Epcos B59601 User manual

PTC thermistors as
limit temperature sensors
SMD, EIA case sizes 0603 and 0805,
standard series
Series/Type: B59601, B59602, B59603,
B59604, B59701
Date: November 2011
© EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.

Applications
DC/DC converters
Home appliances
Dimmers
Electronic ballasts
Over-temperature protection of power components
Secondary protection of battery packs
SMPS
Notebooks
Features
Fast and reliable response
Suitable for reflow soldering only
Compliant to RoHS directive 2002/95/EC
UL approval to UL1434 for B59601A* (file number E69802)
Lead-free tinned terminations
Options
Other Tsense or resistance values on request
Delivery mode
Blister tape (case size 0805) or cardboard tape (case size 0603), 180-mm reel with 8-mm
tape, taping to IEC 60286-3
Packing unit: 4.000 pcs.
General technical data
Max. operating voltage Vmax 32 V DC
Minimum operating temperature (V ≤Vmax) Tmin 40 °C
Maximum operating temperature (V ≤Vmax) Tmax 125 °C or Tsense,1 +25 °C
whichever is higher °C
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 2 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Electrical specifications and ordering codes
Case size 0603
RR
(V ≤Vmax)
Ω
∆RR
%
Tsense,1
(@ 4.7 kΩ)
°C
R
(Tsense,1 +10 °C)
kΩ
Ordering code
EIA case size 0603, standard types
470 ±50 75 ±5 - B59601A0075A062
470 ±50 85 ±5 - B59601A0085A062
470 ±50 95 ±5 - B59601A0095A062
470 ±50 105 ±5 - B59601A0105A062
470 ±50 115 ±5 - B59601A0115A062
470 ±50 125 ±5 - B59601A0125A062
470 ±50 135 ±5 - B59601A0135A062
EIA case size 0603, tight temperature tolerance types
470 ±50 75 ±3 - B59601A0075B062
470 ±50 85 ±3≥15 B59601A0085B062
470 ±50 95 ±3≥40 B59601A0095B062
470 ±50 105 ±3≥40 B59601A0105B062
470 ±50 115 ±3≥40 B59601A0115B062
470 ±50 125 ±3≥40 B59601A0125B062
470 ±50 135 ±3≥40 B59601A0135B062
Note:
In order to limit self heating effects the electrical power during measurement should be below
4 mW for case size 0603.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 3 of 30Please read Cautions and warnings and
Important notes at the end of this document.

1) R (Tsense,1 +25 °C)
Electrical specifications and ordering codes
Case size 0603 and 0805
RR
(V ≤Vmax)
Ω
∆RR
%
Tsense
°C
R
(Tsense,1 5°C)
kΩ
R
(Tsense,1 +5°C)
kΩ
R
(Tsense,1 +15°C)
kΩ
Ordering code
EIA case size 0603, tight resistance tolerance types
110 ±15 70 ≤1.1 ≥1.1 - B59602A0055B062
470 ±15 55 ≤4.7 ≥4.7 - B59603A0055A062
470 ±15 85 ≤4.7 ≥4.7 - B59603A0085A062
470 ±15 105 ≤4.7 ≥4.7 - B59603A0105A062
EIA case size 0805, standard types
680 ±50 70 ≤5.7 ≥5.7 ≥401) B59701A0070A062
680 ±50 90 ≤5.5 ≥13.3 ≥40 B59701A0090A062
680 ±50 100 ≤5.5 ≥13.3 ≥40 B59701A0100A062
680 ±50 110 ≤5.5 ≥13.3 ≥40 B59701A0110A062
680 ±50 120 ≤5.5 ≥13.3 ≥40 B59701A0120A062
680 ±50 130 ≤5.5 ≥13.3 ≥40 B59701A0130A062
680 ±50 140 ≤5.5 ≥13.3 ≥40 B59701A0140A062
Note:
In order to limit self heating effects the electrical power during measurement should be below
4 mW for case size 0603 and below 6 mW for case size 0805.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 4 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Dimensional drawings in mm
EIA case size 0603 Solder pad
EIA case size 0805 Solder pad
Recommended maximum dimensions (mm)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 5 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A601
PTC resistance RPTC versus
PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 6 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A601
PTC resistance RPTC versus
PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 7 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A602 and A603
PTC resistance RPTC versus PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 8 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A603
PTC resistance RPTC versus PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 9 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A701
PTC resistance RPTC versus PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 10 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Characteristics (typical) for type A701
PTC resistance RPTC versus PTC temperature TPTC
(measured at low signal voltage)
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 11 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Reliability data
Test Standard Test conditions ∆R25/R25
Electrical endurance,
cycling
IEC 60738-1 Room temperature: Ismax , Vmax;
Number of cycles: 100
< 20%
Electrical endurance,
constant
IEC 60738-1 Storage at Vmax/Top
Test duration : 1000 h
< 25%
Damp heat IEC 60738-1 Temperature of air: 40 °C
Relative humidity of air: 93%
Duration: 56 days
Test according to IEC 60068-2-78
< 10%
Rapid change
of temperature
IEC 60738-1 TLCT =40 °C, TUCT = 125 °C
Number of cycles: 5
Test duration: 30 min
Test according to IEC 60068-2-14, test Na
< 10%
Vibration IEC 60738-1 Frequency: 10 - 55 - 10 Hz
Displacement amplitude: 0.75 mm
Test duration: 3 ×2 h
Test according to IEC 60028-2-6, test Fc
< 5%
Bump IEC 60738-1 Pulse shape: half-sine
Acceleration: 50g
Pulse duration: 1ms; 6 x 3 pulses
Test according to IEC 60068-2-29
< 5%
Climatic sequence IEC 60738-1 Dry heat: TUCT = 125 °C
Test duration: 16 h
Damp heat first cycle
Cold: TLCT =40 °C
Test duration: 2 h
Damp heat 5 cycles
Tests performed according to
IEC 60068-2-30
< 10%
Bending test IEC 60738-1 Components reflow-soldered to test board
Maximum bendig: 2 mm
Test according to IEC 60068-2-21, test Ue
< 5%
Adhesive strength on
PCB
Shearing of the component soldered on PCB
by a force of 5 N is normal to components
longitudinal axis
No
visible
damage
Taping and packing
Many of the components presented in this data book are suitable for processing on automatic in-
sertion or placement machines. These thermistors can be supplied on tape for easy handling by
automatic systems. The individual modes of taping and packing will be described in the following.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 12 of 30Please read Cautions and warnings and
Important notes at the end of this document.

1) ≤0.2 mm over 10 sprocket holes
1 Taping of SMD thermistors
1.1 Blister tape (to IEC 60286-3)
Figure 1
Dimension
(mm)
8-mm tape 16-mm tape Tolerance
(mm)
24-mm tape Tolerance
(mm)
D0
D1
1.50
1.00
1.50
1.50
+ 0.10/0
min.
1.50
1.50
+ 0.10
+ 0.10
P0
P2
P1
4.00
2.00
4.00
4.00
2.00
12.00
±0.10 1)
±0.05
±0.10
4.00
2.00
16.00
±0.10
±0.10
±0.10
W 8.00 16.00 ±0.30 24.00 + 0.30/0.1
E 1.75 1.75 ±0.10 1.75 ±0.10
F 3.50 7.50 ±0.05 11.50 ±0.10
G 0.75 0.75 min. 0.75 min.
A0x B0, K0, T2: The rated dimensions of the component compartment have been derived from the
relevant component specification and are chosen such that the components cannot change their
orientation within the tape.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 13 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Part orientation in tape pocket for blister tape
For chip thermistors case sizes 0805 and 1210
Figure 2
Additional taping information
For chip thermistors case sizes 0805 and 1210
Reel material Polystyrol (PS)
Tape material Polystyrol (PS) or Polycarbonat (PC) or PVC
Tape break force min. 10 N
Top cover tape strength min. 10 N
Top cover tape peel force 0.2 ... 0.6 N for 8-mm tape and 0.2 ... 0.8 N for 12-mm tape at
a peel speed of 300 mm/min
Tape peel angle Angle between top cover tape and the direction of feed during
peel off: 165°... 180°
Cavity play Each part rests in the cavity so that the angle between the part
and cavity center line is no more than 20°
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 14 of 30Please read Cautions and warnings and
Important notes at the end of this document.

2) ≤0.2 mm over 10 sprocket holes.
1.2 Cardboard tape (to IEC 60286-3)
Figure 3
Dimensions
(mm) 8-mm tape Tolerance
(mm)
Case size
0402 0603
A00.6 0.95 ±0.2
B01.15 1.8 ±0.2
T 0.6 0.95 ±0.05
T20.75 1.1 max.
D01.5 +0.1/0
P04.0 4.0 ±0.12)
P22.0 2.0 ±0.05
P12.0 4.0 ±0.1
W 8.0 ±0.3
E 1.75 ±0.1
F 3.5 ±0.05
G 0.75 min.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 15 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Part orientation in tape pocket for cardboard tape
For chip thermistors case sizes 0402 and 0603
Figure 4
Additional taping information
Reel material Polystyrol (PS)
Tape material Cardboard
Tape break force min. 10 N
Top cover tape strength min. 10 N
Top cover tape peel force 0.1 ... 0.65 N at a peel speed of 300 mm/min
Tape peel angle Angle between top cover tape and the direction of feed during
peel off: 165°... 180°
Cavity play Each part rests in the cavity so that the angle between the part
and cavity center line is no more than 20°
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 16 of 30Please read Cautions and warnings and
Important notes at the end of this document.

1.3 Reel dimensions
180-mm reel with 8-mm tape
Figure 5
Dimension 180-mm reel
A 180 2/+0
W18.4 +1.5/0
W214.4 max.
330-mm reel with 16-mm tape
Figure 6
Dimension 330-mm reel
A 330 2/+0
W116.4 +2.0/0
W222.4 max.
330-mm reel with 24-mm tape
Figure 7
Dimension 330-mm reel
A 330 2/+0
W124.4 min.
W230.4 max.
380-mm reel with 24-mm tape
Figure 8
Dimension 380-mm reel
A 380 2/+0
W124.4 min.
W230.4 max.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 17 of 30Please read Cautions and warnings and
Important notes at the end of this document.

Mounting instructions
1 Soldering
1.1 Leaded PTC thermistors
Leaded PTC thermistors follow the solderability requirements of IEC 60068-2-20.
During soldering, care must be taken that the thermistors are not damaged by excessive heat.
The following maximum temperatures, maximum time spans and minimum distances have to be
observed:
Solder containing lead
(SnPb 60/40)
Lead-free solder
(Sn96.5Ag3Cu0.5)
Solderability Solder bath temperature 230 °C
Soldering time 3 s
Solder bath temperature 245 °C
Soldering time 3 s
Resistance to
soldering heat
Soldering iron temperature 350 °C
Soldering time 3 s
Solder bath temperature 260 °C
Soldering time 10 s
Distance to thermistor has to be ≥6 mm. Under more severe soldering conditions the resistance
may change. Soldering conditions for wave soldering are given in chapter 1.4.1.
1.2 Leadless PTC thermistors
In case of PTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
In addition, soldering methods should be employed which permit short soldering times.
Soldering conditions for wave soldering are given in chapter 1.4.1.
1.3 SMD PTC thermistors
The notes on soldering leadless thermistors also apply to the SMD versions (refer to
IEC 60068-2-58). Soldering conditions for wave soldering are given in chapter 1.4.1., for reflow
soldering in chapter 1.4.2.
1.3.1 Chrome/nickel/tin terminations
(Sizes 0402, 0603, 0805, 1210)
As shown in the figure above, the terminations consists of three metallic layers. A primary chrome
layer provides for good electrical contact. "Leaching" is prevented by a nickel barrier layer. The
outer tin coating prevents corrosion of the nickel and ensures good component solderability.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 18 of 30Please read Cautions and warnings and
Important notes at the end of this document.

1.3.2 Test methods for wetting and resistance to soldering heat
a) Solder bath method according to IEC 60068-2-58
Applicable for SMD components with wire or tag terminations. In case the SMD-component does
not have a completely closed housing, only the wires or tags may be immersed into the solder
bath.
Lead-free solder
(Sn96.5Ag3Cu0.5)
Solder containing lead
(SnPb 60/40)
Wetting test Bath temperature 250 °C
Soldering time 3 s
Bath temperature 215 °C
Soldering time 3 s
Resistance to
soldering heat
Bath temperature 260 °C
Soldering time 10 s
Bath temperature 260 °C
Soldering time 10 s
b) Solder reflow method according to IEC 60068-2-58
Applicable for chip-style SMD components. Reflow temperature profile is stated in
IEC 60068-2-58, 8.1.2.1 for wetting test and 8.1.2.2 for resistance to soldering heat test.
Lead-free solder
(Sn96.5Ag3Cu0.5)
Solder containing lead
(SnPb 60/40)
Wetting test Peak temperature 225 ... 235 °C
Duration maximum 20 s
Peak temperature 215 °C
Duration maximum 10 s
Resistance to
soldering heat
Peak temperature 245 ... 255 °C
Duration maximum 20 s
Peak temperature 235 °C
Duration maximum 30 s
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 19 of 30Please read Cautions and warnings and
Important notes at the end of this document.

1.3.3 Placement and orientation of SMDs on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line.
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Sensors
Limit temperature sensors, EIA sizes 0603 and 0805 Standard series
Page 20 of 30Please read Cautions and warnings and
Important notes at the end of this document.