Dell EMC PowerEdge MX7000 User manual

Dell PowerEdge MX7000
Next Generation Modular Platform, the Dell EMC Poweredge
MX7000 hosts exible blocks of server and storage resources
while providing outstanding eciencies through shared power,
cooling, networking, I/O, and management within the chassis itself.
Technical Guide

© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2018 - 08
Rev. A00

Contents
1 System overview ............................................................................................................ 6
Introduction........................................................................................................................................................................6
New technologies............................................................................................................................................................... 7
2 System features.............................................................................................................. 8
Product comparison........................................................................................................................................................... 8
Specications..................................................................................................................................................................... 9
3 Chassis view and features..............................................................................................10
Front view of the enclosure.............................................................................................................................................. 10
Left control panel.........................................................................................................................................................11
Right control panel...................................................................................................................................................... 13
Back view of the enclosure............................................................................................................................................... 14
4 Internal Architecture...................................................................................................... 15
Infrastructure boards.........................................................................................................................................................15
Main distribution board............................................................................................................................................... 15
Vertical power distribution board.................................................................................................................................15
Rear fan board............................................................................................................................................................ 15
System interconnection.....................................................................................................................................................16
Power supply AC connection...................................................................................................................................... 16
Internal fabrics............................................................................................................................................................ 16
USB............................................................................................................................................................................ 16
Front control panel and power control interfaces........................................................................................................ 16
5 Input output fabrics....................................................................................................... 17
Input output fabrics...........................................................................................................................................................17
Standalone pass through modules...............................................................................................................................17
Front sled to rear port mappings................................................................................................................................. 17
Other I/O modules......................................................................................................................................................18
6 Storage fabrics.............................................................................................................. 19
Storage fabric................................................................................................................................................................... 19
Power distribution.......................................................................................................................................................19
Fabric-C IOM interconnect......................................................................................................................................... 19
7 System Modules............................................................................................................20
Management Module (MM).............................................................................................................................................20
External Network RJ-45 Ports .................................................................................................................................. 20
External Micro USB Serial Port ..................................................................................................................................20
System ID Button ...................................................................................................................................................... 20
Compute Sled.................................................................................................................................................................. 20
3

Storage Sled.....................................................................................................................................................................20
I/O Modules......................................................................................................................................................................21
Power Supplies .................................................................................................................................................................21
Fans ................................................................................................................................................................................. 21
8 Rail kit...........................................................................................................................22
9 Power, thermal, and acoustics ......................................................................................23
Power...............................................................................................................................................................................23
Power Supply............................................................................................................................................................. 23
Thermal............................................................................................................................................................................ 24
Ambient Temperature Requirements...........................................................................................................................24
Acoustics..........................................................................................................................................................................25
Deployment Environment........................................................................................................................................... 25
Acoustical Performance............................................................................................................................................. 25
Acoustical Bae ........................................................................................................................................................26
Sound Cap................................................................................................................................................................. 26
Acoustical Dependencies............................................................................................................................................26
10 OpenManage systems management.............................................................................27
iDRAC with Lifecycle controller.........................................................................................................................................27
OpenManage Enterprise OpenManage Enterprise feature and benets..................................................................... 27
OpenManage Enterprise - Modular Edition.................................................................................................................30
Agent-free management.................................................................................................................................................. 30
Agent-based management............................................................................................................................................... 30
OpenManage console....................................................................................................................................................... 31
OpenManage systems management tools, utilities and protocols......................................................................................31
OpenManage Integrations................................................................................................................................................ 32
OpenManage Connections...............................................................................................................................................32
11 Appendix A. Additional specications........................................................................... 33
Population rules................................................................................................................................................................33
PSU redundancy and population rules.............................................................................................................................. 34
Chassis dimensions.......................................................................................................................................................... 35
Chassis weight................................................................................................................................................................. 35
Fan specications.............................................................................................................................................................36
PSU specications........................................................................................................................................................... 36
Ports and connectors specications.................................................................................................................................36
USB ports.................................................................................................................................................................. 36
Mini DisplayPort......................................................................................................................................................... 36
PowerEdge MX modules ports and connectors................................................................................................................37
PowerEdge MX740c...................................................................................................................................................37
PowerEdge MX840c.................................................................................................................................................. 37
PowerEdge MX7116n..................................................................................................................................................37
PowerEdge MX9116n..................................................................................................................................................37
PowerEdge MX5108n.................................................................................................................................................38
4

PowerEdge MXG610s................................................................................................................................................ 38
PowerEdge MX 10GBASE-T Ethernet Pass-Through Module.....................................................................................38
PowerEdge MX 25 Gb Ethernet Pass-Through Module..............................................................................................38
Video specications..........................................................................................................................................................38
Environmental specications............................................................................................................................................ 39
Standard operating temperature.................................................................................................................................40
Expanded operating temperature............................................................................................................................... 40
Particulate and gaseous contamination specications ................................................................................................41
12 Appendix B. Standards compliance.............................................................................. 42
13 Appendix C. Additional resources................................................................................. 43
14 Appendix D. Support and deployment services............................................................ 44
ProDeploy Enterprise Suite and Residency Services.........................................................................................................44
ProDeploy Plus........................................................................................................................................................... 44
ProDeploy...................................................................................................................................................................44
Basic Deployment.......................................................................................................................................................44
Residency Services.................................................................................................................................................... 45
Deployment services........................................................................................................................................................ 45
Remote Consulting Services............................................................................................................................................ 45
Data Migration Service.....................................................................................................................................................45
ProSupport Enterprise Suite.............................................................................................................................................45
ProSupport Plus............................................................................................................................................................... 46
ProSupport.......................................................................................................................................................................46
ProSupport One for Data Center......................................................................................................................................47
Support Technologies....................................................................................................................................................... 47
SupportAssist.............................................................................................................................................................47
TechDirect..................................................................................................................................................................48
Additional professional services........................................................................................................................................ 48
Dell Education Services.................................................................................................................................................... 48
Dell EMC Global Infrastructure Consulting Services......................................................................................................... 48
Dell EMC Managed Services............................................................................................................................................ 48
5

1
System overview
The PowerEdge MX portfolio delivers a fully managed, high performance system that will free up valuable IT resources and personnel
so you can focus on innovation. Break free from the bounds of technology silos and routine, daily and time consuming operational
management to realize your IT and digital business transformations.
PowerEdge MX, a unied, high performance kinetic infrastructure, provides the agility, resiliency and eciency to optimize a wide
variety of traditional and new, emerging data center workloads and applications. With its kinetic architecture and agile management
the MX portfolio dynamically congures compute, storage and fabric, increases team eectiveness and accelerates operations. Its
responsive design delivers the innovation and longevity customers of all sizes need for their IT and digital business transformations.
The PowerEdge MX ecosystem consists of a new chassis infrastructure, compute sleds, fabric switches, and a storage sled, all
managed by OpenManage Enterprise-Modular Edition.
Introduction
The MX7000 and MX-series portfolio delivers a fully managed, high performance system that will free up valuable IT resources and
personnel so you can focus on innovation. Break free from the bounds of technology silos and routine, daily and time consuming
operational management to realize your IT and digital business transformations. The new PowerEdge MX, a unied, high
performance kinetic infrastructure, provides the agility, resiliency and eciency to optimize a wide variety of traditional and new,
emerging data center workloads and appliances. With its kinetic architecture and agile management the MX portfolio dynamically
congures compute, storage and fabric, increases team eectiveness and accelerates operations. Its responsive design delivers the
innovation and longevity customers of all sizes need for their IT and digital business transformations.
The PowerEdge MX infrastructure provides:
Flexible architecture
• A exible architecture – Non-disruptive provisioning, on-demand allocation of compute, storage and networking resource pools.
• A scalable fabric – Cost-eective multi-chassis architecture with a broad array of open networking options and upgrade
simplicity for future I/O exibility.
• Granular storage – Dense, highly exible, hot swappable, scale-out direct attached storage sled with easy front access.
Agile management
• End-to-end lifecycle management and single point authentication for all devices from a single interface.
•Simplied set-up/updates with no specialized training needed, and with multiple at-the-box management options.
• An operational template methodology and comprehensive Rest API.
Responsive design
• An industry leading fabric, system thermal architecture, mechanical design and control algorithms for dense congurations with
future compatibility.
• A hardened design to protect, detect and recover underlying infrastructure from cyber attacks.
6

New technologies
The following are the new technologies featured on the PowerEdge MX7000:
Table 1. New technologies
New technology Detailed description
Form factor The MX7000 has all new chassis, sled and I/O module form
factors
I/O Fabrics The MX7000 support exible I/O Fabrics
Direct Orthogonal connection Direct Orthogonal Compute to I/O connections allowing for
future technology upgrades
System management solution New Systems Management solution including x86 management
processor option
KVM module KVM solution integrated into Management processor
7

2
System features
The MX7000 enclosure has the following features:
• Sleds
– 8 single wide or 4 double wide sleds
– Double wide sleds in slots 1-2, 3-4, 5-6, 7-8
• Power supply units
– Up to 6 front loading power supply units
• Fans
– 4 x 60 mm front fan modules
– 5 x 80 mm rear fan modules
• Right control panel ear
– Power button and LED indicators
– 2 USB Type-A and 1 USB type Micro-AB
– 1 Mini DisplayPort
• Left control panel ear - three congurations
– LCD with QuickSync
– LCD without QuickSync
– LED indicators only
Product comparison
Table 2. Feature comparison
Feature MX7000 M1000e
Rack height 7U rack chassis enclosure 10U blade chassis enclosure
Sled orientation Vertical Vertical
Sled support Up to:
8 single-width sleds or
4 double-width sleds
Up to seven Storage sleds can be
populated in the enclosure.
Up to:
16 half-height blades or
8 full-height blades or
32 quarter-height blades
Input output modules 3+3 (A/B/C)
A/B direct-IO interconnect
C is Midplane-based interconnect
3+3 (A/B/C)
Midplane-based interconnect
A reserved for Ethernet
Power Supplies 6 x 3 kW 6 x 3 kW
KVM Integrated with the Management module Discrete design
8

Specications
Table 3. Technical specications
Features Specications
Form factor 7U rack
Sled orientation Vertical
Sled support Up to 8 standard-height, or 4 double-wide, or 16 half-height
sleds
I/O modules 3+3 (A/B/C). A and B direct I/O Ethernet interconnect. C is
midplane-based bre channel or SAS interconnect.
Power supplies 6 x 3KW
KVM Integrated with EC/MSM
9

3
Chassis view and features
The MX740c is a full-height, two socket compute sled for the MX7000 chassis.
Front view of the enclosure
Figure 1. Front view of the enclosure
1. Left control panel 2. Single-width compute sled
3. Sled blank 4. Front fan (4)
5. Double-width compute sled 6. Single-width storage sled
7. Right control panel 8. Information tag
9. Power supply unit (6)
10

Left control panel
Figure 2. Left control panel - Status LED
Table 4. Left control panel - LED indicator description
Indicator Description Status
1 System health Blinks amber for 2 seconds and is OFF for 1 second when the chassis health has degraded. By
default, the LED is unlit.
2 System
temperature
Blinks amber for 2 seconds and is OFF for 1 second when a thermal fault exists on the
enclosure. By default, the LED is unlit.
NOTE: A thermal fault includes excessive ambient temp, I/O modules thermal status,
PSU thermal status, and fan status.
3 I/O module health Blinks amber for 2 seconds and is OFF for 1 second when an I/O module is faulty. By default
the LED is unlit.
4 Fan health Blinks amber for 2 seconds and is OFF for 1 second when a front or rear mounted fan fails or
has a warning. By default, the LED is unlit.
5 Stack or group Indicates that the enclosure is a member of a group.
6 LED status bar Indicator status Description
Solid blue Indicates that the enclosure is healthy.
Blinking blue Indicates that the system ID mode is active.
Blinking amber Indicates that the system is experiencing a fault.
7 System ID button Allows you to identify the system or the installed sleds.
11

Figure 3. Left control panel - LCD options
Table 5. Left control panel - LCD panel description
Indicator Description Status
1 LCD with Quick
Sync
LCD enabled with Quick Sync module
2 LCD without
Quick Sync
LCD without Quick Sync module
3 System ID
indicator on LCD
panel
This option is a button/indicator on the LCD panel to identify the chassis, or choose specic
sleds to identify.
4 Settings This option button provides access to the inventory and conguration data of the MX7000
enclosure. It includes the Network Settings, System Information, (Model, Asset Tag, Service
Tag), and Language Settings.
5 Optional
QuickSync
indicator (Only for
LCD with
QuickSync 2.0)
Enables access to QuickSync related controls and connection information.
NOTE: QuickSync feature allows you to manage your system using mobile devices.
This feature is only available on certain congurations.
NOTE: If not ordered at the time of purchase, the QuickSync module will not be
available on the enclosure.
6 System alerts
indicator
System ID Indicator status Description
Solid green The chassis has no degraded or critical alerts.
Solid amber The chassis has critical or degraded health alerts.
NOTE: This option button/indicator shows an amber colored alert icon and a combined
critical and degraded alert count. Pressing the button takes the user to the alert details
menu.
7LCD activation
button/
System ID
Allows you to identify the enclosure.
NOTE: Press the button to activate the LCD.
12

Indicator Description Status
indicator/
Identication
indicator
System ID Indicator status Description
Blinking blue System ID is active.
Blinking amber Chassis alerts are present.
8 Error indicator The error indicator is displayed on the LCD when there are any critical/warning alerts on the
enclosure.
9 Optional Quick
Sync wireless
status indicator
Displays the connection status of the enclosure with any QuickSync enabled device.
NOTE: For more information about the feature, see LCD touch panel.
Right control panel
Figure 4. Right control panel
1. Power button 2. USB 2.0 port (2)
3. Mini display port
13

Back view of the enclosure
Figure 5. Back view of the enclosure
1. Slot for Fabric A1 2. Slot for Fabric A2
3. Rear fans (5) 4. Slot for Fabric B1
5. Slot for Fabric B2 6. Slot for Fabric C2
7. Power cord connection status LED 8. Power supply input sockets (6)
9. Management Module 2 10. Management Module 1
11. Slot for Fabric C1
14

4
Internal Architecture
The following sections contain information about the internal architecture of Dell EMC PowerEdge MX7000 system.
The following diagram is a simplied view of the MX7000 system, showing some of the modules and their interconnection.
Figure 6. Internal Architecture
Infrastructure boards
Main distribution board
The main distribution board is the most complex of all the internal infrastructure boards. There are no active components, however
there are many signals interconnected on this board. The main distribution board is horizontally placed near the chassis oor. From
the front of the chassis, the six power supplies plug into connectors on the bottom of the main distribution board. Also from the
front of the chassis the eight compute sleds plug into this board for power, management signals, and other fabric connections. From
the rear of the chassis the Management Modules (MMs) plug in to this board to provide overall chassis management and control.
Also from the rear of the chassis the two fabric I/O Modules (Fabric - C IOMs) plug into this board.
Vertical power distribution board
The vertical power distribution board is above the main distribution board, oriented perpendicular to the chassis oor. There are no
active components, but many signal connections on this board. This board connects to the main distribution board with a ex cable,
and power and ground bus bars. From the front of the chassis, the four cooling fans plug into the vertical power distribution board.
Also from the rear of the chassis the four fabric I/O Modules (Fab-A/B IOMs) plug into this board for power, management signals,
and other fabric connections. A cable connects this board to the rear fan board.
Rear fan board
The rear fan board, or 80 mm Fan Interposer, sits parallel to the chassis oor. The rear fans plug into this board from the rear of the
chassis. This board connects internally to the vertical power distribution board, through a signal and power cable.
15

System interconnection
Power supply AC connection
The PSUs are accessed from the front, however the AC power cable connection is at the rear of the chassis. There are six C22 inlet
connectors, three on the rear left, and three on the rear right side. Each PSU has an associated AC good LED located next to its
associated plug. If a PSU is not present, plugging in an AC cord has no eect. If a PSU is present, and the AC power source is
providing the appropriate power signal, the PSU drives the LED ON.
The C22 Inlet connectors allow for higher exhaust temperatures. The connectors are dierent than previous PowerEdge oerings, a
C20 to C21 jumper cord is required to connect to the inlet connectors.
Internal fabrics
This infrastructure has numerous communication paths or fabrics interconnecting the modules. The management fabric, referred to
as Fabric-D connects from each Management Module (MM) slot with a point-to-point link to each front slot and each IOM slot. This
fabric runs at 1 Gb/sec, an improvement over previous infrastructures which have run at 100 Mb/sec. A 10Gbit/sec link spans the
Main DB between the two MM slots for communication between those modules.
A second fabric in the infrastructure is Fabric-C. This fabric connects between the IOM C1/C2 modules and each front sled slot. This
fabric is intended for storage applications, for example SAS. Each front slot Fabric-C connection has two links, each x4 in width to
each of the IOMs, IOM_C1 and IOM_C2. Today, this fabric supports 12 Gb/sec SAS and Fibre Channel at 32 Gb/sec.
USB
Each MM has a USB 2.0 link to the control panel. Only one port is operational at a time, based on which MM is active.
Front control panel and power control interfaces
Each MM displays the video to the front control panel Mini DisplayPort. The active MM drives the video. In addition to the DP video,
there are also individual links for USB from each MM to the right control panel.
16

5
Input output fabrics
The following sections contain information about Dell EMC PowerEdge MX7000 Input output fabrics.
Input output fabrics
The internal connection of the main I/O subsystem in MX7000 enclosure is referred to as fabric A and B. These fabrics are
connected using a direct orthogonal connection between sleds in the front of the chassis and I/O fabric modules in the rear. The
mating connection on the sleds is on the mezzanine cards, which can install into location A or B on the sled.
Each fabric A and B allows for two IOMs (that is, A1 and A2, or B1 and B2) for redundancy. Each IOM connects to all 8 compute
nodes through the orthogonal connectors. The connection from the IOM to each compute node (The mezzanine card on the
compute node) is a x8 bi-directional link. Depending on the interface, all the lanes within the link may not be used, however the x8
provides a path for future high-bandwidth fabric types.
Standalone pass through modules
Two stand alone Ethernet pass through modules are supported in the initial release, a 10G (Base-T) and 25 GbE pass through
module. The pass-through IOMs plug into the fabric A or B IOM slots in the chassis. These IOMs redrive, or pass through the link
signals without any switching. Each shall provide 16 internal server-facing ports and 16 external user-facing ports.
NOTE: Only the ports 1-8 are active, when compute sleds with dual-port mezzanine adapters are congured with the
pass-through modules. The ports 9-16 require a quad-port mezzanine adapter.
Front sled to rear port mappings
The external port assignments of pass-thru modules are xed due to the direct routing connection internal to the system and the
IOM itself.
NOTE: If storage or other peripheral sleds are installed that do not support fabric A/B connections, the corresponding
ports on the I/O modules mapping to these slots are not active. This is also the case for any compute sled that does not
have a mezzanine card that is installed for the particular IOM (A or B) in the system.
A standard size compute sled is congured with dual port fabric A/B mezzanine maps to a single port on each (A or B) I/O module.
Table 6. Compute sleds dual-port mapping
Compute sled IOM x1 (top) IOM x2 (bottom)
111
222
333
444
555
666
777
17

Compute sled IOM x1 (top) IOM x2 (bottom)
888
Table 7. Compute sleds with quad-port mezzanine cards mapping
Compute sled IOM x1 (top) IOM x2 (bottom)
1 1, 9 1, 9
2 2, 10 2, 10
3 3, 11 3, 11
4 4, 12 4, 12
5 5, 13 5, 13
6 6, 14 6, 14
7 7, 15 7, 15
8 8, 16 8, 16
Other I/O modules
In addition to the standalone pass through modules previously described, MX7000 enclosure supports the following IOMs:
• MX9116n
• MX7116n
• MX5108n
• MXG610s
18

6
Storage fabrics
The following sections contain information about Dell EMC PowerEdge MX7000 storage fabrics.
Storage fabric
Power distribution
The internal connection of the storage subsystem in the MX7000 enclosure is referred to as Fabric C. This fabric is connected on the
Main DB between sleds in the front of the MX7000 enclosure and I/O modules in the rear. The primary use cases for this fabric will
be for SAS or Fibre Channel storage connectivity, however other technologies could utilize this interconnect in the future.
Each compute sled can support a Fabric-C Mezz card, which connects to each IOM through a x4 link. The SAS Fabric-C IOMs
provide exible SAS switching between compute sleds and internal storage sleds (MX5016s) connected to the MX7000 enclosure.
The bre channel IOMs provide connectivity between compute sleds and external storage.
Fabric-C IOM interconnect
There are several connections on the Main DB to enable communication between the IOMs. Between each pair of IOMs (C1 and
C2), there is a link for intermodule communication. This link supports a x1 connection with each lane operating up to 10 Gbps per
direction. In addition , there are also handshake signals between the two modules to facilitate redundancy/failover or other module to
module communication. The usage of these interconnects depends on the IOM design and its particular requirements.
19

7
System Modules
The following sections contain information about Dell EMC PowerEdge MX7000 system modules.
Management Module (MM)
The MX9002m Management Module (MM), or MM, essentially controls the overall chassis power, cooling, and physical user
interfaces such as the front panel. It also contains the Ethernet switch used by the management network (Fab-D) and external
Ethernet ports. MX7000 supports two MM for redundancy. At least one MM is required to power up the system.
External Network RJ-45 Ports
The MM internal network switch supports dual 1000BASE-T uplink ports to the chassis management network. The management
network provides Gigabit Ethernet (GbE) connectivity to a Sleds, and IOMs. Either uplink port may be used as a stacking port if
multiple MM are daisy-chained to networking switches.
External Micro USB Serial Port
The MX9002m Management Module (MM) provides a Micro-USB port for serial access by an external host. The UART settings are
115K baud, 8 data bits, 1 stop bit.
System ID Button
The System ID button on the MM rear panel allows for identifying the system in a rack. When pressed, the front panel of the chassis
will also blink in the identify pattern. This button also serves as the Health status LED indicator, displaying blue for health or blinking
amber if the MM has a fault.
The rear mounted ID button ONLY illuminates the Chassis/MM ID button, it does not step through the other devices like the Left
Control Panel ID Button.
Compute Sled
The MX7000 supports up to eight standard size or up to four double wide compute sleds. The MX7000 supports 14G Next-
Generation Modular (NGM) compute sleds but does not support 13G, FX2 or M1000e form-factor sleds.
Storage Sled
The MX7000 can accept a storage sled in the front slot, using the same form factor of a compute sled. The MX5016s is an example
of this type of sled. The storage sled shall use the Fab-C interconnect within the chassis to communicate with the IOMs.
NOTE: There is no pre-assigned mapping of a storage sled to a compute sled in the MX7000/MX5016s conguration.
User may map the entire storage sled to any compute sled, or map specic hard drives within the storage sleds to
dierent compute sleds.
20