Dell PowerEdge M710 Quick start guide

PowerEdge M710
Name
Technical Guide
The PowerEdge
M710 offers a
robust and scalable
enterprise platform
that can help you
simplify and save on
IT expenses.

Dell PowerEdge M710 Technical Guide ii
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December 2012 | Version 4.0

Dell PowerEdge M710 Technical Guide iii
Contents
1Product Comparison ...........................................................................................6
1.1 Overview ..................................................................................................6
1.2 Strong IT Foundation ....................................................................................6
1.3 Purposeful Design ........................................................................................6
1.4 Scalability for Growth ...................................................................................6
1.5 Smart Investment ........................................................................................6
1.6 Simplified Systems Management .......................................................................7
1.7 Lifecycle Controller......................................................................................7
1.8 Comparison ...............................................................................................7
2Key Technologies...............................................................................................9
2.1 Overview ..................................................................................................9
2.2 Dual Intel Xeon Quad-Core and Six-Core Processors ................................................9
2.3 DDR3 Memory .............................................................................................9
2.4 PCI Express Generation 2 ...............................................................................9
2.5 Redundant Internal SD Module .........................................................................9
2.6 iDRAC6 Enterprise........................................................................................9
3System Information .......................................................................................... 10
3.1 Overview ................................................................................................ 10
3.2 Product Features Summary ........................................................................... 10
4Mechanical .................................................................................................... 12
4.1 Chassis Description..................................................................................... 12
4.2 Dimensions and Weight................................................................................ 12
4.3 Exterior and Interior Views ........................................................................... 13
4.3.1 Front View......................................................................................... 13
4.3.2 Back View ......................................................................................... 13
4.3.3 Internal View ..................................................................................... 14
4.4 Security.................................................................................................. 14
4.5 Cover Latch ............................................................................................. 14
4.6 TPM (Trusted Platform Module)...................................................................... 14
4.7 Power Off Security..................................................................................... 15
4.8 iDRAC6 Security Features ............................................................................. 15
4.9 USB ....................................................................................................... 15
4.10 Battery................................................................................................... 15
4.11 Field Replaceable Units (FRU)........................................................................ 15
4.12 User Accessible Jumpers, Sockets, and Connectors............................................... 15
5Power, Thermal, Acoustic .................................................................................. 16
5.1 Power Supplies ......................................................................................... 16
5.2 Power Efficiency ....................................................................................... 16
5.3 Thermal Operating and Storage Specifications .................................................... 16
5.4 Acoustics ................................................................................................ 17
5.5 Thermal.................................................................................................. 17
6Processors..................................................................................................... 19
6.1 Overview ................................................................................................ 19
6.2 Features ................................................................................................. 19
6.3 Supported Processors.................................................................................. 20
6.4 Processor Installation.................................................................................. 21
7Memory ........................................................................................................ 22

Dell PowerEdge M710 Technical Guide iv
7.1 Overview ................................................................................................ 22
7.2 DIMMs Supported ....................................................................................... 22
7.3 Slots/Risers ............................................................................................. 23
7.4 Speed .................................................................................................... 24
8Chipset ........................................................................................................ 26
8.1 Overview ................................................................................................ 26
8.2 Intel 5520 I/O Hub ..................................................................................... 26
8.2.1 QuickPath Interconnect ......................................................................... 26
8.2.2 PCI Express Generation 2 ....................................................................... 26
8.2.3 Direct Media Interface (DMI) ................................................................... 26
8.3 Intel I/O Controller Hub 9 ............................................................................ 26
9BIOS ............................................................................................................ 28
9.1 Overview ................................................................................................ 28
9.2 Supported ACPI States................................................................................. 28
10 Embedded LAN on Motherboard ........................................................................... 29
11 I/O Mezzanine Cards......................................................................................... 30
12 Storage ........................................................................................................ 31
12.1 Drives .................................................................................................... 31
12.2 Hard Disk Drive Carrier................................................................................ 31
12.3 Empty Drive Bays....................................................................................... 31
12.4 Diskless Configuration Support ....................................................................... 31
12.5 RAID Configurations.................................................................................... 31
12.6 RAID Controllers........................................................................................ 33
12.7 Optical Drives........................................................................................... 33
12.8 External Storage........................................................................................ 33
13 Video........................................................................................................... 34
14 Rack Information............................................................................................. 35
15 Operating Systems ........................................................................................... 36
16 Virtualization ................................................................................................. 37
16.1 Resources................................................................................................ 37
16.2 Advanced Infrastructure Manager by Scalent ...................................................... 37
17 Systems Management........................................................................................ 38
17.1 Overview ................................................................................................ 38
17.2 Server Management.................................................................................... 38
17.3 Embedded Server Management ...................................................................... 39
17.3.1 Dell Lifecycle Controller and Unified Server Configurator ................................. 39
17.3.2 Integrated Dell Remote Access Controller.................................................... 40
17.3.3 Chassis Management Controller ................................................................ 42
18 USB Peripherals .............................................................................................. 43
Appendix A. Statement of Volatility .......................................................................... 44
Appendix B. Certifications ..................................................................................... 49
B 1. Regulatory Certifications ............................................................................. 49
B 2. Product Safety Certifications......................................................................... 49
B 3. Electromagnetic Compatibility....................................................................... 49
B 4. Ergonomics, Acoustics and Hygienics ............................................................... 50
Appendix C. Industry Standards ............................................................................... 51

Dell PowerEdge M710 Technical Guide v
Tables
Table 1. Product Comparison ..................................................................................7
Table 2. Product Features Summary ........................................................................ 10
Table 3. Operating and Storage Specifications ............................................................ 16
Table 4. Acoustical Performance of M1000e Chassis with Eight M710 Blades Installed.............. 17
Table 5. Comparison of Processor Technology ............................................................ 20
Table 6. Supported Processors ............................................................................... 20
Table 7. Memory Populations and Maximum Frequency.................................................. 24
Table 8. Supported Hard Drives.............................................................................. 31
Table 9. RAID Configurations................................................................................. 32
Table 10. Supported Video Modes ............................................................................ 34
Table 11. Server Management Documentation and Information.......................................... 38
Table 12. Unified Server Configurator Features and Description......................................... 39
Table 13. Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 40
Table 14. PowerEdge M710 Statement of Volatility ........................................................ 44
Table 15. Product Safety Certifications...................................................................... 49
Table 16. Electromagnetic Compatibility Certifications................................................... 50
Table 17. Ergonomics, Acoustics and Hygienics............................................................. 50
Table 18. Industry Standards .................................................................................. 51
Figures
Figure 1. PowerEdge M1000e ................................................................................. 12
Figure 2. Front View ........................................................................................... 13
Figure 3. Back View ............................................................................................ 13
Figure 4. Internal Module View ............................................................................... 14
Figure 5. Memory Slots and Risers............................................................................ 24
Figure 6. 2.5‖ HDD Carrier .................................................................................... 31

Dell PowerEdge M710 Technical Guide 6
1Product Comparison
1.1 Overview
The Dell™ PowerEdge™ M710 is a full-height blade server featuring Intel®Xeon®processor 5500 and
5600 series architecture, including:
•Designed with large memory capacity and several I/O (input/output) options
•Great virtualization and database performance
•Designed for high energy efficiency
1.2 Strong IT Foundation
To build the most efficient data center solutions, Dell sought input from IT professionals. You asked
for reliability, scalability, energy efficiency, and a lower total cost of ownership (TCO). Our M710
blade servers deliver, becoming the cornerstone of a high-performance data center capable of
keeping pace with your changing business demands.
1.3 Purposeful Design
Today’s data centers demand performance, high availability and redundancy. Designed with those
needs in mind, the M710 blade server uses the Intel Xeon processor 5500 and 5600 series. These
processors adapt to your software in real time, processing more tasks simultaneously. Using Intel
Turbo Boost Technology, the M-Series blades can increase performance during peak usage periods.
When demand decreases, Intel Intelligent Power Technology helps reduce operating costs and energy
usage by proactively putting your server into lower power states.
Dell’s innovative full-height M710 provides 18 DIMM slots and up to 288GB of total RAM, coupled with
double the I/O capabilities of half-height blades and full-fabric redundancy on all three fabrics. The
M710 blade server allows quick virtualization with software from leading industry vendors using an SD
card or internal USB for embedded hypervisors.
1.4 Scalability for Growth
To keep pace with changing requirements, you can effectively scale I/O application bandwidth with
end-to-end 10Gbe or Fibre Channel solutions. Use NPIV and Port Aggregator modes on a variety of
switches to virtualize Ethernet or Fibre Channel ports for integration into heterogeneous fabrics. By
harnessing Dell’s FlexIO modular switches, you can cost-effectively scale your I/O needs, adding
ports and functionality through expansion modules—including 10Gb uplinks and stacking ports—
instead of needing to buy complete new switches. Dell provides a range of solutions for building on
your investment to avoid costly ―rip and replace‖ scenarios.
1.5 Smart Investment
The M710 is a foundational component of smart M-Series blade solutions that can help protect your
infrastructure investments, simplify your IT environment, and drive real and sustainable savings in
power efficiency and productivity. Features include:
•A future-ready, passive midplane capable of supporting multiple generations of blade servers
and a full array of upcoming I/O technologies
•FlexIO eliminates ―rip and replace‖ blade switch upgrades; modularity is built into the
switches

Dell PowerEdge M710 Technical Guide 7
•FlexAddress™ technology simplifies efforts and interactions between server and networking
teams by providing slot-assigned, persistent WWN/iSCSI/MAC addresses for maintenance,
without additional management tools or proprietary hardware
•Energy Smart Technologies, including ultra-efficient fans and power supplies for outstanding
energy efficiency
With savings in time and money previously needed for maintenance, you free up resources that can
be used for true innovation.
1.6 Simplified Systems Management
The next generation Dell™ OpenManage™ suite offers enhanced operations and standards-based
commands designed to integrate with existing systems for effective control.
1.7 Lifecycle Controller
Lifecycle Controller is the engine for advanced systems management integrated on the server.
Lifecycle Controller simplifies administrator tasks so you can perform a complete set of provisioning
functions such as system deployment, system updates, hardware configuration and diagnostics from a
single intuitive interface called Unified Server Configurator (USC) in a pre-OS environment. This
eliminates the need to use and maintain multiple pieces of disparate CD/DVD media.
1.8 Comparison
Table 1 compares the PowerEdge M710 blade server to the PowerEdge M710HD, M610x, and M610
servers.
Table 1. Product Comparison
Feature
M710
M710HD
M610x
M610
Description
General purpose Full-
height 2S
General purpose
Full-height 2S
Special purpose
Full-height 2S
General purpose
Half-height 2S
Processor
Intel Xeon Processor 5500 or 5600 Series
Front Side
Bus
Two Intel QuickPath Interconnect (QPI)
Sockets
Two
Cores
Up to six
L2/L3 Cache
8MB (5500 Series) or 12MB (5600 Series)
Chipset
Intel 5520
Intel 5520
Intel 5500
Intel 5500
DIMMs
18 x DDR3 DIMMs
18 x DDR3 DIMMs
12 x DDR3 DIMMs
12 x DDR3 DIMMs
Min/Max RAM
4GB/288GB
4GB/288GB
4GB/192GB
4GB/192GB
Hard Drive
Bays
SAS: 4 x 2.5‖ (hot-
plug)
SSD SATA: 4 x 2.5‖
SAS: 2 x 2.5‖ (hot-
plug)
SSD SATA: 2 x 2.5‖
SAS: 2 x 2.5‖ (hot-
plug)
SATA: 1 x 2.5‖
SAS: 2 x 2.5‖ (hot-
plug)
SATA: 1 x 2.5‖
Hard Drive
Types
SAS SSD, SATA SSD,
SAS, nearline SAS
SAS/SSD
SAS SSD, SATA SSD,
SAS, nearline SAS
SAS SSD, SATA SSD,
SAS, nearline SAS
Hard Drive
Controller
PERC H200
PERC H700
CERC 6/i
Embedded H200
PERC Η200
PERC Η700
PERC Η800
SAS6/Ε
H200
Non-RAID SATA
(one hard drive only)
Optional Hard
SAS6/iR
SAS6/iR
SAS6/iR

Dell PowerEdge M710 Technical Guide 8
Feature
M710
M710HD
M610x
M610
Drive
Controller
PERC6i with RAID
battery
PERC6i with RAID
battery
PERC6i with RAID
battery
Availability
Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol scrubbing
High-availability failover cluster support
Systems
Management
Dell™ OpenManage™
BMC, IPMI2.0
compliant
Unified Server
Configurator
Lifecycle Controller
iDRAC6 Enterprise
with optional vFlash
Remote Management:
iDRAC6 Enterprise
with option vFlash
media
Microsoft System
Center Essential
(SCE) 2010 v2
Dell™ OpenManage™
featuring Dell
Management Console
BMC, IPMI2.0
compliant
Unified Server
Configurator
Lifecycle Controller
iDRAC6 Enterprise
with optional vFlash
Dell™ OpenManage™
featuring Dell
Management Console
BMC, IPMI2.0
compliant
Unified Server
Configurator
Lifecycle Controller
iDRAC6 Enterprise
with optional vFlash
Dell™ OpenManage™
featuring Dell
Management Console
BMC, IPMI2.0
compliant
Unified Server
Configurator
Lifecycle Controller
iDRAC6 Enterprise
with optional vFlash
Remote Management:
iDRAC6 Enterprise
with option vFlash
media
Mezz Slots
Four x8 PCIe Gen2
Two x8 PCIe Gen2
Two x8 PCIe Gen2
Two x8 PCIe Gen2
I/O slots
NA
NA
Two x16 PCIe Gen2
H800/6GB SAS
nVidia M1060 and
M2050-204
NA
RAID
0,1,5
0,1
0,1
0,1
NIC/LOM
Four TOE with
optional iSCSI offload
Four 1GbE dual
Broadcom®BCM5709S
Two 10GbE QLogic
cLOM8214 (Future)
Two 10GbE Broadcom
BCM57712 (Future)
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
USB
Three external USB
2.0 ports at front
bezel
One internal USB port
Two external USB 2.0 ports at front bezel
One internal USB port
SD Card
Two internal SD slots
1 x Persistent Storage
1 x Management
Two internal SD slots
1 x Persistent Storage
1 x Management /
Redundant Persistent
Storage
Two internal SD slots
1 x Persistent Storage
1 x Management
Two internal SD slots
1 x Persistent Storage
1 x Management
TPM
Yes, except in China where Trusted Computing Module (TCM) is the standard.
Video
Matrox G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.

Dell PowerEdge M710 Technical Guide 9
2Key Technologies
2.1 Overview
The Dell™ PowerEdge™ M710 is a full-height blade server with the following features:
Dual quad-core or six-core Intel®Xeon®processors 5500 and 5600 series
DDR3 memory
PCI Express Generation 2 (PCIe Gen2)
Optional redundant, mirrored SD cards
iDRAC6 Enterprise with optional vFlash media
2.2 Dual Intel Xeon Quad-Core and Six-Core Processors
The Intel Xeon processor 5500 and 5600 series features quad-core and six-core processing to
maximize performance and performance/watt for data center infrastructures and highly dense
deployments. The Intel Xeon processor 5500 series 2S family of processor also features Intel Core™
micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems.
2.3 DDR3 Memory
The M710 uses DDR3 memory which provides a high-performance, high-speed memory interface
capable of low latency response and high throughput. The M710 supports registered ECC DDR3 DIMMs
(RDIMMs).
The DDR3 memory interface consists of three channels, with up to three RDIMMs per channel for
single/dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2 GB, 4 GB,
8 GB, or 16GB RDIMMs. The memory mode is dependent on how the memory is populated in the
system.
2.4 PCI Express Generation 2
PCIe is a serial point‐to‐point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit rate
of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports is backwards‐compatible with
Gen1 transfer rates.
2.5 Redundant Internal SD Module
The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for
virtualization. The SD Flash Card contains a bootable OS image for virtualized platforms.
The persistent storage solution on the M710 allows for redundant SD cards.
2.6 iDRAC6 Enterprise
The iDRAC6 Enterprise feature set is a managed persistent storage space for server provisioning data.
It consists of 1 GB flash and vFlash (an optional externally accessible SD card). vFlash offers the
hot-plug portability and increased storage capacity benefits of SD while still being managed by the
system.

Dell PowerEdge M710 Technical Guide 10
3System Information
3.1 Overview
The PowerEdge™ M710 is an optimized solution with large capacity memory capabilities and I/O
scalability in a dense, easy-to-deploy blade form factor. Its key differentiators are superior memory
scalability and granularity, new management capabilities with iDRAC/Life Cycle Controller, internal
persistent storage, two internal hard drives, and trusted platform module (TPM) support. The M710 is
a valuable asset in high-performance cloud computing (HPCC), messaging, database, and
virtualization solutions.
3.2 Product Features Summary
Table 2 summarizes the product features for the PowerEdge M710. For the latest information on
supported features for the PowerEdge M710, visit Dell.com.
Table 2. Product Features Summary
Feature
Technical Specifications
Processors
Quad-core or six-core Intel®Xeon®processor 5500 and 5600 series
Chipset
Intel®5520
Memory1
Up to 288GB (18 DIMM slots): 1GB/2GB/4GB/8GB/16GB ECC DDR3 up to 1333MT/s
Drive Bays
Four 2.5‖ SAS/SSD hot-plug drives
Storage1
Internal Hot-Plug Hard Drives Options:
2.5‖ SAS SSD, SATA SSD, SAS (10K, 15K)
2.5‖ nearline SAS (7.2K)
Maximum Internal Storage:
Up to 3.6TB per blade
External Storage:
For more information about Dell external storage solutions, visit Dell.com/Storage.
RAID Controller
Options
PERC H200 Modular (6Gb/s)
PERC H700 Modular (6Gb/s) with 512MB battery-backed cache;
512MB, 1GB non-volatile battery-backed cache
SAS 6/iR Modular
CERC 6/i Modular
PERC 6/i Modular with 256MB battery-backed cache

Dell PowerEdge M710 Technical Guide 11
Feature
Technical Specifications
I/O Mezzanine Card
Options
1Gb and 10Gb Ethernet:
Dual-Port Broadcom®Gb Ethernet w/ TOE (BCM-
5709S)
Quad-Port Intel Gb Ethernet (82576)
Quad-Port Broadcom Gb Ethernet
Dual-Port Broadcom 10Gb Ethernet (BCM-57711)
Brocade®BR1741M-k Dual-Port Mezzanine CNA
10Gb Enhanced Ethernet and Converged
Network Adapters (CEE/DCB):
Dual Port Intel 10GB Enhanced Ethernet Server
Adapter X520-DA2 (FCoE Ready for Future
Enablement)
Dual-Port QLogic®Converged Network Adapter
(QME8142)—supports CEE/DCB 10GbE + FCoE
Dual-Port QLogic Converged Network Adapter
(QME8242-k)—supports 10GbE + NPAR
Brocade®BR1741M-k Dual-Port Mezzanine CNA
Fibre Channel:
Dual-Port QLogic FC8 Fibre
Channel Host Bus Adapter
(HBA) (QME2572)
Dual-Port Emulex®FC8 Fibre
Channel Host Bus Adapter
(HBA) (LPe1205-M)
Emulex 8 or 4 Gb/s Fibre
Channel Pass-Through Module
InfiniBand:
Dual-Port Mellanox®ConnectX®
Quad Data Rate (QDR)
InfiniBand
Dual-Port Mellanox ConnectX
Dual Data Rate (DDR)
InfiniBand
Operating Systems
Microsoft®Windows Server®2012
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows HPC Server 2008
Novell®SUSE®Linux®Enterprise Server
Red Hat®Enterprise Linux®
Oracle®Solaris™
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Virtualization Options:
Citrix®XenServer®
Microsoft Hyper-V through Microsoft Windows Server 2008
VMware®vSphere®including ESX™and ESXi™
Red Hat Enterprise Virtualization®
Power Supply
Supplied by Dell PowerEdge M1000e Blade Chassis
Video
Integrated Matrox®G200 with 8MB memory
Systems Management
Dell™ OpenManage™
BMC, IPMI2.0 compliant
Dell OpenManage featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash
Remote Management: iDRAC6 Enterprise with option vFlash media
Microsoft System Center Essential (SCE) 2010 v2
Embedded
Hypervisors
Optional embedded SD media
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and

Dell PowerEdge M710 Technical Guide 12
Feature
Technical Specifications
operating environment and will be less.
4Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ M710 is a full-height blade server that requires an M1000e chassis to operate.
Figure 1. PowerEdge M1000e
The M710 occupies two slots in the M1000e rack enclosure for a maximum of eight blades in one
M1000e enclosure. The server can be mixed with other existing Dell blades of half-height form
factors and is designed to mix with possible future half-height-double-wide and full-height-double-
wide blades.
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M710 dimensions and weight are as follows:
Height: 38.5 cm (15.2 in)
Width: 5 cm (2 in)
Depth: 48.6 cm (19.2 in)
Weight (maximum configuration): 11.1 kg (24.5 lb)

Dell PowerEdge M710 Technical Guide 13
4.3 Exterior and Interior Views
4.3.1 Front View
Figure 2. Front View
4.3.2 Back View
Figure 3. Back View

Dell PowerEdge M710 Technical Guide 14
4.3.3 Internal View
A view of the internal module is shown in Figure 4. See Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
Figure 4. Internal Module View
4.4 Security
Configurable client IP address range for clients connecting to iDRAC6.
4.5 Cover Latch
The blade module includes a latch for the cover. See Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
4.6 TPM (Trusted Platform Module)
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008.
TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. A Trusted Computing
Module (TCM) version of the planar is available for use where TCM is the standard, for example, in
China.

Dell PowerEdge M710 Technical Guide 15
4.7 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.8 iDRAC6 Security Features
The iDRAC6 modular solution offers many security features including:
•User authentication through Microsoft Active Directory, generic LDAP Directory Service, or
locally administered user IDs and passwords
•Two-factor authentication provided by the Smart–Card logon feature; the two-factor
authentication is based on what the users have (the Smart–Card) and what they know (the
PIN)
•Role-based authorization, which enables an administrator to configure specific privileges for
each user
•User ID and password configuration
•SM-CLP and Web interfaces that support 128-bit and 40-bit encryption (for countries where
128 bit is not acceptable), using the SSL 3.0 standard
•Session time-out configuration (in seconds)
•Configurable IP ports (where applicable)
•Secure Shell (SSH), which uses an encrypted transport layer for higher security
•Login failure limits per IP address, with login blocking from that IP address when the limit is
exceeded
For greater security, access to iDRAC6 configuration through iDRAC6 Configuration Utility or the local
RACADM CLI can be disabled by means of a RACADM command or from the GUI.
4.9 USB
The M710 supports the following USB devices:
•DVD (bootable; requires two USB ports)
•USB Key (bootable)
•Keyboard (only one USB keyboard is supported)
•Mouse (only one USB mouse is supported)
4.10 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip.
4.11 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number.
4.12 User Accessible Jumpers, Sockets, and Connectors
See System Board Information in the Dell PowerEdge Modular Systems Hardware Owner’s Manual on
Support.Dell.com/Manuals for more information.

Dell PowerEdge M710 Technical Guide 16
5Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The PowerEdge™ M710
achieves higher power efficiency by implementing the following features:
User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see M1000e documentation on Support.Dell.com for further details)
Improved power budgeting
Voltage Regulator (VR) efficiency improvements
Processor VR dynamic phase shedding
Switching regulators instead of linear regulators
Closed loop thermal throttling
DDR3 and LV-DDR3 memory
Memory VR static phase shedding
BIOS Power/Performance options page
Active Power Controller (BIOS-based processor P-state manager)
Ability to power down or throttle memory
Ability to disable a processor core
Ability to turn off embedded NICs or PCIe lanes when not being used
Option to run PCIe at Gen1 speeds instead of Gen2
Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
Thermal specifications for the PowerEdge M710 are detailed in Table 3 along with other important
operating and storage information.
Table 3. Operating and Storage Specifications
Temperature
Operating
10° to 35°C (50° to 95°F) with a maximum temperature gradation of
10°C per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum temperature gradation
of 20°C per hour
Relative humidity
Operating
8% to 85% (noncondensing) with a maximum humidity gradation of 10%
per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of 10%
per hour

Dell PowerEdge M710 Technical Guide 17
Maximum vibration
Operating
0.26 Grms at 10-350 Hz for 15 min
Storage
1.54 Grms at 10-250 Hz for 15 min
Maximum shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/-10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration of
2 ms +/-10%
Altitude
Operating
-16 to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-16 to 10,600 m (-50 to 35,000 ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels measured
at ≤ 50% relative humidity)
5.4 Acoustics
The acoustical design of the PowerEdge M710 reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles or hums. Definitions for
acoustical performance data are as follows:
•Idle: Reference ISO7779 (2010) definition 3.1.7; system is running in its OS but no other
specific activity.
•LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296
(1988) and measured in accordance to ISO 7779 (2010).
Table 4 shows the acoustical performance for a typical configuration of the M1000e chassis with eight
PowerEdge M710 blade servers installed. Acoustical performance varies with hardware
configurations.
Table 4. Acoustical Performance of M1000e Chassis with Eight M710 Blades Installed
Typical Configuration (per blade) @ 23±2°C Ambient in M1000e Chassis
Operating Mode
LwA-UL (bels)
Idle
7.4
5.5 Thermal
The M710 thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling to direct air flow through the components to maintain proper cooling
Custom-designed heat sinks that maintain CPU, DIMM, and board-level chip temperatures
within thermal design targets
Highly optimized fan control algorithm:

Dell PowerEdge M710 Technical Guide 18
oBase fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
oPID control algorithms are used for both CPU, DIMMs, and NDC to maintain appropriate
thermal margin

Dell PowerEdge M710 Technical Guide 19
6Processors
6.1 Overview
The Intel®Xeon®processor 5500 and 5600 series are designed specifically for servers and workstation
applications. These processors feature quad-core processing to maximize performance and
performance/watt for data center infrastructures and highly dense deployments. They feature Intel
Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems and use a 1366-contact Flip-Chip Land Grid Array (FC-LGA) package that plugs into
a surface-mount socket. The M710 provides support for up to two 2S processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
•Up to four cores per processor
•Two point-to-point QuickPath Interconnect links at 6.4 GT/s
•45nm process technology
•No termination required for non-populated CPUs (must populate CPU socket 1 first)
•Integrated QuickPath DDR3 memory controller
•64-byte cache line size
•RISC/CISC hybrid architecture
•Compatible with existing x86 code base
•MMX™ support
•Execute Disable Bit
•Intel Wide Dynamic Execution
Executes up to four instructions per clock cycle
•Simultaneous Multi-Threading (SMT) capability
•Support for CPU Turbo Mode (on certain SKUs)
Increases CPU frequency if operating below thermal, power and current limits
•Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
•Intel 64 Technology
•Intel VT-x and VT-d Technology for virtualization support
•Enhanced Intel SpeedStep®Technology
•Demand-based switching for active CPU power management as well as support for ACPI P-
States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series along with:
•New top BIN processors at 130W TDP
•Support for DDR3L, 1.35v DIMMs for even lower system power
•Support for memory sparing
•AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL
•Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks

Dell PowerEdge M710 Technical Guide 20
Table 5. Comparison of Processor Technology
Intel Xeon Processor
5400 Series
5500 Series
5600 Series
Cores
4
4
6
Last Level Cache
2 x 6MB shared
8MB shared
12MB shared
FSB (MT/s) / Link Frequency
(GT/s)
1333 MT/s
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120W
130W for WS
95W for Server
130W for WS and
Server
Max Frequency
>3GHz
>3GHz
>3GHz
Memory Controller
Separate in
chipset
Integrated 3-channel
DDR3
Integrated
3-channel DDR3
Process Technology
45nm
45nm
32nm
Intel Trusted Execution
Technology
No
No
Yes
Intel Advanced Encryption
Security- New Instructions
No
No
Yes
Intel Virtualization
Technology
Yes
Yes
Yes
Intel 64
Yes
Yes
Yes
Intel Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA771
LGA1366
LGA1366
6.3 Supported Processors
Supported processors are detailed in Table 6.
Table 6. Supported Processors
Model
Speed
TDP
Power
Cache
Cores
Max
Memory
Speed
QPI
Link
Speed
Turbo
Mode
Enabled
Hyper-
threading
X5690
3.46GHz
130W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
X5680
3.33GHz
130W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
X5675
3.06GHz
95W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
X5670
2.93GHz
95W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
X5660
2.8GHz
95W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
X5650
2.66GHz
95W
12M
6
1333MT/s
6.4GT/s
Yes
Yes
E5645
2.4GHz
80W
12M
6
1333MT/s
5.86GT/s
Yes
Yes
E5649
2.53GHz
80W
12M
6
1333MT/s
5.86GT/s
Yes
Yes
L5640
2.26GHz
60W
12M
6
1066MT/s
5.86GT/s
Yes
Yes
X5687
3.6GHz
130W
12M
4
1333MT/s
6.4GT/s
Yes
Yes