Dell Latitude 3310 User manual

Dell Latitude 3310 2-in-1
Service Manual
Regulatory Model: P118G
Regulatory Type: P118G001

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2019 -2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
2020 - 01
Rev. A00

1 Working on your computer............................................................................................................ 5
Safety instructions................................................................................................................................................................ 5
Turning off your computer............................................................................................................................................. 5
Before working inside your computer........................................................................................................................... 6
Safety Precautions.......................................................................................................................................................... 6
After working inside your computer.............................................................................................................................12
2 Technology and components........................................................................................................13
UEFI BIOS............................................................................................................................................................................. 13
DDR4......................................................................................................................................................................................14
Graphic options.................................................................................................................................................................... 15
HDMI 1.4a..............................................................................................................................................................................15
Battery specifications.......................................................................................................................................................... 16
USB features........................................................................................................................................................................ 16
USB Type-C..........................................................................................................................................................................18
Media Card Readers............................................................................................................................................................ 19
Downloading Windows drivers........................................................................................................................................... 19
Command | Configure Graphical User Interface....................................................................................................... 20
3 Major components of your system ...............................................................................................22
4 Disassembly and reassembly....................................................................................................... 25
Base cover............................................................................................................................................................................25
Removing the base cover.............................................................................................................................................25
Installing the base cover............................................................................................................................................... 26
Battery.................................................................................................................................................................................. 28
Removing the battery................................................................................................................................................... 28
Installing the battery......................................................................................................................................................29
Memory modules................................................................................................................................................................. 30
Removing the memory modules.................................................................................................................................. 30
Installing the memory modules..................................................................................................................................... 31
Solid state drive................................................................................................................................................................... 32
Removing the M.2 2230 solid-state drive.................................................................................................................. 32
Replacing the SSD support bracket............................................................................................................................ 32
Installing M.2 2230 solid-state drive........................................................................................................................... 33
Coin-cell battery.................................................................................................................................................................. 34
Removing the coin-cell battery....................................................................................................................................34
Installing the coin-cell battery...................................................................................................................................... 35
WLAN card...........................................................................................................................................................................36
Removing the WLAN card............................................................................................................................................36
Installing the WLAN card.............................................................................................................................................. 37
Speakers............................................................................................................................................................................... 38
Removing the speakers.................................................................................................................................................38
Installing the speakers...................................................................................................................................................39
Contents
Contents 3

Heatsink assembly...............................................................................................................................................................40
Removing the heatsink assembly................................................................................................................................ 40
Installing the heatsink assembly....................................................................................................................................41
System Fan........................................................................................................................................................................... 41
Removing the system fan..............................................................................................................................................41
Installing the system fan............................................................................................................................................... 42
I/O board.............................................................................................................................................................................. 44
Removing the input and output board........................................................................................................................44
Installing the input and output board.......................................................................................................................... 45
DC-in port.............................................................................................................................................................................46
Removing the DC-in......................................................................................................................................................46
Installing the DC-in.........................................................................................................................................................47
World facing camera........................................................................................................................................................... 48
Removing the world-facing camera............................................................................................................................ 48
Installing the world-facing camera.............................................................................................................................. 49
Touchpad buttons............................................................................................................................................................... 49
Removing the touchpad .............................................................................................................................................. 49
Installing the touchpad...................................................................................................................................................51
System board.......................................................................................................................................................................53
Removing the system board........................................................................................................................................ 53
Installing the system board...........................................................................................................................................55
Display assembly..................................................................................................................................................................58
Removing the display assembly................................................................................................................................... 58
Installing the display assembly..................................................................................................................................... 59
LCD panel..............................................................................................................................................................................61
Removing the LCD panel...............................................................................................................................................61
Installing the LCD panel................................................................................................................................................ 62
5 Diagnostics................................................................................................................................64
ePSA Diagnostics................................................................................................................................................................ 64
Validation Tools ............................................................................................................................................................. 67
WiFi power cycle..................................................................................................................................................................73
Diagnostic LEDs................................................................................................................................................................... 74
M-BIST..................................................................................................................................................................................74
Self-Heal............................................................................................................................................................................... 75
Course Introduction.......................................................................................................................................................75
Self-Heal Instruction......................................................................................................................................................75
Supported Latitude Models..........................................................................................................................................75
BIOS recovery......................................................................................................................................................................76
BIOS recovery using hard drive................................................................................................................................... 76
BIOS recovery using USB drive....................................................................................................................................77
LCD Built-in Self Test .........................................................................................................................................................77
6 Getting help and contacting Dell.................................................................................................. 79
4Contents

Working on your computer
Safety instructions
Prerequisites
Use the following safety guidelines to protect your computer from potential damage and to ensure your personal safety. Unless otherwise
noted, each procedure included in this document assumes that the following conditions exist:
• You have read the safety information that shipped with your computer.
• A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order.
About this task
NOTE: Disconnect all power sources before opening the computer cover or panels. After you finish working inside the
computer, replace all covers, panels, and screws before connecting to the power source.
WARNING: Before working inside your computer, read the safety information that shipped with your computer. For
additional safety best practices information, see the Regulatory Compliance Homepage
CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and
simple repairs as authorized in your product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow
the safety instructions that came with the product.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching
an unpainted metal surface at the same time as touching a connector on the back of the computer.
CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by
its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.
CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables
have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you
disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also,
before you connect a cable, ensure that both connectors are correctly oriented and aligned.
NOTE: The color of your computer and certain components may appear differently than shown in this document.
Turning off your computer
Turning off your computertablet tablet— Windows
About this task
CAUTION: To avoid losing data, save and close all open files and exit all open programs before you turn off your
computer or remove the side cover.
Steps
1. Click or tap .
2. Click or tap and then click or tap Shut down.
1
Working on your computer 5

NOTE: Ensure that the computer and all attached devices are turned off. If your computer and attached devices did
not automatically turn off when you shut down your operating system, press and hold the power button for about 6
seconds to turn them off.
Before working inside your computer
Steps
1. Ensure that your work surface is flat and clean to prevent the computer cover from being scratched.
2. Turn off your computer.
3. If the computer is connected to a docking device (docked), undock it.
4. Disconnect all network cables from the computer (if available).
CAUTION: If your computer has an RJ45 port, disconnect the network cable by first unplugging the cable from your
computer.
5. Disconnect your computer and all attached devices from their electrical outlets.
6. Open the display.
7. Press and hold the power button for a few seconds to ground the system board.
CAUTION: To guard against electrical shock, unplug your computer from the electrical outlet before performing Step
# 8.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically
touching an unpainted metal surface at the same time as touching a connector on the back of the computer.
8. Remove any installed ExpressCards or Smart Cards from their slots.
Safety Precautions
Follow the safety precautions described in the following sections when you perform an installation or a disassembly/reassembly procedure:
• Turn off the system and all attached peripherals.
• Disconnect the system and all attached peripherals from AC power, and then remove the battery.
• Disconnect all network cables, telephone or telecommunications lines from the system.
• Use a wrist grounding strap and mat when working inside any computer system to avoid electrostatic discharge (ESD) damage.
• After removing a system component, carefully place the removed component on an anti-static mat.
• Wear shoes with non-conductive rubber soles to help reduce the risk of being shocked or seriously injured in an electrical accident.
Standby Power
Dell products with standby power must be completely unplugged before the case is opened. Systems that incorporate standby power are
essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN), suspended into a
sleep mode, and have other advanced power management features.
After you unplug a system and before you remove components, wait approximately 30 to 45 seconds to allow the charge to drain from
the circuits.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a
Field Service ESD kit. When connecting a bonding wire, always ensure that it is connected to bare metal and never to a painted or non-
metal surface. The wrist strap should be secure and in full contact with your skin, and be sure to always remove all jewelry such as
watches, bracelets, or rings prior to bonding yourself and the equipment.
6Working on your computer

Figure 1. Bonding Properly
Electrostatic Discharge Protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,
memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent
problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is
an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in earlier
Dell products. For this reason some previously approved methods of handling parts are no longer applicable.
There are two recognized types of ESD damage: catastrophic and intermittent failures.
•Catastrophic —The damage causes an immediate and complete loss of device functionality. An example of catastrophic failure is a
memory DIMM that has received a static shock and immediately generates a "No POST/No Video" symptom with a beep code
emitted for missing or nonfunctional memory.
NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.
•Intermittent —The DIMM receives a static shock, but the tracing is merely weakened and does not immediately produce outward
symptoms related to the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause
degradation of memory integrity, intermittent memory errors, etc.
NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of
intermittent failures means that most of the time when damage occurs, it is not immediately recognizable.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or “walking wounded”) failure. The
following image shows an example of intermittent damage to a memory DIMM trace. Although the damage is done, the symptoms may
not become an issue or cause permanent failure symptoms for some time after the damage occurs.
Figure 2. Intermittent (Latent) Damage to a Wiring Trace
Do the following to prevent ESD damage:
• Use a wired ESD wrist strap that is properly grounded.
The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection.
Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased sensitivity to ESD
damage.
Working on your computer 7

Figure 3. Chassis "Bare Metal" Grounding (Unacceptable)
• Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
• When handling static-sensitive components, grasp them by the sides, not the top. Avoid touching pins and circuit boards.
• When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing
material until you are ready to install the component. Before unwrapping the anti-static packaging, be sure to discharge static
electricity from your body.
• Before transporting a static-sensitive component, place it in an anti-static container or packaging.
The ESD Field Service Kit
The unmonitored Field Service kit is the most commonly used. Each Field Service kit includes three main components: anti-static mat,
wrist strap, and bonding wire.
Figure 4. ESD Field Service Kit
The anti-static mat is dissipative and should be used to safely place parts on during service procedures. When using an anti-static mat,
your wrist strap should be snug and the bonding wire should be connected to the mat and to bare-metal on the system being worked on.
Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. Remember, the only safe place
for ESD-sensitive items are in your hand, on the ESD mat, in the system, or inside a bag.
8Working on your computer

Figure 5. Anti-Static Mat
The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware if the ESD mat is
not required, or connected to the anti-static mat to protect hardware that is temporarily placed on the mat. The physical connection of
the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is known as bonding. Use only Field Service kits with
a wrist strap, mat, and bonding wire. Never use wireless wrist straps.
Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly
with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire a
minimum of once per week.
Table 1. Wrist Straps
Wrist Strap and Bonding Wire Wireless ESD Strap (Unacceptable)
ESD Wrist Strap Tester
The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is best practice to regularly test the
strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best method for doing this test. If you do
not have your own wrist strap tester, check with your regional office to find out if they have one. To perform the test, plug the wrist-
strap’s bonding-wire into the tester while it is strapped to your wrist and push the button to test. A green LED is lit if the test is
successful; a red LED is lit and an alarm sounds if the test fails.
Working on your computer 9

Figure 6. Wrist Strap Tester
Insulator Elements
It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulators and often highly
charged.
Table 2. Placement of Insulator Elements
Unacceptable — DIMM lying on an insulator part (plastic
heat sink shroud)
Acceptable — DIMM separated from the insulator part
Consider the Working Environment
Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit for a server
environment is different than for a desktop or portable environment. Servers are typically installed in a rack within a data center; desktops
or portables are typically placed on office desks or cubicles.
Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additional space to
accommodate the type of system that is being repaired. The workspace should also be free of insulators that can cause an ESD event. On
the work area, insulators such as Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from
sensitive parts before physically handling any hardware components.
ESD Packaging
All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred. However, you
should always return the damaged part using the same ESD bag and packaging that the new part arrived in. The ESD bag should be folded
over and taped shut and all the same foam packing material should be used in the original box that the new part arrived in.
ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should never be placed on
top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the ESD mat, in the system, or
inside an anti-static bag.
10 Working on your computer

Figure 7. ESD Packaging
Transporting Sensitive Components
When transporting ESD-sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in
anti-static bags for safe transport.
ESD Protection Summary
It is strongly suggested that all field service engineers use the traditional wired ESD grounding wrist strap and protective anti-static mat at
all times when servicing Dell products. In addition, it is critical that engineers keep sensitive parts separate from all insulator parts while
performing service and that they use anti-static bags for transporting sensitive components.
Lifting Equipment
NOTE: Do not lift greater than 50 pounds. Always obtain assistance from another person or persons, or use a
mechanical lifting device.
Adhere to the following guidelines when lifting equipment:
1. Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.
2. Bend your knees. Do not bend at the waist.
3. Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
4. Lift with your legs, not your back.
5. Keep the load close. The closer it is to your spine, the less force it exerts on your back.
6. Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your
body and back.
7. Follow the same techniques in reverse to set the load down.
Working on your computer 11

After working inside your computer
About this task
After you complete any replacement procedure, ensure that you connect external devices, cards, and cables before turning on your
computer.
CAUTION: To avoid damage to the computer, use only the battery designed for this particular Dell computer. Do not use
batteries designed for other Dell computers.
Steps
1. Connect any external devices, such as a port replicator or media base, and replace any cards, such as an ExpressCard.
2. Connect any telephone or network cables to your computer.
CAUTION: To connect a network cable, first plug the cable into the network device and then plug it into the
computer.
3. Connect your computer and all attached devices to their electrical outlets.
4. Turn on your computer.
12 Working on your computer

Technology and components
This chapter details the technology and components available in the system.
Topics:
•UEFI BIOS
•DDR4
•Graphic options
•HDMI 1.4a
•Battery specifications
•USB features
•USB Type-C
•Media Card Readers
•Downloading Windows drivers
UEFI BIOS
UEFI is an acronym for Unified Extensible Firmware Interface. The UEFI specification defines a new model for the interface between
personal computer operating systems and platform firmware. The interface consists of data tables that contain platform related
information, plus boot and runtime service calls that are available to the operating system and its loader. Together, these provide a
standard environment for booting an operating system and running pre-boot applications. One of the main differences between BIOS and
UEFI is the way applications are coded. Assembler was used if functions or applications had to be coded for the BIOS while a higher level
language code will be used to program the UEFI.
Dell UEFI BIOS implementation will supersede the existing two different sets of BIOS in the portables and desktop products into one single
UEFI BIOS moving forward.
Important Information
There is no difference in between the conventional BIOS and the UEFI BIOS unless the UEFI option is checked in the 'Boot List Option'
setting in the BIOS page. This will allow the user to create a UEFI boot option list manually without affecting the existing boot priority list.
With the implementation of UEFI BIOS, the changes are more related to the manufacturing tools and functionalities with very minimal
impact to the customer's usages.
A few things to remember are:
• If customers have a UEFI boot media, and ONLY if they have UEFI boot media (either in the optical media or via USB storage), the
one-time boot menu will show an additional section listing the UEFI boot options. Customers can view this option If they have UEFI
boot media attached, and the UEFI boot option is specified manually through the 'Boot Sequence' settings.
How to change Service Tag/Owner Tag?
When the service technician replaces a system board, its required to set the service tag when the system restarts. Failure to set a service
tag may result in system battery not being able to charge. Therefore, it is very important that the service technician set the correct
system service tag. If a wrong service tag is set, then the technician will have to place the order for another system board replacement.
How to change Asset tag information?
To change the Asset tag information, we can use one of the following software utilities:
• Portables Technology Dell Command Configure toolkit-
Customers may also report that after a motherboard replacement, the asset field is already populated in the system BIOS, and needs
to be cleared or set. For older systems and all newer systems with the UEFI BIOS platform, customers can download the Dell
Command Configure Toolkit (DCC) to customize the BIOS options or even change the ownership or asset tag from within Windows.
2
Technology and components 13

DDR4
DDR4 (Double Data Rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows up to
512 GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access memory is
keyed differently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the system.
DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4 also
supports a new, deep power-down mode that allows the host device to go into standby without needing to refresh its memory. Deep
power-down mode is expected to reduce standby power consumption by 40 to 50 percent.
DDR4 Details
There are subtle differences between DDR3 and DDR4 memory modules, as listed below:
Key notch difference
The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the insertion edge
but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an incompatible board or platform.
Figure 8. Notch difference
Increased thickness
DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.
Figure 9. Thickness difference
Curved edge
DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.
Figure 10. Curved edge
14 Technology and components

Memory Errors
Memory errors on the system display the new 2 - Amber, 3 - White failure code. If all memory fails, the LCD does not turn on.
Troubleshoot for possible memory failure by trying known good memory modules in the memory connectors on the bottom of the system
or under the keyboard, as in some portable systems.
Graphic options
This topic lists the graphic specifications.
Table 3. Integrated Graphics specification
Parameters Values
Integrated Graphics Controller Intel UHD Graphics 610, Intel UHD Graphics 620
Model Latitude 3310 2 in 1
Bus Type Internal Interface
Memory Interface Unified Memory Architecture
Graphics Level • Intel Core i3/i5- Intel UHD Graphics 620
• Intel Pentium DC- Intel UHD Graphics 610
Estimated Maximum Power Consumption (TDP) 15 W (in the CPU power)
Display Support On System- eDP (internal), HDMI, DP over USB Type-C
Maximum Vertical Refresh Rate Up to 85 Hz depending on resolution
Operating Systems Graphics/ Video API Support DirectX 12, OpenGL 4.5
Supported Resolutions and Max Refresh Rates (Hz), Analog
and/or digital
System ports:
• Max Digital- (HDMI) 4096x2304@24 Hz; (DP over TYPE-C)
4096x2304@60 Hz
Numbers of Displays Supported • System Ports- Three displays max with LCD plus one display max
on each output (HDMI, DisplayPort over USB Type-C).
NOTE: A USB Type C Dell dock is optional.
HDMI 1.4a
This topic explains the HDMI 1.4a and its features along with the advantages.
HDMI (High-Definition Multimedia Interface) is an industry-supported, uncompressed, all-digital audio/video interface. HDMI provides an
interface between any compatible digital audio/video source, such as a DVD player, or A/V receiver and a compatible digital audio and/or
video monitor, such as a digital TV (DTV). The primary advantage is cable reduction and content protection provisions. HDMI supports
standard, enhanced, or high-definition video, plus multichannel digital audio on a single cable.
HDMI 1.4a Features
•HDMI Ethernet Channel - Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled
devices without a separate Ethernet cable.
•Audio Return Channel - Allows an HDMI-connected TV with a built-in tuner to send audio data "upstream" to a surround audio
system, eliminating the need for a separate audio cable.
•3D - Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications.
•Content Type - Real-time signaling of content types between display and source devices, enabling a TV to optimize picture settings
based on content type.
•Additional Color Spaces - Adds support for additional color models used in digital photography and computer graphics.
Technology and components 15

•4K Support - Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema
systems used in many commercial movie theaters.
•HDMI Micro Connector - A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p.
•Automotive Connection System - New cables and connectors for automotive video systems, designed to meet the unique
demands of the motoring environment while delivering true HD quality.
Advantages of HDMI
• Quality HDMI transfers uncompressed digital audio and video for the highest, crispest image quality.
• Low-cost HDMI provides the quality and functionality of a digital interface while also supporting uncompressed video formats in a
simple, cost-effective manner.
• Audio HDMI supports multiple audio formats from standard stereo to multichannel surround sound.
• HDMI combines video and multichannel audio into a single cable, eliminating the cost, complexity, and confusion of multiple cables
currently used in A/V systems.
• HDMI supports communication between the video source (such as a DVD player) and the DTV, enabling new functionality.
Battery specifications
This topic lists out the detailed battery specifications.
Table 4. Battery specifications
Parameter Values
Battery Type Polymer 3C 42 Wh smart battery
Dimension:
Width 191.85 mm (7.55 in.)
Height 103.25 mm (4.06 in.)
Weight 0.20 kg (0.44 lb)
Depth 5.90 mm (0.23 in.)
Voltage 11.40 VDC
Typical Amp-hour capacity 3.684 Ah
Typical Watt-hour capacity 42 Wh
Operating time 0°C–35°C
Charge: 0°C–50°C
Discharge: 0°C–70°C
Temperature range: Operating Charge: 0°C–50°C, 32°F–122°F,
Discharge: 0°C–70°C, 32°F–158°F
Temperature range: Non-Operating -20°C–65°C (-4°F–149°F )
Charging time 0 deg~15 deg C: 4 hours, 16 deg~45 deg C: 2 hours, 46 deg~60 deg C: 3 hours
ExpressCharge Capable Not supported
BATTMAN Capable Yes
USB features
Universal Serial Bus, or USB, was introduced in 1996. It dramatically simplified the connection between host computers and peripheral
devices like mice, keyboards, external drivers, and printers.
16 Technology and components

Table 5. USB evolution
Type Data Transfer Rate Category Introduction Year
USB 2.0 480 Mbps High Speed 2000
USB 3.0/USB 3.1 Gen 1
Port
5 Gbps SuperSpeed 2010
USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)
For years, the USB 2.0 has been firmly entrenched as the de facto interface standard in the PC world with about 6 billion devices sold, and
yet the need for more speed grows by ever faster computing hardware and ever greater bandwidth demands. The USB 3.0/USB 3.1 Gen 1
finally has the answer to the consumers' demands with a theoretically 10 times faster than its predecessor. In a nutshell, USB 3.1 Gen 1
features are as follows:
• Higher transfer rates (up to 5 Gbps)
• Increased maximum bus power and increased device current draw to better accommodate power-hungry devices
• New power management features
• Full-duplex data transfers and support for new transfer types
• Backward USB 2.0 compatibility
• New connectors and cable
The topics below cover some of the most commonly asked questions regarding USB 3.0/USB 3.1 Gen 1.
Speed
Currently, there are 3 speed modes defined by the latest USB 3.0/USB 3.1 Gen 1 specification. They are Super-Speed, Hi-Speed and Full-
Speed. The new SuperSpeed mode has a transfer rate of 4.8 Gbps. While the specification retains Hi-Speed, and Full-Speed USB mode,
commonly known as USB 2.0 and 1.1 respectively, the slower modes still operate at 480 Mbps and 12 Mbps respectively and are kept to
maintain backward compatibility.
USB 3.0/USB 3.1 Gen 1 achieves the much higher performance by the technical changes below:
• An additional physical bus that is added in parallel with the existing USB 2.0 bus (refer to the picture below).
• USB 2.0 previously had four wires (power, ground, and a pair for differential data); USB 3.0/USB 3.1 Gen 1 adds four more for two
pairs of differential signals (receive and transmit) for a combined total of eight connections in the connectors and cabling.
• USB 3.0/USB 3.1 Gen 1 utilizes the bidirectional data interface, rather than USB 2.0's half-duplex arrangement. This gives a 10-fold
increase in theoretical bandwidth.
With today's ever increasing demands placed on data transfers with high-definition video content, terabyte storage devices, high
megapixel count digital cameras etc., USB 2.0 may not be fast enough. Furthermore, no USB 2.0 connection could ever come close to the
480Mbps theoretical maximum throughput, making data transfer at around 320 Mbps (40 MB/s) — the actual real-world maximum.
Technology and components 17

Similarly, USB 3.0/USB 3.1 Gen 1 connections will never achieve 4.8Gbps. We will likely see a real-world maximum rate of 400MB/s with
overheads. At this speed, USB 3.0/USB 3.1 Gen 1 is a 10x improvement over USB 2.0.
Applications
USB 3.0/USB 3.1 Gen 1 opens up the laneways and provides more headroom for devices to deliver a better overall experience. Where USB
video was barely tolerable previously (both from a maximum resolution, latency, and video compression perspective), it's easy to imagine
that with 5-10 times the bandwidth available, USB video solutions should work that much better. Single-link DVI requires almost 2Gbps
throughput. Where 480Mbps was limiting, 5Gbps is more than promising. With its promised 4.8Gbps speed, the standard will find its way
into some products that previously weren't USB territory, like external RAID storage systems.
Listed below are some of the available SuperSpeed USB 3.0/USB 3.1 Gen 1 products:
• External Desktop USB 3.0/USB 3.1 Gen 1 Hard Drives
• Portable USB 3.0/USB 3.1 Gen 1 Hard Drives
• USB 3.0/USB 3.1 Gen 1 Drive Docks & Adapters
• USB 3.0/USB 3.1 Gen 1 Flash Drives & Readers
• USB 3.0/USB 3.1 Gen 1 Solid-state Drives
• USB 3.0/USB 3.1 Gen 1 RAIDs
• Optical Media Drives
• Multimedia Devices
• Networking
• USB 3.0/USB 3.1 Gen 1 Adapter Cards & Hubs
Compatibility
The good news is that USB 3.0/USB 3.1 Gen 1 has been carefully planned from the start to peacefully co-exist with USB 2.0. First of all,
while USB 3.0/USB 3.1 Gen 1 specifies new physical connections and thus new cables to take advantage of the higher speed capability of
the new protocol, the connector itself remains the same rectangular shape with the four USB 2.0 contacts in the exact same location as
before. Five new connections to carry receive and transmitted data independently are present on USB 3.0/USB 3.1 Gen 1 cables and only
come into contact when connected to a proper SuperSpeed USB connection.
USB Type-C
USB Type-C is a new, tiny physical connector. The connector itself can support various exciting new USB standards like USB 3.1 and USB
power delivery (USB PD).
Alternate Mode
USB Type-C is a new connector standard that is very small. It is about a third the size of an old USB Type-A plug. This is a single
connector standard that every device should be able to use. USB Type-C ports can support a variety of different protocols using
“alternate modes,” which allows you to have adapters that can output HDMI, VGA, DisplayPort, or other types of connections from that
single USB port
USB Power Delivery
The USB PD specification is also closely intertwined with USB Type-C. Currently, smartphones, tablets, and other mobile devices often
use a USB connection to charge. A USB 2.0 connection provides up to 2.5 watts of power — that'll charge your phone, but that's about
it. A laptop might require up to 60 watts, for example. The USB Power Delivery specification ups this power delivery to 100 watts. It's bi-
directional, so a device can either send or receive power. And this power can be transferred at the same time the device is transmitting
data across the connection.
This could spell the end of all those proprietary laptop charging cables, with everything charging via a standard USB connection. You could
charge your laptop from one of those portable battery packs you charge your smartphones and other portable devices from today. You
could plug your laptop into an external display connected to a power cable, and that external display would charge your laptop as you used
it as an external display — all via the one little USB Type-C connection. To use this, the device and the cable have to support USB Power
Delivery. Just having a USB Type-C connection doesn't necessarily mean they do.
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USB Type-C and USB 3.1
USB 3.1 is a new USB standard. USB 3's theoretical bandwidth is 5 Gbps, while USB 3.1's is 10 Gbps. That's double the bandwidth, as fast
as a first-generation Thunderbolt connector. USB Type-C isn't the same thing as USB 3.1. USB Type-C is just a connector shape, and the
underlying technology could just be USB 2 or USB 3.0. In fact, Nokia's N1 Android tablet uses a USB Type-C connector, but underneath
it's all USB 2.0 — not even USB 3.0. However, these technologies are closely related.
Media Card Readers
NOTE: The media card reader is integrated into the system board on portable systems. If there is a hardware failure or
the reader malfunctions, replace the system board.
The media card reader expands the usefulness and functionality of portable systems, especially when used with other devices such as
digital cameras, portable MP3 players, and handheld devices. All these devices use a form of media card to store information. Media card
readers allows for easy transfer of data between these devices.
Several different types of media or memory cards are available today. Below is a list of the different types of cards that work in the media
card reader.
SD Card Reader
1. Memory Stick
2. Secure Digital (SD)
3. Secure Digital High Capacity (SDHC)
4. Secure Digital eXtended Capacity(SDXC)
Downloading Windows drivers
Steps
1. Turn on the laptop.
2. Go to Dell.com/support.
3. Click Product Support, enter the Service Tag, and then click Submit.
NOTE: If you do not have the Service Tag, use the auto detect feature or manually browse for your laptop model.
4. Click Drivers and Downloads.
5. Select the operating system installed on your laptop.
6. Scroll down the page and select the driver to install.
7. Click Download File to download the driver.
8. After the download is complete, navigate to the folder where you saved the driver file.
9. Double-click the driver file icon and follow the instructions on the screen.
Technology and components 19

Command | Configure Graphical User Interface
The Dell Command | Configure Graphical User Interface (Command | Configure GUI) displays all Basic Input/Output System (BIOS)
configurations supported by Command | Configure. Using the GUI, you can perform the following tasks:
• Create BIOS configuration for client systems
• Validate the BIOS configuration against the BIOS configuration of the host system
• Export the customized BIOS configurations as a configuration file (.ini/.cctk), Self-Contained Executable (SCE), shell script, or report
NOTE: To apply the configuration using Command Line Interface (CLI), run the required file (.ini , .cctk, or sce).
Accessing Command | Configure From a Windows System
Click Start > All Programs > Dell > Command | Configure > Command Configure Command Wizard.
Accessing Command | Configure From a Linux System
Navigate to the /opt/Dell/toolkit/bin directory.
Files And Folders of Command | Configure
The following table displays the files and folders of Command | Configure on a Windows system.
Table 6. Files And Folders configuration
Files/Folders Description
Command | Configure Command
Prompt
Allows access to the Command | Configure command prompt.
Configuration Wizard Allows access to the Command | Configure GUI.
Command | Configure WINPE Allows access to the Windows PE scripts to create a bootable image. For more details, see the Dell
Command | Configure Installation Guide.
20 Technology and components