Caswell CAR-5050 User manual

CAR-5050 Series User`s Manual
http://www.cas-well.com
Tel: [phone] Fax: [phone] E-mail: info@ cas-well.com
Address: 8F, No. 242, Bo-Ai St., Shu-Lin Dist., New Taipei City 238, Taiwan.
1
CAR-5050
User Manual
Revision: 0.1

CAR-5050 Series User`s Manual
http://www.cas-well.com
Tel: [phone] Fax: [phone] E-mail: info@ cas-well.com
Address: 8F, No. 242, Bo-Ai St., Shu-Lin Dist., New Taipei City 238, Taiwan.
2
Correct disposal of this product (Waste electrical & electronic equipment)
This marking on the product, accessories or literature indicates that the product and its electronic accessories (e.g. PCBA, CPU, HDD,
MEM and Cable) should not be disposed of with other household waste at the end of their working life. To prevent possible harm to the
environment or human health from uncontrolled waste disposal, please separate these items from others of waste and recycle them
responsibly to promote the sustainable reuse of material resources. Household users should contact either the retailer where they
purchased this product, or their local government office, for details of where and how they can take these items for environmentally safe
recycling. Business users should contact their supplier and check the terms and conditions of the purchase contract. This product and its
electronic accessories should not be mixed with other commercial wastes for disposal.
Before You Begin To prevent damage to any system board, it is important to handle it with care. The following measures are generally
sufficient to protect your equipment from static electricity discharge: When handling the board, to use a grounded wrist strap designed for
static discharge elimination and touch a grounded metal object before removing the board from the antistatic bag. Handle the board by its
edges only. do not touch its components, peripheral chips, memory modules or gold contacts. When handling processor chips or memory
modules, avoid touchingtheir pins or gold edge fingers. Restore the communications appliancesystem board and peripherals back into the
antistatic bag when they are not in use or not installed in the chassis Some circuitry on the system board can continue operating even
though the power is switched off. Under no circumstances should the Lithium battery cell used to power the real-time clock be allowed to
be shorted. The battery cell may heat up under these conditions and present a burn hazard WARNING! 1. "CAUTION: DANGER OF
EXPLOSION IF BATTERY IS INCORRECTLY REPLACED. REPLACE ONLY WITH SAME OR EQUIVALENT TYPE RECOMMENDED
BY THE MANUFACTURER. DISCARD USED BATTERIES ACCORDING TO THE MANUFACTURER'S INSTRUCTIONS" 2. This guide is
for technically qualified personnel who have experience installing and configuring system boards. Disconnect the system board power
supply from its power source before you connect disconnect cables or install remove any system board components. Failure to do this can
result in personnel injury or equipment damage. 3. Avoid short-circuiting the lithium battery; this can cause it to superheat and cause burns
if touched. Do not operate the processor without a thermal solution. Damage to the processor can occur in 4. 5. Do not block air vents.
Minimum 1/2-inch clearance required. "Rack Mount Instructions The following or similar rack-mount instructions are included with the 6.
installation instructions: A) Elevated operating Ambient f installed in a closed or multi-unit rack assembly, the operating ambient
temperature of the rack environment may be greater than room ambient. Therefore, consideration should given to installing the equipment
in an environment compatible with the maximum ambient temperature specified by the manufacturer. B) Reduced Air Flow Installation of
the equipment in a rack should be such that the amount of air flow required for safe operation of the equipment is not compromised. c)
Mechanical Loading Mounting of the equipment in the rack should be such that a hazardous condition is not achieved due to uneven
mechanical loading D) Circuit overloading Consideration should be given to the connection of the equipment to the supply circuit and the
effect that overloading of the circuits might have on over current protection and supply wiring. Appropriate consideration of equipment
nameplate ratings should be used when addressing this E) Reliable Ear thing Reliable ear thing of rack-mounted equipment should be
maintained. Particular attention should be given to supply connections other than direct connections to the branch circuit (e.g. use of power
strips).

CAR-5050 Series User`s Manual
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Table of Contents
CHAPTER 1 PREVIEW ...............................................................................................................................................5
1.1 ABOUT THIS MANUAL ........................................................................................................................................5
1.2 INTENDED AUDIENCES .......................................................................................................................................5
1.3 CONTENTS DESCRIPTIONS ..................................................................................................................................5
1.4 TECHNICAL OR CUSTOMER SUPPORT .................................................................................................................5
CHAPTER 2 INTRODUCTION.....................................................................................................................................6
2.1 PROCESSOR AND CHIPSET OVERVIEW ................................................................................................................6
2.2 MOTHERBOARD FEATURES ................................................................................................................................6
2.3 JUMPER SETTING................................................................................................................................................8
CHAPTER 3 HARDWARE INSTALL/DISMANTLING PROCEDURES.............................................................................19
3.1 THE CHASSIS.....................................................................................................................................................19
3.2 OPEN THE CHASSIS ...........................................................................................................................................21
3.3 REMOVE PROCESSOR .......................................................................................................................................22
3.4INSTALL PROCESSOR ........................................................................................................................................23
3.5REMOVE AND INSTALL DIMM ..........................................................................................................................25
3.6REMOVE AND INSTALL COMPACT FLASH CARD ................................................................................................27
3.7REMOVE AND INSTALL BATTERY ......................................................................................................................28
3.8REMOVE AND INSTALL ADD-ON CARD .............................................................................................................29
3.9EAR MOUNT KIT INSTALLATION .......................................................................................................................30
3.10 REMOVE EZIO...................................................................................................................................................31
3.11 REMOVE HDD TRAY..........................................................................................................................................32
3.12 REMOVE LOM MODULE ...................................................................................................................................33
3.13 REMOVE POWER SUPPLY .................................................................................................................................34
3.14 REMOVE MAIN BOARD ....................................................................................................................................35

CAR-5050 Series User`s Manual
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CHAPTER 4 BIOS SETTINGS ....................................................................................................................................40
4.1 INTRODUCTION ................................................................................................................................................35
4.2MAIN................................................................................................................................................................36
4.3ADVANCED.......................................................................................................................................................36
4.4CHIPSET............................................................................................................................................................42
4.5BOOT................................................................................................................................................................44
4.6SAVE & EXIT .....................................................................................................................................................44
4.7BIOS STATUS ABD BEEP CODE ..........................................................................................................................45

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Chapter1 Preview
1.1 About This Manual
This manual contains all necessary information for configuration and testing of CAR-5050. The CAR-5050 is based on
the Intel® Skylake-SP series processors. If there is any information not included, please contact your sales person at
CASwell.
1.2 Audiences
This manual is intended for use by engineers who are evaluating and developing applications on CAR-5050 platform.
1.3 Contents Descriptions
This manual describes how to configure the CAR-5050 to meet various operating requirement, which is organized as
follows:
Chapter 1: Preview. This chapter provides an overview of this manual and contact information of customer support.
Chapter 2: Introduction. This chapter provides an overview of the components in the CAR-5050, detail of features,
and a description of the development environment.
Chapter 3: Hardware dismantling procedures. This chapter shows the procedures for how to dismantle the
hardware.
Chapter 4: BIOS Settings. This chapter introduces the functions and settings of CAR-5050 BIOS menu.
1.4 Technical or Customer Support
You can reach CASwell customer support in the following ways:
Visit the CASwell web site at http://www.cas-well.com/
E-mail your questions to [e-mail]

CAR-5050 Series User`s Manual
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Chapter2 Introduction
2.1 Processor and chipset Overview
Built upon the functionality and the capability of the Intel® Skylake-SP processors, the CAPB-5050 provides the
performance and feature required for high-end server & carrier-grade platform.
2.2 Motherboard Features
2.2.1 System Hardware Specification
Product Name
CAR-5050
Intel® Purley Skylake-SP Platform, Support up to 48 SFP+ Fiber Port
Features
Intel Purley Skylake-SP platform
16x DDR4 ECC RDIMMs up to 2666MHz
Up to 6 front-access NIC module supported
RPSU, Smart LEDs, N+1 Fans solution, IPMI, System thermal integrate solution.
ICON(參考附件)
5,6,11,12,14,15,31,45,46,57,62,72,73
Specification
CPU
Intel® Xeon Scalable Processor-Purley
PCH/Chipset
Intel® Lewisburg C621 PCH
System Memory
16 DDR4 ECC RDIMMs up to 2666MHz
Ethernet Port
Up to 48 SFP+ Fiber Port
Bypass
Based on CASwell NIC Module or Standard add-on card
Expansion
Up to 5 PCIe Gen3 x 16 for CASwell NIC Module
Up to 1 PCIe Gen3 x 8 for CASwell NIC Module
Up to 1 PCIe Gen3 x 8 for Standard NIC Module
Storage Device
2x 3.5”or2.5”Swappable SATA/SAS HDDs
CF Socket
M.2 SSD 2280(PCIe)

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Dimension
465(W) x 594(D) x 89(H)mm
18.31''(W) x 21.02''(D) x 3.5''(H)
Front Panel
Serial Port
Front-access RJ45 system console with micro USB for backup
LCD Panel
128x32/64 Graphic,2x16 Characters
LED
HDD/ Ethernet/ Customization LED
USB
Dual USB 3.0
VGA
Optional from LOM or VGA module
LOM
IPMI 2.0 w/ GbE speed
Power
800W CRPS Redundant PSU
Operation
Operating Environment
Temp: 0 to 40°C (32 to 104°F)
20 to 90%RH
Storage Environment
Temp: -10 to 70°C (14 to 158°F)
5 to 95%RH @ 55°C
Certification
CE/FCC/UL
OS Support
Linux Kernel
Option CPU
Model
Cores/ Threads
Frequency
Cache
TDP
Intel® Xeon® SP Platinum 8180
28C/56T
2.5GHz
38.5MB
205W
Intel® Xeon® SP Platinum 8176
28C/56T
2.1GHz
38.5MB
165W
Intel® Xeon® SP Platinum 8160T
24C/48T
2.1GHz
33MB
150W
Intel® Xeon® SP Gold 6138/6138T
20C/40T
2.0GHz
27.5MB
125W
Intel® Xeon® SP Gold 6130/6130T
16C/32T
2.1GHz
22MB
125W
Intel® Xeon® SP Gold 6126/6126T
12C/24T
2.6GHz
19.25MB
125W
Intel® Xeon® SP Gold 5120/5120T
14C/28T
2.2GHz
19.25MB
105W
Intel® Xeon® SP Gold 5119T
14C/28T
1.9GHz
19.25MB
85W
Intel® Xeon® SP Gold 5118
12C/24T
2.3GHz
16.5MB
105W
Intel® Xeon® SP Silver 4116/4116T
12C/24T
2.1GHz
16.5MB
85W
Intel® Xeon® SP Silver 4114/4114T
10C/20T
2.2GHz
13.75MB
85W
Intel® Xeon® SP Silver 4110
8C/16T
2.1GHz
11MB
85W

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Intel® Xeon® SP Silver 4109T
8C/16T
2.0GHz
11MB
70W
Intel® Xeon® SP Bronze 3106
8C/8T
1.7GHz
11MB
85W
2.2.2 System Block Diagram
2.3 Jumper Setting
CAPB-5050
˙Components Map
TOP Layer

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CPU SOCKET
U45
CPU0
U46
CPU1
DIMM SOCKET
CPU0

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J15
CPU 0, CH A DIMM0
J18
CPU 0, CH D DIMM0
J16
CPU 0, CH A DIMM1
J17
CPU 0, CH D DIMM1
J14
CPU 0, CH B DIMM0
J19
CPU 0, CH E DIMM0
J13
CPU 0, CH C DIMM0
J20
CPU 0, CH F DIMM0
CPU1
J23
CPU 1, CH G DIMM0
J26
CPU 1, CH K DIMM0
J24
CPU 1, CH G DIMM1
J25
CPU 1, CH K DIMM1
J22
CPU 1, CH H DIMM0
J27
CPU 1, CH L DIMM0
J21
CPU 1, CH J DIMM0
J28
CPU 1, CH M DIMM0
Jumper & Connector List
Connector
Function
Remark
JP9
NMI Button
˙Open★
JP10
Watchdog Timer Reset
˙1-2：Enable★
˙Open：Disable
JP11
Auto Power Button
˙1-2：Enable★
˙Open：Disable
JP17
CMOS Clear Jumper
˙1-2：Clear RTC Register
˙2-3：Normal★
J1/J2/J3/J4
FAN module Slots
J5/J6/J7/J8
FAN Headers
J11/J12
CPU Power connector
J29
PMBus Connector
J30
PCH SMBus Connector
J32
Debug Port
J35
GPIO Header
J36
VGA Header
J37
IPMI connector
J39
ATX 24 pin Connector
J40
CPU0 Fan Header
J41
CPU1 Fan Header
J43
SATA Port 1 (6Gb/s) or SATA DOM
J44
SATA Port 0 (6Gb/s)
J45
TPM Header
J48
SATA Port 2 (6Gb/s)
J49
M.2 PCIex4 Connector

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J50
SATA Port 3 (6Gb/s)
J54/J57/J58
NIP Module Fan
J55/J56
Upper Layer NIP Connector
J59
USB3.0 Header
J62
PCI-E Slot C x16 (CASwell NIP)-CPU0
J63
PCI-E Slot E x16 (CASwell NIP)-CPU1
J64
PCI-E Slot G x16 (CASwell NIP)-CPU1
J65/J76
Manager Board Slot
J77
BT module Header
BAT1
Battery
BZ1
Buzzer
U85
PCH (C621)
ATX1/2
Power Connector
U71
BIOS 0 Socket
U72
BIOS 1 Socket
(Default Setting:“★”)
˙Pin Header definition
J29/J30：PMBus / PCH SMBus Connector
1 2 3 4 5

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Pin No.
Signal Description
1
CLOCK
2
DATA
3
ALERT
4
GND
5
3.3V
J32：Debug Port
Pin No.
Signal Description
Pin No.
Signal Description
1
LPC_LAD0
2
P3V3
3
LPC_LAD1
4
RST_PLTRST_B_N
5
LPC_LAD2
6
LPC_FRAME_N
7
LPC_LAD3
8
CLK_33M
9
NC
10
GND
J40：CPU0 Fan
J41：CPU1 Fan
1 2 3 4
Pin No.
Signal Description
1
GND
2
12V
3
NO SENSE Function
4
NC
J36：VGA
2 4 6 8 10
1 3 5 7 9
Pin No.
Signal Description
Pin No.
Signal Description
1
RED
2
DDC_CLOCK

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3
GREEN
4
GND
5
BLUE
6
DDC_DATA
7
V-SYNC
8
GND
9
H-SYNC
10
NC
J45：TPM
2 4 6 8 10 12 14 16 18 20
1 3 5 7 9 11 13 15 17 19
Pin No.
Signal Description
Pin No.
Signal Description
1
TPM_CLK
2
GND
3
LFRAME#
4
NC
5
TPM_RESET#
6
5V
7
LAD3
8
LAD2
9
VCC3
10
LAD1
11
LAD0
12
GND
13
SMB_CLK
14
SMB_DATA
15
3VSB
16
SERIRQ
17
GND
18
GND
19
3VSB
20
LDRQ#1
J54/J57/J58：NIP Module Fan
1 2 3
Pin No.
Signal Description
1
GND
2
12V
3
NC
J7/J8/J5/J6：Smart Fan
1 2 3

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Pin No.
Signal Description
1
GND
2
PWM Control
3
Sense
J59：USB3.0
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
Pin No.
Signal Description
Pin No.
Signal Description
20
KEY
1
+5V
19
+5V
2
SSRX2_N
18
SSRX1_N
3
SSRX2_P
17
SSRX1_P
4
GND
16
GND
5
SSTX2_N
15
SSTX1_N
6
SSTX2_P
14
SSTX1_P
7
GND
13
GND
8
D1_N
12
D2_N
9
D1_P
11
D2_P
10
GND
J35：GPIO
2 4 6 8 10
1 3 5 7 9
Pin No.
Signal Description
Pin No.
Signal Description
1
GP67
2
GP60
3
GP66
4
GP61
5
GP65
6
GP62

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7
GP64
8
GP63
9
GND
10
3.3V
ATX1/2：Power Connector
1 2 3 4
Pin No.
Signal Description
1
12V
2
GND
3
GND
4
5V
CB-5050-2
˙Components Map
TOP Layer
Jumper & Connector List
Connector
Function
Remark
J4
Power connector
J7
PCI-E Slot B x16 (CASwell NIP)-CPU0
J8
PCI-E Slot D x16 (CASwell NIP)-CPU0
J9
PCI-E Slot F x16 (CASwell NIP)-CPU0
J10/J11
Board to Board Connector
ABM-5050-0

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˙Components Map
TOP Layer
BOT Layer

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˙Jumper & Connector List
Connector
Function
Remark
J3
Standard PCIe x8 Slot
J4
CF Slot
J5
COM2 Header
J6
COM2 Slot
J7
USB 3.0 Connector
J8
USB 3.0 Connector
J9
Management Port 01 RJ45
J10
Management Port 02 RJ45
J11
IPMI connector ( RJ45 Interface )

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J12
Consol port ( RJ45 Interface )
J14
Micro-USB Console Port
D15
Customized LED
Green / Red
D16
Customized LED
Green / Red
D17
Customized LED
Green / Red
SW1
Power Button
SW2
Reset Button / Reset to default
˙TOP-Reset Button
˙BOT-Reset to default
(Default Setting:“★”)
˙Pin Header definition
J5：COM2 Pin Header
Pin
Signal Name
Pin
Signal Name
1
GND
2
NC
3
C2_SIN
4
NC
5
C2_SOUT
6
NC
7
VCC
8
NC
9
NC
10
NC
Chapter3 HardwareInstallationProcedures
3.1 The Chassis
The system is integrated in a customized 2U chassis . on the front panel you will find , two LAN port , two types
of console port(default baud rate 115200), two USB ports, one IPMI port, one NIC module, and six LAN module
slot.

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CAR-5050 Front view of the chassis
CAR-5050 Rear view of the chassis

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3.2 Open The Chassis
1. Loosen the 12 screws of the chassis.
Take off screws
2. The top lead can be removed from the base stand