Clevo 5100S User manual

Model 5100S/5500S
Service Manual
Mainboard
D/D board
Inverter board
Hard transfer board
Specifications are subject to change without notice. October, 2000

Contents
Systemspecifications........................................................................................... 1
Chipsets ................................................................................................................ 3
SiS630S .................................................................................................................3
PC Card Chipset.....................................................................................................8
CPUand Memory .................................................................................................. 9
CPU ........................................................................................................................9
Addingor replacing the processor. ........................................................................10
A: Remove the heat sink ................................................................................................10
B: Remove the processor ..............................................................................................11
C: Insert a new processor..............................................................................................12
D: Reinstall the heat sink................................................................................................13
E: Changing the SW1 DIP Switch settings ....................................................................13
Memory .................................................................................................................15
ExpansionMemory Socket ....................................................................................16
Installinga Memory Module ............................................................................................17
Changing the S3 DIP Switch settings ............................................................................18
RemovingaMemory Module ..........................................................................................19
Driveinformationand Pinassignments ............................................................. 20
Storage Devices....................................................................................................20
HDD(BUILT-IN).................................................................................................................20
HDDPINASSIGNMENT.................................................................................................20
Removing the HDD from the notebook ..........................................................................21
Removing the HDD from its tray ....................................................................................21
Inserting the HDD...........................................................................................................21
FDD ..................................................................................................................................22
FDDPIN ASSIGNMENT .................................................................................................22
Removing the Floppy Disk Drive ....................................................................................22
Inserting the Floppy Disk Drive.......................................................................................23
DVD-ROM.........................................................................................................................24
DVD-ROMPINASSIGNMENT .......................................................................................24
Removing the DVD-ROM Module...................................................................................25
Inserting the DVD-ROM module.....................................................................................25
CD-ROM (OPTIONAL)......................................................................................................26
CD-ROMPIN ASSIGNMENT..........................................................................................26
InterfacePinAssignments .....................................................................................27
RS-232 Serial Interface ..................................................................................................27
ParallelInterface.............................................................................................................27
USBInterface .................................................................................................................27
Internaltrackpad Interface ..............................................................................................28
ExternalMonitor Interface...............................................................................................28
ExternalKeyboard/PS2Mouse Interface........................................................................28
PCMCIACardBusInterface............................................................................................29
Internal PCIInterface ......................................................................................................30
LCD Interface .................................................................................................................31
Power.................................................................................................................. 32
Application: ...........................................................................................................32
Charge board ........................................................................................................35
Inverterboard ........................................................................................................38
Adaptor .................................................................................................................39

BatteryPack..........................................................................................................41
Batterydiagram.....................................................................................................44
Componentdiagrams andpart numbers ........................................................... 45
SchematicDrawings ........................................................................................... 51

1
System specifications
The 5100S/5500S uses the SiS630S core logic and InSyde BIOS code. This product also
features three bays for user-installed modules (a HDD, a CD-ROM or DVD-ROM or a FDD),
and has an optional Fax/Modem MDC module.
The main unit of the Model 5100S/5500S Notebook PC has the following components:
– Intel Mobile Pentium III with AGP technology-based mainboard, using the SiS630S
chipset solution supporting SDRAM with 0 MB on-board DRAM, expandable to
32MB, 64MB, 96MB, 128MB, 192MB, 256MB, or 512MB using one or two expansion
S.O. DIMMs
– user-installed modules: CD-ROM, DVD-ROM and an FDD
– main storage (HDD) bay: principal HDD, 2.5” up to 12GB(Ultra DMA33/66)
– User interfaces:
· one internal keyboard, 84 keys (depending on the language)
· one built-in trackpad
· one 800x600 SVGA TFT 12.1” LCD display panel with CCFT backlight
– Power Solutions
· power bay: battery pack
· AC/DC adapter
CPU ( µPGA2)
Intel Celeron-450 (1.6V)
Intel Celeron-500 (1.6V)
Intel Celeron-550 (1.6V)
Intel Celeron-700 (1.6V)
Intel Pentium III-600 * (1.6V)
Intel Pentium III-650 * (1.6V)
Intel Pentium III-700 * (1.6V)
Intel Pentium III-750 * (1.6V)
Intel Pentium III-850 * (1.6V)
* with Intel SpeedStep Technology
HDD
Removable module up to 12GB
Drive size 2.5"
Height maximum 12.7mm
Average access time <13ms
Interface: PCI local bus master
IDE with Ultra DMA33/66 I/F
FDD
removable 3.5" 1.44MB
BIOS
InSyde 256KB
CD-ROM (MKE CR175) 24X remov-
able module
CD type 12.8cm
Height 12.7mm
Data transfer rate 3600KB/s (max)
Random access time <100ms
Compliance Multimedia PC-2 Spec.
Transport drawer type load/eject
Interface PCI local bus master IDE
Memory
L2 Cache (on die)
Celeron(.18) series 128KB
Pentium III series 256KB
On board RAM 0MB
Upgradable to 512MB (MAX.)

2
Keyboard
Keys 84
Fn key support YES
Integrated numeric keypad YES
Inverted "T" layout cursor keys YES
Power Supply
AC adapter
AC-in 100-240V47-63Hz
Capacity 65W
Battery pack Li-Ion
Power Saving Management
Doze mode YES
Sleep mode YES
Suspend/Resume mode YES
Suspend to HDD mode YES
Hot key control suspend YES
APM ver 1.2 support YES
ACPI Ver 1.0 support YES
LCD TFT/DSTN
Backlite CCFT
Size 12.1"
Resolution 800x600
Color (CRT) 16,77M
Monitor 1280x1024
Support non-interlaced
Physical
Dimension 316mm(W)
256mm(D)
38.5mm(H)
Weight 3KG (with Lithium-lon
battery) Display
LCD/CRT (simultaneous) YES
VGA/EGA/CGA/Hercules compatible
YES
AGP 3D graphics accelerator YES
Adjustable brightness (TFT) YES
Packaging
(standard)
AC/DC adaptor & power cord x1
User™s manual (printed format) x 1
(Optional)
Car adapter x 1
Smart Li-Ion battery pack x 1
S.O. DIMM 32MB/64MB/128MB/256MB
Fax/modem module(56K, MDC) x 1
DVD-ROM (X8) x 1
CD-RW x1
Audio
3D, Sound Blaster compatible YES
Built-in speakers 2
Built-in microphone 1
External Audio Jacks
Speaker-out Jack YES
Microphone-in Jack YES
Ports
Serial port x 1
IrDA/SIR/ASK/FIR x1
Parallel port x1
15 pin external video port x 1
External 101/102 keyboard port/ PS/2 mouse
x 1
PC Card Standard Type I x 1
Modem (RJ-11) port for MDC x 1
USB connector x1
speaker-out jack x 1
microphone-in jack x 1
LAN (RJ-45) port x 1
TouchPad
built-in x1
Interface PS/2

3
Chipsets
SiS630S
– provides a high performance/low cost Desktop solution for the Intel mobile CPU
based system
– integrates a high performance North Bridge
– has an advanced hardware 2D/3D GUI engine, Super-South bridge or an external
AGP4X Slot
TheSiS630S is asystem-on-chip solution thatcomplies with
– Easy PC Initiative which supports Instantly Available/OnNow PC technology
– USB
– Legacy Removal
– Slotless Design and FlexATX form factor
TheSiS630S:
– integrates UltraAGPTM technology and advanced 128-bit graphic display interface.
– delivers AGP 4x performance and memory bandwidth up to 1 GB/s.
– supports an extra AGP Slot that supports 4X and Fast Write transactions.
– provides powerful hardware decoding DVD accelerator to improve the DVD
playback performance.
– Provides the standard interface for CRT monitors
– provides the Digital Flat Panel Port (DFP) for a standard interface between a
personal computer and a digital flat panel monitor.
– adopts Share System Memory Architecture which can flexibly utilize the frame
buffer size up to 64MB.
KeyFeatures:
“Super-SouthBridge” in SiS630S
-integrates all peripheral controllers/accelerators /interfaces.
-provides a total communication solution including 10/100Mb Fast Ethernet for
Office requirement and 1Mb HomePNA for Home Networking.
-offers AC’97 compliant interface that comprises digital audio engine with 3D-
hardware accelerator, on-chip sample rate converter, and professional wavetable
along with separate modem DMA controller.
-provides interface to Low Pin Count (LPC) operating at 33 MHz clock which is the
same as PCI clock on the host, and dual USB host controllers with six USB ports
that deliver better connectivity and 2 x 12Mb bandwidth.
-The built-in fast PCI IDE controller supports the ATA PIO/DMA, and the Ultra
DMA33/66 function that supports the data transfer rate up to 100 MB/s. It provides
the separate data path for two IDE channels that can eminently improve the
performance under the multi-tasking environment.

4
HostInterface Controller
- Supports Intel mobile Pentium II/!!! CPUs
- Synchronous Host/DRAM Clock Scheme
- Asynchronous Host/DRAM Clock Scheme
IntegratedDRAM Controller
- 3-DIMM/6-Bank of 3.3V SDRAM
- Supports Memory Bus up to 133 MHz
- System Memory Size up to 3 GB
- Up to 512MB per Row
- Supports 16Mb, 64Mb, 128Mb, 256Mb, 512Mb SDRAM Technology
- Suspend-to-RAM (STR)
- Relocatable System Management Memory Region
- Programmable Buffer Strength for CS#, DQM[7:0], WE#, RAS#, CAS#, CKE,
MA[14:0] and MD[63:0]
- Shadow RAM Size from 640KB to 1MB in 16KB increments
- Two Programmable PCI Hole Areas
IntegratedA.G.P.Compliant Target/66MhzHost-to-PCI Bridge
- AGP v2.0 Compliant
- Supports Graphic Window Size from 4MBytes to 256MBytes
- Supports Pipelined Process in CPU-to-Integrated 3D A.G.P. VGA Access
- Supports 8 Way, 16 Entries Page Table Cache for GART to Enhance Integrated
A.G.P. VGA Controller
- Read/Write Performance
- Supports PCI-to-PCI Bridge Function for Memory Write from 33Mhz PCI Bus to
Integrated A.G.P. VGA
- Supports Additional AGP slot with 4X and Fast Write Transaction
MeetPC99Requirements
PCI2.2Specification Compliant
HighPerformance PCIArbiter
- Supports up to 4 PCI Masters
- Rotating Priority Arbitration Scheme
- Advanced Arbitration Scheme Minimizing Arbitration Overhead.
- Guaranteed Minimum Access Time for CPU And PCI Masters
IntegratedHost-To-PCIBridge
- Zero Wait State Burst Cycles
- CPU-to-PCI Pipeline Access
- 256B to 4KB PCI Burst Length for PCI Masters
- PCI Master Initiated Graphical Texture Write Cycles Re-mapping
- Reassembles PCI Burst Data Size into Optimized Block Size

5
FastPCI IDE Master/SlaveController
- Supports PCI Bus Mastering
- Native Mode and Compatibility Mode
- PIO Mode 0, 1, 2 , 3, 4
- Multiword DMA Mode 0, 1, 2
- Ultra DMA 33/66/100
- Two Independent IDE Channels Each with 16 DW FIFO
VirtualPCI-to-PCI Bridge
IntegratedUltra AGP VGA forHardware 2D/3D Video/Graphics Accelerators
- Supports Tightly Coupled 64 Bits Host Interface to VGA to Speed Up GUI
Performance and Video Playback Frame Rate
- AGP v. 2.0 Compliant
- Zero-Wait-State 128x4 Post-Write Buffer with Write Combine Capability
- Zero-Wait-State 128x4 2-Way Read Ahead Cache Capability
- Re-locatable Memory-Mapped and I/O Address Decoding
- Flexible Design Shared Frame Buffer Architecture for Display Memory
- Shared System Memory Area up to 64MB
- Built-in 8K Bytes Texture Cache
- Supports High Quality Dithering
- Supports Bump Mapping
- Supports 8/16/24/32 BPP RGB/ARGB Texture Format
- Supports Video YUV Texture in All Supported Texture Formats
- 128-Bit 2D Engine with a Full Instruction Set
- Maximum 64 MB Frame Buffer with Linear Addressing
- Supports Hardware DVD Accelerator
- Supports Single Frame Buffer Architecture
- Supports Two Independent Video Windows with Overlay Function and Scaling
Factors
- Supports YUV-To-RGB Color Space Conversion
- Supports Graphic and Video Overlay Function
- Supports CD/DVD to TV Playback Mode
- Simultaneous Graphic and TV Video Playback Overlay
- Supports RGB555, RGB565, YUV422 and YUV420 Video Playback Format
- Supports Filtered Horizontal Up and Down Scaling Playback
- Supports DVD Sub-Picture Playback Overlay
- Supports DVD Playback Auto-Flipping
- Built-in Two Video Playback Line Buffers
- Built-in Programmable 24-bit True-Color RAMDAC up to 270 MHz Pixel Clock
RAMDAC Snoop Function
- Built-in Dual-Clock Generator
- Supports Multiple Adapters and Multiple Monitors
- Built-in PCI Multimedia Interface
- Supports Digital Flat Panel Port for Digital Monitor (LCD Panel)

6
- Built-in VESA Plug and Display for CH7003, PanelLinkTM and LVDS Digital
Interface
- Built-in Secondary CRT Controller for Independent Secondary CRT, LCD or TV
digital output
- Supports VESA Standard Super High Resolution Graphic Modes
640x480 16/256/32K/64K/16M colors 120 Hz NI
800x600 16/256/32K/64K/16M colors 120 Hz NI
1024x768 256/32K/64K/16M colors 120 Hz NI
1280x1024 256/32K/64K/16M colors 85 Hz NI
1600x1200 256/32K/64K/16M colors 85 Hz NI
1920x1440 8bbp/16bbp 60NI
- Low Resolution Modes
- Supports Virtual Screen up to 4096x4096
- Fully Directx 7.0 Compliant
- Efficient and Flexible Power Management with ACPI Compliance
LowPin Count Interface
- Forwards PCI I/O and Memory Cycles into LPC Bus
- Translates 8-/16-bit DMA Cycles into PCI Bus Cycles
AdvancedPCI H/WAudio &Modem
Advanced Power Management
- Meets ACPI 1.0b Requirements
- Meets APM 1.2 Requirements
- ACPI Sleep States Include S1, S4, S5
- CPU Power States Include C0, C1, C2 C3
- Power Button with Override
- RTC Day-of-Month, Month-of-Year Alarm
- 24-bit Power Management Timer
- LED Blinking in S1 State
- System Power-Up Events Include: Power Button, Hot-Key, Keyboard Password/
Hot-
- Key, RTC Alarm, Modem Ring-In, LAN, PME#, AC’97 Wake-Up and USB
- Wake-Up
- Software Watchdog Timer
- Power Supply’98 Support
- PCI Bus Power Management Interface Spec. 1.0
IntegratedDMA Controller
- Two 8237A Compatible DMA Controllers
- 8/16- bit DMA Data Transfer
- Distributed DMA Support
IntegratedInterrupt Controller
- Two 8237A Compatible DMA Controllers
- Two 8259A Compatible Interrupt Controllers
- Level- or Edge-Triggered Programmable

7
- Serial IRQ
- Interrupt Sources Re-routable to Any IRQ Channel
Three 8254CompatibleProgrammable 16-bit Counters
- System Timer Interrupt
- Generate Refresh Request
- Speaker Tone Output
IntegratedKeyboard Controller
- Hardwired Logic Provides Instant Response
- Supports PS/2 Mouse Interface
- Password Security and Password Power-Up
- System Sleep and Power-Up by Hot-Key
- KBC and PS2 Mouse Can Be Individually Disabled
IntegratedReal Time Clock(RTC) with 256B CMOS SRAM
- Supports ACPI Day-of-Month and Month-of-Year Alarm
- 256 Bytes of CMOS SRAM
- Provides RTC H/W Year 2000 Solution
Universal Serial Bus Host Controller
- OpenHCI Host Controller with Root Hub
- Two USB Host Controllers
- Six USB Ports
- Supports Legacy Devices
- Over Current Detection
I2C Bus/SMBUSSeries Interface
IntegratedFast Ethernet Controller and MACInterface
- Plug and Play Compatible
- High-Performance 32-Bit PCI Bus Master Architecture with Integrated Direct
Memory
- Supports Big Endian and Little Endian Byte Alignments
- Implements Optional PCI 3.3v Auxiliary Power Source 3.3Vaux Pin And Optional
PCI
- Supports Software, Enhanced Software, and Automatic Polling Schemes to Internal
- PHY Status Monitor and Interrupt
- Supports 10base-T, 100base-Tx
NANDTreefor BallConnectivity Testing
672-BallsBGAPackage
1.8VCore with Mixed 3.3V and 5V I/O CMOS Technology

8
PC Card Chipset
The PCI1410 supports the following features:
-Ability to wake from D3 hot and D3 cold
-Fully compatible with the IntelE 430TX (Mobile Triton II) chipset
-A 144-Pin Low-Profile QFP (PGE), 144-ball MicroStar Ball Grid Array (GGU)
package, or 209-ball MicroStar Ball Grid Array (GHK) package
-3.3-V core logic with universal PCI interfaces compatible with 3.3-V and 5-V PCI
signaling environments
-Mix-and-match 5-V/3.3-V 16-bit PC Cards and 3.3-V CardBus Cards
-Single PC Card or CardBus slot with hot insertion and removal
-Burst transfers to maximize data throughput on the PCI bus and the CardBus bus
-Parallel PCI interrupts, parallel ISA IRQ and parallel PCI interrupts, serial ISA
IRQ with parallel PCI interrupts, and serial ISA IRQ and PCI interrupts
-Serial EEPROM interface for loading subsystem ID and subsystem vendor ID
-Pipelined architecture allows greater than 130M bps sustained throughput from
CardBus-to-PCI and from PCI-to-CardBus
-Interface to parallel single-slot PC Card power interface switches like the TI
TPS2211
-Up to five general-purpose I/Os
-Programmable output select for CLKRUN
-Five PCI memory windows and two I/O windows available to the 16-bit PC Card
socket
-Two I/O windows and two memory windows available to the CardBus socket
-Exchangeable Card Architecture (ExCA) compatible registers are mapped in
memory and I/O space
-Intel 82365SL-DF and 82365SL register compatible
-Distributed DMA (DDMA) and PC/PCI DMA
-16-Bit DMA on the PC Card socket
-Ring indicate, SUSPEND, PCI CLKRUN, and CardBus CCLKRUN
-Socket activity LED pins
-PCI Bus Lock (LOCK)
-Advanced Submicron, Low-Power CMOS Technology
-Internal Ring Oscillator

9
CPU and Memory
CPU
The 5100S/5500S Notebook PC uses the Intel Mobile Pentium III/Celeron (.18) processor in a
µPGA2 package.
The Intel Mobile Pentium III/Celeron (.18) processor features an integrated L2 cache(256KB
for Pentium III and 128KB for Celeron (.18)) and a 64-bit high performance system bus.
The Mobile Pentium III/Celeron (.18) processor’s 64-bit wide Low Power Gunning Trans-
ceiver Logic system bus is compatible with the SIS630S AGPSet and provides a glue-less,
point-to-point interface for an I/O bridge/memory controller.
The Intel Mobile Pentium III and Celerons (.18) processors are fully compatible with all
software written for the Pentium processor with MMX technology, Pentium processor,
Intel486 microprocessor, and Intel386 microprocessor. In addition, they provide improved
multimedia & communications performance.
They feature:
Performance improved over existing mobile processors
- Supports the Intel Architecture with Dynamic Execution
- Supports the Intel Architecture MMX technology
Integrated primary (L1) instructions and data caches
- 4-way set associative, 32-byte line size, 1 line per sector
- 16-Kbyte instruction cache and 16-Kbyte writeback data cache
- Cacheable range programmable by processor programmable registers
Integrated second level (L2) cache
- 4-way set associative, 32-byte line size, 1 line per sector
- Operated at full core speed
- 128/256-Kbyte, ECC protected cache data array
Low Power GTL+ system bus interface
- 64-bit data bus, 100-MHz operation
- Uniprocessor, two loads only (processor and I/O bridge/memory controller)
- Short trace length and low capacitance allows for single ended termination
Voltage reduction technology
Pentium III processor clock control
- Quick Start for low power, low exit latency clock ‘throttling’
- Deep Sleep mode for extremely low power dissipation
Thermal diode for measuring processor temperature

10
L
O
heat sink cable
heat sink screws
Heat sink
Adding or replacing the processor.
Note: If you plan on removing the heat sink, which is necessary to add or replace the
processor, you will need to have a replacement heat sink pad available. Before proceed-
ing, please contact your dealer to get a replacement pad which you will need when you
reinstall the heat sink.
In order to add or replace the processor you must:
A: Remove the heat sink
B: Remove the processor
C: Insert a new processor
D: Reinstall the heat sink
E: Changing the SW DIP Switch settings
A:Remove the heat sink
1) Turn off the computer
2) Turn over the computer
3) Remove the Heat Sink and CPU Cover
4) Remove the 4 screws which hold the
heat sink in place.
5) Gently remove the heat sink cable.
6) Lift the heat sink out of the computer
Figure 4-3

11
L
O
OPEN 1) Turn the screw on the
processor lock to the
open position. (O)
B:Remove the processor
The processor is secured on the mainboard with a lock which is easily opened using a small
regular screwdriver.
With the heat sink already removed you will need to set the lock to the open position before
removing the processor:
Processor socket
Lock
L
O
processor mounted on the socket

12
3) Turn the screw to the locked
position (L)
LOCK
L
O
L
O
2) Lift the processor
from the socket.
C: Insert a new processor
1) With the processor lock in the open position, align the pins of the processor with the
holes in the socket.
2) Press the processor into
the socket.
L
O

13
D:Reinstallthe heat sink
Note: When reinstalling the heat sink, you will also have to replace the heat sink pad. A
heat sink pad can be obtained from your dealer.
1) Peel off the old heat sink pad and stick on a new one.
2) Insert the heat sink cable in the slot. (Figure 4-3)
3) Align the 4 screw holes on the heat sink with those on the mainboard and screw them
in about half way. Once all the screws are in about half way and the heat sink is
seated probably tighten the screws.
Heat sink pad
E:Changing the SW1 DIP Switch settings
If you have installed the processor with Intel Speedstep you will have to change the
SW1 DIP Switch settings. Follow these steps to get to change the SW1 DIP Switch
setings:
1) Turn off the computer.
2) Press the two keyboard latches to elevate the keyboard from its normal position.
3) Carefully lift the keyboard assembly out to expose the
mainboard.

14
SW1 DIP Switch
ON position
OFF position
Metal shield
7) Put the metal shield back into place
8) Put the keyboard back into place.
SW settings for Intel Speedstep processor
SW1-1 SW1-2 SW1-3 SW1-4
ON ON ON OFF
4) Remove the metal protective shield
5) Locate the SW DIP Switch on the right side.
6) Change the settings to the following:

15
Memory
The computer has two memory sockets for PC-100/PC-133 compliant, 144 pin SODIMM
(Small Outline Dual In-line Memory Module) modules. The memory can be expanded to 512
MB with the following combinations:
Once a new module is installed the memory size is automatically
detected by the POST routines when you turn on your computer.
Bank 0
(64-bit) Bank 1 (64-bit) Power Total
Size
32 MB Empty 32 MB
32 MB 32 MB 64 MB
64 MB Empty 64 MB
64 MB 32 MB 96 MB
64 MB 64 MB 128 MB
128 MB Empty 128 MB
128 MB 32 MB 160 MB
128 MB 64 MB 192 MB
128 MB 128 MB 256 MB
256 MB Empty 256 MB
256 MB 32 MB 288 MB
256 MB 64 MB 320 MB
256 MB 128 MB 384 MB
256 MB 256 MB
3.3V
512 MB

16
Expansion Memory Socket
The Model 5100S/5500S Notebook PC has two 144-pin SODIMM type memory sockets with the
followingconfiguration:
Pin SDRAM Pin SDRAM Pin SDRAM Pin SDRAM
1 Vss 2 Vss
73 Reserved 74 CLK1
3 DQ0 4 DQ32
75 Vss 76 Vss
5 DQ1 6 DQ33
77 Reserved 78 Reserved
7 DQ2 8 DQ34
79 Reserved 80 Reserved
9 DQ3 10 DQ35
81 Vdd 82 Vdd
11 Vdd 12 Vdd 83 DQ16 84 DQ48
13 DQ4 14 DQ36
85 DQ17 86 DQ49
15 DQ5 16 DQ37
87 DQ18 88 DQ50
17 DQ6 18 DQ38
89 DQ19 90 DQ51
19 DQ7 20 DQ39
91 Vss 92 Vss
21 Vss 22 Vss 93 DQ20 94 DQ52
23 DQMB0 24 DQMB4 95 DQ21 96 DQ53
25 DQMB1 26 DQMB5 97 DQ22 98 DQ54
27 Vdd 28 Vdd 99 DQ23 100 DQ55
29 A0 30 A3 101 Vdd 102 Vdd
31 A1 32 A4 103 A6 104 A7
33 A2 34 A5 105 A8 106 BA0
35 Vss 36 Vss 107 Vss 108 Vss
37 DQ8 38 DQ40
109 A9 110 BA1
39 DQ9 40 DQ41
111 A10 112 A11
41 DQ10 42 DQ42 113 Vdd 114 Vdd
43 DQ11 44 DQ43 115 DQMB2 116 CAS6#
45 Vdd 46 Vdd 117 DQMB3 118 DQMB7
47 DQ12 48 DQ44 119 Vss 120 Vss
49 DQ13 50 DQ45 121 DQ24 122 DQ56
51 DQ14 52 DQ46 123 DQ25 124 DQ57
53 DQ15 54 DQ47 125 DQ26 126 DQ58
55 Vss 56 Vss 127 DQ27 128 DQ59
57 Reserved 58 Reserved 129 Vdd 130 Vdd
59 Reserved 60 Reserved 131 DQ28 132 DQ60
61 CLK0 62 CKE0 133 DQ29 134 DQ61
63 Vdd 64 Vdd 135 DQ30 136 DQ62
65 RAS# 66 CAS# 137 DQ31 138 DQ63
67 WE# 68 CKE1#
139 Vss 140 Vss
69 S0# 70 A12 141 SDA 142 SCL
71 S1# 72 A13 143 Vdd 144 Vdd

17
5) Insert the memory module at an angle (about 45°)
and fit its connectors firmly into the bank .
6) Press down the edge of the memory module and lock
it into place .
7) Put the keyboard back into place.
Note: Only use Bank 0 if you have one memory module. If you are using two memory mod-
ules always use the larger module in Bank 0.
InstallingaMemoryModule
1) Turn off the computer.
2) Press the two keyboard latches at the top of the
keyboard to elevate the keyboard from its normal
position.
3) Carefully lift the keyboard assembly out to expose
the mainboard.
4) Locate the memory banks, Bank 0 is on the
right and Bank 1 is on the left.
Figure 4-1
Bank 1 Bank 0
Figure 4-2