Fibocom H330 Instructions for use

H330 HSPA+ Module
Hardware User Manual
Version: V1.0.0
Date: 2012-05-29

H330 HSPA+
Confide
n
This docu
m
(Fibocom).
engineerin
g
requiremen
t
subject to c
of G&T.
Copyrig
Transmittal
,
contents a
n
be held liab
or design p
a
Copyright
©
Revisio
n
V
e
V
1
Tradem
a
The FIBOC
service na
m
Copyright
©
Module Hard
n
tial Ma
t
m
ent contain
s
Fibocom of
f
g
efforts that
t
s specifical
hange. Dis
c
ht
,
reproducti
o
n
d communi
c
le for paym
e
a
tent are re
s
©
1999-2010
n
Histor
y
rsion
1
.0.0
a
rks Not
OM Logo is
m
es or Logo
s
©
1999-2012
ware User M
a
t
erial
s
informatio
n
f
ers this inf
o
use the pr
o
ly provided
c
losure of th
o
n, dissemi
n
c
ation there
o
e
nt of dama
s
erved.
Shenzhen
G
y
Date
2012-05-2
9
ice
registered
b
s
are the pr
o
Shenzhen
G
a
nual
n
highly co
n
o
rmation as
a
o
ducts desi
g
to Fibocom
is informati
o
n
ation and/
o
o
f to others
ges. All rig
h
G
&T Indust
r
9
Initial
b
y Shenzhe
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perty of th
e
G
&T Indust
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n
fidential to
S
a
service to
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ned by Fib
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by the cust
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p
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without exp
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b
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G&T Indu
s
e
ir
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espectiv
r
ial Develop
m
S
henzhen
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its custom
e
o
com. The i
n
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mers. All s
p
p
arties is pr
o
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his docum
e
ress authori
b
y patent gr
a
m
ent Co., L
t
Rem
a
s
trial Devel
o
e owners.
m
ent Co., L
t
G
&T Industri
a
e
rs, to supp
o
n
formation
p
p
ecification
s
o
hibited wit
h
e
nt as well a
zation are
p
a
nt or regist
t
d. All right
s
a
rks
o
pment Co.,
t
d. All right
s
a
l Develop
m
o
rt applicati
o
p
rovided is
b
s
supplied h
h
out the writ
t
s utilization
p
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O
ration of a
u
s
reserved.
Ltd. All oth
e
s
reserved.
Page 2 of 44
m
ent Co., Lt
d
o
n and
b
ased upon
erein are
t
en consent
of its
O
ffenders wi
l
u
tility model
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H330 HSPA+
1Prefac
e
1.1
S
1.2
S
2Introdu
2.1
P
2.2
P
2.3
P
3Macha
n
3.1
D
3.2
R
4Hardw
a
4.1
B
4.2
P
4.
2
4.
2
5Hardw
a
5.1
P
5.
1
5.
1
5.
1
5.
1
5.2
O
5.
2
5.
2
5.
2
5.
2
5.3
5.
3
5.
3
5.4
U
5.
4
5.
4
Module Hard
e
.................
S
cope ........
S
tandards ..
ction ..........
P
roduct De
s
P
roduct Sp
e
P
roduct Ap
p
n
ical ...........
D
imension .
R
ecommen
d
a
re Scope ..
B
lock Diagr
a
P
in Definiti
o
2
.1Pin
M
2
.2Pin
D
a
re Interfac
e
P
ower Inter
f
1
.1VBA
T
1
.2Pow
e
1
.3VIO .
1
.4VRT
C
O
n/Off/Res
e
2
.1Pin
D
2
.2Pow
e
2
.3Pow
e
2
.4Res
e
Indicator Si
g
3
.1Pin
D
3
.2Indic
a
U
SB Interfa
c
4
.1USB
4
.2USB
ware User M
a
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cription .....
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cification...
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earance ....
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PCB Desi
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m .............
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ap ............
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ace ...........
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r Consum
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escription..
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tor Descri
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Pin Descri
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Design ......
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H330 HSPA+
5.5
U
5.
5
5.
5
5.6
U
5.
6
5.
6
5.
6
5.
6
5.7
A
5.
7
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8
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6Electri
c
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6.2
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7RF Int
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7.1
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7.
1
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7.2
R
7.
2
7.
2
7.3
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7.
3
7.
3
Module Hard
U
ART.........
5
.1UAR
T
5
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T
U
SIM .........
6
.1USI
M
6
.2USI
M
6
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M
6
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M
A
nalog Aud
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7
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D
7
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o
D
igital Audi
o
8
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8
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O
the
r
.........
c
al and Envi
E
lectrical C
h
E
nvironme
n
e
rface .........
O
perational
1
.1Main
1
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R
F PCB De
2
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2
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ntenna D
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3
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3
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Interface .
T
Design....
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Interface..
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Design.....
M
Design N
o
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Hot Plug ..
i
o ...............
D
escription..
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Descriptio
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Page 4 of 44
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H330 HSPA+
1 Pref
a
1.1 Sc
o
This manu
a
the H330 H
This manu
a
availability
o
and softwa
r
1.2 Sta
n
3GPP
T
3GPP
T
(DTE-
D
3GPP
T
3GPP
T
radio i
n
3GPP
T
3GPP
T
3GPP
resele
c
3GPP
T
Stage
2
3GPP
T
3GPP
T
3GPP
T
3GPP
T
3GPP
T
3GPP
T
Modul
e
3GPP
T
specifi
c
3GPP
T
3GPP
T
3GPP
T
Module Hard
a
ce
o
pe
a
l provides t
h
SPA+ mod
u
a
l gives a co
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f any featu
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r
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T
S 27.007
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S 23.040
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S 24.011
n
terface
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S 27.010
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S 27.060
TS 25.3
0
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tion in con
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T
S 25.308
2
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S 25.309
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S 23.038
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S 21.111
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S 31.111
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S 45.002
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S 51.014
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E
T
S 51.010
c
ation
T
S 22.004
T
S 23.090
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S 24.008
ware User M
a
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e electrical
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mplete set
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H
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a
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application.
o
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n, which is
d
H
330 HAPA
+
command
s
e of Data T
e
Message
S
c
hnical reali
int- to - Poi
n
r
minal Equi
p
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U
ser Equip
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g
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o
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D enhance
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p
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SIM-ME) in
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neral on su
n
structured
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ervice (SM
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n
t (PP) Sho
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ment to Us
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m
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rface Laye
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Equipment
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r
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n
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ket Access
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specific inf
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m
ents
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le access o
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pecificatio
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tion;
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n the hard
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minating E
q
S
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verall desc
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Subscribe
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; Part 1: C
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D
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Page 5 of 44
y
integrating
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are revisio
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n mobile
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rotocol
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s
ures for cell
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r
Identity
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n
s

H330 HSPA+
2 Intr
o
2.1 Pro
d
H330 is a h
GSM/GPR
S
850/900/19
0
2.2 Pro
d
Product
F
Support
e
Data：
Physical
：
Environ
m
Module Hard
o
ductio
n
d
uct De
s
igh integrity
S
/EDGE GS
0
0/2100MH
z
d
uct Sp
e
F
eatures
e
d Bands：
• 4 Band
U
850/90
0
• 4 Band
G
850/90
0
• UMTS/H
• HSUPA
5
• HSDPA
2
• GSM 3
G
• EDGE (
E
• GPRS
m
：
• Size：3
3
• Height：
• Mountin
g
• Weight：
m
ental
• Operatin
ware User M
a
n
s
criptio
n
3G WCDM
A
M850/900/
D
z
.
e
cificati
o
U
MTS/HSP
A
0
/1900/210
0
G
SM
0
/1800/190
0
SDPA/HSU
5
.76Mbps (
C
2
1Mbps (C
a
G
PP release
E
-GPRS) m
u
m
ulti-slot cla
s
3
.8mm x 27
.
2.45 mm
g
：LGA
< 6 grams
g Tempera
t
a
nual
n
A
wireless
m
D
CS1800/P
C
o
n
A
(WCDMA
/
0
MHz
0
MHz
PA 3GPP r
e
C
at 6)
a
t 14)
7
u
lti-slot clas
s
s
s 12
.
8mm
t
ure：-30℃
m
odule, LG
A
C
S1900MH
z
/
FDD)
e
lease 7
s
12
~ +65℃
A
package,
1
z
and UMT
S
1
20 pin. It c
a
S
/HSDPA/H
S
a
n support
S
UPA/HSP
A
Page 6 of 44
A
+

H330 HSPA+
Perform
a
Operatin
g
Current
C
Tx Powe
r
Rx Sensi
t
Interface
Connect
o
Connecti
v
Module Hard
• Storage
a
nce
g
Voltage
• Voltage:
C
onsumpti
o
• 2mA (Sl
e
• 3G Idle:
• 3G Talk:
• 2G Talk:
r
(Typical)
• UMTS/H
• GSM 85
0
• GSM 18
0
• EDGE 8
5
• EDGE 1
8
t
ivity(Typi
c
• UMTS/H
• GSM：-
1
o
rs
• RF Thro
u
• Main An
t
• Diversit
y
v
ity
• 1*USB 2
• 2*UART
ware User M
a
Temperatu
r
3.6 ~ 4.2V
o
n(Typical)
e
ep Mode)
35mA
500mA
260mA (G
S
SPA Class
3
0
/900 MHz
C
0
0/1900 M
H
5
0/900 MH
z
8
00/1900 M
c
al)
SPA：-109
d
1
07dBm
u
gh Pads in
t
enna
y
Antenna
.0
a
nual
r
e：-40 ~℃
S
M PCL5)
3
(24dBm)
C
lass4 (33
d
H
z Class1 (
3
z
Class E2 (
2
Hz Class E
2
d
Bm
LGA, 2 x
m
+85℃
d
Bm)
3
0dBm)
2
7dBm)
2
(26dBm)
m
ini-UFL in
P
P
CIe model
Page 7 of 44

H330 HSPA+
Data Fea
t
HSPA+
EDGE
GPRS
CSD
SMS
V
oice Fe
a
Module Hard
• MUX Ov
• Multiple
• SPI Sup
p
• I2C Sup
p
• I2S Sup
p
t
ures
• Embedd
e
• Max upli
n
• Max do
w
• Multi-slo
t
(4 Down;
4
• Coding
S
• Multi-slo
t
(4 Down;
4
• Coding
S
• UMTS
• GSM
• MO / M
T
• Cell bro
a
a
tures
• Telepho
n
ware User M
a
er UART1
Profiles ove
p
ort
p
ort
p
ort
e
d TCP/IP
a
n
k 5.76Mbp
w
nlink 21Mb
p
t
class 12
4
Up; 5 Tot
a
S
cheme M
C
t
class 12
4
Up; 5 Tot
a
S
cheme CS
1
T
Text and
P
a
dcast
n
y
a
nual
r USB
a
nd UDP/IP
s
p
s
a
l)
C
S1-MCS9
a
l)
1
-CS4
P
DU modes
protocol st
a
a
ck
Page 8 of 44

H330 HSPA+
Audio C
o
Characte
Control/
S
AT Com
m
Accesso
r
Regulato
Module Hard
• Analog
a
• Voice c
o
o
ntrol
• Broad g
a
• Echo su
p
• Noise s
u
• Side ton
e
r Set
• IRA
• GSM
• UCS2
• HEX
S
tatus Indi
c
• GPIO’s
• A/D
• RTC
m
and Set
• G&T pro
• GSM 07
.
• GSM 07
.
r
ies
• Firmwar
e
• User Ma
• Develop
e
ry and Ap
p
• FCC
ware User M
a
a
nd Digital
A
o
ders EFR/
H
a
in control
p
pression
u
ppression
e
c
ations
prietary AT
.
05
.
07
e
Loader T
o
nual
e
r Kit
p
rovals
a
nual
A
udio
H
R/FR/AMR
commands
o
ol over US
B
B
/UART
Page 9 of 44

H330 HSPA+
2.3 Pro
d
H330
H
Top Vi
e
Botto
m
Module Hard
w
• RoHS
• CE
• RRB
d
uct Ap
p
H
SPA+ Mod
u
e
w：
m
View：
w
are User M
a
p
earanc
e
u
le Appear
a
a
nual
e
a
nce is belo
w
w
。
Page 10 of 4
4
4

H330 HSPA+
3 Mec
h
3.1 Di
m
Module Hard
w
h
anical
m
ension
w
are User M
a
a
nual
Top View
Side View
Bottom Vie
w
w
Page 11 of 4
4
4

H330 HSPA+
3.2 Re
c
Module Hard
w
c
ommen
d
w
are User M
a
d
PCB D
e
a
nual
e
sign
Page 12 of 4
4
4

H330 HSPA+
4 Har
d
4.1 Blo
c
Module Hard
w
d
ware S
c
c
k Diagr
a
w
are User M
a
c
ope
a
m
a
nual Page 13 of 4
4
4

H330 HSPA+
4.2 Pin
4.2.1 Pi
n
4.2.2 Pi
n
Notice: H3
3
H330 Pin d
e
Pin#
P
Power
59
V
60
V
61
V
62
V
64
V
1
V
Module Hard
w
Definiti
o
n
Map
n
Descript
i
3
0 logic ele
c
e
scription：
P
in Name
V
BAT
V
BAT
V
BAT
V
BAT
V
P
A
V
TRX
w
are User M
a
o
n
i
on
c
trical level i
s
a
nual
s
1.8V.
I/O
I
I
I
I
O
O
Descrip
t
Power s
u
Power s
u
Power s
u
t
ion
u
pply
u
pply indica
t
u
pply indica
t
t
or for RF P
A
t
or for RF tr
a
A
a
nsceive
r
Page 14 of 4
4
4

H330 HSPA+
46
V
47
V
On/off
48
P
49
P
Reset
77
R
USIM
4
U
5
U
6
U
7
U
8
U
High Spee
d
9
U
10
U
Audio
13
A
14
A
15
E
16
E
17
M
18
M
19
A
20
A
21
A
Module Hard
w
V
IO
V
RTC
P
OWER_O
F
P
OWER_O
N
R
ESET_AL
L
U
SIM_CD
U
SIM_VCC
U
SIM_RST
U
SIM_CLK
U
SIM_DAT
A
d
SIM
U
SIM_D+
U
SIM_D-
A
UXO+
A
UXO-
E
AR-
E
AR+
M
IC+
M
IC-
A
UXI-
A
UXI+
A
GND
w
are User M
a
F
F
N
L
_N
A
a
nual
O
I/O
I
I
I
I
O
O
O
I/O
O
O
O
O
I
I
I
I
GND
Digital p
o
Real tim
e
Off contr
o
On contr
o
External
USIM in
s
USIM p
o
USIM re
s
USIM cl
o
USIM d
a
High sp
e
High sp
e
Audio ch
Audio ch
Audio ch
Audio ch
Audio ch
Audio ch
Audio ch
Audio ch
Audio G
N
o
wer supply
e
clock pow
e
o
l signal
o
l signal
reset signal
s
ert detect, l
o
wer supply
s
et
o
ck
a
ta
e
ed SIM US
B
e
ed SIM US
B
annel2 out
p
annel2 out
p
annel1 out
p
annel1 out
p
annel1 inp
u
annel1 inp
u
annel2 inp
u
annel2 inp
u
N
D
1.8V.
er
,1.71V ~
ow activity
B
data line+
B
data line-
p
ut+
p
ut -
p
ut -
p
ut +
u
t +
u
t -
u
t -
u
t +。
1.89V
（No supp
o
（No suppo
r
Page 15 of 4
4
o
rt）
r
t）
4

H330 HSPA+
22
V
I2S
11 I
2
24 I
2
25 I
2
26 I
2
27 I
2
USB
31
U
32
U
33
U
34
V
92
U
I2C
28 I
2
29 I
2
UART1
35
U
36
U
37
U
38
U
39
U
40
U
41
U
42
U
UART2
Module Hard
w
V
SPK
2
S2_CLK1
2
S2_CLK0
2
S2_WA0
2
S2_TX
2
S2_RX
U
SB_DP
U
SB_DM
U
SB_ID
V
USB
U
SB_TEST
2
C_SDA
2
C_SCL
U
ART1_RI
U
ART1_DS
R
U
ART1_DT
R
U
ART1_DC
D
U
ART1_CT
S
U
ART1_RT
S
U
ART1_TX
D
U
ART1_RX
D
w
are User M
a
R
R
D
S
S
D
D
a
nual
I
O
O
O
O
I
I/O
I/O
—
I
—
I/O
O
O
I
O
O
I
O
O
I
Audio c
o
VBAT
I2S2 clo
c
I2S2 clo
c
I2S2 wo
r
I2S2 tra
n
I2S2 rec
e
USB dat
a
USB dat
a
USB ID l
USB po
w
USB TE
S
I2C data
I2C cloc
k
UART1
R
UART1
D
UART1
D
UART1
C
UART1
C
UART1
R
UART1
T
UART1
R
o
dec speak
e
c
k
c
k
r
d alignmen
t
n
smit line
e
ive line
a
line +
a
line -
ine
w
er supply
S
T line
line
k
line
R
ing indicat
o
D
TE Data S
e
D
CE Data T
e
C
arrier Dete
C
lear to sen
R
equest to
s
T
ransmitted
R
eceived D
a
e
r part powe
r
t
select
or
e
t ready
e
rminal rea
d
ct
d
s
end
Data
a
ta
r supply, co
n
d
y
Page 16 of 4
4
n
nect to
4

H330 HSPA+
45
U
44
U
ADC
50
A
51
A
EINT
56
W
57
E
USB HSIC
90
H
91
H
Antenna
67
A
71
A
Other
23
D
53
T
54
C
55
C
89
S
86
L
Not Conne
73
N
74
N
75
N
76
N
Module Hard
w
U
ART2_TX
D
U
ART2
_
RX
D
A
DC2
A
DC1
W
AKE_UP
E
INT2
H
SIC_USB
_
H
SIC_USB
_
A
NT_MAIN
A
NT_DIV
D
ACOUT
T
_OUT0
C
LKOUT0
C
LK32K
S
MI
L
PG
ct
N
C
N
C
N
C
N
C
w
are User M
a
D
D
_
DATA
_
STRB
a
nual
O
I
I
I
I
I
I
O
UART2
T
UART2
R
Analog
d
Analog
d
Wake u
p
External
HSIC U
S
HSIC U
S
Main ant
Diversity
No Sup
p
No supp
o
No supp
o
No supp
o
Sleep M
o
Module
w
T
ransmitted
R
eceived D
a
d
igital conve
d
igital conve
p
signal, low
interrupt, lo
w
S
B data sig
n
S
B pulse sig
enna port,
5
antenna p
o
p
ort
o
rt
o
rt
o
rt
o
de Indicat
o
w
ord mode i
Data
a
ta
r
ter 2（No
s
r
ter 1（No
s
activit
y
.
w
activit
y
.
n
al（No sup
p
nal（No su
p
5
0ohm imp
e
o
rt, 50ohm i
m
or
ndicato
r
s
upport）
s
upport）
p
ort）
p
port）
e
dance
m
pedance
Page 17 of 4
4
4

H330 HSPA+
105
N
106
N
107
N
108
N
78
N
79
N
80
N
81
N
82
N
83
N
84
N
85
N
87
N
88
N
94
N
95
N
96
N
101
N
GND
2
G
12
G
21
G
30
G
43
G
58
G
63
G
Module Hard
w
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
N
C
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
w
are User M
a
a
nual Page 18 of 4
4
4

H330 HSPA+
65
G
66
G
68
G
69
G
70
G
72
G
93
G
97
G
98
G
99
G
100
G
102
G
103
G
104
G
109
G
110
G
111
G
112
G
113
G
114
G
115
G
116
G
117
G
118
G
119
G
120
G
Module Hard
w
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
G
ND
w
are User M
a
a
nual Page 19 of 4
4
4

H330 HSPA+
5 Har
d
5.1 Po
w
5.1.1
V
B
A
The H330
p
must be ab
l
2.0A.
It is require
m
Parame
t
VBAT
Special car
e
source indi
r
amplifier (P
A
transients,
w
The burst-
m
from the po
w
transmissio
drop. If the
v
performanc
It is recom
m
H330 interf
a
In any case
burst. Drop
p
an automat
i
To minimiz
e
guidelines:
Use a
1
locate
d
Use lo
w
Use ca
Filter t
h
Module Hard
w
d
ware In
w
er Inter
f
A
T
p
ower suppl
y
l
e to sustai
n
m
ent below
:
t
e
r
M
3
e
must be t
a
r
ectly suppli
e
A
). Therefo
r
w
ill directly
a
m
ode operat
w
er supply,
n bursts co
n
v
oltage dro
p
e.
m
ended that
a
ce connec
t
, the H330
s
p
ing below t
i
c power-off
e
the losses
1
000 uF, or
g
d
as near to
w
impedanc
e
bling and r
o
h
e H330 su
p
w
are User M
a
terface
f
ace
y
must be a
n
the voltag
e
:
M
in.
3
.6
a
ken when
d
e
s all the di
g
r
e, any degr
a
ffect the H
3
ion of the G
which caus
e
n
sume the
m
p
s are not
m
the voltage
t
or.
s
upply input
he minimu
m
.
and transie
g
reater, low
the H330 in
e
power so
u
o
uting as sh
o
p
ply lines u
s
a
nual
single exte
r
e
level durin
g
Re
c
3.8
d
esigning th
e
g
ital and an
a
adation in t
h
3
30 perform
SM transmi
s
e
s tempora
r
m
ost instant
a
m
inimized, t
h
drops duri
n
must not d
r
m
operating l
nts on the
p
ESR capa
c
terface con
n
u
rce, cablin
g
o
rt as possi
b
s
ing filtering
r
nal DC volt
a
g
a GSM tr
a
c
ommend
e
power su
p
a
log interfa
c
h
e power su
ance.
s
sion and r
e
r
y voltage d
r
a
neous cur
r
h
e frequent
v
n
g a transmi
t
r
op below t
h
evel may r
e
p
ower suppl
y
c
itor on the
H
n
ector as p
o
g
and board
b
le.
capacitors,
a
ge source
a
nsmit burst
Max.
4.2
p
ply of the
H
c
es, but als
o
pply perfor
m
e
ception dr
a
r
ops of the
p
r
ent, and th
e
v
oltage
f
luc
t
t
burst will n
h
e minimum
e
sult in a lo
w
y
lines, it is
r
H
330 suppl
y
o
ssible.
routing.
as describe
of 3.6V to 4
current ser
g
H
330. The si
o
directly su
p
m
ance, due
a
ws instanta
p
ower suppl
e
refore caus
t
uations ma
y
ot exceed
3
operating l
e
w
voltage de
t
r
ecommend
y
inputs. Th
e
d in the tab
l
.2V. The po
w
g
e, which m
Unit
V
ngle extern
a
p
plies the
R
to losses, n
neous curr
e
y level. The
e the large
s
y
degrade t
h
3
00mV, mea
s
e
vel during
a
t
ection, whi
c
ed to follow
e
capacitor
s
l
e.
Page 20 of 4
4
w
er supply
ay reach
a
l DC powe
r
R
F power
oises or
e
nt surges
s
t voltage
h
e H330
s
ured on th
e
a
transmit
c
h will initiat
e
these
s
hould be
4
r
e
e