Dell External OEMR T710 User manual

PowerEdge T710 Technical Guidebook
Dell
DELLTM
POWEREDGETM T710
TECHNICAL GUIDEBOOK
INSIDE THE POWEREDGE T710

PowerEdge T710 Technical Guidebook
Dell
Table of Contents
1Product Comparison .........................................................................................................................1
1.1 Overview...................................................................................................................................1
2New Technologies.............................................................................................................................2
2.1 Overview/Description................................................................................................................2
2.2 Detailed Information..................................................................................................................2
2.2.1 Intel Xeon 5500 Series Processors...................................................................................2
2.2.2 Intel 5520 Chipset .............................................................................................................3
2.2.3 PCIe Generation 2.............................................................................................................3
2.2.4 DDR3 Memory Technology...............................................................................................3
2.2.5 16-Drive Active Backplane................................................................................................3
2.2.6 Next Generation Broadcom 5709C LOMs.........................................................................4
2.2.7 Next generation Dell Embedded Server Management......................................................4
3System Overview..............................................................................................................................4
3.1 Overview/Description................................................................................................................4
3.2 T710 Product Features Summary.............................................................................................5
4Mechanical........................................................................................................................................6
4.1 Chassis Description ..................................................................................................................6
4.2 Dimensions and Weight............................................................................................................6
4.3 Front Panel View and Features.................................................................................................7
4.4 Back Panel View and Features.................................................................................................7
4.5 Power Supply Indicators ...........................................................................................................8
4.6 Side Views and Features..........................................................................................................8
4.7 Internal Chassis Views..............................................................................................................9
4.8 Rails and Cable Management...................................................................................................9
4.9Rack View...............................................................................................................................10
4.10 Fans........................................................................................................................................10
4.11 Control Panel/LCD..................................................................................................................11
4.11.1 Cover Latch.....................................................................................................................12
4.11.2 Bezel ...............................................................................................................................12
4.11.3 Hard Drive.......................................................................................................................13
4.11.4 Trusted Platform Management (TPM).............................................................................13
4.11.5 Power-Off Security..........................................................................................................13
4.11.6 Intrusion Alert..................................................................................................................13
4.11.7 Secure Mode...................................................................................................................13
4.12 Persistent Storage...................................................................................................................14
4.12.1 Managed Persistent Storage...........................................................................................14
4.12.2 SD Module (Unmanaged Internal Persistent Storage)....................................................15
4.13 USB Key (Unmanaged Internal Persistent Storage)...............................................................16
4.14 Battery.....................................................................................................................................16
4.15 Field Replaceable Units (FRU) ...............................................................................................16
5Electrical..........................................................................................................................................16
5.1 Clock Circuitry.........................................................................................................................16
5.2 Volatility...................................................................................................................................16
6Power, Thermal, and Acoustic........................................................................................................16
6.1 Power Supplies.......................................................................................................................16
6.2 Power Supply Specifications...................................................................................................17
6.3 Power Efficiency......................................................................................................................18
6.4 Environmental Specifications..................................................................................................19

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6.6 Maximum Input Amps .............................................................................................................20
6.7 EnergySmart Enablement.......................................................................................................20
6.8 Energy Star Compliance.........................................................................................................20
6.9 Acoustics.................................................................................................................................20
7Block Diagram.................................................................................................................................22
8Processors......................................................................................................................................22
8.1 Overview.................................................................................................................................22
8.2 Features..................................................................................................................................23
8.3 Supported Processors.............................................................................................................23
8.4 Processor Configurations........................................................................................................24
8.5 Additional Processor Information............................................................................................24
9Memory...........................................................................................................................................24
9.1 Overview.................................................................................................................................24
9.2 DIMMs Supported...................................................................................................................24
9.3 Memory Population Scenarios................................................................................................24
9.4 Slots/Risers.............................................................................................................................25
9.5 Speed/Memory Features.........................................................................................................25
9.6 Memory Population.................................................................................................................26
9.7 Memory Speed Limitations......................................................................................................26
9.8 Mirroring..................................................................................................................................27
10 Chipset............................................................................................................................................27
10.1 Overview.................................................................................................................................27
10.2 Intel 5500 Chipset Dual I/O Hub (IOH)....................................................................................27
10.3 Intel Quickpath Architecture....................................................................................................28
10.4 PCI Express Generation 2 ......................................................................................................28
10.5 Intel Direct Media Interface (DMI)...........................................................................................28
10.6 Super I/O Controller................................................................................................................29
11 BIOS................................................................................................................................................29
11.1 Overview.................................................................................................................................29
11.2 Supported ACPI States...........................................................................................................29
12 Embedded NICs/LAN on Motherboard (LOM)................................................................................29
12.1 Overview.................................................................................................................................29
13 I/O Slots ..........................................................................................................................................30
13.1 Overview.................................................................................................................................30
13.2 X16 Express Card Specifications............................................................................................30
13.3 Available PCIe Cards..............................................................................................................31
13.4 Boot Order...............................................................................................................................32
14 Storage............................................................................................................................................32
14.1 Overview.................................................................................................................................32
14.2 3.5” X8 HDD Backplane..........................................................................................................33
14.3 2.5” X16 HDD Backplane........................................................................................................33
14.4 Storage Card Support Matrix ..................................................................................................33
14.5 Available Drives ......................................................................................................................34
14.6 RAID Configurations ...............................................................................................................35
14.7 Internal Storage Controllers....................................................................................................42
14.8 LED Indicators.........................................................................................................................42
14.9 Optical Drives..........................................................................................................................42
14.10 Tape Drives.............................................................................................................................42
15 Video...............................................................................................................................................42

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15.1 Overview.................................................................................................................................42
16 Audio...............................................................................................................................................43
17 Rack Information.............................................................................................................................43
17.1 Overview.................................................................................................................................43
17.2 Cable Management Arm (CMA)..............................................................................................43
17.3 Rack Configuration..................................................................................................................43
17.4 Rails........................................................................................................................................44
18 Operating Systems..........................................................................................................................45
18.1 Overview.................................................................................................................................45
18.2 Operating Systems Supported................................................................................................45
19 Virtualization....................................................................................................................................46
19.1 Overview.................................................................................................................................46
19.2 Virtualization Options Supported.............................................................................................46
20 Systems Management ....................................................................................................................47
20.1 Overview/Description..............................................................................................................47
20.2 Server Management................................................................................................................47
20.3 Embedded Server Management.............................................................................................48
20.4 Lifecycle Controller and Unified Server Configurator..............................................................48
20.5 Optional iDRAC Express.........................................................................................................49
20.6 iDRAC6 Enterprise..................................................................................................................49
21 Peripherals......................................................................................................................................51
21.1 USB peripherals......................................................................................................................51
21.2 External Storage .....................................................................................................................51
22 Packaging Options..........................................................................................................................51

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1 Product Comparison
1.1 Overview
The PowerEdge T710 is the flagship of the Dell tower servers positioned above the PowerEdge T610
and replacing the PowerEdge 2900III. Table 1shows a comparison between these versions.
Table 1. Comparison of T710 to PE2900-III and T610
Feature/Spec PE2900-III (predecessor) T710 T610
Processor Quad-Core Intel®Xeon®
Processor 5400 Series,
Intel Xeon 5200 Series Intel Xeon 5500 Series Intel Xeon 5500 Series
Front Side Bus 1066/1333 MHz QPI 4.8 – 6.4 GT/s QPI 4.8 – 6.4 GT/s
# Processors 1 or 2 1 or 2 1 or 2
# Cores 2 or 4 per proc 2 or 4 per proc 2 or 4 per proc
L2/L3 Cache 2 X 3MB or 2 X 6MB
shared L2 256K L2 per core/4MB or 8MB shared L3 256K L2 per core/4MB or 8MB shared L3
Chipset Intel 5000X chipset Intel 5520 chipset Intel 5520 chipset
DIMMs 12 18 12
Min/Max RAM 1GB/48GB 1GB/144GB 1GB/96GB
HD Bays 8 or 10 X 3.5” 8 X 3.5” or 16 X 2.5” 8 X 3.5” or 2.5”
HD Types SAS, SATA SSD, SAS, SATA SSD, SAS, SATA
Ext Drive Bay(s) 2 X HH Perhiperal Bays 2 X HH Perhiperal Bays 2 X HH Perhiperal Bays
Int. HD Controller None None None
Opt. HD Controller Perc 5/i, Perc 6/i, SAS
6/iR, SAS 5/i Perc 6/i, SAS 6/iR Perc 6/i, SAS 6/iR
Availability Hot Swap HDD, Hot Swap
Redundant Fans, Hot
Swap Redundant PS
Hot Swap HDD, Hot Swap
Redundant Fans, Hot
Swap Redundant PS
Hot Swap HDD, Optional
Hot Swap Redundant
Fans, Hot Swap
Redundant PS
Server Mgt. BMC, Optional DRAC5 iDRAC6 Express, Optional
iDRAC6 Enterprise,
Optional VFlash
iDRAC6 Express, Optional
iDRAC6 Enterprise,
Optional VFlash
I/O Slots 6 + Storage Controller
Slot 6 + Storage Controller Slot 5 + Storage Controller Slot
RAID 0, 1, 5, 6, 10 See RAID Configurations 0, 1, 5, 6, 10
NIC/LOM 2 X TOE/iSCSI 4 X TOE/iSCSI 2 X TOE/iSCSI
USB 2 Front, 4 Rear, 1 Internal 2 Front, 6 Rear, 1 Internal 2 Front, 6 Rear, 1 Internal
Power Supplies 930 W Redundant 1100 W Redundant 598 W Redundant
Fans Hot plug Redundant Hot plug Redundant Cabled, Optional Hot plug
Redundant
Chassis 5U Rackable Tower 5U Rackable Tower 5U Rackable Tower

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Feature/Spec PE2900-III (predecessor) T710 T610
Unmanaged Internal
Storage Internal USB key SD card for virtualization
solutions SD card for virtualization solutions
2 New Technologies
2.1 Overview/Description
The T710 utilizes the following new technologies common to other Dell 11G servers:
• Intel Xeon 5520 Series processors
oNew architecture with memory controller within each processor
oDual and quad core
oIntel turbo mode allows increased processor speed
oHyperthreading technology
oQuick Path Interconnect
• Intel 5520 chipset
oDual IOH for maximum I/O capability
• PCIe Generation 2
• DDR3 memory technology
• 16-drive active backplane with expander
• Next generation Broadcom 5709C LOMs
• Next generation Dell embedded server management
oiDRAC express with Lifecycle Controller and Unified Server Configurator
oOptional iDRAC enterprise
oOptional v-flash
2.2 Detailed Information
2.2.1 Intel Xeon 5500 Series Processors
Intel Xeon 5500 series processors are the latest generation Intel processors for two-socket servers.
They are based on a new 45nm die technology and utilize integrated memory controllers on the
processor itself rather than a separate memory controller. QuickPath interconnect technology, the
speed of which varies with the processor model, replaces the familiar front-side-bus.

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Figure 1. Intel Xeon 5500 Series Processors
• Intel Hyper-Threading Technology: enables more software threads to be running simultaneously
• Intel Intelligent Power Technologies: scales server power consumption to performance needs
• Intel Turbo Boost Technology: boosts frequency for active cores by up to 400 MHz for during
peak demand periods
See Section 8 “Processors” for more detail.
2.2.2 Intel 5520 Chipset
The Intel 5520 chipset is the companion to the new Intel Xeon 5500 series processor. It supports the
QuickPath interconnect technology and provides PCI Express Gen 2 capability for I/O. The T710
system is designed around dual Intel 5520 chipset I/O HUBs 36-D (IOH). See Section 27 “Chipset”.
2.2.3 PCIe Generation 2
PCIe Gen 2 provides the next generation of I/O bandwidth to the system. PCIe Gen2 doubles the
signaling bit rate of each lane from 2.5 Gb/s to 5 Gb/s.
2.2.4 DDR3 Memory Technology
Intel Xeon 5500 series processors support new DDR3 memory technology that replaces fully-buffered
DIMMs in the new Intel architecture. Native DDR3 memory capability improves memory access speed,
lowers latency, and allows more memory capacity (up to 18 DIMMs per two-socket platform). See
Section 9 “Memory”.
2.2.5 16-Drive Active Backplane
T710 includes an optional 16-drive active backplane that allows one controller to address all 16 drives.
See Section 14.3 “2.5” X16 HDD BACKPLANE”.
PCI Express
Gen 2
Intel Xeon
5500
Intel Xeon
5500
QPI
QPI up to 25.6 GB/sec bandwidth per link
DDR3 Memory
Up to 18 slots

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2.2.6 Next Generation Broadcom 5709C LOMs
The Broadcom 5709C LOMs are the latest 1GBe offering. Two dual-port devices provide a total of four
LOM ports for the T710. They are TOE enabled, with iSCSI offload available as an option. See Section
12 “Embedded NICs/LAN on Motherboard (LOM)”.
2.2.7 Next generation Dell Embedded Server Management
The chart below shows the components of the new embedded server management capability. As a
700-series enterprise product, T710 comes standard with BMC and iDRAC Express. The iDRAC
Express hosts the Lifecycle Controller and Unified Server Configurator. Optional iDRAC Enterprise
provides out-of-band management capabilities and enables the optional V-Flash.
See Section 20.2 “Embedded Server Management”.
Figure 2. Embedded Server Management Capability
3 System Overview
3.1 Overview/Description
• Customer driven product priorities
oBest performance and availability in a two-socket tower
oLarge Storage footprint, best I/O capability
• Product Positioning
oIndustry leading performance and availability in a two-socket tower
oIn direct competition with the HP ML370, IBM x3500

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• Target Market
oCorporate workgroups in remote sites running critical apps requiring 24 x 7 uptime
oSupports applications across Data Access and Data Processing
oVirtualization
oRetail space, Digital signage, TV walls
• Key Features
oDual IOH, up to 16 drives in one volume, 18 DIMMS, 4x LOMs, all HA in base, 4 x 25 W
PCI
3.2 T710 Product Features Summary
Table 2. PowerEdge T710 Features and Descriptions
Feature Details
Processor Intel Xeon 5500 Series,1,86GHz – 2.93GHz, 60W, 80W, 95W, See Section 8.3
“Supported Processors”.
Front Side Bus Intel Quick Path Interconnect (QPI) 4.8 – 6.4 GT/s
# Processors 1 or 2
# Cores 2 or 4
L2/L3 Cache 256 K per core L2, 4MB – 8MB shared L3
Chipset Intel 5520 chipset
DIMMs/Speed 1, 2, 4, 8 GB UDIMM and RDIMM @ 1066 and 1333 MHz
Certain memory configurations clock down to 800 MHz
Min/Max RAM 1GB/144 GB
HD Bays 8 X 3.5” or 16 X 2.5”, 3Gb SAS
HD Types SSD, SAS, SATA are supported
Ext Drive Bay(s) Two full height peripheral bays
Int. HD Controller None
Opt. HD Controller Perc 6/i or SAS 6/iR in dedicated storage slot
BIOS Dell BIOS core 11G implementation. See Section 11 “BIOS”.
Video Integrated Matrox G200 with iDRAC6
Availability Hot swap HDD, hot swap redundant power supplies, hot swap redundant fans
Server Mgt. iDRAC6 Express, Optional iDRAC6 Enterprise, Optional VFlash
I/O Slots 6 PCIe Gen 2 expansion slots + 1 dedicated controller slot
RAID 0, 1, 5, 10, 50, 60. See Section 14.6 “RAID Configurations”.
NIC/LOM 2 X Broadcom 5709 1GBe LOMs (4 ports total). TOE enabled, Optional iSCSI
offload
USB Two front, six rear, one internal
Power Supplies Optional redundant 1100 W. Climate Saver Gold
Front Panel Active LCD, rotates 90 degrees for rack mounting
System ID System ID for PR T710:: 0x029B

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Feature Details
Fans 4 X hot swap redundant
Chassis 5U rackable tower
4 Mechanical
4.1 Chassis Description
The T710 system uses a tower or rack mount 5U chassis. It is classified by Dell as a rackable tower,
meaning it is optimized for tower operation
4.2 Dimensions and Weight
Figure 3. T710 Dimensions
Table 3. Detailed Dimensions
Xa Xb Ya Yb Yc Za
with
bezel
Za
without
bezel Zb Zc
217.9 mm 304.4 mm 431.3
mm 466.3 mm 471.3 mm 37 mm 35 mm 659.6 mm 694.8 mm
8.6 in 12.0 in 17.0 in 18.4 in 18.6 in 1.5 in 1.4 in 26.0 in 27.4 in
Weight (maximum configuration) 35.3 kg (78 lb)

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4.3 Front Panel View and Features
Figure 4. Front Panel View and Features
4.4 Back Panel View and Features
Figure 5. Back Panel View and Features
PCIe Slots
iDRAC Enterprise
USB
LOMs
Control Panel
and LCD
Front
USB (2)
Peripheral
Bays, 2HH

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4.5 Power Supply Indicators
T710 power supplies have embedded cooling fans and one bi-colored status LED.
Status States:
• Off – LED is dark
• AC source applied – solid green LED
• Fault of any kind – solid amber LED
• DC enable applied – solid green LED (no change from AC applied)
4.6 Side Views and Features
Figure 6. Side Views and Features
Figure 7. Fold-out Feet Add Additional Stability

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4.7 Internal Chassis Views
Figure 8. Internal Chassis Overview
Figure 9. Internal Chassis Detailed View
4.8 Rails and Cable Management
The T710 Rack Kit has rack installation components, such as rails. The rack installation components
consist of sliding rack mount rails with the latest generation Cable Management Arm (CMA). T710
features slam latches to offer easier removal from the rack.
Processors
Backplane
Backplane Cables
DIMM Slots
Controller
Slot
PCIe Slots

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Figure 10. New Cable Management Arm
• All steel construction – eliminates creep/sag
• More open area for air flow
When the system is installed in a rack, please observe the following guidelines:
• Nothing should be located within 12” of the front of the unit that could restrict the air flow into the
system.
• Nothing should be mounted or placed behind the chassis that would restrict airflow from exiting
the system. Only Dell approved CMAs can be placed behind the chassis. All other objects
should be located at least 24” away from the rear of the chassis.
• When two systems are placed back-to-back, the separation between the units should be at least
24” if the exit airflow is equivalent for the two chassis. This allows exit air to escape without
creating an extreme back pressure at the rear of one of the chassis.
4.9 Rack View
Figure 11. T710 Rack View
For more rack, rail, and CMA information see Section 17 “Rack Information”.
4.10 Fans
Four 92mm single-rotor hot-pluggable fans are mounted in the rear of the cooling shroud. Each fan has
a single-wire harness that plugs into the planar fan connectors (FAN1 through FAN4).

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Figure 12. Fans
The Embedded Server Management logic in the system controls and monitors the speed of the fans. A
fan speed fault or over-temperature condition results in a notification by ESM.
T710 Power Supply Units have integrated fans. The system requires a blank module in place of the
empty power supply slot.
System fan speed is pulse-width modulated. Optional redundant cooling is supported with only one
rotor failing at a time (system may throttle when a rotor fails).
Note
Do not place any physical obstructions in the front (at least 12”) or rear (at least 24”) of the T710
chassis. This may cause a decrease in airflow, resulting in an over-temperature condition.
Placement of non-redundant fans must be at the rearmost section of the shroud. Do not operate the
system without the cooling shroud installed.
4.11 Control Panel/LCD
The system control panel is located on the front of the system chassis to provide user access to
buttons, display, and I/O interfaces.
Figure 13. Control Panel/LCD View

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Features of the system control panel include:
• 128x20 pixel LCD panel with controls
oTwo navigation buttons
oOne select button
oOne system ID button
• ACPI-compliant power button with an integrated green power LED
• Non-Maskable Interrupt (NMI) button (recessed)
• Ambient temperature sensor
• LCD panel can rotate 90 degrees for optional rack mounting of the server
• Two external USB 2.0 connectors
The LCD panel is a graphics display controlled by the iDRAC, unlike the 9G panel that had its own
CPLD. Error codes can be sent to the display by either ESM or BIOS.
BIOS has the ability to enter a “Secure Mode” through setup, which locks the power and NMI buttons.
When in this mode, pressing either button has no effect and does not mask other sources of NMI and
power control.
4.11.1 Cover Latch
A tool-less latch is integrated in the side cover to secure it to the tower chassis. It is lockable.
Figure 14. Cover Latch
4.11.2 Bezel
A metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel prevents un-
authorized access to system HDD(s). System status (via the LCD) is viewable when the bezel is
installed.
The bezel is standard for the T710 system.

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Figure 15. T710 Bezel
4.11.3 Hard Drive
The front bezel of the system contains a lock. A locked bezel secures the system hard drives.
4.11.4 Trusted Platform Management (TPM)
The TPM generates/stores keys, protects/authenticates passwords, and creates/stores digital
certificates. TPM can also enable the BitLocker™ hard drive encryption feature in Windows Server
2008.
TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. There are different
planar PWA part numbers to accommodate the different TPM solutions. The Rest of World (ROW)
version has the TPM soldered onto the planar. The other version of the planar has a connector for a
plug-in module (Factory Install Only).
China TPM (TCM) is a post-RTS feature. Until China TCM is available, T710 units shipped to
customers in China contain a no TPM motherboard.
4.11.5 Power-Off Security
BIOS has the ability to disable the power button function.
4.11.6 Intrusion Alert
A switch mounted on the cooling shroud detects chassis intrusion. When the cover is opened, the
switch circuit closes to indicate intrusion to ESM. When enabled, the software provides notification that
the cover has been opened.
4.11.7 Secure Mode
BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out
the power and NMI switches on the control panel or set up a system password.

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4.12 Persistent Storage
T710 offers two types of persistent storage: managed (iDRAC6 Express/iDRAC6 Enterprise) and
unmanaged internal persistent storage.
One of the unmanaged ports is for an optional SD card and the other is for a USB key.
Figure 16. Persistent Storage Block Diagram
4.12.1 Managed Persistent Storage
iDRAC6 Express is a managed persistent storage space for server provisioning data. The base
iDRAC6 express consists of 1 GB flash, and the optional Vflash is an external SD card on the optional
iDRAC6 Enterprise. The optional vflash offers the hot-plug portability and increased storage capacity
benefits of SD while managed by the system.
iDRAC6 is currently configured to support the following applications:
• Unified Server Configurator Browser and System Services Module (SSM) (25 MB): the UEFI
browser provides a consistent graphical user interface for bare metal deployment and is ideal
for one-to-one deployment. The SSM supports automatic one-to-N deployment.
• Service Diagnostics (15 MB): formerly on the hard drive as the Utility Partition, this is a bootable
FAT16 partition for Service Diagnostics
• Deployment OS Embedded Linux (100 MB): storage space to hold Embedded Linux
• Online Diagnostics (35 MB): non-bootable FAT32 partition for Online Diagnostics.
• Deployment OS WinPE (200 MB): storage space to hold Windows Pre-installation Environment
• Driver Store (150 MB): holds all files required for OS deployment.
• iDRAC firmware (120 MB): holds the two most recent versions of iDRAC firmware

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• Firmware Images (160 MB): holds the two most recent versions of BIOS, RAID, LOM, power
supplies and hard drive firmware. This partition also holds the BIOS and option ROM
configuration data.
• Life Cycle Log (2 MB): stores initial factory configuration as well as all detectable hardware and
firmware changes to the server since its deployment. The Life Cycle Log is stored on the BMC
SPI flash.
Approximately 20 percent of the flash space is reserved for wear leveling on the NAND flash. Wear
leveling extends the life of the NAND flash by balancing the use cycles on the flash’s blocks.
4.12.2 SD Module (Unmanaged Internal Persistent Storage)
The optional Internal SD module is a dedicated port for an SD flash card for embedded Hypervisor for
virtualization. The SD flash card contains a bootable OS image for virtualized platforms.
Figure 17. T710 SD Module
Figure 18. SD Diagram

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4.13 USB Key (Unmanaged Internal Persistent Storage)
T710 has one internal USB port on the motherboard for any USB key based security or license
application.
Some possible applications of the USB key:
• User custom boot and pre-boot OS for ease of deployment or diskless environments
• USB license keys for software applications like eToken™ or Sentinel Hardware Keys
• Storage of custom logs or scratch pad for portable user defined information (not hot-pluggable)
4.14 Battery
A replaceable coin cell CR2032 3V battery mounted on the planar provides backup power for the Real-
Time Clock and CMOS RAM on the ICH. The battery is located under the fan assembly at the rear of
the motherboard, near the rear USB ports.
4.15 Field Replaceable Units (FRU)
Hot swap HDD and SSD, fans, and power supplies are the primary field replaceable units on T710.
The planar contains a serial EEPROM to store FRU information including Dell part number, part
revision level, and serial number. The Advanced Management Enablement Adapter (AMEA) contains a
FRU EEPROM. The backplane SEP and the power supply microcontroller are also used to store FRU
data.
5 Electrical
5.1 Clock Circuitry
System clock circuitry is based on Intel CK410B+ synthesizer and DB1200/DB900 driver specification.
A clock synthesizer device is a single chip solution. The CK410B+ synthesizes and distributes a
multitude of clock outputs at various frequencies, timings and drive levels using a single 14.318 MHz
crystal.
• PCI Express Gen2 support
• Host clock support (133 MHz)
• Spread spectrum support
• 33 MHz, 48 MHz, 100 MHz clock support
• 14.318 MHz clock support
5.2 Volatility
See your Dell Representative for the current T710 Statement of Volatility.
6 Power, Thermal, and Acoustic
6.1 Power Supplies
The power supply subsystem consists of one or two AC-DC power supplies (1+1 redundant
configuration) connected to the planar through the PDB. The power supply only provides +12V and
+12Vaux. There are several voltage regulators in the system to supply different voltage levels needed
by different logic devices.