DFI GH9A3 User manual

GH9A3
COM Express Mini Module
User’s Manual
A-637-M-2150
Copied from SH960MD

2User's Manual | GH9A3
Copyright
This publication contains information that is protected by copyright. No part of it may be repro-
duced in any form or by any means or used to make any transformation/adaptation without the
prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions or
changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2021. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re-
ceiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for com-
pliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

3User's Manual | GH9A3
Table of Contents
Copyright........................................................................................................................................ 2
Trademarks....................................................................................................................................2
FCC and DOC Statement on Class B........................................................................................... 2
Notice:............................................................................................................................................2
About this Manual.........................................................................................................................4
Warranty ........................................................................................................................................ 4
Static Electricity Precautions ....................................................................................................... 4
Safety Measures ........................................................................................................................... 4
About the Package........................................................................................................................5
Optional Items...............................................................................................................................5
Before Using the System Board................................................................................................... 5
Chapter 1 - Introduction................................................................................................................6
Specifications ......................................................................................................................... 6
Features .................................................................................................................................. 7
Concept................................................................................................................................... 8
Chapter 2 - Hardware Installation................................................................................................9
Board Layout........................................................................................................................... 9
System Memory ...................................................................................................................10
Assembly ..............................................................................................................................10
I/O Connectors .....................................................................................................................12
Board-to-board Connector ............................................................................................12
Signal Descriptions ..............................................................................................................14
Pin Types........................................................................................................................14
AC97/HDA Signals Descriptions ..................................................................................14
Gigabit Ethernet Signals Descriptions .........................................................................14
SATA Signals Descriptions ...........................................................................................15
PCI Express Lanes Signals Descriptions.....................................................................15
DDI Signals Descriptions...............................................................................................16
USB Signals Descriptions .............................................................................................17
LVDS Signals Descriptions............................................................................................18
LPC Signals Descriptions..............................................................................................19
SPI Signals Descriptions...............................................................................................20
Serial Interface Signals Descriptions...........................................................................20
Miscellaneous Signal Descriptions ..............................................................................20
Power and System Management Signals Descriptions .............................................21
Power and GND Signal Descriptions ...........................................................................22
Chapter 3 - BIOS Settings...........................................................................................................23
Overview ...............................................................................................................................23
Main.......................................................................................................................................24
Advanced .............................................................................................................................24
AMD CHIPSET Setting...................................................................................................25
AMD Platform Setting ...................................................................................................26
ACPI Configuration........................................................................................................27
Serial Port Console Redirection ...................................................................................28
Trusted Computing........................................................................................................29
PTN3460 Config ............................................................................................................29
IT8528 Super IO Configuration.....................................................................................30
CPU Configuration.........................................................................................................31
USB Configuration .........................................................................................................31
Network Stack Configuration........................................................................................32
CSM Configuration ........................................................................................................33
PC Health Status ...........................................................................................................33
WatchDog Configuration...............................................................................................34
Security .................................................................................................................................35
Secure Boot....................................................................................................................35
Boot .......................................................................................................................................37
Save & Exit ............................................................................................................................37
Updating the BIOS................................................................................................................38
Notice: BIOS SPI ROM..........................................................................................................38
Chapter 4 - Supported Software ................................................................................................39
Auto-run Menu......................................................................................................................39
AMD Chipset and VGA Drivers............................................................................................39
Intel LAN Driver ...................................................................................................................40
Audio Drivers ........................................................................................................................41
Adobe Acrobat Reader 9.3 ..................................................................................................41

4User's Manual | GH9A3
About this Manual
This manual can be downloaded from the website. The manual is subject to change and up-
date without notice, and may be based on editions that do not resemble your actual products.
Please visit our website or contact our sales representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper in-
stallation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in
or out of warranty. It must be returned to the purchase point, factory or authorized ser-
vice agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, con-
tacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the sys-
tem chassis cover for installation or servicing. After installation or servicing, cover the
system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

5User's Manual | GH9A3
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One GH9A3 board
Optional Items
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
When installing the system board in a new system, you will need at least the following internal
components.
• Power adaptor
External system peripherals may also be required for navigation and display, including at least
a keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
User's Manual | GH9A3
Chapter 1 - Introduction
X Specifications
SYSTEM Processor AMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12W
AMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12W
AMD® Ryzen™ Embedded R1000 series
Memory 4GB/8GB Memory Down Single Channel DDR4 2400MHz
BIOS SPI 64Mbit (default supports fTPM2.0)
GRAPHICS Controller Radeon™ Vega 3 Graphics
Feature OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display 1 x DDI (HDMI/DP++)
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz
DP++: resolution up to 3840x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Display DDI + LVDS DDI + eDP
EXPANSION Interface 3 x PCIe x1 (Gen 3)
1 x SDIO
1 x LPC
1 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
AUDIO Interface HD Audio
ETHERNET Controller Realtek RTL8111/RTL8119 (Option)
I/O USB 2 x USB 3.1
8 x USB 2.0
SATA 2 x SATA 3.0 (up to 6Gb/s)
GPIO 1 x 8-bit GPIO
SECURITY TPM BIOS default support FTPM, TPM2.0 by request.
WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds
POWER Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode)
Consumption TBD
OS SUPPORT
(UEFI ONLY)
Windows 10 IoT Enterprise 64-bit Linux
ENVIRONMENT Temperature Operating: 0 to 60°C
-40 to 85°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH
MTBF TBD
MECHANICAL Dimensions COM Express®Mini 84mm (3.30") x 55mm (2.16")
Compliance PICMG COM Express®R3.0, Type 10

7
Chapter 1
INTRODUCTION
User's Manual | GH9A3
X Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so that
your system will continue to operate.
LPDDR4
LPDDR4 delivers increased system bandwidth and improves performance. The advantages of
LPDDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2. Instead of using memory connectors, the system features memory down with the
support of ECC memory.
Graphics
The integrated AMD Radeon™ Vega 3 Graphics engine delivers an excellent blend of graphics
performance and features to meet business needs. It provides excellent video and 3D graphics
with outstanding graphics responsiveness. These enhancements deliver the performance and
compatibility needed for today’s and tomorrow’s business applications. Supports LVDS, eDP
and DDI display outputs.
Serial ATA
The system supports multiple SATA 3.0 (up to 6Gb/s) ports and allows for different configura-
tions of RAID levels to meet various requirements for data redundancy and performance.
Gigabit LAN
The Intel® I210 Gigabit LAN controller features up to 1Gbps data transmission with support for
Intel® Active Management Technology. It provides remote maintenance and manageability for
networked computing assets in an enterprise environment.
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is
supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Man-
agement Event) signal. However, if your system is in the Suspend mode, you can power-on the
system only through an IRQ or DMA interrupt.
USB
The system board supports the new USB 3.1. It is capable of running at a maximum transmis-
sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power
consumption, and is backward compatible with USB 2.0. It is a marked improvement in device
transfer speeds between your computer and a wide range of simultaneously accessible exter-
nal Plug and Play peripherals.
ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows® without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.

8
Chapter 1
INTRODUCTION
User's Manual | GH9A3
X Concept
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50 4.00 0.00
Extended
BasicCompact
Mini
74.20 80.00 91.00 121.00 151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
COM Express
Computer-on-module (COM) Express is a PC form factor designed with the core computing in-
tegrated on a fairly compact module. All the I/O signals and power supply are concentrated and
mapped to the board-to-board connectors on the bottom side to interface with a carrier board
that is typically customized to fit the application. When an upgrade or change of application is
needed, the physical separation of the core computing and the I/O of COM Express cuts back
the cost greatly, whereas canonical IPC designs would typically require an entire makeover. The
COM Express module can be replaced when there is only need to upgrade for higher computing
performance, while the carrier board can be redesigned when there is solely change in applica-
tion. COM Express also comes in different form factors and signal Types cut out for different
scales and aspects of the system's application. Detailed specifications of COM Express are
available on the website of PCI Industrial Computer Manufacturers Group (PICMG).
Carrier Board
This design guide addendum organizes and provides the recommendations of DFI’s COM carri-
er board design for COM-Express Modules. All other Schematic Guidelines for the carrier board
are applicable and can be found in the PICMG Design Guide V1.0. Please contact DFI sales and
application engineers if there are any questions about designing the carrier board, or you plan
to use this processor in applications other than mobile or desktop platforms.
Carrier Board
COM Express
module
CPU Cooler /
Heatsink

9
Chapter 2
HARDWARE INSTALLATION
User's Manual | GH9A3
Chapter 2 - Hardware Installation
X Board Layout Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives,
add-in boards, and other components. Perform installation procedures at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.
AMD
Ryzen
DDR4
DDR4
ITE
IT8528VG SPI
Flash BIOS
B110 B1
A110 A1
COM Express connector
eMMC
DDR4
DDR4
PTN3460
TOP
BOTTOM

10
Chapter 2
HARDWARE INSTALLATION
User's Manual | GH9A3
• LPDDR4 2400 MHz memory
• 4GB / 8GB Memory Down
X System Memory
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
DDR4_1
DDR4_2
AMD
Ryzen
DDR4
DDR4
ITE
IT8528VG SPI
Flash BIOS
Carrier Board
COM Express
module
CPU Cooler /
Heatsink
X Assembly
A CPU cooler / Heatsink may be included in the package. The CPU cooler / Heatsink contains
four spring screws and shall be installed after the COM Express module is securely mounted
onto the carrier board. Please make sure the cooler, the module, and the carrier board are ori-
ented correctly by inspecting whether the screws, screw holes, and stand-offs all align.
Note:
The carrier board is not included in the standard package and is typically custom-
ized.