BILIAN ELECTRONIC LB-LINK BL-M8723DS1 User manual

BL-M8723DS1
IEEE 802.11b/g/n 150Mbps 1T1R SDIO
WiFi and BT combo Module
SHENZHEN BILIAN ELECTRONIC CO., LTD
Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China
Web: www.b-link.net.cn

1 http://www.b-link.net.cn
Revision History
Revision
Summary
Release Date
1.0
Official release
2020-07-03
Module Name: BL-M8723DS1
Module Type: 802.11b/g/n 150Mbps 1T1R SDIO WiFi and BT combo Module
Revision: V1.0
Customer Approval:
Company:
Title:
Signature:
Date:
BL-link Approval:
Title:
Signature:
Date:

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1. Introduction
BL-M8723DS1 is a highly integrated WiFi+BT combo module, it contains a WLAN and a BT MAC,
a 1T1R capable base band. It supports IEEE 802.11b/g/n standard and provides the highest PHY
rate up to 150Mbps, and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. This module can
offering feature-rich wireless connectivity and reliable throughput from an extended distance.
1.1 Features
Operating Frequencies: 2.4~2.4835GHz
Host Interface is SDIO 2.0 and UART
IEEE Standards: IEEE 802.11b/g/n
BT2.1+EDR/BT3.0 and BT LE4.2
Wireless data rate can reach up to 150Mbps
Connect to external antenna through half hole pad
Power Supply: 3.3±0.2V main power and VDIO power supply
1.2 Block Diagram

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1.3 General Specifications
Module Name
BL-M8723DS1 WiFi and BT combo Module
Chipset
RTL8723DS-CG
WiFi Standards
IEEE802.11b/g/n/, 1T1R, 2.4GHz, 150Mbps (Max)
BT Standards
BT 4.2/4.2LE/2.1EDR/2.1BR
Host Interface
SDIO 2.0 for WIFI; UART for BT
Antenna
Connect to the external antennas through half hole pad
Dimension
SMD 44Pins, 12*12*1.6mm (L*W*H)
Power Supply
DC 3.3±0.2V(main power and VDIO power) @ 350 mA (Max)
Operation Temperature
-10℃ to +70℃
Storage temperature
-45℃to +85℃
Operation Humidity
10% to 95% RH (Non-Condensing)
2. Pin Assignments
Top view
2.1 Pin Definition
No
Pin Name
Type
Description
Supply
1
GND
RF
Ground connections
2
WLAN/BT ANT
RF
WLAN and BT RF port
3
GND
RF
Ground connections

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4
NC
/
NC
5
NC
/
NC
6
BT_WAKE
I
HOST wake-up Bluetooth device
VDIO
7
BT_WAKE_HOST
O
Bluetooth device to wake-up HOST
VDIO
8
NC
/
NC
9
VDD33
P
3.3V Main power supply
10
NC
/
NC
11
NC
/
NC
12
WL_DSI#
I
WLAN radio off (active low)
VDD33
13
WL_WAKE_HOST
O
WLAN to wake-up HOST
VDIO
14
SD_D2
I/O
SDIO data line
15
SD_D3
I/O
SDIO data line
16
SD_CMD
I/O
SDIO command line
17
SD_CLK
I
SDIO clock line
18
SD_D0
I/O
SDIO data line
19
SD_D1
I/O
SDIO data line
20
GND
P
Ground connections
21
NC
/
NC
22
VDIO
P
3.3V SDIO power supply
23
NC
/
NC
24
SUSCLK_IN
I
Shared with GPIO6.
External 32K or RTC clock input with 1.8V ~ 3.3V swing.
This clock source is configured by BT and WL FW,
respectively.
25
PCM_DOUT
O
PCM Data output
26
PCM_CLK
I/O
PCM Clock
27
PCM_DIN
I
PCM data input
28
PCM_SYNC
O
PCM sync signal
29
NC
/
NC
30
NC
/
NC
31
GND
P
Ground connections
32
NC
/
NC
33
GND
P
Ground connections
34
BT_DIS#
I
Shut down BT function (active low)
VDD33
35
NC
/
NC
36
GND
P
Ground connections

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37
NC
/
NC
38
NC
/
NC
39
NC
/
NC
40
NC
/
NC
41
GND
P
Ground connections
42
UART_OUT
O
HOST Data output
43
UART_IN
I
HOST Data input
44
UART_CTS
I
HOST_CTS
P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port
3. Electrical and Thermal Specifications
3.1 Recommended Operating Conditions
Parameters
Min
Typ
Max
Units
Ambient Operating Temperature
-10
25
70
℃
External Antenna VSWR
1
1.7
2
/
Supply Voltage
VDD33/VDIO
3.1
3.3
3.5
V
3.2 Current Consumption
Conditions : VDD33=3.3V ; Ta:25℃
Use Case
VDD33 Current (average)
Typ
Max
Units
WiFi Radio Off (Linux Driver)
42
50
mA
WiFi Unassociated (Linux Driver)
40
60
mA
2.4G 1Mbps TX (RF-Test)
285
310
mA
2.4G 1Mbps RX (RF-Test)
60
70
mA
2.4G 11Mbps TX (RF-Test)
280
310
mA
2.4G 11Mbps RX (RF-Test)
59
70
mA
2.4G 6Mbps TX (RF-Test)
250
280
mA

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2.4G 6Mbps RX (RF-Test)
63
77
mA
2.4G 54Mbps TX (RF-Test)
260
270
mA
2.4G 54Mbps RX (RF-Test)
60
65
mA
2.4G MCS0(HT20) TX (RF-Test)
255
272
mA
2.4G MCS0(HT20) RX (RF-Test)
65
70
mA
2.4G MCS7(HT20) TX (RF-Test)
220
285
mA
2.4G MCS7(HT20) RX (RF-Test)
63
70
mA
2.4G MCS7(HT40) TX (RF-Test)
220
270
mA
2.4G MCS7(HT40) RX (RF-Test)
63
80
mA
BT BR_1M DH5 TX(RF-Test)
125
152
mA
BT EDR_3M DH5 TX(RF-Test)
119
147
mA
BT LE_1M TX(RF-Test)
122
161
mA
BT BR_1M DH5 RX Active(RF-Test)
103
127
mA
BT EDR_3M DH5 RX Active(RF-Test)
102
130
mA
BT LE_1M RX Active(RF-Test)
110
133
mA
4. Interface Functional and Timing Specifications
4.1 SDIO Power On Sequence

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4.2 SDIO Timing
5. WiFi RF Specifications
5.1 2.4G WiFi RF Specification
Conditions : VDD33=3.3V ; Ta:25℃
Features
Description
WLAN Standard
IEEE 802.11b/g/n CSMA/CA
Frequency Range
2.4~2.4835GHz (2.4GHz ISM Band)
Channels
Ch1~Ch13 (For 20MHz Channels)
Modulation
802.11b (DSSS): DBPSK, DQPSK, CCK;
802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM;
802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM;

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Date Rate
802.11b: 1, 2, 5.5, 11Mbps;
802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;
802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps;
Frequency Tolerance
≦±15ppm
5.2 Bluetooth RF Specifications
Conditions : VDD33=3.3V ; Ta:25℃
Features Description
Bluetooth Specification Bluetooth v2.1+EDR/3.0+HS (Bluetooth Classic _ BT BR/EDR),
Bluetooth 4.2 (Bluetooth Low Energy _ BT_LE) FHSS
Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band)
Channels Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels);
Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels);

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Power Classes
Bluetooth Classic: Class1;
Bluetooth Low Energy: Class1.5;
Date Rate & Modulation
BR_1Mbps: GFSK;
EDR_2Mbps: π/4-DQPSK;
EDR_3Mbps: 8DPSK;
LE_1Mbps: GFSK;
Bluetooth Transmitter Specifications
Items
Min
Typ
Max
TX Power
BR_1M TX Power
1
6
8
EDR_2/3M TX Power
1
6
8
LE_125K~1M TX Power
1
6
8
1DH1 TX Power
1
6
8
2DH3 TX Power
1
6
8
3DH5 TX Power
1
6
8
BR_1M Modulation Characteristics
Δf1avg
145kHz
163kHz
--
Δf2max [For at least 99.9% of all
Δf2max]
143kHz
146kHz
--
Δf1avg / Δf2max
1.01
0.12
--
EDR Modulation Accuracy
RMS DEVM (EDR_2M)
--
10%
20%
99% DEVM (EDR_2M)
--
13%
30%
Peak DEVM (EDR_2M)
--
17%
35%
RMS DEVM (EDR_3M)
--
9%
13%
99% DEVM (EDR_3M)
--
11%
20%
Peak DEVM (EDR_3M)
--
14%
25%
LE_Modulation characteristics
Δf1avg (LE_1M)
207kHz
210kHz
--
Δf2max[For at least 99.9% of all
195kHz
194kHz
--

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Δf2max] (LE_1M)
Δf1avg / Δf2max(LE_1M)
1.06
1.08
--
Bluetooth Receiver Specifications
Items
Sensitivity
Maximum Input Level
Input Level(Typ)
BER
Input Level(Typ)
BER
BR_1M
-92dBm
≦0.1%
-20dBm
≦0.1%
EDR_2M
-90dBm
≦0.01%
-20dBm
≦0.1%
EDR_3M
-86dBm
≦0.01%
-20dBm
≦0.1%
LE_1M
-92dBm
≦30.8%
-20dBm
≦0.1%
1DH1
-92dBm
≦30.8%
-20dBm
≦0.1%
2DH3
-90dBm
≦30.8%
-20dBm
≦0.1%
3DH5
-86dBm
≦30.8%
-20dBm
≦0.1%
6. Mechanical Specifications
6.1 Module Outline Drawing
Module dimension: 12.0*12.0*1.6mm (L*W*H; Tolerance: ±0.15mm)

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Module Bow and Twist:≤0.1mm
6.2 Mechanical Dimensions

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7. Application Information
7.1 Typical Application Circuit

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7.2 Recommend PCB Layout Footprint
Design size mm
Top View

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7.3 Reflow Soldering Standard Conditions
Please use the reflow within 2 times.
Set up the highest temperature within 250℃.
8. Key Components Of Module
No.
Parts
Specification
Manufacturer
Note
1
Chipset
RTL8723DS-CG
Realtek
2
PCB
BL-M8723DS1
Shen Zhen Tie Fa Technology limited
Guangdong KINGSHINE ELECTRONICS
CO., LTD
Quzhou Sunlord Electronics Co., Ltd
3
Crystal
24MHz-12pF-10ppm-2520
HUBEI TKD ELECTRONICS
TECHNOLOGY CO., LTD.
LUCKI CM ELECTRONICS CO., LTD
HOSONIC ELECTRONIC CO., LTD.
SHENZHEN KAIYUEXIANG
ELECTRONICS CO., LTD

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9. Package and Storage Information
9.1 Package Dimensions
Package specification:
1. 2,000 modules per roll and 10,000 modules per box.
2. Outer box size: 37.5*36*29cm.
3. The diameter of the blue environment-friendly rubber plate is 13 inches,
with a total thickness of 25.3mm (with a width of 21.3mm carrying belt).
4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
5. Each carton is packed with 5 boxes.

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9.2 Storage Conditions
Absolute Maximum Ratings:
Storage temperature: -45℃to +85℃
Storage humidity: 10% to 95% RH(Non-Condensing)
Recommended Storage Conditions:
Storage temperature: 5℃to +40℃
Storage humidity: 20% to 90% RH
Please use this Module within 12month after vacuum-packaged.
The Module shall be stored without opening the packing.
After the packing opened, the Module shall be used within 72hours.
When the color of the humidity indicator in the packing changed,
the Module shall be baked before soldering.
Baking condition: 60℃, 24hours, 1time.
ESD Sensitivity:
The Module is a static-sensitive electronic device.
Do not operate or store near strong electrostatic fields.
Take proper ESD precautions!

FCC Statement
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi
s device may not cause harmful interference, and (2) this device must accept any interference received, incl
uding interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’
s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursua
nt to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful inte
rference in a residential installation. This equipment generates uses and can radiate radio frequency energy a
nd, if not installed and used in accordance with the instructions, may cause harmful interference to radio com
munications. However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be determined by turn
ing the equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
‐Reorient or relocate the receiving antenna.
‐Increase the separation between the equipment and receiver.
‐Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
‐Consult the dealer or an experienced radio/TV technician for help important announcement
Important Note:
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance
0cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the US/Canada.
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna,
3. For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band
by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user
regarding to Regulatory Domain change. (if modular only test Channel 1-11)
As long as the three conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the
end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
The final end product must be labeled in a visible area with the following" Contains FCC ID: 2AL6KBL-
M8723DS1"
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
17

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM
Manual v01
2.2 List of applicable FCC rules
CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter
2.3 Specific operational use conditions
This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different
operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer
for the installation method in end system.
2.4 Limited module procedures
This module is Limited single modular without shielding, host manufacturer have to consult with module manufacturer for the module
limiting conditions when integrate the module in the host. module manufacturer should reviews detailed test data or host designs
prior to giving the host manufacturer approval.
2.5 Trace antenna designs
Not applicable
2.6 RF exposure considerations
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be
installed and operated with minimum distance 20cm between the radiator & your body.
2.7 Antennas
This radio transmitter 2AL6KBL-M8723DS1 has been approved by Federal Communications Commission to operate with the
antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain
greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.
Model
Type
Connector
Peak gain ( dBi )
2400-2483.5
MHz
5150-5250
MHz
5250-5350
MHz
5470-5725
MHz
5725-5850
MHz
2400-2483.5
MHz
External
Antenna
/
2.0dBi
/
/
/
/
2.8 Label and compliance information
The final end product must be labeled in a visible area with the following" Contains FCC ID:2AL6KBL-M8723DS1".
2.9 Information on test modes and additional testing requirements
Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when the module is
installed in the host.
2.10 Additional testing, Part 15 Subpart B disclaimer
Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for
the system such as Part 15 B.
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