Brooks Instrument GP200 Series User manual

Installation & Operation Manual
GP200 Series Metal Sealed
Pressure-Based Mass Flow Controllers

for local sales office contact information. Save this instruction manual for future reference.
this warning can result in serious personal injury and / or damage to the equipment.
resultinseriouspersonalinjuryand /ordamagetotheequipment.
Connect all products to the proper electrical and pressure sources.
and outlet connections. If no leaks are present, bring the system up to the operating pressure.
maintenance is being performed by qualified persons.
Essential Instructions
Read before proceeding!
European Pressure Equipment Directive (PED)
European Electromagnetic Compatibility (EMC)

Section 1Introduction
Introduction ......................................................................................................................................... 1
How to Use This Manual ..................................................................................................................... 1
Product Support References ............................................................................................................... 2
Notice and Caution Statements .......................................................................................................... 2
Product Warranty ................................................................................................................................ 2
Industry Standard References ............................................................................................................ 2
Glossary of Terms and Acronyms ..................................................................................................... ..3
Product Description ........................................................................................................................... ..4
Specifications for GP200 Series Devices ......................................................................................... ..5
Section 2Installation
General ............................................................................................................................................. 10
Receipt of Equipment ........................................................................................................................ 10
Recommended Storage Practice ...................................................................................................... 10
Return Shipment ............................................................................................................................... 10
Transit Precautions ........................................................................................................................... 11
Removal from Storage ...................................................................................................................... 11
Gas Connections ............................................................................................................................... 11
In-Line Filter ...................................................................................................................................... 11
Mechanical Installation ...................................................................................................................... 11
Flow Controller Installation Arrangement .......................................................................................... 12
Purge the Gas Supply Line Before GP200 Series Installation ..........................................................13
Position and Mount the GP200 Series ............................................................................................ ..14
Perform a Leak Test........................................................................................................................ ..17
Zeroing Setup Process ......................................................................................................................17
Zeroing the GP200 Series from the LCD Display Panel ....................................................................18
Zeroing GP200 Series Over DeviceNet .......................................................................... ..................19
Introduction to the Brooks Expert Support Tool .............................................................................. ...20
Using the Brooks Expert Support Tool ............................................................................ ...................21
GP200 Alarms in the Brooks Expert Support Tool ......................................................... ...................22
GP200 Warping in the Brooks Expert Support Tool ....................................................... .................24
Electrical Connections....................................................................................................................... .25
EtherCAT Connections ...................................................................................................................... 25
DeviceNet Connections......................................................................................................................26
Analog/RS485 Connections ............................................................................................................... 27
Section 3Operation
General ............................................................................................................................................. .29
Theory of Operation for Pressure-Based Flow Measurement ............................................................29
Section 4Maintenance & Troubleshooting
Maintenance & Troubleshooting Overview .........................................................................................32
Maintenance ........................................................................................................................................32
Troubleshooting ..................................................................................................................................33
Troubleshooting Checklist ...................................................................................................................33
GP200 Series Troubleshooting Guide ................................................................................................34
Section 5Product Description Code
Overview .............................................................................................................................................38
Section 6Appendix
Appendix A: GP200 Series Patents .................................................................................................. ..40
Contents
GP200 Series
Performance Checks...........................................................................................................................20
GP200 Gas Pages in the Brooks Expert Support Tool ......................................................... .............22

GP200 Series
Figure 1-1 Dimensions of GP200 Series Downport Configurations ................................................... 8
Figure 1-2 Dimensions of GP200 Series VCR Configurations ........................................................... 9
Figure 2-1 Typical Gas Supply Arrangement .................................................................................... 13
Figure 2-2 GP200 Series Mounting Attitude Positions ...................................................................... 15
Figure 2-3 GP200 Series Mounted to K1 Series Substrate Blocks .................................................... 16
Figure 2-4 Mounting Screws Torque Pattern ..................................................................................... 16
Figure 2-5 GP200 Display showing "%FS" ........................................................................................ 18
Figure 2-6 Top View of GP200 Series Device ................................................................................... 19
Figure 2-7 DeviceNet Remote Diagnostic Example .......................................................................... 20
Figure 2-8 Standard USB to Micro USB Cable .................................................................................. 21
Figure 2-9 GP200 Series Alarm Status Window in BEST .................................................................. 22
Figure 2-10 GP200 Series Alarm Settings Window in BEST ............................................................. 23
Figure 2-12 GP200 Warping in the Brooks Expert Support Tool ....................................................... 25
Figure 2-13 GP200 Series EtherCAT M8 Power Connector .............................................................. 26
Figure 2-14 EtherCAT Power Connector Drawing ............................................................................. 26
Figure 2-15 GP200 Series DeviceNet Connection ............................................................................ 27
Figure 2-16 DeviceNet Pin Connections ........................................................................................... 27
Figure 2-17 GP200 Series Analog 9-Pin Connector .......................................................................... 28
Figure 2-18 GP200 Series Analog 9-Pin Connector (M) .................................................................... 28
Figure 3-1 GP200 Series MFC Architecture ...................................................................................... 30
Figure 3-2 Hagen-Poiseuille Equation ............................................................................................... 30
Figure 3-3 GP200 DP Measurement Concept ................................................................................... 31
Tables
Table 1-1 Industry Standard References .......................................................................................... 2
Table 1-2 Terms and Acronyms ........................................................................................................ 3
Table 1-3 Specifications for GP200 Series ........................................................................................ 6
Table 2-1 K1 Series Fasteners ......................................................................................................... 16
Table 2-2 K1 Substrate Torque Data ................................................................................................ 16
Table 4-1 Environmental Factors ...................................................................................................... 34
Table 4-2 GP200 Series Troubleshooting Guide ............................................................................... 34
Table 5-1 GP200 Series Model Code ............................................................................................... 38
Contents
Figures
Figure 2-11 Changing Gas Pages using BEST..................... ............................................................. 24

Introduction
The GP200 Series is the first fully (both inlet and outlet) pressure
insensitive P-MFC, designed specifically for semiconductor
applications. The GP200’s unique differential pressure technology,
coupled with its downstream valve architecture, removes the
current limitations of pressure-based mass flow controllers,
enabling the most precise process gas delivery over the widest
range of operating conditions in the industry.
As the inventor and market leader in gas and flow range
programmable Mass Flow Controllers, Brooks sophisticated and
proprietary MultiFlo™ gas model is now embedded within each
GP200 device enabling on-the-fly gas & range reconfiguration for
maximum process flexibility.
The GP200’s ultra-fast, highly repeatable Matched Transient
Response and dynamic cross-talk insensitivity enable tighter
process control, handling extreme supply pressure variations while
maintaining precise mass flow control to the chamber. The GP200
platform supports a broad range of process conditions which
enables drop-in replacement and upgrade of many traditional
pressure-based mass flow controllers.
How toUse This Manual
This manual is intended to provide the user with all the information
necessary to install, operate, troubleshoot, and maintain these
pressure-based mass flow devices. The manual is organized in the
following sections:
•Section 1 Introduction
•Section 2 Installation
•Section 3 Operation
•Section 4 Maintenance and Troubleshooting
•Section 5 Product Description Code
•Section 6 Appendix
It is recommended that this manual be read in its entirety before
attempting to operate or repair these devices.
Section 1 Introduction
1

Product Support References
Refer to www.BrooksInstrument.com for Brooks sales and service
locations and to obtain other documents that support the GP200
Series. Those documents include:
•Brooks Expert Support Tool (BEST)
•Brooks GP200 Series Datasheet
Notice and Caution Statements
Warning, caution, and notice statements are located throughout this
manual in the ANSI format. A WARNING statement indicates a
potentially hazardous situation which, if not avoided, COULD result
in death or serious injury. A CAUTION statement indicates a
potentially hazardous situation which, if not avoided, MAY result in
minor or moderate injury. It may also be used to alert against unsafe
practices. A NOTICE statement describes specific information that
requires special attention.
Product Warranty
Product warranty information can be found on the Brooks website
at www.BrooksInstrument.com. This information provides general
warranty information, limitations, disclaimers, and applicable
warranty periods according to product group.
Industry Standard References
Table 1-1 Industry Standard References
Reference Number
Reference Description
MIL-STD-810
Method 514.4, Category 1, Transportation Requirement
Method 516.4, Procedure 1, Functional Shock Test Requirement
SEMI E12
Standard temperature and pressure
SEMI E16
Guideline for determining and describing MFC leak rates
SEMI E17
Guideline for MFC transient characteristics tests
SEMI E18
Guideline for temperature specifications of the MFC
SEMI E27
Standard for MFC and MFM linearity
SEMI E28
Guideline for pressure specifications for the MFC
SEMI E52
Practice for referencing gases used in digital MFCs
SEMI E54
Sensor actuator network connections for DeviceNet
SEMI E56
Test method for determining accuracy, linearity, repeatability, short-term
reproducibility, hystereses of thermal MFCs
SEMI E66
Test method for determining particle contribution by MFCs
SEMI E67
Test method for determining reliability of MFCs
SEMI E68
Test method for determining warm-up time of MFCs
Section 1 Introduction
2

SEMI E69
Test method for reproducibility and zero drift for thermal MFCs
SEMI E80
Test method for determining attitude sensitivity of MFCs
SEMI E16-90
Guidelines for determining and describing mass flow controllers leak rates
SEMI F19
Specification for the finish of the wetted surface of electro polished
216L stainless steel components
SEMI F20
Specifications for 316L stainless steel bar, extruded shapes, plate, and
investment castings for components used in ultra-high purity semi
manufacturing applications
SEMI F36
Guide for dimensions and connections of gas distribution components
SEMI F37
Method for determination of surface roughness parameters for gas
distribution system components
SEMI F44
Guideline for standardization of machined stainless steel weld fittings
SEMI F45
Guideline for standardization of machined stainless steel reducing fittings
SEMI F47
Specifications for semiconductor processing equipment
voltage sag immunity
SEMI S2
Environmental, Health and Safety Guidelines
SEMI S9
Dielectric testing
SEMI S10
Risk assessment
SEMI S12
Decontamination of fielded products
ETG.1000.2
Physical Layer service definition and protocol specification
ETG.1000.3
Data Link Layer service definition
ETG.1000.4
Data Link Layer protocol specification
ETG.1000.5
Application Layer service definition
ETG.1000.6
Application layer protocol specification
ETG.1020
EtherCAT Protocol Enhancements
ETG.2000
EtherCAT Slave Information
ETG.5001.1
Modular Device Profile - Part 1: General MDP Device Model
ETG.5003.1
Semiconductor Device profile - Part 1: Common Device Profile (CDP)
ETG.5003.2020
Specific Device Profile: Enhanced Mass Flow Controller
ETG.5003.2021
Specific Device Profile: Mass Flow Controller
ETG.5003.2022
Specific Device Profile: Mass Flow Meter
ETG.5003.2023
Specific Device Profile: Enhanced Mass Flow Meter
Glossary of Terms and Acronyms
Table 1-2 Terms and Acronyms
Term or Acronym
Definition
CSR
Customer Special Requirement
CVD Chemical Vapor Deposition
DeviceNet
A 5-wire local network I/O communication device that employs a command/response
communication protocol
DSP Digital Signal Processor
EPI Epitaxy (EPI)
A process technology where a pure silicon crystalline structure is deposited or “grown”
on a bare wafer, enabling a high-purity starting point for building the semiconductor
device.
HBD
Horizontal Base Down
GP200 Series
Pressure Based Mass Flow Controller
Section 1 Introduction
3

F.S.
Full Scale
LED
Light Emitting Diode
MFC
Mass Flow Controller
MultiFlo Technology
A physics-based calibration methodology that enables gas and flow range
configuration within a defined standard configuration
P-MFC Pressure-Based Mass Flow Controller
PID Proportional Integral Derivative Controller
PSIA
Pounds per Square Inch Absolute
PSID
Pounds per Square Inch Differential
PSIG
Pounds per Square Inch Gauge
PTI
Pressure Transient Insensitive. Reduces the effect of pressure fluctuations in gas flow.
ROR
As pressure increases, flow increases at a pressure rate of rise, or ROR.
S.P.
Setpoint
VIU
Vertical mounting attitude with inlet side facing up
Product Description
The GP200 Series is the first fully (both inlet and outlet) pressure
insensitive P-MFC, designed specifically for semiconductor
applications. The GP200’s unique differential pressure technology,
coupled with its downstream valve architecture, removes the
current limitations of pressure-based mass flow controllers,
enabling the most precise process gas delivery over the widest
range of operating conditions in the industry.
As the inventor and market leader in gas and flow range
programmable Mass Flow Controllers, Brooks sophisticated and
proprietary MultiFlo™ gas model is now embedded within each
GP200 device enabling on-the-fly gas & range reconfiguration for
maximum process flexibility.
The GP200’s ultra-fast, highly repeatable Matched Transient
Response and dynamic cross-talk insensitivity enable tighter
process control, handling extreme supply pressure variations while
maintaining precise mass flow control to the chamber. The GP200
platform supports a broad range of process conditions which
enables drop-in replacement and upgrade of many traditional
pressure-based mass flow controllers.
True Differential Pressure Measurement
By removing the requirement to match and compensate two
Section 1 Introduction
4

separate pressure transducers, the GP200 differential pressure
technology reduces measurement uncertainty for enhanced
accuracy, repeatability, and drift performance.
Lower Inlet Pressure Operation
Safer fab operation at lower inlet pressures is now achievable with
a P-MFC due to the GP200’s differential pressure sensor that is
specifically optimized for low differential pressure measurement.
Cross-Talk Insensitive
Maintains tight process control under dynamic process conditions-
the accuracy of the GP200 P-MFC will stay within ≤ ± 1% of S.P.
during extreme pressure supply disruptions up to 40 psi/sec.
Matched Transient Response
Ultra-fast, highly repeatable ascending and descending flow
stabilization time enables tighter process control in advanced high
cycle Deposition and Etch processes.
Downstream Valve Architecture
The GP200's downstream valve architecture ensures that accuracy
is independent of downstream pressure, enabling flow delivery into
pressures as high as 1200 Torr. The GP200's fast closing valve
addresses non-productive recipe wait times, or "tail effects", that
are seen in upstream MFC valve designs that require additional
time to bleed down their internal volume of gas.
Zero Leak-by Control Valve
100X improvement in valve shut-down addresses the long standing
“first wafer effect” where the accumulation of unmetered gas
(between the MFC control valve & downstream isolation valve)
contributes to non-uniformities and Critical Dimension (CD) defects
on the first wafer of a process.
High Flow Rate Capability
10 sccm to 50 slm F.S. N2 equivalent P-MFC supports all process
flow needs with just nine (9) standard bin configurations for
maximum flexibility.
Specifications for GP200 Series Devices
Section 1 Introduction
5

Table 1-3 Specifications for GP200 Series
Section 1 Introduction
6