EMC2 TAE Installation instructions

Abstract
This document provides clear guidance for end-of-life recyclers
on how to identify and disassemble reportable materials in
compliance with the Waste Electrical and Electronic Equipment
(WEEE) directive. The document does not replace disposal
WEEE DISASSEMBLY
INSTRUCTIONS
for the TAE and TAE-DC Disk Array Enclosure

2
WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
instructions in EMC contracts, or those included in EMC Product
and Residuals Disposal Guidelines.
June 2019
Copyright © 2019 EMC Corporation. All Rights Reserved.
Dell believes the information in this publication is accurate as of its
publication date. The information is subject to change without
notice.
The information in this publication is provided “as is.” Dell makes
no representations or warranties of any kind with respect to the
information in this publication, and specifically disclaims implied
warranties of merchantability or fitness for a particular
purpose.Use, copying, and distribution of any Dell software
described in this publication requires an applicable software
license.
Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be the property of their
respective owners. Published in the USA.

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Part Number: 300-015-574

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Table of Contents
1.0 Document Purpose................................................................................................................. 6
2.0 Important Notice..................................................................................................................... 6
3.0 How to Use these Instructions................................................................................................ 6
5.0 Brand Owner Identification.................................................................................................... 6
6.0 Acronyms................................................................................................................................ 8
7.0 Product Identification........................................................................................................... 10
7.0.1 TAE and TAE-DC Disk Array Enclosure............................................................................. 10
8.0 Product Photos...................................................................................................................... 11
9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure.............................................. 12
9.0.1 Locating Materials on the TAE Power/Cooling Module (AC Type)............................ 14
9.0.2 Locating Materials on the TAE-DC Power/Cooling Module........................................ 16
9.0.3 Locating Materials in the Midplane Assembly .............................................................. 18
9.0.4 TAE and TAE-DC Accessories and Optional Equipment.............................................. 19
9.0.4.1 Locating Materials on a 2.5-inch Hard Disk Drive.................................................. 20
10.0 TAE and TAE-DC Disk Array Enclosure PCBs..................................................................... 21
11.0 Reportable Materials on TAE and TAE-DC Common Components................................ 22
11.1 Materials of Interest to Recyclers (TAE and TAE-DC)....................................................... 24
11.2 Precious Metals (TAE and TAE-DC).................................................................................... 25
11.3 Plastic Part Markings (TAE and TAE-DC) ........................................................................... 25
12.0 Disassembly Details............................................................................................................ 26
12.0.1 Required Tools for Disassembly...................................................................................... 26
12.0.2 Safety Precautions and Battery Warnings.................................................................... 26
13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure............................................... 27
13.0.1 Removing and Disassembling a 2.5-inch Hard Disk Drive.......................................... 27
13.0.2 Removing an LCC............................................................................................................ 28
13.0.2.1 Removing LCC Components ................................................................................. 29
13.0.2.2 Removing the LCC PCB Heat Sink and LCC PCB................................................ 30
13.0.3 Removing and disassembling the power/cooling module (AC type).................... 31
13.0.3.1 DC Power/Cooling Module Top Cover................................................................. 33
13.0.3.2 Power/Cooling Module Top PCB........................................................................... 34
13.0.3.3 Removing materials on the Power/Cooling Module Top PCB.......................... 35
13.0.3.4 Removing materials on the Power/Cooling Module Bottom PCB ................ 37
13.0.3.5 Removing the Power/Cooling Module Fan Pack Assembly, Attached
Wiring, Carrier.......................................................................................................................... 38
13.0.4 Removing and disassembling the power/cooling module (DC type)................. 39
13.0.4.1 DC Power/Cooling Module Top Cover................................................................. 40
13.0.4.2 Removing the DC Power/Cooling Module Fan Pack Assembly and Top PCB40

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
13.0.4.3 Removing materials in the DC Power/Cooling Module..................................... 41
13.0.5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB.......... 43
14.0 RoHS Restricted Materials................................................................................................... 45

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
1.0 Document Purpose
This document provides the most accurate information available on the location and
removal of reportable materials as required by the European Union (EU) Waste Electrical
and Electronic Equipment (WEEE) Directive 2002/96/EC.
For more information on EMC’s environmental initiatives, policies, and goals go to:
http://www.emc.com/corporate/sustainability/index.htm
2.0 Important Notice
This document does not in any way replace disposal instructions in EMC contracts, or
those included in EMC Product and Residuals Disposal Guidelines.
3.0 How to Use these Instructions
EMC recommends that you adopt the following workflow to ensure the greatest
efficiency in compliance with WEEE legislation.
1. See 8.0 Product Photos to familiarize yourself with the hardware.
2. Review the items listed in 11.0 Reportable Materials on TAE and TAE-DC Common
Components, 11.1 Materials of Interest to Recyclers (TAE and TAE-DC), and 11.2
Precious Metals (TAE and TAE-DC) to learn the recyclable materials present in this
product.
3. Review 12.0.2 Safety Precautions and Battery Warnings prior to disassembling the
product.
4. Review 13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure for removal
procedures.
5. 4.0 Related Documentation
EMC provides separate WEEE disassembly instructions per product platform. Contact
the
EMC WEEE administrator at ewas[email protected] to request additional documentation as
required.
5.0 Brand Owner Identification
EMC Corporation
176 South Street
Hopkinton, Massachusetts 01748
U.S.A

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
http://www.emc.com

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
6.0 Acronyms
Table 1 defines acronyms that may be used in the document.
Table 1 Acronyms List
ABS
Acrylonitrile butadiene styrene
Ag
Silver
Au
Gold
BBU
Battery Backup Unit
Cd
Cadmium
CFC
Chlorofluorocarbons
CPU
Central Processing Unit
Cr Vl
Hexavalent Chromium
Cu
Copper
DAE
Disk Array Enclosure
DIMMs
Dual in-line Memory Modules
DPE
Disk Processor Enclosure
DRL
Device Regulatory Label
EMI
Electromagnetic Interference
ESD
Electrostatic discharge
EU
European Union
GWP
Global Warming Potential
HC
Hydrocarbons
HCFC
Hydrochlorofluorocarbons
HDPE
High-Density Polyethylene
Hg
Mercury
LCC
Link Control Card
LDPE
Low-Density Polyethylene
Pb
Lead
PBB
Polybrominated Biphenyls
PBDE
Polybrominated Diphenyl Ethers
PC
Polycarbonate
PCB
Printed Circuit Board
PCT
Polychlorinated Terphenyl

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Pd
Palladium
PETE or PET
Polyethylene Terephthalate
PP
Polypropylene
PS
Polystyrene
Pt
Platinum
PVC
Polyvinyl Chloride
RoHS
Restriction of Hazardous Substances
SAS
Serial Attached SCSI
SP
Storage Processor
SPE
Storage Processor Enclosure
SSD
Solid State Disk
V
Volt
WEEE
Waste Electrical and Electronic Equipment

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
7.0 Product Identification
7.0.1 TAE and TAE-DC Disk Array Enclosure
Note: EMC uses the Product Regulatory Model Name (usually represented by letters, see
the first item in Table 2) as the main identifier throughout this document. Locate the
product regulatory model name on the Device Rating Label (DRL) affixed to a
rectangular recess on the top of the product chassis.
Table 2 Product Regulatory Model Name and Specifications
Product Regulatory Model Name
TAE (ships with two DC power supplies
installed)
TAE-DC (ships with two DC power supplies
for the customer to install)
Product Description
2.5U, 25-slot Disk Array Enclosure (DAE)
Part Number
100-887-129
Note: The part number cited denotes the
base chassis. However, each platform
supports many different EMC products.
Contact your EMC Sales Representative for
product-specific part numbers.
Mass
Less than 45 pounds with 25 drives installed
Dimensions
87.0 mm (H) x 447.2 mm (W) x 355.6 mm (D)

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
8.0 Product Photos
Figure 1. TAE or TAE-DC front view (fully populated with twenty five hard disk
drives)
Figure 2. TAE or TAE-DC rear view (TAE shown)

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure
Figure 3 and Figure 4 identify TAE and TAE-DC Disk Array Enclosure components. Table 3
and Table 4 provide the disassembly sequence with links to disassembly procedures.
Item numbers below correspond with reportable materials listed in Table 10 through
Table 12.
Figure 3. TAE Chassis and front view
Table 3 Decoder and Disassembly Sequence
Item
Component
1
TAE 25-slot Chassis (sheet metal)
2
Power/Cooling Module
3
LCC I/O Assembly
1
2
2
3
3

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Figure 4. Link Control Card Assembly
Table 4 Decoder and Disassembly Sequence
Item
Component
Item
Component
4
Connector Fence (non-ferrous)
7
SAS Connector Cage (not visible,
under air dam)
5
Plastic LCC Guide (ABS plastic)
8
Heat Sink (aluminum)
6
Air Dam (ferrous)
9
LCC PCB
9
5
6
4
8
7

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0.1 Locating Materials on the TAE Power/Cooling Module (AC
Type)
Figure 5 and Figure 6 identify power/cooling module components. Table 5 also provides
the disassembly sequence with links to disassembly procedures. Item numbers below
correspond with reportable materials listed in materials listed in Table 10 through Table
12.
Figure 5. TAE AC Power/Cooling Module
10

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Figure 6. Materials located on the SAE AC Power/Cooling Module PCBs
Table 5. Decoder and Disassembly Sequence
Item
Component
Item
Component
10
Top Cover (sheet metal)
14
Wiring (cable sheathing, copper)
11
Top PCB
15
Bottom PCB
12
Coils (copper)
16
Fan Pack Assembly (ABS Plastic)
13
Large Capacitor
17
Power/Cooling Module Carrier (sheet metal)
12
13
14
15
16
17
11
12

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0.2 Locating Materials on the TAE-DC Power/Cooling Module
Figure 7 and Figure 8Figure 6 identify TAE-DC power/cooling module components. Table
6 also provides the disassembly sequence with links to disassembly procedures. Item
numbers below correspond with reportable materials listed in Table 10 through Table 12.
Figure 7. TAE DC Power/Cooling Module
18

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Figure 8. Materials located on the TAE DC Power/Cooling Module PCB
Table 6. Decoder and Disassembly Sequence
Item
Component
Item
Component
18
Top Cover (sheet metal)
23
Coils (copper)
19
Fan Pack Assembly (ABS Plastic)
24
Large Capacitor
20
Top PCB
25
Bottom PCB
21
Heat Fins (non-ferrous)
26
Power/Cooling Module Carrier (sheet metal)
22
Wiring (cable sheathing, copper)
19
20
21
22
23
24
25
26
23

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0.3 Locating Materials in the Midplane Assembly
Figure 9, Figure 10 and Table 7 identify midplane PCB materials. Table 7 also provide the
disassembly sequence with links to disassembly procedures Item numbers below
correspond with reportable materials listed in Table 10 through Table 12.
For disassembly, see Disassembling the Chassis for Recycling and Retrieving the
Midplane PCB.
Figure 9. Locating midplane air flappers (ABS plastic)
Figure 10. Midplane PCB
Table 7 Decoder and Disassembly Sequence
Item
Component
27
Two Power/Cooling Module Air Flappers(ABS plastic)
28
Two LCC Assembly Air Flappers(ABS plastic)
29
Midplane PCB
27
29
27
28
28

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0.4 TAE and TAE-DC Accessories and Optional Equipment
Table 8 lists accessories and optional hard disk drives.
Table 8 TAE and TAE-DC Accessories and Options
Component
Photo
Disassembly Required?
AC Power
Cord
No
See Table 10 Complete list of
Reportable Materials on TAE and TAE-
DC Components
DC Power
Cord
No
See Table 10 Complete list of
Reportable Materials on TAE and TAE-
DC Components
2.5-inch
Hard Disk
Drive
Yes
See Locating Materials on a 2.5-inch
Hard Disk Drive,
and
Disassembling the Hard Disk Drive

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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
9.0.4.1 Locating Materials on a 2.5-inch Hard Disk Drive
Figure 11, Figure 12 and Table 9 identify hard disk drive components. Table 10 also
provides the disassembly sequence with links to disassembly procedures. Item numbers
below correspond with reportable materials listed in Table 10 through Table 12.
Also see Removing and Disassembling a Hard Disk Drive.
Figure 11. TAE and TAE-DC 2.5-inch hard disk drive
Table 9 Decoder and Disassembly Sequence
Item
Component
21
SAS PCB
22
PCB
23
Plastic Disk Carrier (Lexan plastic)
Figure 12. Close up of SAS PCB
21
22
23