal Name
Type
Function
30
TRST
I - 4k7 pull down
JTAG
31
EMU
O
JTAG
32
TMS
I –10k pull up
JTAG
33
TDO
O
JTAG
34
Bmode2
I -10k pull down
Boot mode
35
Bmode3
I -10k pull down
Boot mode
36
Bmode1
I -10k pull down
Boot mode
37
PG3 / SPIMISO / DR0SECA
IO
SPI, SPORT
38
PG7 / TMR3 / DR0PRIA / UART0TX
IO
Timer, SPORT, UART
39
PG1 / SPISS/ SPISEL1
IO
SPI slave select
40
PG12 / DMAR1 / UART1TXA / H_ACK
IO
UART
41
PPICLK / TMRCLK
IO
PPI clock, Timer clock
42
PG5 / TMR1 / PPIFS2
IO
Timer, PPI frame sync
43
PF15 / PPID15 / DR1SEC / UART1RX / TACI3
IO
PPI data, SPORT, UART
44
PF13 / PPID13 / TSCLK1 / SPISEL3 / CUD
IO
PPI data, SPORT
45
PF11 / PPID11 / TFS1 / CZM
IO
PPI data, SPORT
46
PF9 / PPID9 / RSCLK1 / SPISEL6
IO
PPI data, SPORT
47
PF7 / PPID7 / DR0SEC / ND_D7A / TACI1
IO
PPI data, SPORT, NAND
interface
48
PF5 / PPID5 / TSCLK0 / ND_D5A / TACLK1
IO
PPI data, SPORT, NAND
interface
49
PF3 / PPID3 / DT0PRI / ND_D3A
IO
PPI data, SPORT, NAND
interface
50
PF1 / PPID1 / RFS0 / ND_D1A
IO
PPI data, SPORT, NAND
interface
51
GND
Power
52
GND
Power
53
USB_VBUS
I/O
USB
54
PG10 / TMR6 / TSCLK0A / TACI6
IO
Timer, SPORT
55
NC2) or PH9/SPISEL5/ETxD2/HOST_D9/TACLK3
IO –10k pull down
56
SCL
O
I2C
57
PG0 / HWAIT
IO
Boot host wait
58
PH14/ND_CLE/ERxDV/HOST_D14
IO
NAND interface
59
PH12/ND_RE/ERxD3/HOST_D12
IO
NAND interface
60
PH10/ND_CE/ERxD2/HOST_D10
IO
NAND interface
Table 4-1: Connector description X1
Note 1) Internally connected to 2.5V. If you want to program the OTP memory, just power this pin with 7.0V.
Note 2) These IO pins are normally used to access more flash memory. They should not be used as general-
purpose IO pins.

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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For more information please see chapter 2.3.
4.2 Connector X2
Pin No.
Signal Name
Type
Function
61
A1
O
Address bus
62
A3
O
Address bus
63
A5
O
Address bus
64
A7
O
Address bus
65
A9
O
Address bus
66
A11
O
Address bus
67
A13
O
Address bus
68
A15
O
Address bus
69
A17
O
Address bus
70
A19
O
Address bus
71
ABE1
O
Byte Enable
72
LED_ACT
IO
Ethernet
73
GND
Power
74
RX+
IO –49R9 pull up to 2V5
Ethernet
75
RX-
IO –49R9 pull up to 2V5
Ethernet
76
ARDY
I
Hardware ready control
77
USBD+
I/O
USB
78
SCLK
O
Blackfin CLKOUT
79
GND
Power
80
AMS3
O
Memory select
81
AWE
O
Write Enable
82
NMI
I -10k pull up
Non makeable interrupt
83
D0
IO
Data Bus
84
D2
IO
Data Bus
85
D4
IO
Data Bus
86
D6
IO
Data Bus
87
D8
IO
Data Bus
88
D10
IO
Data Bus
89
D12
IO
Data Bus
90
D14
IO
Data Bus
91
D15
IO
Data Bus
92
D13
IO
Data Bus
93
D11
IO
Data Bus
94
D9
IO
Data Bus
95
D7
IO
Data Bus
96
D5
IO
Data Bus

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Pin No.
Signal Name
Type
Function
97
D3
IO
Data Bus
98
D1
IO
Data Bus
99
RESET
I/O see chapter 3.5
Reset
100
AOE
O
Output enable
101
ARE
O
Read enable
102
AMS2
O
Memory select
103
VDD-RTC
Power
104
USBD-
I/O
USB
105
USB_OTG_ID
I
USB OTG
106
VA33
Power Out
Ethernet
107
TX-
IO –49R9 pull up to 2V5
Ethernet
108
TX+
IO –49R9 pull up to 2V5
Ethernet
109
LED_FD
IO
Ethernet
110
LED_SPEED
IO
Ethernet
111
ABE0
O
Byte Enable
112
A18
O
Address bus
113
A16
O
Address bus
114
A14
O
Address bus
115
A12
O
Address bus
116
A10
O
Address bus
117
A8
O
Address bus
118
A6
O
Address bus
119
A4
O
Address bus
120
A2
O
Address bus
Table 4-2: Connector description X2

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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5Application Information
5.1 Supply Voltage Decoupling
For a better stability we recommend to add a 100 nF and a 10 µF capacitor close to the 3V3 VIN supply pins.
5.2 Reset circuit
The reset of the flash and the processor are connected to a power monitoring IC. The output can be used as
power on reset for external devices, see Figure 5-1.
Figure 5-1: Schematic of reset circuit on the Core Module

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Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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5.3 Application Example Schematics
5.3.1 RJ45 schematic
The KSZ8041 is connected via the RMII to the processor.
The Rx and Tx pairs should be routed with 100 Ωdifferential lines.
Figure 5-2: Schematic for RJ45 connection
Designator
Value
Type
Description
Quantity
X1
RJLBC-060TC1
RJ45 with magnetics
1
R5, R6
220 Ω
Resistor
2
R7
0 Ω
Resistor
1
C1
10 uF
1
V1, V2
USBLC6-2P6
TSV-Diode
2
Table 5-1: Bill of material RJ45
LED_SPEED
LED_ACT
Rx+
Rx-
Tx-
Tx+
REXT 10
GND
1
VddIO 17
GND
0
LED1/SPEED 31
VddPLL 2
LED0/WAYEN 30
XO 8
REFCLK / XI 9
RESET 32
MDIO
11 MDC
12
RxD3/PHYAD0
13
RxD2/PHYAD1
14
RxD1/PHYAD2
15
RxD0/DUPLEX
16
Rx_DV/CRSDV/CONFIG2
18
Rx_CLK
19
Rx_ER/ISO
20
Tx_CLK
22 Tx_EN
23 TxD0
24 TxD1
25 TxD2
26 TxD3
27
INT_P 21
COL/CONFIG0
28 CRS/CONFIG1
29
Tx- 6
Tx+ 7
Rx- 4
Rx+ 5
VddA 3
KSZ8041NL
U1
3.3V_A_PHY
1
3
2 5
4
6
USBLC6-2P6
V1
1
3
2 5
4
6
USBLC6-2P6
V2
GND
GND
3V3
3V3
3
Tx-
2
Rx-
8
Tx+
1
14
13
Rx+
7
9
11
10
12
X1
GND
GND
220R
R5
220R
R6
3V3
3V3
0R
R7 GND
Core Module External Components
106
74
75
107
108
110
72
Rx+
Rx-
Tx-
Tx+
Rx+
Rx-
Tx-
Tx+
100n
C61
1 2 3 4 5
6 7 8
49R9
R1
100n
C62
GNDGND
100n
C10
100R
RJ45 connector with integrated magnetics