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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Table of Contents
1.0 Document Purpose................................................................................................................. 6
2.0 Important Notice..................................................................................................................... 6
3.0 How to Use these Instructions................................................................................................ 6
5.0 Brand Owner Identification.................................................................................................... 6
6.0 Acronyms................................................................................................................................ 8
7.0 Product Identification........................................................................................................... 10
7.0.1 TAE and TAE-DC Disk Array Enclosure............................................................................. 10
8.0 Product Photos...................................................................................................................... 11
9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure.............................................. 12
9.0.1 Locating Materials on the TAE Power/Cooling Module (AC Type)............................ 14
9.0.2 Locating Materials on the TAE-DC Power/Cooling Module........................................ 16
9.0.3 Locating Materials in the Midplane Assembly .............................................................. 18
9.0.4 TAE and TAE-DC Accessories and Optional Equipment.............................................. 19
9.0.4.1 Locating Materials on a 2.5-inch Hard Disk Drive.................................................. 20
10.0 TAE and TAE-DC Disk Array Enclosure PCBs..................................................................... 21
11.0 Reportable Materials on TAE and TAE-DC Common Components................................ 22
11.1 Materials of Interest to Recyclers (TAE and TAE-DC)....................................................... 24
11.2 Precious Metals (TAE and TAE-DC).................................................................................... 25
11.3 Plastic Part Markings (TAE and TAE-DC) ........................................................................... 25
12.0 Disassembly Details............................................................................................................ 26
12.0.1 Required Tools for Disassembly...................................................................................... 26
12.0.2 Safety Precautions and Battery Warnings.................................................................... 26
13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure............................................... 27
13.0.1 Removing and Disassembling a 2.5-inch Hard Disk Drive.......................................... 27
13.0.2 Removing an LCC............................................................................................................ 28
13.0.2.1 Removing LCC Components ................................................................................. 29
13.0.2.2 Removing the LCC PCB Heat Sink and LCC PCB................................................ 30
13.0.3 Removing and disassembling the power/cooling module (AC type).................... 31
13.0.3.1 DC Power/Cooling Module Top Cover................................................................. 33
13.0.3.2 Power/Cooling Module Top PCB........................................................................... 34
13.0.3.3 Removing materials on the Power/Cooling Module Top PCB.......................... 35
13.0.3.4 Removing materials on the Power/Cooling Module Bottom PCB ................ 37
13.0.3.5 Removing the Power/Cooling Module Fan Pack Assembly, Attached
Wiring, Carrier.......................................................................................................................... 38
13.0.4 Removing and disassembling the power/cooling module (DC type)................. 39
13.0.4.1 DC Power/Cooling Module Top Cover................................................................. 40
13.0.4.2 Removing the DC Power/Cooling Module Fan Pack Assembly and Top PCB40
