Ebyte E01-2G4M20S1B User manual

E01-2G4M20S1B User Manual
2.4GHz 100mW SPI SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
1
CONTENTS
1. Overview...........................................................................................................................................................................2
1.1 Introduction...............................................................................................................................................................2
1.2 Features.....................................................................................................................................................................2
1.3 Application................................................................................................................................................................2
2. Technical Parameters.......................................................................................................................................................... 3
2.1 Limit Parameter........................................................................................................................................................ 3
2.2 Working parameters ................................................................................................................................................ 3
3. Size and pin definition........................................................................................................................................................ 4
4. Basic operation................................................................................................................................................................... 5
4.1 Hardware design....................................................................................................................................................... 5
4.2 Software programming............................................................................................................................................. 5
5. Basic application.................................................................................................................................................................6
5.1 Basic circuit diagram................................................................................................................................................ 6
6. FAQ.....................................................................................................................................................................................6
6.1 Communication range is too short.........................................................................................................................6
6.2 Module is easy to damage......................................................................................................................................7
6.3 BER(Bit Error Rate) is high.................................................................................................................................. 7
7. Welding guidance................................................................................................................................................................7
7.1 Reflow Soldering Temperature............................................................................................................................... 7
7.2 Reflow Soldering Curve........................................................................................................................................ 8
8. Batch packaging..................................................................................................................................................................9
Revision history...................................................................................................................................................................... 9
About us..................................................................................................................................................................................9

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
1-2
1. Overview
1.1 Introduction
E01-2G4M20S1B is a 2.4GHz SMD small-sized wireless module with PCB
antenna developed by Ebyte.
Built-in power amplifier (PA) and low-noise amplifier (LNA) on the original
basis, so that the maximum transmit power reaches 100mW while receiving
sensitivity is further improved, Compared with products without power amplifier
and low noise amplifier, the overall communication stability is greatly improved.
This product uses industrial grade high precision 16MHz crystal.
Because E01-2G4M20S1B is a pure RF transceiver module, it needs to use MCU driver or use a dedicated SPI
debugging tool.
1.2 Features
The maximum transmit power is 20dBm, which meets the battery power supply and greatly expands the
communication distance;
Communication distance can reach 800m under ideal conditions;
Global license-free ISM 2.4GHz band；
Air data rate : 2Mbps, 1Mbps and 250kbps；
125 communication channels to meet the needs of multi-point communication, packet, frequency hopping and other
applications；
Connect to MCU through SPI interface, the speed is 0 ～10Mbps；
Professional RF shielding cover, anti-interference, anti-static;
Industrial grade standard design for long-term use from -40 ～+ 85 ℃;
Built-in PCB antenna, no need for external antenna.
1.3 Application
Wearable devices;
Smart home and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Health care products;
Wireless voice, wireless headphones;
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
1-3
2. Technical Parameters
2.1 Limit Parameter
Main parameter
Performance
Remarks
Min
Min
Voltage supply（V）
0
3.6
Voltage over 3.6V will cause permanent damage
to module
Blocking power（dBm）
-
-10
Chances of burn is slim when modules are used in
short distance
Working temperature（℃）
-40
85
2.2 Working parameters
Main parameter
Performance
Remarks
Min.
Typ.
Max.
Operating voltage（V）
2.0
3.3
3.6
≥3.3 V ensures output power
Communication level（V）
3.3
For 5V TTL, it may be at risk of burning down
Working temperature（℃）
-40
25
85
Industrial design
Operating frequency（GHz）
2.4
-
2.525
Support ISM band
Power
consumptio
n
TX current（mA）
-
135
-
Instant power consumption
RX current（mA）
-
20
-
Sleep current（μA）
19
19.5
20
Software is set 0dBm, built-in pa
Max Tx power（dBm）
-97
-98
-99
Air data rate is 250kbps
Receiving sensitivity（dBm）
250k
250k
2M
controlled by user's programming
Main parameter
Value
Remarks
Distance
800m
in open and clear air, at height of 2.5m，air data rate:250kbps
FIFO
32Byte
Max packet length per time
Crystal Frequency
16MHz
Modulation
GFSK
Package
SMD
Connector
Half hole 1.27mm
Communication interface
SPI
0-10Mbps
Size
23 * 14mm
with PCB antenna
Antenna
PCB antenna
50 ohm impedance match

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
1-4
3. Size and pin definition
Pin No.
Pin item
Pin direction
Application
1
VCC
Power supply
Power supply must be between 2.0 and 3.6V
2
CE
Input
Module control pin
3
CSN
Input
Chip select pin for starting new SPI communication
4
SCK
Input
SPI clock pin
5
MOSI
Input
SPI data input pin
6
MISO
Output
SPI data output pin
7
IRQ
Output
Interrupt request，valid in low level
8
GND
Power supply
Ground, connected to power reference ground (Module fixed)
9
GND
Power supply
Ground, connected to power reference ground (Module fixed)
10
GND
Power supply
Ground, connected to power reference ground

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
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4. Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,
and the module needs to be reliably grounded.；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged；
Please check the stability of the power supply, the voltage cannot be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of
the margin, so the whole machine is beneficial for long-term stable operation.；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and
other parts with large electromagnetic interference.；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and
the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom
Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency
analog, power traces) around the module that will greatly affect the performance of the module. It is
recommended to stay away from the module according to the strength of the interference. If necessary,
appropriate isolation and shielding can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended,
there is still a risk of damage)；
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
The antenna installation structure has a great impact on the performance of the module. Be sure to ensure that
the antenna is exposed, preferably vertically.When the module is installed inside the case, a high-quality
antenna extension cable can be used to extend the antenna to the outside of the case;
Do not install the antenna inside the metal case,it will greatly reduce the transmission distance;
The on-board PCB antenna should avoid conductors or other sources of interference.
4.2 Software programming
Insert the module on the user's circuit board, use the microcontroller to communicate with it through SPI or serial
port, and operate its control register and transmit / receive buffer through the SPI instruction. Please refer to the

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
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latest nRF24L01P datasheet for the register read and write operations.
IRQ is an interrupt pin. It is used to wake up the microcontroller and achieve fast response; users can leave it
unconnected and use SPI to query the interrupt status (not recommended, not conducive to overall power
consumption, low efficiency)；
CE can be connected to high level for a long time, but the module must be set to POWER DOWN power-down
mode when writing to the register. It is recommended that CE be controlled by MCU pin.
5. Basic application
5.1 Basic circuit diagram
6. FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
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6.2 Module is easy to damage
Please check the power supply to ensure that it is between the recommended power supply voltage. If the maximum
value is exceeded, the module will be permanently damaged.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure anti-static measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long.
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7. Welding guidance
7.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average descent rate
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time of 25 ° C to peak
temperature
6 minutes max
8 minutes max

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
6-8
7.2 Reflow Soldering Curve

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M20S1B User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co., Ltd
6-9
8. Batch packaging
Revision history
Version
Date
Description
Issued by
1.0
2019-11-19
Initial version
Ren
About us
Tel: [phone] Support: suppo[email protected] Website: www.ebyte.com
Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China