F&S armStone A9 Operator's manual

Hardware Documentation
armStone™A9
Version 102
14.09.2018
© F&S Elektronik Systeme GmbH
Untere Waldplätze 23
D-70569 Stuttgart
Fon: [phone]
Fax: [phone]

ESD Requirements
All F&S hardware products are ESD (electrostatic sensitive devices).
All products are handled and packaged according to ESD guidelines.
Please do not handle or store ESD-sensitive material in ESD-unsafe
environments. Negligent handling will harm the product and warranty
claims become void.
History
Date
V
Platform
A,M,R
Chapter
Description
Au
2013-02-19
0.01
ASA9
A
*
First Preliminary version
KW
2013-11-15
0.02
ASA9
M
4
5.1
Correct signal name conventions, correct pins for COM
Adjust TDP
KW
2014-03-06
0.03
ASA9
A
M
4
0
Connector layout
additions
KW
2014-03-14
0.04
ASA9
A
4.11.5
2, 3
Add note it is optional
Add SATA with limitations
KW
2014-08-15
0.04
ASA9
M
*
Change to New Company CI
JG
2014-10-02
0.05
ASA9
A
A
A
5.2
0
4
Add cooling notes
Add backlight wiring description
Note for JILI30 pin 1
KW
2014-10-14
0.06
ASA9
A
4.11.5
5.2
Correct to ADS1015
Add electrical data for 3.3V IO
KW
2014-10-16
0.06
ASA9
A
4.11.4
Information about I2C interfaces
HF
2014-10-18
0.07
ASA9
A
4.11.4
Correct information about SPI
HF
2014-12-02
0.07
ASA9
M
4.8
Correct article numbers for touch modules
JG
2014-12-10
0.08
ASA9
M
4.6.1
Correct pin 24
KW
2015-01-08
0.09
ASA9
M
4.6.14.11
4.11.10
Remove the optional CAN Transceiver
KW
2015-02-05
0.10
ASA9
M
0
Add notice for pull-up at touch con.
HF
2015-06-15
0.11
ASA9
A
5.1
Add TDP for Solo and Duallight
KW
2016-10-16
0.12
ASA9
M
A
4.11.7
6,7,8
Correct PU to COL
Add some chapter for Storage, ROHS, Barcode Sticker
KW
2017-01-03
100
ASA9
A
4.6.2
4.6, 5.1
Add missing I2C signals
Add VLCD max current
KW
2017-11-13
101
ASA9
M
Index refreshed
HF
2018-09-14
102
ASA9
A
Extend thermal specification
HF
V Version
A,M,R Added, Modified, Removed
Au Author
About This Document
This document describes how to use the armStoneA9 board with mechanical and electrical
information’s. The latest version of this document can be found at http://www.fs-net.de.
Please also refer the design guide by using this module for your application.
Specifications are subject to change without notice!

Hardware Documentation armStone™A9 | 3 of 26
Table of Contents
ESD Requirements 2
History 2
About This Document 2
Table of Contents 3
1Dimensions 4
2Technical Data armStoneA9 5
2.1 Thermal Specification......................................................................................5
3Block diagram 6
4Interface and signal description 7
4.1 Gbit Ethernet LAN ...........................................................................................8
4.2 USB Host Connector .......................................................................................8
4.3 USB Device Connector....................................................................................8
4.4 Digital Monitor Connector ................................................................................8
4.5 microSD Connector .........................................................................................8
4.6 LVDS Connectors............................................................................................9
4.6.1 F&S JAE FI-S25P connector on top side.........................................................9
4.6.2 JILI30 JAE FI-X30S connector on bottom side...............................................10
4.7ESDCI RGB connector..................................................................................12
4.8 Backlight control connector............................................................................13
4.8.1 Solution with a single cable with 3 connectors...............................................13
4.8.2 Solution with 2 cable with 2 connectors each.................................................14
4.9 I2C connector for touch module.....................................................................15
4.10 Mini PCI Express...........................................................................................15
4.11 66 Pin Feature connector ..............................................................................16
4.11.1 Audio.............................................................................................................17
4.11.2 RS232 COM port...........................................................................................17
4.11.3 TTL COM port................................................................................................17
4.11.4 I2C/ SPI.........................................................................................................18
4.11.5 ADC In...........................................................................................................19
4.11.6 PWM out........................................................................................................19
4.11.7 Matrix keyboard.............................................................................................19
4.11.8 GPIOs............................................................................................................19
4.11.9 MISC signals, power......................................................................................19
4.11.10 CAN Bus........................................................................................................20
4.12 Power connector............................................................................................21
5Electrical Data 22
5.1 Power supply.................................................................................................22
5.2 DC electrical characteristics for 3.3V IO pins.................................................22
5.3Power consumption and cooling....................................................................23
6Storage conditions 24
7ROHS and REACH statement 24
8Matrix Code Sticker 24
9Appendix 25
Important Notice..........................................................................................................25

Hardware Documentation armStone™A9 | 4 of 26
Warranty Terms ..........................................................................................................26
1 Dimensions
Figure 1: mechanical dimensions
PCB thickness 1.5 mm ±10%
PCB size 72x100 mm (picoITX)
Max. Height of parts on top side 15 mm
Max. Height of parts on bottom side tbd
Weight: tbd

Hardware Documentation armStone™A9 | 5 of 26
2 Technical Data armStoneA9
Power supply: 5V DC ±5%, optional 8..14V DC
Interfaces: 1x Ethernet 10/100/1000Mbit
4x USB 2.0 Host
1x USB 2.0 Device
1x digital monitor
1x microSD card connector push-push
1x mPCIe
1x SATA (only with quad core CPU)
1x I2C for touch module
1x stereo Audio LineIn, LineOut, Mic
2x serial port RS232
1x serial port TTL
4x ADC In (10 bit, 500kSPS, optional on custom version)
3x PWM out
1x I2C
1x SPI
17x GPIO
LCD-interfaces: 1x 18bit LVDS F&S JAY FI-S25P
1x 2x 24bit LVDS JILI30
1x 18bit TTL ESDCI
Memory: 1 GByte DDR3 DRAM (optional 2GB)
128 MByte NAND Flash (optional up to 32 GByte)
CPU: Freescale i.MX6 Solo, DualLite or Quad Core
(Optional several temperature and frequency)
2.1 Thermal Specification
Min
Typ
Max
Unit
Operating temperature
0
+701
°C
Operating temperature (“I”)2
-20
+851
°C
Junction temperature i.MX6
-20
+105
°C
Junction temperature i.MX6 (“I”) 2
-20
+105
°C
Junction to Top of i.MX6 (Psi-JT)3
2
°C/W
1 Depending on cooling solution.See also: Power consumption and cooling
2Optional
3Temperature difference between package top and the junction temperature per JEDEC
JESD51-2.

Hardware Documentation armStone™A9 | 6 of 26
3 Block diagram
I2C
SPI
GPIO
UART
RS232
Figure 2: block diagram
LVDS 2x24 bit
(JILI30 JAE FI-X30S)
4x 128Mx16 DDR3
(4x 256Mx16)
I2C con for touch controller
(Hirose DF13A-6P)
microSD push-push
USB 2.0 device
3x USB 2.0 host
digital monitor
66 pin connector
Audio Codec
SLC NAND Flash
TTL 18 bit
(ESDCI 34polig 1.27mm)
LVDS 18 bit
(JAE FI-S25P)
SATA (iMX6 Quad only)
10/100/1000 Mbit LAN
LAN Phy
Freescale
CortexTM A9
CPU
i.MX6
1GHz
mPCIe
USB Hub
I2C->ADC
CAN controller

Hardware Documentation armStone™A9 | 7 of 26
4 Interface and signal description
Figure 3: connector diagram
Note: there is a wrong pin 1 marker on the JILI30 connector on back side. The inner pin is
pin 1. The picture above is right. This marking failure will occur up to PCB Rev 1.10.

Hardware Documentation armStone™A9 | 8 of 26
4.1 Gbit Ethernet LAN
The LAN1 connector does support 10, 100 and 1000 Mbit LAN.
4.2 USB Host Connector
The double USB Host connector does support USB2.0 connection with High speed up to
480Mbit/s and also full and low speed devices.
The on-board pin connector for internal USB does have the following pin out.
Pin
Function
1
+5V (shared with resettable fuse from front port connector)
2
USB3-
3
USB3+
4
GND
Table 1: Internal USB host connector
The signals on the internal connector doesn’t have EMV filter.
The power on the 5V line is equipped with a resettable fuse with 1100mA for both front
connected port and the internal port together. At 70°C the summary current is limited to
650mA.
Current consuming summary of all ports shouldn’t exceed maximum power consuming limit
on the 5V path.
4.3 USB Device Connector
The USB device connects the armStoneA9 as device on a PC.
4.4 Digital Monitor Connector
A digital monitor can connected to the board. This interface supports up to 1080p 60Hz.
4.5 microSD Connector
The microSD push-push connector supports the SD Standard Host Specification Version 2.0
standard.

Hardware Documentation armStone™A9 | 9 of 26
4.6 LVDS Connectors
4.6.1 F&S JAE FI-S25P connector on top side
The single channel LVDS display port on top side can be direct connected to a LVDS 18 or
24 bit display.
The VLCD voltage is 3.3V and switched on the baseboard. The current limit is 1.2 A.
Connector is a JAE FI-S25P-HFE. Matching connector on display cable is a crimp connector
FI-S25S housing and a cable with FI-C3-A1-15000 crimp contacts.
This connector is used because a wide range of displays does have a JAE FI-S series
connector (with different pinouts) and it's easy to handle identical crimp contacts for the cable
manufacturer.
LCD FI-S25S Connector
Pin
Function
1,2,23
VLCD (3.3V switched, max. 300mA)
3,4,7,10,13,16,19..22
GND
14
LVDS0_CLK-
15
LVDS0_CLK+
5
LVDS0_DATA0-
6
LVDS0_DATA0+
8
LVDS0_DATA1-
9
LVDS0_DATA1+
11
LVDS0_DATA2-
12
LVDS0_DATA2+
17
LVDS0_DATA3-
18
LVDS0_DATA3+
24
Backlight on (3.3V high active CMOS logic)
25
Backlight PWM (3.3V level CMOS logic)
Table 2: Single channel LVDS connector
Pin 1 is marked on the connector with an arrow and also marked on PCB.
The single channel LVDS port can be direct connected to a LVDS 18 bit display.
Unused signals should be left unconnected.

Hardware Documentation armStone™A9 | 10 of 26
4.6.2 JILI30 JAE FI-X30S connector on bottom side
The dual channel LVDS display port can be direct connected to a LVDS 18 or 24 bit single
channel or dual channel display.
The signals for the first channel are shared with the other connector 4.6.1.
By connecting 2 single channel displays to the board we recommend to use the top
connector for the first channel and the second channel of the bottom connector for the
second display.
LCD FI-X30P Connector
Pin
Function
28..30
VLCD (3.3V switched, max. 300 mA)
7,14,17,24
GND
1
LVDS0_DATA0- *3)
2
LVDS0_DATA0+ *3)
3
LVDS0_DATA1- *3)
4
LVDS0_DATA1+ *3)
5
LVDS0_DATA2- *3)
6
LVDS0_DATA2+ *3)
8
LVDS0_CLK- *3)
9
LVDS0_CLK+ *3)
10
LVDS0_DATA3- *3)
11
LVDS0_DATA3+ *3)
12
LVDS1_DATA0-
13
LVDS1_DATA0+
15
LVDS1_DATA1-
16
LVDS1_DATA1+
18
LVDS1_DATA2-
19
LVDS1_DATA2+
20
LVDS1_CLK-
21
LVDS1_CLK+
22
LVDS1_DATA3-
23
LVDS1_DATA3+
25
I2C_C_DAT (4k7 PU onboard)