Ebyte E18-MS1PA2-IPX User manual

E18-MS1PA2-IPX User Manual
CC2530 2.4GHz 100mW ZigBee Wireless Module

Chengdu Ebyte Electronic Technology Co.,ltd. E18-MS1PA2-IPX User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd.
1
Content
1. General introduction........................................................................................................................................................... 2
1.1 Brief introduction.....................................................................................................................................................2
1.2 Features.....................................................................................................................................................................2
1.3 Application................................................................................................................................................................2
2. Specification and parameter............................................................................................................................................... 3
2.1 Limit parameter........................................................................................................................................................ 3
2.2 Operating parameter................................................................................................................................................. 3
3. Size and pin definition........................................................................................................................................................ 4
4. Usage.................................................................................................................................................................................. 5
5. Programming...................................................................................................................................................................... 7
5.1 TI ZigBee FAQ......................................................................................................................................................... 7
6. Basic operation................................................................................................................................................................. 10
6.1 Hardware design..................................................................................................................................................... 10
7. FAQ...................................................................................................................................................................................11
7.1 Communication distance is too short......................................................................................................................11
7.2 Module is easy to damage...................................................................................................................................... 11
7.3 BER(Bit Error Rate) is high................................................................................................................................... 11
8. Welding instruction...........................................................................................................................................................12
8.1 Reflow soldering temperature................................................................................................................................ 12
8.2 Reflow soldering curve...........................................................................................................................................12
9. E18 series..........................................................................................................................................................................13
10. Antenna recommendation............................................................................................................................................... 13
11. Package........................................................................................................................................................................... 14
Revision history....................................................................................................................................................................14
About us................................................................................................................................................................................14

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1. General introduction
1.1 Brief introduction
E18-MS1PA2-IPX is small-sized 2.4GHz ZigBee wireless module, which is
designed and produced by Chengdu Ebyte. SMD type, IPEX interface, with a
transmission power of 100mW and the pin pitch is 1.27mm. It is applicable for
various applications (especially smart home).
E18-MS1PA2-IPX adopts the original CC2530 RF chip of TI, the chip is
integrated with 8051 MCU and wireless transceiver, and built-in PA+LNA, greatly
expanding communication distance and improving communication stability. The
module is applicable for ZigBee design and 2.4GHz IEEE 802.15.4 protocol.
All IO ports of the MCU have been pinned out for multiple development.
1.2 Features
Built-in PA+LNA，Maximum transmission power of 100mW，achieve long distance ZigBee transmission；
Communication distance can reach 1200m under ideal conditions;
Built-in ZigBee protocol stack;
Support peripherals such as ADC、PWM、GPIO;
Built-in 32.768kHz clock crystal oscillator;
Support the global license-free ISM 2.4GHz band;
Rich resources, 256KB FLASH，8KB RAM；
High performance and low power 8051 micro-controller core with code acquisition;
Support 2.0～3.6V power supply, power supply over 3.3V can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
IPEX interface for easy connection to coaxial cable or external antenna.
1.3 Application
Smart home and industrial sensors;
Security system, positioning system;
Wireless remote control, drone；
Wireless game remote control；
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.

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2. Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min
Max
Power supply（V）
0
3.6
Voltage over 3.6V will cause permanent damage to
the module
Blocking power（dBm）
-
10
Chance of is slim when modules are used in short
distance
Operating temperature（℃）
-40
+85
Industrial grade
2.2 Operating parameter
Main parameter
Performance
Remark
Min
Type
Max
Operating voltage（V）
2.0
3.3
3.6
≥3.3 V ensures output power
Communication level （V）
3.3
For 5V TTL, it may be at risk of burning down
Operating temperature （℃）
-40
-
+85
Industrial grade
Operating frequency（GHz）
2.400
-
2.480
ISM band
Power
Consum-ptio
n
TX current（mA）
100
Instant power consumption
RX current（mA）
35
-
Sleep current（μA）
2
Shut down by software
Max TX power（dBm）
19.6
20
20.5
-
Receiving sensitivity（dBm）
-99
-98
-97
Air data rate is 250 kbps
Main parameter
Description
Remark
Reference distance
1200m
Test condition: clear and open area, antennna gain: 5dBi,
antenna height: 2.5m, aur data rate: 250kbps
Protocol
ZigBee
Communication interface
I/O
All IO ports lead out
Package
SMD
Interface
1.27mm
IC
CC2530F256RHAT/QFN40
Built-in PA+LNA
FLASH
256KB
RAM
8KB
Core
8051
Main parameter
16*22.5mm

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Antenna
IPEX
50 ohm impedance
3. Size and pin definition
Pin No.
Pin item
Pin
direction
Application
1
GND
Input
Ground, connecting to power supply reference ground
2
VCC
Input
Power supply, must be 2.0-3.6V
3
P2.2
Input /Output
MCU GPIO
4
P2.1
Input /Output
MCU GPIO
5
P2.0
Input /Output
MCU GPIO
6
P1.7
Input /Output
MCU GPIO
7
P1.6
Input /Output
MCU GPIO
8
NC
N.C.
9
NC
N.C.
10
P1.5
Input /Output
MCU GPIO
11
P1.4
Input /Output
MCU GPIO
12
P1.3
Input /Output
MCU GPIO
13
P1.2
Input /Output
MCU GPIO

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14
P1.1
Output
MCU GPIO，PA transmission control pin
15
P1.0
Output
MCU GPIO，PA receiving control pin
16
P0.7
Input /Output
MCU GPIO
17
P0.6
Input /Output
MCU GPIO
18
P0.5
Input /Output
MCU GPIO
19
P0.4
Input /Output
MCU GPIO
20
P0.3
Input /Output
MCU GPIO
21
P0.2
Input /Output
MCU GPIO
22
P0.1
Input /Output
MCU GPIO
23
P0.0
Input /Output
MCU GPIO
24
RESET
Input
Reset port
If you need to use the ad hoc network function,please go to the official website to download
"E18-MS1PA2-IPX_UserManual-S_CN" for reference;
4. Usage
No.
Keyword
Remark
1
Burn
firmware
The module is built-in 8051 MCU，to download programme please use CC Debugger；
use2
Initiate PA
Initiate PA , modify it in file hal_board_cfg.h.

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3
Parameter
setting
This product can modify the settings of PA in zstack directly in the previous program;
In this example, the pins P1.1 and P1.0 of the CC2530 are connected to the PA_EN, LNA_EN of the
internal PA;
At the same time, it can be seen that LNA_EN is always in the high level and the receiving mode.
4
Program
modificati-
on
Find macRadioTurnOnPower() from file mac_radio_defs.c, and modify.
5
Power
modificati-
on
Find static CODE const macPib_t macPibDefaults from file mac_pib.c,modify in the red signed
below.

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5. Programming
5.1 TI ZigBee FAQ
①Differences between different versions of TI's ZigBee protocol stack, how to choose the right
protocol stack for product development?
From the Z-Stack 0.1 to Z-Stack 2.5.1a and the current Z-Stack Home 1.2.1, Z-Stack Lighting 1.0.2, Z-Stack Energy
1.0.1, Z-Stack Mesh 1.0.0, TI mainly upgraded the protocol stack through: 1) adding some new features according to
ZigBee Specification of the ZigBee Alliance, for example, ZigBee2007 tree-shape route, adding Mesh route in ZigBee
Pro, and raising MTO and Source Routing algorithms so TI added some new functions to the protocol stack, also did
some correction of bugs in Spec such as some unclear descriptions; 2) Correction of bugs of TI ZigBee protocol itself.
You can find the differences between one protocol stack and the previous version in the Release Note of the installation
directory.
After the Z-Stack 2.5.1a, TI did not publish the protocol stack in the form of Z-Stack 2.6.x but in Application Profile
form, because TI hopes the developers could select proper protocol stack based on actual applications. The protocol
stacks like Z-Stack Home 1.2.1 includes two parts: 1）Core Stack, it is the follow-up versions of Z-Stack 2.5.1a, it can be
found from the Z-Stack Core Release Notes.txt, Version 2.6.2. 2）Profile-related part, this part is related to the actual
application, Home Automation stack is about the realization of ZigBee Home Automation Profile. Meanwhile, Z-Stack
Lighting 1.0.2 and Z-Stack Energy 1.0.1 are Core Stack with Profile for application.
1) Z-Stack Home 1.2.2a is specific for smart home products development.
2) Z-Stack Lighting 1.0.2 is specific for ZLL products development.
3) Z-Stack Energy 1.0.1 is specific for intelligent energy, meter, In Home Display, and so on.
4) Z-Stack Mesh 1.0.0 is specific for private applications, it only utilizes the function of standard ZigBee protocol,
Mesh route and so on, the application layer shall be defined by the developer.
After the publish of ZigBee 3.0 protocol, the latest ZigBee protocol stack is Z-Stack 3.0, it supports CC2530 and
CC2538.
②How to apply for standard ZigBee test certification?
Take standard ZigBee Home Automation products as example, developers must develop according to the description
in the ZigBee Home Automation Profile Specification, this document can be found from www.zigbee.or. After
developing the product, developers need to learn the ZigBee Home Automation Profile Test Specification, this document
described the items to be tested by the Test House, it can be downloaded from www.zigbee.org also, in addition, there is
another PICS document, it is specific for describing the functions supported, developers confirm the functions by
checking the boxes according to the actual functions and the required functions in the Specification, as below are the
testing procedure:
1) Join the ZigBee alliance, generally assisted by testing labs;
2) Send samples to testing lab, complete the PICS file;
3) First round pre-testing, the testing lab feedback the testing results, developers modify the sample codes.
4) The testing lab verify the modified sample, and starts formal test;
5) The testing lab assists developers to complete the ZigBee alliance online certification application;
6) The testing lab submits the test report to ZigBee alliance. The alliance will review and issue certificate.
Currently, there are two testing labs in China who can complete standard ZigBee test:
1) CESI in Beijing;

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2) Element Shenzhen Office (headquartered in England)
Please refer to below wiki link for details:
http://processors.wiki.ti.com/index.php/ZigBee_Product_Certification_Guide
③How to select the 64-bit MAC address of the device?
There are two IEEE addresses in CC2530, one is Primary IEEE address, the other is Secondary address. Primary
IEEE address is stored in Information Page of the chip, this address is bought by TI from IEEE, each chip has one unique
address. Users could only Read this value and cannot modify or erase it. By reading the address in the protocol stack,
users can obtain osal_memcpy (aExtendedAddress, (uint8 *)(P_INFOPAGE+HAL_INFOP_IEEE_OSET),
Z_EXTADDR_LEN). Secondary address is stored in the last Page of the Flash of CC2530, users can Read/Write with the
function HalFlashRead (HAL_FLASH_IEEE_PAGE, HAL_FLASH_IEEE_OSET, aExtendedAddress,
Z_EXTADDR_LEN).
When the protocol stack is operating, how to select Primary IEEE address or Secondary address as MAC address?
Please operate in the function zmain_ext_addr(void).
1) Read IEEE address from NV, if it already exists (not 0xFF), use this address as MAC address;
2) If not in 1), read from the Secondary IEEE address storage place, if it exists (not 0xFF), write the address into NV,
and use this address as MAC address;
3) If not in 2), read from the Primary IEEE address storage place, if it exists (not 0xFF), write the address into NV,
and use this address as MAC address;
4) If not in 3), generate one 64-bit variable randomly, write it into NV, use it as MAC address.
④How to forbid node from searching network, or extend the interval for sending Beacon Request?
End Device is low power consumption device powered by battery, after cutting from network, how to forbid the
node from searching network, or how to extend the interval for sending Beacon Request.
1)Start searching network uint8 ZDApp_StartJoiningCycle( void )
Stop searching network uint8 ZDApp_StopJoiningCycle( void )
2) Change the Beacon Request sending period
Modify the variable zgDefaultStartingScanDuration
// Beacon Order Values
#define BEACON_ORDER_NO_BEACONS 15
#define BEACON_ORDER_4_MINUTES 14 // 245760 milliseconds
#define BEACON_ORDER_2_MINUTES 13 // 122880 milliseconds
#define BEACON_ORDER_1_MINUTE 12 // 61440 milliseconds
#define BEACON_ORDER_31_SECONDS 11 // 30720 milliseconds
#define BEACON_ORDER_15_SECONDS 10 // 15360 MSecs
#define BEACON_ORDER_7_5_SECONDS 9 // 7680 MSecs
#define BEACON_ORDER_4_SECONDS 8 // 3840 MSecs
#define BEACON_ORDER_2_SECONDS 7 // 1920 MSecs
#define BEACON_ORDER_1_SECOND 6 // 960 MSecs
#define BEACON_ORDER_480_MSEC 5
#define BEACON_ORDER_240_MSEC 4
#define BEACON_ORDER_120_MSEC 3
#define BEACON_ORDER_60_MSEC 2

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#define BEACON_ORDER_30_MSEC 1
#define BEACON_ORDER_15_MSEC 0
⑤How to put End Device into low power consumption mode, how to set up sleep time?
After the POWER_SAVING is enabled in the protocol stack macro definition,put
DRFD_RCVC_ALWAYS_ON=FALSE in f8wConfig.cfg file, then the End Device will enter sleep mode.
The sleep time is decided by the OSAL operating system, the latest Event Timeout to occur will be set as sleep time.
There is description in the protocol stack hal_sleep function.
There are two kinds of timeout: one is the timeout of application layer event, the other is the timeout of MAC layer
event.
1) Timeout of application layer, can be obtained through osal_next_timeout() of osal_pwrmgr_powerconserve(void)
function;
2) Timeout of MAC layer, can be obtained through MAC_PwrNextTimeout() of halSleep(uint16 osal_timeout)
function.
⑥What new features does ZigBee 3.0 stack have?
Please refer to below link, it describes the new features of the ZigBee 3.0 stack as compared with the previous
ZigBee Home Automation/ZigBee Light Link.
http://processors.wiki.ti.com/index.php/What%27s_New_in_ZigBee_3.0
About the status switch in the TI ZigBee protocol stack
http://www.deyisupport.com/question_answer/wireless_connectivity/zigbee/f/104/t/104629.aspx
⑦About the difference between OAD and OTA in TI protocol stack?
OAD is short for Over the Air Download, OTA is short for Over the Air. The functions of these two are the same,
they can be called the software upgrade on air. In the earlier ZigBee protocol standard, there was no standard for node
software upgrading on air, but many customers have such requirements, thus TI developed their own protocol stack for
software upgrading on air, and named it as OAD. After that, ZigBee alliance noticed the more and more requirements for
upgrading on air, so they developed the upgrading on air standard and named it as OTA, this standard has taken the TI
OAD method as reference and has made some modification. The upgrading on air in TI’s earlier protocol stack, it is
called OAD, and in the later stack, it is called OTA as following the ZigBee alliance stack.
⑧Which protocol stack shall be selected for developing private application based on ZigBee Mesh?
Many customers only need to apply the function of ZigBee Mesh network in their system or products, and do not
need to do according to the application layer as defined by the ZigBee, especially for some industrial applications, as for
such requirements, how to select proper TI protocol stack for developing products?
http://www.deyisupport.com/question_answer/wireless_connectivity/zigbee/f/104/t/132197.aspx

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6. Basic operation
6.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.

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7. FAQ
7.1 Communication distance is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the
lower the transmitting power；
Due to antenna quality or poor matching between antenna and module.
7.2 Module is easy to damage
Please check the power supply source, ensure it is between the recommended supply voltage, voltage higher than
the maximum will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
7.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.

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8. Welding instruction
8.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Max preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time to peak temperature
for 25℃
6 minutes max
8 minutes max
8.2 Reflow soldering curve

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9. E18 series
Model
IC
Frequency
Tx power
Distance
Size
Package
Antenna
Hz
dBm
m
mm
E18-MS1-PCB
CC2530
2.4G
4
200
14.1*23
SMD
PCB
E18-MS1-IPX
CC2530
2.4G
4
240
14.1*20.8
SMD
IPEX
E18-MS1PA1-PCB
CC2530
2.4G
20
800
16*27
SMD
PCB
E18-MS1PA2-IPX
CC2530
2.4G
20
1200
16*22.5
SMD
IPEX
E18-2G4M27SI
CC2530
2.4G
27
2500
16*22.5
SMD
IPEX
E18-2G4U04B
CC2531
2.4G
4
200
18*59
USB
PCB
10. Antenna recommendation
Model No.
Type
Frequency
Gain
Size
Cable
Interface
Function feature
Hz
dBi
mm
cm
TX2400-NP-5010
Flexible
Antenna
2.4G
2.0
10x50
-
IPEX
Flexible FPC soft antenna
TX2400-JZ-3
Rubber
antenna
2.4G
2.0
30
-
SMA-J
Short straight &omnidirectional
antenna
TX2400-JZ-5
Rubber
antenna
2.4G
2.0
50
-
SMA-J
Short straight &omnidirectional
antenna
TX2400-JW-5
Rubber
antenna
2.4G
2.0
50
-
SMA-J
Fixed bending& omnidirectional
antenna
TX2400-JK-11
Rubber
antenna
2.4G
2.5
110
-
SMA-J
Flexible&omnidirectional antenna
TX2400-JK-20
Rubber
antenna
2.4G
3.0
200
-
SMA-J
Flexible&omnidirectional antenna
TX2400-XPL-150
Sucker
antenna
2.4G
3.5
150
150
SMA-J
small-size sucker antenna,
cost-effective

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11. Package
Revision history
Version
Date
Description
Issued by
1.0
2019-12-13
Initial version
1.1
2019-12-14
Format adjustment
Ren
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