Ebyte E01C-ML01SP2 User manual

E01C-ML01SP2 User Manual
SI24R1+ 2.4GHz 100mW SPI SMD wireless module

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co., Ltd
1
Contents
Disclaimer...............................................................................................................................................................................2
Chapter1. Overview................................................................................................................................................................ 3
1.1 Brief introduction......................................................................................................................................................3
1.2 Features.....................................................................................................................................................................3
1.3 Application................................................................................................................................................................3
Chapter2. Specifications......................................................................................................................................................... 4
2.1 Limit parameter .......................................................................................................................................................4
2.2 Operating parameter.............................................................................................................................................. 4
Chapter3. Size and pin definition.......................................................................................................................................... 5
Chapter4. Basic operation.......................................................................................................................................................6
4.1 Hardware design....................................................................................................................................................... 6
4.2 Software editing........................................................................................................................................................7
Chapter5. Circuit diagram.......................................................................................................................................................8
Chapter6. FAQ........................................................................................................................................................................ 8
6.1 Communication range is too short............................................................................................................................ 8
6.2 Module is easy to damage.........................................................................................................................................8
6.3 BER(Bit Error Rate) is high...................................................................................................................................9
Chapter7. Soldering guidance.................................................................................................................................................9
7.1 Reflow soldering temperature...................................................................................................................................9
7.2 Reflow soldering curve...........................................................................................................................................10
Chapter8. Related models..................................................................................................................................................... 10
Chapter9. Antenna Guide......................................................................................................................................................10
Chapter10. Antenna selection............................................................................................................................................... 11
Chapter11. Bulk packaging...................................................................................................................................................12
Revision history.................................................................................................................................................................... 12
About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co., Ltd
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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co., Ltd
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Chapter1. Overview
1.1 Brief introduction
E01C-ML01SP2 is a small size, self-contained PCB antenna and a 2.4GHz patch
type wireless module with a maximum transmission power of 100mW based on the
domestic SI24R1.
Built-in power amplifier (PA) and low noise amplifier (LNA) on the original basis,
so that the maximum transmission power reaches 100mW, while the receiving
sensitivity is further improved, and the overall communication stability is less than
there is no power amplifier and low noise amplifier The products have been greatly
improved.
This product has obtained FCC, CE, RoHS and other authoritative certification reports at home and abroad, and uses
industrial-grade high-precision 16MHz crystal oscillator.
Since E01C-ML01SP2 is a pure radio frequency transceiver module, it needs to use MCU driver or use a dedicated SPI
debugging tool.
1.2 Features
Ultra-small size, only 12.8x25mm;
RFX2401C power amplifier scheme, the maximum transmission power is 100mW, and the software is multi-level
adjustable;
Under ideal conditions, the communication distance can reach 1.8km;
At the same time, it has PCB onboard antenna and IPX interface, users can choose to use according to their own
needs;
Professional radio frequency shield, anti-interference and anti-static;
Support the global license-free ISM 2.4GHz frequency band;
Support 2Mbps, 1Mbps and 250kbps air rate;
125 communication channels to meet application requirements such as multipoint communication, grouping, and
frequency hopping;
Connect with MCU through SPI interface, rate 0～10Mbps;
Support 2.0～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;
Industrial standard design, support -40～+85℃ long time use；
1.3 Application
Wearable device;
Smart home and industrial sensors, etc.;
Security system, positioning system;
Wireless remote control, UAV;
Wireless game remote control;

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Healthcare products;
Wireless voice, wireless headset;
Automotive industry applications.
Chapter2. Specifications
2.1 Limit parameter
Main parameter
Performance
备注
Min.
Max.
Power supply（V）
0
3.6
Voltage over 3.6V will cause permanent damage
to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules are used
in short distance
Operating temperature（℃）
-40
85
Industrial grade
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage（V）
2.0
3.3
3.6
≥3.3V ensures output power
Communication level（V）
3.3
For 5V TTL, it may be at risk of burning
down
Operating temperature（℃）
-40
-
85
Industrial design
Operating frequency（GHz）
2.4
-
2.525
Support ISM band
Power
consumptio
n
Tx current
120
Instantaneous power consumption
Rx current
28.5
Sleep current(μA)
2
Software is shut down
Max Tx power（dBm）
19.7
20
20.2
Receiving sensitivity（dBm）
-96.5
-96
-97.5
Air data rate is 250kbps
Air data rate（bps）
250k
-
2M
Controlled via user’s programming
Main parameter
Description
Remark
Reference distance
1800m
Test condition：clear and open area, antenna gain: 5dBi，antenna
height: 2.5m，air data rate: 250kbps
FIFO
32Byte
Max length transmitted each time
Crystal frequency
16MHz

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Modulation
GFSK
Package
SMD
Connector
1.27mm pin header
Communication interface
SPI
0～10Mbps
Size
12.8 * 25mm
With out SMA
Antenna
PCB/IPEX
The factory default PCB antenna, the equivalent impedance is about
50Ω
Chapter3. Size and pin definition
Pin No.
Pin item
Pin direction
Pin application
1
VCC
The power supply must be between 2.0～3.6V
2
CE
Input
Module control pin
3
CSN
Input
Module chip select pin, used to start a SPI communication

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4
SCK
Input
Module SPI bus clock
5
MOSI
Input
Module SPI data input pin
6
MISO
Output
Module SPI data output pin
7
IRQ
Output
Module terminal signal output, active low
8
GND
Ground wire, connected to the power reference ground
9
GND
Ground wire, connected to the power reference ground
10
GND
Ground wire, connected to the power reference ground
Chapter4. Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;
Please check the stability of the power supply, the voltage can not be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding
can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage)；
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside；

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The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
Conductors or other sources of interference should be avoided around the onboard PCB antenna.
4.2 Software editing
The drive mode of this module SI24R1+PA+LNA is completely equivalent to SI24R1, and users can operate
according to the SI24R1 chip manual (see SI24R1 manual for details);
Power bin:
SI24R1 register setting table:
Address(Hex)
Mnemonic
Bit
Reset Value
Description
06
RF_SETUP
RF configuration
RF_PWR
2:0
110
Set TX power
111:7dBm 110:4dBm
101:3dBm 100:1dBm
011:0dBm 010:-4dBm
001:-6dBm 000:-12dBm
011：Pre-stage-0dBm, Output 20dBm；
010：Pre-stage-4dBm, Output 16dBm；
011：Pre-stage-6dBm, Output 12dBm;
000：Pre-stage-12dBm, Output 6dBm;
IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response; it can be
disconnected, and the interrupt status can be obtained by SPI query (not recommended, not conducive to overall
power consumption, and low efficiency);
CE can be connected to the high level for a long time, but the module must be set to POWER DOWN power-down
mode when writing the register. It is recommended that CE be controlled by the MCU pin;
The CE pin is connected to the LNA enable pin. When CE=1, the LNA is turned on, and when CE=0, the LNA is
turned off. This operation is completely consistent with the transceiver mode of nRF24L01; that is, the user does not
need to care about LNA operation at all;
If the user needs to answer automatically, the CE pin must be kept high during the transmission process, and the
high level time cannot be longer than 10us as mentioned in the nRF24L01+ manual. The correct operation is: CE=1
to trigger the transmission. After knowing that the transmission is completed, CE=0, instead of CE=0 after 10us.
The reason is: After SI24R1+ is sent, it will immediately switch to receiving mode. At this time, if CE= 0, the LNA
has been turned off, which is not conducive to receiving sensitivity.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
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Chapter5. Circuit diagram
Chapter6. FAQ
6.1 Communication range is too short
When there is a straight line communication obstacle, the communication distance will be attenuated accordingly;
Temperature, humidity, and co-frequency interference will increase the communication packet loss rate;
The ground absorbs and reflects radio waves, and the test results near the ground are poor;
Sea water has a strong ability to absorb radio waves, so the seaside test results are poor;
If there is a metal object near the antenna or placed in a metal shell, the signal attenuation will be very serious;
The power register setting is wrong, the air speed setting is too high (the higher the air speed, the closer the
distance);
The low voltage of the power supply at room temperature is lower than the recommended value, the lower the
voltage, the lower the power output;
The poor matching degree of the antenna and the module or the quality of the antenna itself.
6.2 Module is easy to damage
Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the
maximum value, it will cause permanent damage to the module;
Please check the stability of the power supply, the voltage should not fluctuate greatly and frequently;
Please ensure anti-static operation during installation and use, and high-frequency components are electrostatically
sensitive;
Please ensure that the humidity during installation and use should not be too high, and some components are
humidity sensitive devices;
If there is no special requirement, it is not recommended to use at too high or too low temperature.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01C-ML01SP2 User Manual
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6.3 BER(Bit Error Rate) is high
There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency
and channel to avoid interference;
The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line
should not be too long;
Unsatisfactory power supply may also cause garbled codes. Ensure the reliability of the power supply;
Poor or too long extension cords and feeders will also cause high bit error rates.
Chapter7. Soldering guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid
phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average ramp-down
rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak
temperature for 25℃
6 minutes max
8 minutes max

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7.2 Reflow soldering curve
Chapter8. Related models
Model
IC
Frequency
Power
Distance
Pakage
Antenna
Hz
dBm
m
E01-ML01S
nRF24L01+
2.4G
0
100
SMD
PCB
E01-ML01D
nRF24L01+
2.4G
0
100
DPI
PCB
E01-ML01IPX
nRF24L01+
2.4G
0
200
SMD
IPEX
E01-2G4M13S
nRF24L01+
2.4G
13
1200
SMD
PCB
E01-ML01SP2
nRF24L01+
2.4G
20
1800
SMD
PCB/IPEX
E01-ML01SP4
nRF24L01+
2.4G
20
2000
SMD
IPEX
E01-ML01DP4
nRF24L01+
2.4G
20
1800
DPI
PCB
E01-ML01DP5
nRF24L01+
2.4G
20
2500
DPI
SMA-K
E01-2G4M27D
nRF24L01+
2.4G
27
5000
DPI
SMA-K
All wireless modules of the E01 series can communicate with each other
Chapter9. Antenna Guide

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Products Model
Type
Frequency
Gain
Size
Feeder
Interface
Feature
Hz
dBi
mm
cm
TX2400-NP-5010
Flexible
antenna
2.4G
2.0
10x50
-
IPEX
Flexible FPC soft antenna
TX2400-JZ-3
Glue stick
antenna
2.4G
2.0
30
-
SMA-J
Ultra-short straight,
omnidirectional antenna
TX2400-JZ-5
Glue stick
antenna
2.4G
2.0
50
-
SMA-J
Ultra-short straight,
omnidirectional antenna
TX2400-JW-5
Glue stick
antenna
2.4G
2.0
50
-
SMA-J
Fixed bending,
omnidirectional antenna
TX2400-JK-11
Glue stick
antenna
2.4G
2.5
110
-
SMA-J
Bendable glue stick,
omnidirectional antenna
TX2400-JK-20
Glue stick
antenna
2.4G
3.0
200
-
SMA-J
Bendable glue stick,
omnidirectional antenna
TX2400-XPL-15
0
Suction
cup
antenna
2.4G
3.5
150
150
SMA-J
Small suction cup
antenna, cost-effective
Chapter10. Antenna selection
使能 PCB 板载天线（出厂默认） 使能 IPEX 接口

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Chapter11. Bulk packaging
Revision history
Version
Date
Description
Issued by
1.0
2017-11-15
initial version
huaa
1.1
2018-5-22
Content increase
huaa
1.2
2018-9-13
Manual split
huaa
1.3
2019-1-26
Content increase
Ray
1.4
2019-11-06
Fix mistakes
Ren
1.5
2019-11-18
Fix mistakes
Ren

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