Chenbro RB251 User manual

RB251
RB251
Rackmount Server User Manual
February 17, 2021 Version 0.8
This document provides an overview of product features, functions, architecture, and support specifications.

2
DISCLAIMERS
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The manufacturer disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability,
fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing,
or usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact the manufacturer to obtain the latest Configuration Guide.
The products and services described may contain defects or errors known as errata which may cause deviations from published
specifications. Current characterized errata are available on request.
Names and brands mentioned may be claimed as the property of their respective owners

Table of Contents │3
Table of Contents
Table of Contents ...............................................................................................................................................3
List of Figures .....................................................................................................................................................4
List of Tables.......................................................................................................................................................5
1Product Overview ........................................................................................................................................6
1-1 System Features Overview...........................................................................................................8
1-2 Front Panel...................................................................................................................................9
1-3 Back Panel..................................................................................................................................10
1-4 Front Control Panel....................................................................................................................11
1-5 Chassis Dimensions....................................................................................................................12
1-6 Available Rack Mounting Kit Options.........................................................................................15
1-7 System Level Environmental Specifications...............................................................................16
1-8 System Packaging......................................................................................................................17
2Installing and Removing Components .......................................................................................................18
2-1 Top Cover Removal and Installation...........................................................................................19
2-2 HDD Cage Removal and Installation...........................................................................................21
2-3 Hot-swap HDD Assembly Removal and Installation...................................................................22
2-4 System Maintenance..................................................................................................................28
2-5 Fan Assembly Removal and Installation.....................................................................................29
2-6 CPU Installation...........................................................................................................................31
2-7 Memory Module Installation .....................................................................................................32
2-8 Full-height PCIe Card Installation...............................................................................................34
2-9 Low-profile PCIe Card Installation..............................................................................................36
2-10 OCP Mezzanine Card Installation...............................................................................................38
2-11 PSU Installation and Removal ....................................................................................................39
2-12 Slide Rail Installation..................................................................................................................40
3Backplane...................................................................................................................................................42
3-1 Storage Backplane Options........................................................................................................42
3-1 Storage Backplane Options........................................................................................................43
3-2 3.5” 12-Port 12Gbps Mini-SAS HD Active Backplane.................................................................44
3-3 12Gbps 8-Port Mini SAS HD Passive Backplane.........................................................................47
3-4 2.5” 8-Port 12Gb/s SAS Passive Backplane................................................................................50
3-7 2.5” 16-Port 12Gb/s SAS Passive Backplane Docked with Expander Board..............................52
4Base Board .................................................................................................................................................56
4-1 Base board feature overview.....................................................................................................56
4-2 Base board feature overview.....................................................................................................56
4-3 Base board jumper identification ..............................................................................................57
4-4 Base board LED identification....................................................................................................58
5Maintenance and Service...........................................................................................................................60

Error! No text of specified style in document. │4
List of Figures
Figure 1 RB251 overview................................................................................................................................8
Figure 2 RB251 major components overview ...................................................................................................8
Figure 3 251 front panel ....................................................................................................................................9
Figure 4 RB251 back panel...............................................................................................................................10
Figure 5 Front control panel .........................................................................................................................11
Figure 6 Chassis dimensions .........................................................................................................................12
Figure 7 Label embossing dimensions..........................................................................................................14
Figure 8 Front top cover removal .................................................................................................................19
Figure 9 Rear top cover removal...................................................................................................................19
Figure 10 Front top cover installation...........................................................................................................20
Figure 11 Rear top cover installation............................................................................................................20
Figure 12 HDD cage removal.........................................................................................................................21
Figure 13 HDD cage installation....................................................................................................................21
Figure 14 2.5" hot-swap HDD assembly removal..........................................................................................22
Figure 15 2.5’’ hot-swap HDD assembly installation ....................................................................................22
Figure 70 Backplane front view.................................................................................................................50

List of Tables │5
List of Tables
Table 1 RB251 specifications...........................................................................................................................6
Table 2 Front control panel...........................................................................................................................11
Table 3 Slide rail options ...............................................................................................................................15
Table 4 System environmental specifications summary...............................................................................16
Table 5 System packaging information .........................................................................................................17
Table 6 Product weight information .............................................................................................................17
Table 7 Drive power LED/activity LED behavior..........................................................................................42
Table 8 Backplane specifications ............................................................................................................44
Table 9 Connector and pin header function description.......................................................................45
Table 10 Dip switch setting........................................................................................................................45
Table 11 Backplane specifications ............................................................................................................47
Table 12 Connector and pin header function description.....................................................................48
Table 13 Fan setting for RM24508............................................................................................................49
Table 14 Backplane specifications ............................................................................................................50
Table 15 Connector and pin header function description.....................................................................51
Table 25 Dip switch setting........................................................................................................................51
Table 26 Backplane specifications ............................................................................................................52
Table 27 Connector and pin header function description.....................................................................53
Table 28 Expander board specifications ..................................................................................................54
Table 29 Connector and pin header function description.....................................................................55
Table 30 Dip switch setting........................................................................................................................55

Product Overview │6
1Product Overview
The RB251 2U rackmount system is in order to support Intel 3rd generation Xeon Scalable processor-- up to 2x Ice lake processor and
32x DDR4 DIMM slot based on Intel Whitley server board M50CYP2SB. RB251 provides the performance and scalability to meet the
needs of a variety of workloads for virtualization, high performance computing, cloud, etc applications. This chapter provides a
high-level overview of the system features and available options. More details for each major sub-system, feature and option are
provided in the following chapters.
Table 1 RB251 specifications
Feature
Description
Dimensions (D x W x H)
770.0.0 x 438.0 x 87.0 (mm)
30.3” x 17.24” x 3.43”
Drive Bays
External
2.5” 24-port NVMe (PCIe Gen 4), tray-less
2.5” 24-port SAS/SATA, Hot-Swap, tool-less tray
3.5” 12-port SAS/SATA, Hot-Swap, tool-less tray
3.5” 8-port SAS/SATA, Hot-Swap, tool-less tray
Internal
2x 2.5”SSD, Internal fix
Slim ODD
Optional support based on 8x3.5”HDD SKU
Slim FDD
N/A
PSU
Form Factor
1+1 (or 1+0) CRPS
Max. Power
1200W/1600W/2000W
Indicators
Front Panel
1 x Power Status
1 x UID
1 x System Alarm
Rear Panel
1 x Power Status
1 x System Reset
1 x UID
Front Control
1 x Power On/Off
1 x System Reset
1 x UID
1 x VGA
1 x USB 3.0
Cooling Fans
Front
N/A
Middle
60 x 38 mm (6) Hot-swap
Rear
N/A
Expansion Slots
4 x FHFL + 2 x FHFL + 2 x HHHL + 1 x OCP 3.0 Mezzanine Card Slots
3x 2U Riser Cards:
Riser 1: 1x PCIe x16 slot + 2x PCIe x8 slots (2x PCIe x16 slot for
Double-width GPGPU supporting)
Riser 2: 1x PCIe x16 slot + 2x PCIe x8 slots (2x PCIe x16 slot for

Product Overview │7
Feature
Description
Double-width GPGPU supporting)
Riser 3: 2x PCIe x8 slot
System Management
IPMI 2.0
Redfish compliant
Dedicate onboard RJ45 1GbE management port
Support for Intel DCM
Support for Intel SDP tool
Support for Intel server management software
BMC
ASPEED AST2500
System Security
Intel TPM support
Chassis intrusion detection
Temperature
Operating
Temperature
5°C to 35°C
Non-Operating
Temperature
-40ºC to 70ºC
Humidity
Operating
Relative
Humidity
N/A
Non-Operating
Relative
Humidity
5% to 90%
Regulatory Compliance
CE, FCC, CCC, BSMI (option)
Safety Compliance
CB, UL
Net Weight
14.9 kg / 32.82 lb (TBD)
Gross Weight
19.0 kg / 41.86 lb (TBD)
Volume
4.75 cubic feet (TBD)
Container Loading
20': 160, 40': 336, 40'H: 378 (TBD)

Product Overview │8
1-1 System Features Overview
A B C D
E
Figure 1 RB251 over view
E F G H I
Figure 2 RB251 major components overview
A. Label Embossing
B. Front Top Cover Latch
C. Front Top Cover
D. Rear Top Cover
E. Fan Assembly
F. Server Board
G. Power Supply Unit
H. Full-Height Expansion Bracket
I. Low-Profile Expansion Bracket

Product Overview │9
1-2 Front Panel
A AB B
C D
Figure 3 251 front panel
A. Rack Handles
B. Front Control Panel
C. Storage Drive Bay
D. Info Tag

Product Overview │10
1-3 Back Panel
A B C CD E
Figure 4 RB251 back panel
A. 1U Single Power Supply
B. Low-Profile Expansion Slots
C. Full-Height Expansion Slots
D. OCP Expansion Slot
E. UID Button

Product Overview │11
1-4 Front Control Panel
Figure 5 Front control panel
Table 2 Front control panel
Label
Icon
Indicator, button or connector
A
USB 3.0
B
Video Port (VGA)
C
Power Button
D
RST
Reset Button
E
UID Button
F
System Alarm LED

Product Overview │12
1-5 Chassis Dimensions
438.0 mm/17.24”
770.0 mm/30.3”
87.0 mm/3.43”
Figure 6 Chassis dimensions

Product Overview │13

Product Overview │14
400.0 mm/15.74”
129.3 mm/5.09”
R 3.7 mm
Figure 7 Label embossing dimensions

Product Overview │15
1-6 Available Rack Mounting Kit Options
Advisory Note –Available rack and cabinet mounting kits are not designed to support shipment of the server system while installed
in a rack. If you chose to do so, it is advised to verify your shipping configuration with appropriate shock and vibration testing before
shipment. Shipping tests which cover the complex combination of unique rack offerings and custom packaging options are not
performed.
Caution: Exceeding the specified maximum weight limit of a given rail kit or misalignment of the server in the rack may result in
failure of the rack rails, causing damage to the system or personal injury. Two persons to operate or the use of a mechanical assist
tool to install and align the server into the rack is highly recommended.
Available rack mounting kits:
Table 3 Slide rail options
Part Number
384-15103-3300A0
384-15103-3301A0
Rail Dimensions (mm/inch)
599 mm / 23.58"
853.7 mm / 33.61"
Applicable Cabinet-Post to Post (mm/inch)
660.4 - 838.2 mm / 26.00" - 33.00"
623.3 - 916.8 mm / 24.53" - 36.09"
No. of Sections
2 sections
3 sections
Post to Post Distance (mm/inch)
660.4 - 838.2 mm / 26.00" - 33.00"
623.3 - 916.8 mm / 24.53" - 36.09"
Traveling Distance (mm/inch)
560.0 mm / 22.04 "
820.0 mm / 32.28 "
Support Chassis Width (mm)
438.0 mm / 17.24"
438.0 mm / 17.24"
Loading (kg)
31.22 kg
31.22 kg
Tool-less
Yes
Yes
Supports CMA
No
Yes
Refer to 2-12 Slide Rail Installation on page 40 for installation instructions.

Product Overview │16
1-7 System Level Environmental Specifications
The following table defines the system level specifications under operating and non-operating environments.
Table 4 System environmental specifications summary
Parameter
Specification
Temperature
Operating
5ºC to 35ºC (41ºF to 95ºF)
Temperature
Non-Operating
-40ºC to 70ºC (-40ºF to 158ºF)
Humidity
Non-Operating
50% to 90%, non-condensing with a maximum wet bulb of 28°C
(at temperatures from 25°C to 35°C)
Unpackaged
Shock
Non-Operating
Trapezoidal, 25 g, velocity change is based on product weight
Unpackaged
Vibration
Operating
5 Hz @ 0.0002 g2/Hz to 350 Hz @ 0.0002 g2/Hz
Input acceleration is 0.26 g RMS
10 minutes per axis for all 3 axes on all samples
Random control limit tolerance is ±3 dB
Sag & Bow
Non-Operating
Tolerance analysis among rack, rail and chassis
Actual on rack test with EIA Go-NoGo fixture
EMI
Pre-scan
Radiated Emissions
CISPR CLASS A (under 6 dB):
30~1000 MHz vertical/horizontal
1G~6G GHz vertical/ horizontal
1G~18G GHz vertical/horizontal
ESD
Contact and Air Discharge
Electrostatic Discharge Immunity Test: IEC 61000-4-2
RVI
Operating
HDD Class:
Class 1: Highest performance, reliability, and data integrity
Class 2: A second tier of performance, reliability, and data integrity
HDD I/O Throughput Degradation Specification - Pass/Fail Criteria:
No functional failure during test or post-test diagnostics.
Requirement to pass test is based on IOMeter data throughput (in IO’s per
second) expressed as a percent of Test HDD maximum theoretical
baseline performance
Class1: > 90% of baseline for 4K random writes and > 80% of baseline for
128K sequential writes
Class2: > 85% of baseline for 4K random writes and > 75% of baseline for
128K sequential writes
Mix: > 80% of baseline for 4K random writes and > 70% of baseline for
128K sequential writes
Packaged
Vibration
Non-Operating
ISTA (weight over 68 kg, 1B; weight equal or less than 68 kg, 1A)
Packaged
Drop
Non-Operating
Drop height change is based on product weight
Non-palletized product:
Investigation: Test requirement is 6 face drops, 8 corner drops and 12
edge drops for a total of 26 drops
Validation: Test requirement is 6 face drops, 2 corner drops and 3 edge
drops for a total of 11 drops
Palletized product (both investigation and validation):
Perform two bottom drops at the specified height, 10 bottom drops at
one half of the specified height
Perform 4 rotational edge drops (one per edge) at the specified height

Product Overview │17
1-8 System Packaging
The original packaging, where the server system is delivered, is designed to provide protection for L5 configuration and tested to
meet ISTA (International Safe Transit Association) Test Procedure 1A (2008). The packaging is also designed to be reused for
shipment after the system integration has been completed.
The original packaging includes the shipping box and various protective inner packaging components, which are designed to
function together as a protective packaging system. When reused, all of the original packaging material must be used, including box
and each inner packaging component. In addition, all inner packaging components MUST be reinstalled in the proper location to
ensure adequate protection to the system for subsequent shipment.
Table 5 System packaging information
Part Number
Single/Bulk
Form Factor (mm)
Support level
TBD
Single
1100 x 600 x 210 mm
L6
NOTE: The design of the inner packaging components does not prevent improper placement within the packaging
assembly. There is only one correct packaging assembly that will allow the package to meet the ISTA (International Safe
Transit Association) Test Procedure 1A (2008).
Failure to follow the specified packaging assembly instructions may result in damage to the system during shipment.
Table 6 Product weight information
Product
Unpackaged Net Weight
（kg）
Packaged Gross Weight
（kg）
Unpackaged Net Weight
(lb)
Packaged Gross Weight
(lb)
RB251
10.8
13.3
23.79
29.3
NOTE: A L5 system does not include motherboards, processors, memories, drives, or add-in cards. It is the system
configuration as shipped. Weights of integrated system (system configurations that include the items above) will vary
depending on the final system configuration.

Installing and Removing Components │18
2Installing and Removing Components
The RB251 2U rackmount server supports a variety of different storage options:
2.5” 24-port NVMe (PCIe Gen 4), tray-less
2.5” 24-port SAS/SATA, Hot-Swap, tool-less tray
3.5” 12-port SAS/SATA, Hot-Swap, tool-less tray
3.5” 8-port SAS/SATA, Hot-Swap, tool-less tray
Support for different storage and peripheral options will vary depending on the system model and/or available accessory options
installed.

Installing and Removing Components │19
2-1 Top Cover Removal and Installation
1
2
2
3
Figure 8 Front top cover removal
1. Loosen and remove the two locking screws securing the front top cover.
2. Press the latch as shown to release the cover.
3. Slide the cover towards the front panel and remove it.
1
2
2
3
Figure 9 Rear top cover removal
1. Loosen and remove the two locking screws securing the rear top cover.
2. Press the latch as shown to release the cover.
3. Slide the cover towards the rear panel and remove it.

Installing and Removing Components │20
1
2
3
Figure 10 Front top cover installation
1. Align the three guide pins on both sides of the cover with the grooves on the chassis frame.
2. Slide the cover toward the rear panel until it is locked into place.
3. Replace the two locking screws on either side of the chassis to secure the cover.
1
2
3
Figure 11 Rear top cover installation
1. Align the three guide pins on both sides of the cover with the grooves on the chassis frame.
2. Slide the cover toward the front panel until it is locked into place.
3. Replace the two locking screws on either side of the chassis to secure the cover.