Burr-Brown Corporation SpeedPLUS 165MSPS User manual

DAC902
DAC902
12-Bit, 165MSPS
DIGITAL-TO-ANALOG CONVERTER
FEATURES
●SINGLE +5V OR +3V OPERATION
●
HIGH SFDR: 5MHz Output at 100MSPS: 67dBc
●LOW GLITCH: 3pV-s
●LOW POWER: 170mW at +5V
●INTERNAL REFERENCE:
Optional Ext. Reference
Adjustable Full-Scale Range
Multiplying Option
APPLICATIONS
●COMMUNICATION TRANSMIT CHANNELS:
WLL, Cellular Base Station
Digital Microwave Links
Cable Modems
●WAVEFORM GENERATION:
Direct Digital Synthesis (DDS)
Arbitrary Waveform Generation (ARB)
●MEDICAL/ULTRASOUND
●HIGH-SPEED INSTRUMENTATION AND CON-
TROL
●VIDEO, DIGITAL TV
DESCRIPTION
The DAC902 is a high-speed, Digital-to-Analog Converter (DAC)
offering a 12-bit resolution option within the SpeedPlus Family of
high-performance converters. Featuring pin compatibility among
family members, the DAC908, DAC900, and DAC904 provide a
component selection option to an 8-, 10-, and 14-bit resolution,
respectively. All models within this family of DACs support update
rates in excess of 165MSPS with excellent dynamic performance,
and are especially suited to fulfill the demands of a variety of
applications.
The advanced segmentation architecture of the DAC902 is opti-
mized to provide a high Spurious-Free Dynamic Range (SFDR) for
single-tone, as well as for multi-tone signals—essential when used
for the transmit signal path of communication systems.
The DAC902 has a high impedance (200kΩ) current output with a
nominal range of 20mA and an output compliance of up to 1.25V.
The differential outputs allow for both a differential or single-
ended analog signal interface. The close matching of the current
outputs ensures superior dynamic performance in the differential
configuration, which can be implemented with a transformer.
Utilizing a small geometry CMOS process, the monolithic DAC902
can be operated on a wide, single-supply range of +2.7V to +5.5V.
Its low power consumption allows for use in portable and battery-
operated systems. Further optimization can be realized by lowering
the output current with the adjustable full-scale option.
For noncontinuous operation of the DAC902, a power-down mode
results in only 45mW of standby power.
The DAC902 comes with an integrated 1.24V bandgap reference
and edge-triggered input latches, offering a complete converter
solution. Both +3V and +5V CMOS logic families can be inter-
faced to the DAC902.
The reference structure of the DAC902 allows for additional
flexibility by utilizing the on-chip reference, or applying an exter-
nal reference. The full-scale output current can be adjusted over a
span of 2mA to 20mA, with one external resistor, while maintain-
ing the specified dynamic performance.
The DAC902 is available in the SO-28 and TSSOP-28 packages.
Current
Sources
LSB
Switches
Segmented
Switches
+1.24V Ref. Latches
12-Bit Data Input
D11...D0
DAC902
FSA
BW +V
D
+V
A
AGND CLK DGND
REF
IN
INT/EXT
I
OUT
I
OUT
BYP
PD
DAC902
SBAS094B – MAY 2002
www.ti.com
Copyright © 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TM
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

DAC902
2SBAS094B
ELECTRICAL CHARACTERISTICS
At TA= full specified temperature range, +VA= +5V, +VD= +5V, differential transformer coupled output, 50Ωdoubly terminated, unless otherwise specified.
DAC902U/E
PARAMETER CONDITIONS MIN TYP MAX UNITS
RESOLUTION 12 Bits
OUTPUT UPDATE RATE 2.7V to 3.3V 125 165 MSPS
Output Update Rate (fCLOCK) 4.5V to 5.5V 165 200 MSPS
Full Specified Temperature Range, Operating Ambient, TA–40 +85 °C
STATIC ACCURACY(1) TA= +25°C
Differential Nonlinearity (DNL) fCLOCK = 25MSPS, fOUT = 1.0MHz –1.75 ±0.5 +1.75 LSB
Integral Nonlinearity (INL) –2.5 ±1.0 +2.5 LSB
DYNAMIC PERFORMANCE TA= +25°C
Spurious-Free Dynamic Range (SFDR) To Nyquist
fOUT = 1MHz, fCLOCK = 25MSPS 71 77 dBc
fOUT = 2.1MHz, fCLOCK = 50MSPS 75 dBc
fOUT = 5.04MHz, fCLOCK = 50MSPS 68 dBc
fOUT = 5.04MHz, fCLOCK = 100MSPS 67 dBc
fOUT = 20.2MHz, fCLOCK = 100MSPS 61 dBc
fOUT = 25.3MHz, fCLOCK = 125MSPS 61 dBc
fOUT = 41.5MHz, fCLOCK = 125MSPS 57 dBc
fOUT = 27.4MHz, fCLOCK = 165MSPS 60 dBc
fOUT = 54.8MHz, fCLOCK = 165MSPS 53 dBc
Spurious-Free Dynamic Range within a Window
fOUT = 5.04MHz, fCLOCK = 50MSPS 2MHz Span 80 dBc
fOUT = 5.04MHz, fCLOCK = 100MSPS 4MHz Span 80 dBc
Total Harmonic Distortion (THD)
fOUT = 2.1MHz, fCLOCK = 50MSPS –74 dBc
fOUT = 2.1MHz, fCLOCK = 125MSPS –75 dBc
Two Tone
f
OUT1
= 13.5MHz, f
OUT2
= 14.5MHz, f
CLOCK
= 100MSPS
64 dBc
ABSOLUTE MAXIMUM RATINGS
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER(1) MEDIA
DAC902U SO-28 217 –40°C to +85°C DAC902U DAC902U Rails
"""""DAC902U/1K Tape and Reel
DAC902E TSSOP-28 360 –40°C to +85°C DAC902E DAC902E Rails
"""""DAC902E/2K5 Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC902E/2K5”will get a single 2500-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION
+VA to AGND ........................................................................ –0.3V to +6V
+VD to DGND ........................................................................ –0.3V to +6V
AGND to DGND................................................................. –0.3V to +0.3V
+VAto +VD............................................................................... –6V to +6V
CLK, PD to DGND ..................................................... –0.3V to VD+ 0.3V
D0-D11 to DGND ....................................................... –0.3V to VD+ 0.3V
IOUT, IOUT to AGND........................................................ –1V to VA+ 0.3V
BW, BYP to AGND..................................................... –0.3V to VA+ 0.3V
REFIN, FSA to AGND ................................................. –0.3V to VA+ 0.3V
INT/EXT to AGND ...................................................... –0.3V to VA+ 0.3V
Junction Temperature.................................................................... +150°C
Case Temperature......................................................................... +100°C
Storage Temperature .................................................................... +125°C
DEMO BOARD
PRODUCT ORDERING NUMBER COMMENT
DAC902U DEM-DAC90xU
Populated evaluation board without the DAC. Order sample of desired DAC90x model separately.
DAC902E DEM-DAC902E Populated evaluation board including the DAC902E.
DEMO BOARD ORDERING INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.

DAC902 3
SBAS094B
DAC902U/E
PARAMETER CONDITIONS MIN TYP MAX UNITS
ELECTRICAL CHARACTERISTICS (Cont.)
At TA= full specified temperature range, +VA= +5V, +VD= +5V, differential transformer coupled output, 50Ωdoubly terminated, unless otherwise specified.
DYNAMIC PERFORMANCE (Cont.)
Output Settling Time(2) to 0.1% 30 ns
Output Rise Time(2) 10% to 90% 2 ns
Output Fall Time(2) 10% to 90% 2 ns
Glitch Impulse 3pV-s
DC-ACCURACY
Full-Scale Output Range(3)(FSR) All Bits High, IOUT 2.0 20.0 mA
Output Compliance Range –1.0 +1.25 V
Gain Error With Internal Reference –10 ±1 +10 %FSR
Gain Error With External Reference –10 ±2 +10 %FSR
Gain Drift With Internal Reference ±120 ppmFSR/°C
Offset Error With Internal Reference –0.025 +0.025 %FSR
Offset Drift With Internal Reference ±0.1 ppmFSR/°C
Power-Supply Rejection, +VA–0.2 +0.2 %FSR/V
Power-Supply Rejection, +VD–0.025 +0.025 %FSR/V
Output Noise IOUT = 20mA, RLOAD = 50Ω50 pA/√Hz
Output Resistance 200 kΩ
Output Capacitance IOUT, IOUT to Ground 12 pF
REFERENCE
Reference Voltage +1.24 V
Reference Tolerance ±5%
Reference Voltage Drift ±50 ppmFSR/°C
Reference Output Current 10 µA
Reference Input Resistance 1MΩ
Reference Input Compliance Range 0.1 1.25 V
Reference Small-Signal Bandwidth(4) 1.3 MHz
DIGITAL INPUTS
Logic Coding Straight Binary
Latch Command Rising Edge of Clock
Logic High Voltage, VIH +VD= +5V 3.5 5 V
Logic Low Voltage, VIL +VD= +5V 0 1.2 V
Logic High Voltage, VIH +VD= +3V 2 3 V
Logic Low Voltage, VIL +VD= +3V 0 0.8 V
Logic High Current,IIH(5) +VD= +5V ±20 µA
Logic Low Current, IIL +VD= +5V ±20 µA
Input Capacitance 5pF
POWER SUPPLY
Supply Voltages
+VA+2.7 +5 +5.5 V
+VD+2.7 +5 +5.5 V
Supply Current(6)
IVA 24 30 mA
IVA, Power-Down Mode 1.1 2 mA
IVD 815mA
Power Dissipation +5V, IOUT = 20mA 170 230 mW
+3V, IOUT = 2mA 50 mW
Power Dissipation, Power-Down Mode 45 mW
Thermal Resistance,
θ
JA
SO-28 75 °C/W
TSSOP-28 50 °C/W
NOTES: (1) At output IOUT, while driving a virtual ground. (2) Measured single-ended into 50ΩLoad. (3) Nominal full-scale output current is 32 •IREF; see Application
Section for details. (4) Reference bandwidth depends on size of external capacitor at the BW pin and signal level. (5) Typically 45µA for the PD pin, which has an
internal pull-down resistor. (6) Measured at fCLOCK = 50MSPS and fOUT = 1.0MHz.

DAC902
4SBAS094B
PIN DESIGNATOR DESCRIPTION
1 Bit 1 Data Bit 1 (D11), MSB
2 Bit 2 Data Bit 2 (D10)
3 Bit 3 Data Bit 3 (D9)
4 Bit 4 Data Bit 4 (D8)
5 Bit 5 Data Bit 5 (D7)
6 Bit 6 Data Bit 6 (D6)
7 Bit 7 Data Bit 7 (D5)
8 Bit 8 Data Bit 8 (D4)
9 Bit 9 Data Bit 9 (D3)
10 Bit 10 Data Bit 10 (D2)
11 Bit 11 Data Bit 11 (D1)
12 Bit 12 Data Bit 12 (D0), LSB
13 NC No Connection
14 NC No Connection
15 PD Power Down, Control Input; Active
HIGH.
Contains internal pull-down circuit;
may be left unconnected if not used.
16 INT/EXT Reference Select Pin; Internal ( = 0) or
External ( = 1) Reference Operation.
17 REFIN Reference Input/Ouput. See Applica-
tions section for further details.
18 FSA Full-Scale Output Adjust
19 BW Bandwidth/Noise Reduction Pin:
Bypass with 0.1µF to +VAfor Optimum
Performance.
20 AGND Analog Ground
21 IOUT Complementary DAC Current Output
22 IOUT DAC Current Output
23 BYP Bypass Node: Use 0.1µF to AGND
24 +VAAnalog Supply Voltage, 2.7V to 5.5V
25 NC No Connection
26 DGND Digital Ground
27 +VDDigital Supply Voltage, 2.7V to 5.5V
28 CLK Clock Input
PIN DESCRIPTIONSPIN CONFIGURATION
Top View SO, TSSOP
TYPICAL CONNECTION CIRCUIT
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9
Bit 10
Bit 11
Bit 12
NC
NC
CLK
+V
D
DGND
NC
+V
A
BYP
I
OUT
I
OUT
AGND
BW
FSA
REF
IN
INT/EXT
PD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DAC902
Current
Sources
LSB
Switches
Segmented
MSB
Switches
+1.24V Ref. Latches
12-Bit Data Input
D11.......D0
DAC902
FSA
BW +V
D
+V
A
R
SET
AGND CLK DGND
REF
IN
0.1µF
INT/EXT
I
OUT
I
OUT
BYP
PD
20pF
50Ω50Ω20pF
1:1
0.1µF
0.1µF
+5V +5V

DAC902 5
SBAS094B
TIMING DIAGRAM
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t1Clock Pulse HIGH Time 3.0 ns
t2Clock Pulse LOW Time 3.0 ns
tSData Setup Time 1.0 ns
tHData Hold Time 1.5 ns
tPD Propagation Delay Time 1 ns
tSET Output Settling Time to 0.1% 30.0 ns
t2 t1
tStH
tSET
tPD
CLOCK
D13 D0
Iout or
Iout
Data Changes Stable Valid Data Data Changes

DAC902
6SBAS094B
TYPICAL CHARACTERISTICS: VD= VA= +5V
At TA= +25°C, differential transformer coupled output, 50Ωdoubly terminated, and SFDR up to Nyquist, unless otherwise noted.
SFDR vs fOUT AT 25MSPS
Frequency (MHz)
SFDR (dBc)
90
85
80
75
70
65
60 2.0 4.0 6.0 8.0 10.0 12.00
0dBFS
–6dBFS
SFDR vs fOUT AT 50MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55 5.0 10.0 15.0 20.0 25.00
–6dBFS
0dBFS
SFDR vs fOUT AT 100MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 40.0 50.00
0dBFS
–6dBFS
SFDR vs fOUT AT 125MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 50.040.0 60.00
0dBFS
–6dBFS
DAC Code
TYPICAL DNL
Error (LSBs)
2.5
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
0
500
1000
1500
2000
2500
3000
3500
4000
4096
DAC Code
TYPICAL INL
Error (LSBs)
2.5
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
0
500
1000
1500
2000
2500
3000
3500
4000
4096

DAC902 7
SBAS094B
TYPICAL CHARACTERISTICS: VD= VA= +5V (Cont.)
At TA= +25°C, differential transformer coupled output, 50Ωdoubly terminated, and SFDR up to Nyquist, unless otherwise noted.
SFDR vs TEMPERATURE AT 100MSPS, 0dBFS
Temperature (°C)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 –20 0 25 7050 85–40
2.1MHz
10.1MHz
40.4MHz
X
X
X
X
X
X
X
SFDR vs I
OUTFS
and f
OUT
AT 100MSPS, 0dBFS
I
OUTFS
(mA)
SFDR (dBc)
80
75
70
65
60
55
50
45
40 510202
XXX
X
2.1MHz
20.2MHz
10.1MHz
40.4MHz
DIFFERENTIAL vs SINGLE-ENDED SFDR vs f
OUT
AT 100MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 40.0 50.00
Diff (0dBFS)
I
OUT
(–6dBFS)
I
OUT
(0dBFS)
Diff (–6dBFS)
X
XX
X
XX
X
SFDR vs fOUT AT 200MSPS
Frequency (MHz)
SFDR (dBc)
80
75
70
65
60
55
50
45
40 20.010.0 30.0 40.0 50.0 70.060.0 90.080.00
–6dBFS
0dBFS
SFDR vs fOUT AT 165MSPS
Frequency (MHz)
SFDR (dBc)
80
75
70
65
60
55
50
45
40 20.010.0 30.0 40.0 50.0 70.060.0 80.00
–6dBFS
0dBFS
THD vs f
CLOCK
AT f
OUT
= 2.1MHz
f
CLOCK
(MSPS)
THD (dBc)
–70
–75
–80
–85
–90
–95
–100 25 50 100 125 1500
2HD
4HD
3HD
X
XXX

DAC902
8SBAS094B
TYPICAL CHARACTERISTICS: VD= VA= +5V (Cont.)
At TA= +25°C, differential transformer coupled output, 50Ωdoubly terminated, and SFDR up to Nyquist, unless otherwise noted.
FOUR-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 510152025
fCLOCK = 50MSPS
fOUT1 = 6.25MHz
fOUT2 = 6.75MHz
fOUT3 = 7.25MHz
fOUT4 = 7.75MHz
SFDR = 66dBc
Amplitude = 0dBFS
DUAL-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 5 101520253035404550
fCLOCK = 100MSPS
fOUT1 = 13.5MHz
fOUT2 = 14.5MHz
SFDR = 64dBc
Amplitude = 0dBFS
SINGLE-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 5 101520253035404550
fCLOCK = 100MSPS
fOUT = 2.1MHz
SFDR = 74dBc
Amplitude = 0dBFS

DAC902 9
SBAS094B
TYPICAL CHARACTERISTICS: VD= VA= +3V
At TA= +25°C, differential transformer coupled output, 50Ωdoubly terminated, and SFDR up to Nyquist, unless otherwise noted.
DIFFERENTIAL vs SINGLE-ENDED SFDR vs f
OUT
AT 100MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 40.0 50.00
Diff (0dBFS)
I
OUT
(–6dBFS)
I
OUT
(0dBFS)
Diff (–6dBFS)
SFDR vs fOUT AT 165MSPS
Frequency (MHz)
SFDR (dBc)
80
75
70
65
60
55
50
45
40 20.010.0 30.0 40.0 50.0 70.060.0 80.00
–6dBFS
0dBFS
SFDR vs fOUT AT 125MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 50.040.0 60.00
0dBFS
–6dBFS
SFDR vs fOUT AT 100MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 10.0 20.0 30.0 40.0 50.00
–6dBFS
0dBFS
SFDR vs fOUT AT 50MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55 5.0 10.0 15.0 20.0 25.00
–6dBFS
0dBFS
SFDR vs fOUT AT 25MSPS
Frequency (MHz)
SFDR (dBc)
85
80
75
70
65
60
55 2.0 4.0 6.0 8.0 10.0 12.00
0dBFS
–6dBFS

DAC902
10 SBAS094B
TYPICAL CHARACTERISTICS: VD= VA= +3V (Cont.)
At TA= +25°C, differential transformer coupled output, 50Ωdoubly terminated, and SFDR up to Nyquist, unless otherwise noted.
FOUR-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 510152025
fCLOCK = 50MSPS
fOUT1 = 6.25MHz
fOUT2 = 6.75MHz
fOUT3 = 7.25MHz
fOUT4 = 7.75MHz
SFDR = 66dBc
Amplitude = 0dBFS
DUAL-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 5 101520253035404550
fCLOCK = 100MSPS
fOUT1 = 13.5MHz
fOUT2 = 14.5MHz
SFDR = 68dBc
Amplitude = 0dBFS
SINGLE-TONE OUTPUT SPECTRUM
Frequency (MHz)
Magnitude (dBm)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100 5 101520253035404550
fCLOCK = 100MSPS
fOUT = 2.1MHz
SFDR = 76dBc
Amplitude = 0dBFS
SFDR vs TEMPERATURE AT 100MSPS, 0dBFS
Temperature (°C)
SFDR (dBc)
85
80
75
70
65
60
55
50
45 –20 0 25 7050 85–40
2.1MHz
10.1MHz
40.4MHz
X
X
X
X
X
X
X
THD vs fCLOCK AT fOUT = 2.1MHz
fCLOCK (MSPS)
THD (dBc)
–70
–75
–80
–85
–90
–95
–100 25 50 100 125 1500
2HD
4HD
3HD
I
OUTFS
(mA)
SFDR (dBc)
80
75
70
65
60
55
50
45
40 510202
XX
X
X
SFDR vs I
OUTFS
and f
OUT
AT 100MSPS, 0dBFS
2.1MHz
20.2MHz
10.1MHz
40.4MHz

DAC902 11
SBAS094B
APPLICATION INFORMATION
THEORY OF OPERATION
The architecture of the DAC902 uses the current steering
technique to enable fast switching and a high update rate. The
core element within the monolithic DAC is an array of
segmented current sources that are designed to deliver a full-
scale output current of up to 20mA, as shown in Figure 1. An
internal decoder addresses the differential current switches
each time the DAC is updated and a corresponding output
current is formed by steering all currents to either output
summing node, IOUT or IOUT. The complementary outputs
deliver a differential output signal that improves the dynamic
performance through reduction of even-order harmonics,
common-mode signals (noise), and double the peak-to-peak
output signal swing by a factor of two, compared to single-
ended operation.
The segmented architecture results in a significant reduc-
tion of the glitch energy, improves the dynamic perfor-
mance (SFDR), and DNL. The current outputs maintain a
very high output impedance of greater than 200kΩ.
The full-scale output current is determined by the ratio of
the internal reference voltage (1.24V) and an external
resistor, RSET. The resulting IREF is internally multiplied by
a factor of 32 to produce an effective DAC output current
that can range from 2mA to 20mA, depending on the value
of RSET.
The DAC902 is split into a digital and an analog portion,
each of which is powered through its own supply pin. The
digital section includes edge-triggered input latches and the
decoder logic, while the analog section comprises the cur-
rent source array with its associated switches, and the
reference circuitry.
DAC TRANSFER FUNCTION
The total output current, IOUTFS, of the DAC902 is the
summation of the two complementary output currents:
IOUTFS = IOUT + IOUT (1)
The individual output currents depend on the DAC code and
can be expressed as:
IOUT = IOUTFS • (Code/4096) (2)
IOUT = IOUTFS • (4095 – Code/4096) (3)
where ‘Code’ is the decimal representation of the DAC data
input word. Additionally, IOUTFS is a function of the refer-
ence current IREF, which is determined by the reference
voltage and the external setting resistor, RSET.
IOUTFS = 32 • IREF = 32 • VREF/RSET (4)
In most cases the complementary outputs will drive resistive
loads or a terminated transformer. A signal voltage will
develop at each output according to:
VOUT = IOUT • RLOAD (5)
VOUT = IOUT • RLOAD (6)
FIGURE 1. Functional Block Diagram of the DAC902.
PMOS
Current
Source
Array
LSB
Switches
Segmented
MSB
Switches
+1.24V Ref
Latches and Switch
Decoder Logic
12-Bit Data Input
D11...D0
DAC902
Full-Scale
Adjust
Resistor
Ref
Control
Amp
Ref
Buffer
BW +VD
+VA
RSET
2kΩ
CLK DGND
Ref
Input
0.1µFINT/EXT
IOUT
IOUT
BYP
PD
20pF
50Ω50Ω20pF
1:1 VOUT
0.1µF
400pF
0.1µF
+3V to +5V
Analog
Bandwidth
Control
+3V to +5V
Digital
FSA
REFIN
AGND
Analog
Ground Digital
Ground
Power Down
(internal pull-down)
Clock
Input
NOTE: Supply bypassing not shown.

DAC902
12 SBAS094B
The value of the load resistance is limited by the output
compliance specification of the DAC902. To maintain speci-
fied linearity performance, the voltage for IOUT and IOUT
should not exceed the maximum allowable compliance range.
The two single-ended output voltages can be combined to
find the total differential output swing:
(7)
ANALOG OUTPUTS
The DAC902 provides two complementary current outputs,
IOUT and IOUT. The simplified circuit of the analog output
stage representing the differential topology is shown in
Figure 2. The output impedance of 200kΩ|| 12pF for IOUT
and IOUT results from the parallel combination of the differ-
ential switches, along with the current sources and associ-
ated parasitic capacitances.
IOUT and IOUT. Furthermore, using the differential output
configuration in combination with a transformer will be
instrumental for achieving excellent distortion performance.
Common-mode errors, such as even-order harmonics or
noise, can be substantially reduced. This is particularly the
case with high output frequencies and/or output amplitudes
below full-scale.
For those applications requiring the optimum distortion and
noise performance, it is recommended to select a full-scale
output of 20mA. A lower full-scale range down to 2mA may
be considered for applications that require a low power
consumption, but can tolerate a reduced performance level.
FIGURE 2. Equivalent Analog Output.
The signal voltage swing that may develop at the two
outputs, IOUT and IOUT, is limited by a negative and positive
compliance. The negative limit of –1V is given by the
breakdown voltage of the CMOS process, and exceeding it
will compromise the reliability of the DAC902, or even
cause permanent damage. With the full-scale output set to
20mA, the positive compliance equals 1.25V, operating with
+VD= 5V. Note that the compliance range decreases to
about 1V for a selected output current of IOUTFS = 2mA.
Care should be taken that the configuration of DAC902 does
not exceed the compliance range to avoid degradation of the
distortion performance and integral linearity.
Best distortion performance is typically achieved with the
maximum full-scale output signal limited to approximately
0.5V. This is the case for a 50Ωdoubly-terminated load and
a 20mA full-scale output current. A variety of loads can be
adapted to the output of the DAC902 by selecting a suitable
transformer while maintaining optimum voltage levels at
OUTPUT CONFIGURATIONS
The current output of the DAC902 allows for a variety of
configurations, some of which are illustrated below. As men-
tioned previously, utilizing the converter’s differential out-
puts will yield the best dynamic performance. Such a differ-
ential output circuit may consist of an RF transformer or a
differential amplifier configuration. The transformer configu-
ration is ideal for most applications with ac coupling, while
op amps will be suitable for a DC-coupled configuration.
The single-ended configuration may be considered for appli-
cations requiring a unipolar output voltage. Connecting a
resistor from either one of the outputs to ground will convert
the output current into a ground-referenced voltage signal.
To improve on the DC linearity, an I-to-V converter can be
used instead. This will result in a negative signal excursion
and, therefore, requires a dual supply amplifier.
DIFFERENTIAL WITH TRANSFORMER
Using an RF transformer provides a convenient way of
converting the differential output signal into a single-ended
signal while achieving excellent dynamic performance (see
Figure 3). The appropriate transformer should be carefully
selected based on the output frequency spectrum and imped-
ance requirements. The differential transformer configura-
tion has the benefit of significantly reducing common-mode
signals, thus improving the dynamic performance over a
wide range of frequencies. Furthermore, by selecting a
suitable impedance ratio (winding ratio), the transformer can
be used to provide optimum impedance matching while
controlling the compliance voltage for the converter outputs.
The model shown in Figure 3 has a 1:1 ratio and may be used
to interface the DAC902 to a 50Ωload. This results in a 25Ω
load for each of the outputs, IOUT and IOUT. The output
signals are ac coupled and inherently isolated because of its
magnetic coupling.
INPUT CODE (D11 - D0) IOUT IOUT
1111 1111 1111 20mA 0mA
1000 0000 0000 10mA 10mA
0000 0000 0000 0mA 20mA
TABLE I. Input Coding vs Analog Output Current.
VVV Code IR
OUTDIFF OUT OUT OUTFS LOAD
==
•••–(–)2 4095
4096
IOUT IOUT
DAC902
RLRL
+VA

DAC902 13
SBAS094B
As shown in Figure 3, the transformer’s center tap is con-
nected to ground. This forces the voltage swing on IOUT and
IOUT to be centered at 0V. In this case the two resistors, RS,
may be replaced with one, RDIFF, or omitted altogether. This
approach should only be used if all components are close to
each other, and if the VSWR is not important. A complete
power transfer from the DAC output to the load can be
realized, but the output compliance range should be ob-
served. Alternatively, if the center tap is not connected, the
signal swing will be centered at RS• IOUTFS/2. However, in
this case, the two resistors (RS) must be used to enable the
necessary DC-current flow for both outputs.
The OPA680 is configured for a gain of two. Therefore,
operating the DAC902 with a 20mA full-scale output will
produce a voltage output of ±1V. This requires the amplifier
to operate off of a dual power supply (±5V). The tolerance
of the resistors typically sets the limit for the achievable
common-mode rejection. An improvement can be obtained
by fine tuning resistor R4.
This configuration typically delivers a lower level of ac
performance than the previously discussed transformer solu-
tion because the amplifier introduces another source of dis-
tortion. Suitable amplifiers should be selected based on their
slew-rate, harmonic distortion, and output swing capabilities.
High-speed amplifiers like the OPA680 or OPA687 may be
considered. The ac performance of this circuit may be im-
proved by adding a small capacitor, C
DIFF
, between the
outputs I
OUT
and I
OUT
(as shown in Figure 4). This will
introduce a real pole to create a low-pass filter in order to
slew-limiting the DACs fast output signal steps that other-
wise could drive the amplifier into slew-limitations or into an
overload condition; both would cause excessive distortion.
The difference amplifier can easily be modified to add a level
shift for applications requiring the single-ended output volt-
age to be unipolar, i.e., swing between 0V and +2V.
DUAL TRANSIMPEDANCE OUTPUT CONFIGURATION
The circuit example of Figure 5 shows the signal output
currents connected into the summing junction of the
OPA2680, which is set up as a transimpedance stage, or
I-to-V converter. With this circuit, the DAC’s output will be
kept at a virtual ground, minimizing the effects of output
impedance variations, which results in the best DC linearity
(INL). However, as mentioned previously, the amplifier
may be driven into slew-rate limitations, and produce un-
wanted distortion. This may occur especially at high DAC
update rates.
DIFFERENTIAL CONFIGURATION USING AN OP AMP
If the application requires a DC-coupled output, a difference
amplifier may be considered, as shown in Figure 4. Four
external resistors are needed to configure the voltage-feed-
back op amp OPA680 as a difference amplifier performing
the differential to single-ended conversion. Under the shown
configuration, the DAC902 generates a differential output
signal of 0.5Vp-p at the load resistors, RL. The resistor
values shown were selected to result in a symmetric 25Ω
loading for each of the current outputs since the input
impedance of the difference amplifier is in parallel to resis-
tors RL, and should be considered.
FIGURE 4. Difference Amplifier Provides Differential to
Single-Ended Conversion and DC-Coupling. FIGURE 5. Dual, Voltage-Feedback Amplifier OPA2680
Forms Differential Transimpedance Amplifier.
1/2
OPA2680
1/2
OPA2680
DAC902
–V
OUT
= I
OUT
•R
F
–V
OUT
= I
OUT
•R
F
R
F1
R
F2
C
F1
C
F2
C
D1
C
D2
I
OUT
I
OUT
50Ω
50Ω–5V
+5V
IOUT
IOUT
DAC902
RL
26.1ΩRL
28.7ΩR4
402Ω
R3
200Ω
R2
402Ω
R1
200Ω
OPA680
COPT +5V
VOUT
–5V
DAC902
IOUT
IOUT
1:1
ADT1-1WT
(Mini-Circuits)
RS
50Ω
RS
50Ω
RL
Optional
RDIFF
FIGURE 3. Differential Output Configuration Using an RF
Transformer.

DAC902
14 SBAS094B
The DC gain for this circuit is equal to feedback resistor RF.
At high frequencies, the DAC output impedance (CD1, CD2)
will produce a zero in the noise gain for the OPA2680 that
may cause peaking in the closed-loop frequency response.
CFis added across RFto compensate for this noise-gain
peaking. To achieve a flat transimpedance frequency re-
sponse, the pole in each feedback network should be set to:
1
24ππRC GBP
RC
FF FD
=
(8)
with GBP = Gain Bandwidth Product of OPA
which will give a corner frequency f-3dB of approximately:
fGBP
RC
dB FD
−
=
3
2π
(9)
The full-scale output voltage is simply defined by the prod-
uct of IOUTFS • RF, and has a negative unipolar excursion. To
improve on the ac performance of this circuit, adjustment of
RFand/or IOUTFS should be considered. Further extensions of
this application example may include adding a differential
filter at the OPA2680’s output followed by a transformer, in
order to convert to a single-ended signal.
SINGLE-ENDED CONFIGURATION
Using a single load resistor connected to the one of the DAC
outputs, a simple current-to-voltage conversion can be ac-
complished. The circuit in Figure 6 shows a 50Ωresistor
connected to IOUT, providing the termination of the further
connected 50Ωcable. Therefore, with a nominal output
current of 20mA, the DAC produces a total signal swing of
0V to 0.5V into the 25Ωload.
Different load resistor values may be selected as long as the
output compliance range is not exceeded. Additionally, the
output current, IOUTFS, and the load resistor may be mutually
adjusted to provide the desired output signal swing and
performance.
FIGURE6.DrivingaDoubly-Terminated50ΩCableDirectly.
I
OUT
I
OUT
DAC902
25Ω
50Ω50Ω
I
OUTFS
= 20mA V
OUT
= 0V to +0.5V
FIGURE 7. Internal Reference Configuration.
INTERNAL REFERENCE OPERATION
The DAC902 has an on-chip reference circuit that comprises
a 1.24V bandgap reference and a control amplifier. Ground-
ing pin 16, INT/EXT, enables the internal reference opera-
tion. The full-scale output current, IOUTFS, of the DAC902 is
determined by the reference voltage, VREF, and the value of
resistor RSET. IOUTFS can be calculated by:
IOUTFS = 32 • IREF = 32 • VREF / RSET (10)
As shown in Figure 7, the external resistor R
SET
connects to
the FSA pin (Full-Scale Adjust). The reference control am-
plifier operates as a V-to-I converter producing a reference
current, I
REF
, which is determined by the ratio of V
REF
and
R
SET
, as shown in Equation 10. The full-scale output current,
I
OUTFS
, results from multiplying I
REF
by a fixed factor of 32.
Using the internal reference, a 2kΩresistor value results in
a 20mA full-scale output. Resistors with a tolerance of 1%
or better should be considered. Selecting higher values, the
converter output can be adjusted from 20mA down to 2mA.
Operating the DAC902 at lower than 20mA output currents
may be desirable for reasons of reducing the total power
consumption, improving the distortion performance, or ob-
serving the output compliance voltage limitations for a given
load condition.
It is recommended to bypass the REF
IN
pin with a ceramic chip
capacitor of 0.1µF or more. The control amplifier is internally
compensated, and its small signal bandwidth is approximately
3MHz. To improve the ac performance, an additional capacitor
(C
COMPEXT
) should be applied between the BW pin and the
analog supply, +V
A
, as shown in Figure 7. Using a 0.1µF
capacitor, the small-signal bandwidth and output impedance of
the control amplifier is further diminished, reducing the noise
that is fed into the current source array. This also helps
shunting feedthrough signals more effectively, and improving
the noise performance of the DAC902.
DAC902
C
COMPEXT
0.1µF
C
COMP
400pF
+1.24V Ref.
R
SET
2kΩ0.1µFINT/EXT
FSA
BW
+5V
+V
A
REF
IN
Current
Sources
I
REF
= V
REF
R
SET
Ref
Control
Amp

DAC902 15
SBAS094B
EXTERNAL REFERENCE OPERATION
The internal reference can be disabled by applying a logic
HIGH (+VA) to pin INT/EXT. An external reference voltage
can then be driven into the REFIN pin, which in this case
functions as an input, as shown in Figure 8. The use of an
external reference may be considered for applications that
require higher accuracy and drift performance, or to add the
ability of dynamic gain control.
While a 0.1µF capacitor is recommended to be used with the
internal reference, it is optional for the external reference
operation. The reference input, REFIN, has a high input
impedance (1MΩ) and can easily be driven by various
sources. Note that the voltage range of the external reference
should stay within the compliance range of the reference
input (0.1V to 1.25V).
DIGITAL INPUTS
The digital inputs, D0 (LSB) through D11 (MSB) of the
DAC902 accepts standard-positive binary coding. The digi-
tal input word is latched into a master-slave latch with the
rising edge of the clock. The DAC output becomes updated
with the following falling clock edge (refer to the specifica-
tion table and timing diagram for details). The best perfor-
mance will be achieved with a 50% clock duty cycle,
however, the duty cycle may vary as long as the timing
specifications are met. Additionally, the setup and hold
times may be chosen within their specified limits.
All digital inputs are CMOS compatible. The logic thresh-
olds depend on the applied digital supply voltage such that
they are set to approximately half the supply voltage;
Vth = +VD/2 (±20% tolerance). The DAC902 is designed to
operate over a supply range of 2.7V to 5.5V.
FIGURE 8. External Reference Configuration.
POWER-DOWN MODE
The DAC902 features a power-down function that can be
used to reduce the supply current to less than 9mA over the
specified supply range of 2.7V to 5.5V. Applying a logic
HIGH to the PD pin will initiate the power-down mode,
while a logic LOW enables normal operation. When left
unconnected, an internal active pull-down circuit will enable
the normal operation of the converter.
GROUNDING, DECOUPLING AND
LAYOUT INFORMATION
Proper grounding and bypassing, short lead length, and the
use of ground planes are particularly important for high
frequency designs. Multilayer pc-boards are recommended
for best performance since they offer distinct advantages
such as minimization of ground impedance, separation of
signal layers by ground layers, etc.
The DAC902 uses separate pins for its analog and digital
supply and ground connections. The placement of the decou-
pling capacitor should be such that the analog supply (+VA)
is bypassed to the analog ground (AGND), and the digital
supply bypassed to the digital ground (DGND). In most
cases 0.1uF ceramic chip capacitors at each supply pin are
adequate to provide a low impedance decoupling path. Keep
in mind that their effectiveness largely depends on the
proximity to the individual supply and ground pins. There-
fore, they should be located as close as physically possible
to those device leads. Whenever possible, the capacitors
should be located immediately under each pair of supply/
ground pins on the reverse side of the pc-board. This layout
approach will minimize the parasitic inductance of compo-
nent leads and pcb runs.
R
SET
+5V
External
Reference
I
REF
= V
REF
R
SET
DAC902
C
COMPEXT
0.1µF
C
COMP
400pF
+1.24V Ref.
INT/EXT
FSA
BW
+5V
+V
A
REF
IN
Current
Sources
Ref
Control
Amp

DAC902
16 SBAS094B
Further supply decoupling with surface mount tantalum
capacitors (1uF to 4.7uF) may be added as needed in
proximity of the converter.
Low noise is required for all supply and ground connections
to the DAC902. It is recommended to use a multilayer pc-
board utilizing separate power and ground planes. Mixed
signal designs require particular attention to the routing of
the different supply currents and signal traces. Generally,
analog supply and ground planes should only extend into
analog signal areas, such as the DAC output signal and the
reference signal. Digital supply and ground planes must be
confined to areas covering digital circuitry, including the
digital input lines connecting to the converter, as well as the
clock signal. The analog and digital ground planes should be
joined together at one point underneath the DAC. This can
be realized with a short track of approximately 1/8" (3mm).
The power to the DAC902 should be provided through the
use of wide pcb runs or planes. Wide runs will present a
lower trace impedance, further optimizing the supply decou-
pling. The analog and digital supplies for the converter
should only be connected together at the supply connector of
the pc-board. In the case of only one supply voltage being
available to power the DAC, ferrite beads along with bypass
capacitors may be used to create an LC filter. This will
generate a low-noise analog supply voltage that can then be
connected to the +VAsupply pin of the DAC902.
While designing the layout, it is important to keep the analog
signal traces separate from any digital line, in order to
prevent noise coupling onto the analog signal path.

PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DAC902E ACTIVE TSSOP PW 28 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC902E
DAC902E/2K5 ACTIVE TSSOP PW 28 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC902E
DAC902U ACTIVE SOIC DW 28 20 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC902U
DAC902U/1K ACTIVE SOIC DW 28 1000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC902U
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

PACKAGE OPTION ADDENDUM
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Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DAC902E/2K5 TSSOP PW 28 2500 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
DAC902U/1K SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DAC902E/2K5 TSSOP PW 28 2500 367.0 367.0 38.0
DAC902U/1K SOIC DW 28 1000 350.0 350.0 66.0
Pack Materials-Page 2
Table of contents