ERNI ERmet ZD Setup guide

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www.erni.com 07/02 Edition 1
Repair instruction ERmet ZD Female Connector
Tools
1. Press-off device organizer for connectors type 4-10 and 3-10 / Part number: 220658
Press-off device organizer for connector type 2-10 / Part number: 220668
2. Manual grippers / Part number: 220586
3. Takeoff device insulation body for manual gripper / Part number: 220652
4. Manual device for pressing out the contact wafers (different for all connector types)
Type 4-10 / Part number: 220651
Type 3-10 / Part number: 220672
Type 2-10 / Part number: 220673
Steps for pressing out an ERmet ZD Female Connector
1.
Place connector into the takeoff device for the
organizer. By locking the latching device lever into
position (see Fig. 2) clamp fast the connector in
the takeoff device. By operating the lever (1) the
top housing section (organizer) is shifted to the
rear.
2.
Two different latchings are possible. For the
female connectors type 4-10 or 3-10. For type 2-
10 there is a separate device..
1
4-10
3-10
3.
After releasing the latching device lever and the
removal of the connector from the device, the
organizer can be withdrawn manually.
4.
Now use the manual grippers to withdraw
carefully the front section of the housing.

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www.erni.com 07/02 Edition 1
Warning: - It is not possible to press out a female connector within one working step.
-The female connector must be pressed out completely. It is not possible to
replace individual contact wafers.
5.
The contact wafers can now be pressed out indi-
vidually by means of the manual device. The tool
is securely fixed at the termination side by means
of the signal contacts. There are two adjustment
possibilities on the tool to ensure a secure fixing
(depending on the thickness of the printed circuit
board and the termination length of the signal
contacts).
6.
Adjustment with the arrester device screwed on.
For pressing out contact wafers where the signal
contacts do not protrude from the printed circuit
board.
7.
Adjustment with the arrester device screwed off.
For pressing out contact wafers where the signal
contacts do protrude from the printed circuit
board.