EMC2 302-002-206 Installation instructions

Abstract
This document provides guidance for end-of-life recyclers on how
to identify and disassemble reportable materials in compliance
with the Waste Electrical and Electronic Equipment (WEEE)
directive. The document does not replace disposal instructions in
EMC contracts, or those included in EMC Product and Residuals
Disposal Guidelines.
May 2019
WEEE DISASSEMBLY
INSTRUCTIONS
for the 12G High Availability Disk Array Enclosure (DAE)

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Copyright © 2019 EMC Corporation. All Rights Reserved.
EMC believes the information in this publication is accurate as of
its publication date. The information is subject to change without
notice.
The information in this publication is provided “as is.” EMC
Corporation makes no representations or warranties of any kind
with respect to the information in this publication, and specifically
disclaims implied warranties of merchantability or fitness for a
particular purpose.
Use, copying, and distribution of any EMC software described in
this publication requires an applicable software license.
For the most up-to-date listing of EMC product names, see EMC
Corporation Trademarks on EMC.com.

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Part Number: 302-002-206

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Table of Contents
1.0 Document Purpose........................................................................................................... 6
2.0 Important Notice .............................................................................................................. 6
3.0 How to Use These Instructions.......................................................................................... 6
4.0 Related Documentation................................................................................................... 6
5.0 Brand Owner Identification.............................................................................................. 6
6.0 Acronyms .......................................................................................................................... 7
7.0 Product Identification....................................................................................................... 8
8.0 Product Photos.................................................................................................................. 9
8.1 Photos—Front/Back Labeled ............................................................................................ 9
8.2 2.5” Disk................................................................................................................................ 10
8.3 Fan Module......................................................................................................................... 10
8.4 System Status Card (SSC).................................................................................................. 11
8.5 Power Supply Units (PSU)................................................................................................... 11
8.6 Link Controller Card (LCC)................................................................................................ 12
8.7 Chassis ................................................................................................................................. 12
9.0 Locating Materials .......................................................................................................... 13
9.1 Locating Materials on a 2.5” Disk Drive .......................................................................... 15
9.2 Locating Materials on a Fan Module.............................................................................. 15
9.3 Locating Materials on a SSC ............................................................................................ 16
9.4 Locating Materials on a Power Supply Unit (PSU) ...........Error! Bookmark not defined.
9.4.1 PSU—Single Output, with Lever ............................................................................... 17
9.4.2 PSU—Dual Output, with Knob....................................Error! Bookmark not defined.
9.5 Locating Materials on a Link Controller Card (LCC) .................................................... 18
9.6 Locating Materials on a Chassis ...................................................................................... 19
9.7 Accessories and Optional Equipment............................................................................ 21
10.0 PCBs ................................................................................................................................. 22
11.0 Reportable Materials...................................................................................................... 27
11.1 Materials of Interest to Recyclers................................................................................... 29
11.2 Precious Metals................................................................................................................. 30
11.3 Plastic Part Markings ........................................................................................................ 31
12.0 Disassembling the DAE .................................................................................................. 31
12.1 Prerequisites ...................................................................................................................... 31
12.1.1 Required Tools for Disassembly............................................................................... 31
12.1.2 Safety Precautions ................................................................................................... 32
12.2 Disassembly Sequence ................................................................................................... 32
12.3 Removing a Disk Drive..................................................................................................... 32
12.3.1 Disassembling a Disk Drive ...................................................................................... 33
12.4 Removing a Fan Module ................................................................................................ 34

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12.4.1 Disassembling a Fan Module.................................................................................. 34
12.5 Removing the System Status Card (SSC)...................................................................... 37
12.5.1 Disassembling the System Status Card ................................................................. 38
12.6 Removing a Power Supply Unit (PSU)............................................................................ 39
12.6.1 Disassembling a Power Supply Unit (PSU) ............................................................. 40
12.6.2 Disassembling a PSU—Single Output, with Lever................................................ 40
12.6.3 Disassembling a Dual-Output PSU, with Knob...................................................... 43
12.7 Removing a Link Controller Card (LCC)....................................................................... 46
12.7.1 Disassembling an LCC ............................................................................................. 47
12.8 Disassembling the Chassis .............................................................................................. 49
13.0 RoHS Restricted Materials .............................................................................................. 59

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1.0 Document Purpose
This document provides the most accurate information available on the location and
removal of reportable materials as required by the European Union (EU) Waste Electrical
and Electronic Equipment (WEEE) Directive 2002/96/EC.
For more information on EMC’s environmental initiatives, policies, and goals go to:
http://www.emc.com/corporate/sustainability/index.htm
2.0 Important Notice
This document does not in any way replace disposal instructions in EMC contracts, or
those included in EMC Product and Residuals Disposal Guidelines.
3.0 How to Use These Instructions
EMC recommends that you adopt the following workflow to ensure the greatest
efficiency in compliance with WEEE legislation.
1. See 8.0 Product Photos to familiarize yourself with the hardware.
2. Review the items listed in 11.0 Reportable Materials, 11.1 Materials of Interest to
Recyclers, and 11.2 Precious Metals to learn the recyclable materials present in this
product.
3. Review 12.1.2 Safety Precautions prior to disassembling the product.
4. Review 12.2 Disassembly Sequence and subsequent tasks for removal procedures.
4.0 Related Documentation
EMC provides separate WEEE disassembly instructions per product platform. Contact
the EMC WEEE administrator at [email protected] to request additional documentation
as required.
▪WEEE Reuse and Treatment Instructions for EMC Product Consoles and Bezels
5.0 Brand Owner Identification
EMC Corporation
176 South Street
Hopkinton, Massachusetts 01748
U.S.A
http://www.emc.com

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6.0 Acronyms
Table 1 defines acronyms that may be used in the document.
Table 1. Acronyms List
ABS
Acrylonitrile butadiene styrene
Ag
Silver
Au
Gold
BBU
Battery Backup Unit
Cd
Cadmium
CFC
Chlorofluorocarbons
CPU
Central Processing Unit
Cr Vl
Hexavalent Chromium
Cu
Copper
DAE
Disk Array Enclosure
DIMMs
Dual in-line Memory Modules
DPE
Disk Processor Enclosure
DRL
Device Regulatory Label
EMI
Electromagnetic Interference
ESD
Electrostatic discharge
EU
European Union
GWP
Global Warming Potential
HC
Hydrocarbons
HCFC
Hydrochlorofluorocarbons
HDPE
High-Density Polyethylene
Hg
Mercury
LCC
Link Control Card
LDPE
Low-Density Polyethylene
Pb
Lead
PBB
Polybrominated Biphenyls
PBDE
Polybrominated Diphenyl Ethers
PC
Polycarbonate
PCB
Printed Circuit Board
PCT
Polychlorinated Terphenyl
Pd
Palladium

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PETE or PET
Polyethylene Terephthalate
PP
Polypropylene
PS
Polystyrene
Pt
Platinum
PVC
Polyvinyl Chloride
RoHS
Restriction of Hazardous Substances
SAS
Serial Attached SCSI
SP
Storage Processor
SPE
Storage Processor Enclosure
SSD
Solid State Disk
V
Volt
WEEE
Waste Electrical and Electronic Equipment
7.0 Product Identification
12G High Availability Disk Array Enclosure (DAE)
Note: EMC uses the Product Regulatory Model Name as the main identifier throughout
this document. Locate the product regulatory model name on the Device Rating Label
(DRL) affixed to a rectangular recess on the top of the product chassis.
Table 2. Product Regulatory Model Name and Specifications
Product Regulatory Model Name
12G
Product Description
3U, high availability, Disk Array Enclosure
(DAE) that supports 120 x 2.5” disk drives.
Part Number
100-887-010-03
Note: The part number cited denotes the
base chassis. However, each platform
supports many different EMC products.
Contact your EMC Sales Representative for
product-specific part numbers.
Mass
65.4 kg (144.2 lbs.) (Max)
Dimensions
Height: 13.20 cm (5.2 in)
Width: 44.70 cm (17.6 in)
Depth: 87.63 cm (34.5 in)

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8.0 Product Photos
Components with reportable items are referred to consistently using a yellow blocked
item number. Sub-components are identified by appending that number with a letter.
All reportable items are cross-referenced in 9.0 Locating Materials
8.1 Photos—Front/Back Labeled
Figure 1. Front view
Figure 2. Rear view
Table 3. Main components with reportable items
Item #
Item Description
Item
#
Item Description
1
2.5” Disks (up to 120/unit)
4
Power Supply Unit (PSU) (4/unit)
2
Fan Module
(2 rows of 5, front and mid-range)
5
Link Controller Card (LCC) (2/unit)
3
System Status Card (SSC )
6
Chassis
4
2
2
1
3
6
6
5

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8.2 2.5” Disk
Figure 3. 2.5" disk
8.3 Fan Module
Figure 4. Fan module
1
2