Ebyte E70-400M14S1B User manual

E70-400M14S1B
CC1312 410~490MHz Wireless SOC Module

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd 1
CONTENTS
Disclaimer ...........................................................................................................................................................................................................2
1 Product Overview ..........................................................................................................................................................................................3
1.1 Brief Introduction ............................................................................................................................................................................. 3
1.2 Feature .................................................................................................................................................................................................3
1.3 Application ......................................................................................................................................................................................... 4
2 Specification and parameter ........................................................................................................................................................................4
2.1 Limit parameter .................................................................................................................................................................................4
2.2 Operating parameter .........................................................................................................................................................................4
3 Size and pin definition ..................................................................................................................................................................................5
4 Basic operation ...............................................................................................................................................................................................7
4.1 Hardware design ............................................................................................................................................................................... 7
4.2 Software program ............................................................................................................................................................................. 8
4.3 Program burn ..................................................................................................................................................................................... 9
5 FAQ...................................................................................................................................................................................................................9
5.1 Communication range is too short................................................................................................................................................9
5.2 Module is easy to damage .............................................................................................................................................................. 9
5.3 BER(Bit Error Rate) is high ........................................................................................................................................................ 10
6 Production guidance ...................................................................................................................................................................................10
6.1 Reflow soldering temperature .....................................................................................................................................................10
6.2 Reflow soldering curve .................................................................................................................................................................11
7 E70 series ......................................................................................................................................................................................................11
8 Antenna recommendation ......................................................................................................................................................................... 12
8.1 Recommendation .....................................................................................................................................................................................12
9 Package for bulk order...............................................................................................................................................................................12
Revision history.............................................................................................................................................................................................. 13
About us ............................................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd 2
Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd 3
1 Product Overview
1.1 Brief Introduction
E70-900M14S1B adopts the original imported CC1312R from Texas
Instruments (TI). It integrates a single-chip microcomputer and wireless transceiver,
and uses a 48MHz industrial-grade high-precision low-temperature drift crystal
oscillator to ensure its industrial characteristics and stable performance.
The CC1312R chip has a built-in powerful 48MHz Arm Cortex-M4F
processor, and has abundant peripheral resources such as UART, I2C, SPI, ADC,
DMA, and PWM. The module leads to all the IO ports of the single-chip
microcomputer, which can be used for multi-directional development.
Since the E70-900M14S1B is a pure hardware SOC module, there is no program at the factory, and the user needs to develop it
again before it can be used.
1.2 Feature
Developed based on CC1312R, built-in powerful 48MHz Arm Cortex-M4F processor;
With 48MHz temperature compensated crystal oscillator, industrial-grade standard design
352KB system programmable flash memory, 256KB ROM for protocol and library functions；
8KB cache SRAM (available as general-purpose RAM), 80KB ultra-low leakage SRAM, SRAM adopts parity check protection
to ensure high reliability of operation
RSSI signal strength reading；
Air wake-up, that is, low power consumption function, suitable for battery-powered solutions；
Ultra-low receiving current, its receiving current is only half of similar products；
The maximum transmit power is 25mW, and the software is multi-level adjustable；
For European license-free frequency band ISM 868MHz and North America license-free ISM 915MHz frequency band；
Air transmission rate: 20～1000kbps；
2.2～3.8V power supply, power supply greater than or equal to 3.3V can guarantee the best performance；
Under ideal conditions, the communication distance can reach 1.5km；
Dual antennas are optional (IPEX/stamp hole), which is convenient for users to develop and integrate.

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1.3 Application
Home security alarm and remote keyless entry;
Wireless alarm security system;
Building automation solutions;
Wireless industrial-grade remote control;
Health care products;
Advanced Meter Reading Architecture(AMI);
Automotive industry applications.
2 Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min
Max
Power supply（V）
0
3.8
Voltage over 3.8V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Operating temperature（℃）
-40
85
2.2 Operating parameter
Main parameter
Performance
备注
Min
Type
Max
Operating voltage（V）
2.2
3.3
3.8
≥3.3 V ensures output power
Communication level（V）
-
3.3
-
For 5V TTL, it may be at risk of burning down
Operating temperature（℃）
-40
-
+85
Industrial grade
Operating frequency（MHz）
410
-
490
Support ISM band
Power
Consump-
tion
TX current（mA）
-
24.9
-
Instant power consumption
RX current（mA）
-
5.8
-
-
Sleep current （μA）
-
2.0
-
Shut down by software
Max TX power（dBm）
13.5
14
14.5
-
Receiving sensitivity（dBm）
-120
-121
-122
Air data rate is 5 kbps
Air data rate（bps）
20
-
1000k
Controlled via user’s programming

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Main parameter
Description
Remark
Reference distance
1500m
Test condition：clear and open area, antenna gain: 5dBi，
antenna height: 2.5m，air data rate: 2.5 kbps
Crystal Oscillator
48MHz
Modulation
GFSK
Package
SMD
Interface
1.27mm
IC
CC1312R1F3RGZ
FLASH
352KB
ROM
256KB
RAM
8KB+80KB
8KB cache SRAM (available as general-purpose RAM)
80KB ultra-low leakage SRAM.
Core
Arm Cortex-M4F processor
Size
26*16mm
-
Antenna
IPEX/stamp hole
50 ohm impedance
Weight（g）
2.5

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3 Size and pin definition
Pin No.
Item
Direction
Description
1
GND
Reference ground
Ground
2
ANT
Antenna（50 ohm impedance）
3
X32K_Q1
Input/Output
Connect with pin 4 to 32.768K quartz crystal
4
X32K_Q2
Input/Output
Connect with pin 3 to 32.768K quartz crystal
5
DIO_1
Input/Output
MCU GPIO
6
DIO_2
Input/Output
MCU GPIO
7
DIO_3
Input/Output
MCU GPIO
8
DIO_4
Input/Output
MCU GPIO
9
DIO_5
Input/Output
MCU GPIO
10
DIO_6
Input/Output
MCU GPIO
11
DIO_7
Input/Output
MCU GPIO
12
DIO_8
Input/Output
MCU GPIO
13
DIO_9
Input/Output
MCU GPIO

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14
DIO_10
Input/Output
MCU GPIO
15
DIO_11
Input/Output
MCU GPIO
16
GND
Reference ground
Ground
17
DIO_12
Input/Output
MCU GPIO
18
DIO_13
Input/Output
MCU GPIO
19
DIO_14
Input/Output
MCU GPIO
20
DIO_15
Input/Output
MCU GPIO
21
TMSC
Input
JTAG TMSC
22
TCKC
Input
JTAG TCKC
23
DIO_16
Input/Output
MCU GPIO
24
DIO_17
Input/Output
MCU GPIO
25
DIO_18
Input/Output
MCU GPIO
26
VCC
Power supply：2.2～3.8V DC
27
GND
Reference ground
Ground
28
DIO_19
Input/Output
MCU GPIO
29
DIO_20
Input/Output
MCU GPIO
30
DIO_21
Input/Output
MCU GPIO
31
DIO_22
Input/Output
MCU GPIO
32
RESET
Input
Module reset
33
DIO_23
Input/Output
MCU GPIO
34
DIO_24
Input/Output
MCU GPIO
35
DIO_25
Input/Output
MCU GPIO
36
DIO_26
Input/Output
MCU GPIO
37
DIO_27
Input/Output
MCU GPIO
38
DIO_28
Input/Output
MCU GPIO
39
DIO_29
Input/Output
MCU GPIO
40
DIO_30
Input/Output
MCU GPIO
41
GND
Reference ground
Ground
42
GND
Reference ground
Ground
4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply,
reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;

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Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
4.2 Software program
The chip scheme of this module is the CC1312R of Texas Instruments (Texas Instruments), and the user can operate according to
the CC1312R chip book provided by TI's official website;
Users can download the CC1312R software development kit on TI's official website to effectively shorten the development
cycle;
If you encounter problems during the development process, you can log in to TI’s E2E community to ask questions, and TI’s
technical staff will answer them;

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4.3 Program burn
Description
Program burn
The module is a SoC module with its own GPIO port. Program download uses the CC series dedicated downloader:
JTAG downloader (or TI's official CC1312 supporting development board). Serial ports or any other ISP or ICP
tools cannot be used.
The figure below is a schematic diagram of the JTAG connection (XDS100). For the specific development method,
please refer to the relevant Ti official documents (the TDI and TDO pins may not be connected).
5 FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power;
Due to antenna quality or poor matching between antenna and module.
5.2 Module is easy to damage
Please check the power supply source, ensure it is in right range, or the module will be damaged;
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;

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Please avoid using modules under too high or too low temperature.
5.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.
6 Production guidance
6.1 Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time（tL）Maintained Above（TL）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max

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6.2 Reflow soldering curve
7 E70 series
Model No.
Chip
Frequency
TX power
Distance
Size
Package
Communication
Connector
Hz
dBm
km
mm
E70-433T14S
CC1310
433M
14
1.5
2.5k～168k
SMD
16 * 26
E70-868T14S
CC1310
868M
14
1.5
2.5k～168k
SMD
16 * 26
E70-915T14S
CC1310
915M
14
1.5
2.5k～168k
SMD
16 * 26
E70-433T30S
CC1310
433M
30
6.0
2.5k～168k
SMD
24 * 38.5
E70-915T30S
CC1310
915M
30
6.0
2.5k～168k
SMD
24 * 38.5
E70-868T30S
CC1310
868M
30
6.0
2.5k～168k
SMD
24 * 38.5
E70-433T14S2
CC1310
433M
14
1.5
2.5k～168k
SMD
14 * 20
E70-868T14S2
CC1310
868M
14
1.5
2.5k～168k
SMD
14 * 20
E70-915T14S2
CC1310
915M
14
1.5
2.5k～168k
SMD
14 * 20
E70-900M14S1B
CC1312R
868M/915M
14
1.5
20-1000k
SMD
16 * 26

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8 Antenna recommendation
8.1 Recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the
communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Model No.
Type
Frequency
Gain
Size
Length
Feeder
Feature
Hz
dBi
mm
cm
TX915-XPL-100
Sucker antenna
915M
SMA-J
3.5
250
100
High gain small sucker antenna
TX915-JK-20
Rubber antenna
915M
SMA-J
3.0
210
-
Flexible &omnidirectional
TX915-JK-11
Rubber antenna
915M
SMA-J
2.5
110
-
Flexible &omnidirectional
TX915-JZ-5
Rubber antenna
915M
SMA-J
2.0
50
-
Short straight
&omnidirectional
9 Package for bulk order

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Revision history
Version
Date
Description
Issued by
1.0
2023-07-4
Initial version
Linson
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