FLIR Lepton 1.6 Instruction Manual

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
1
General Description
Lepton® is a complete long-wave infrared
(LWIR) camera module designed to interface
easily into native mobile-device interfaces and
other consumer electronics. It captures infrared
radiation input in its nominal response
wavelength band (from 8 to 14 microns) and
outputs a uniform thermal image with
radiometry
1
to provide temperature image with
measurements.
Lepton Features
2
•Integral shutter configurations
•Configurations with 25°, 50° and 57°
HFOV (f/1.1 silicon doublet)
•LWIR sensor, wavelength 8 to 14 µm
•Arrays with 80x60 and 160x120 active
pixels available
•Thermal sensitivity <50 mK
•Integrated digital thermal image
processing functions, including
automatic thermal environment
compensation, noise filters, non-
uniformity correction, and gain control
•Radiometric accuracy1(35°C blackbody)
oHigh gain: ±5C @ 25°C
oLow gain ±10C @ 25°C
•Radiometric Leptons1feature
temperature measurement including
per pixel and frame radiometric output
(TLinear) and Spotmeter
•Export compliant frame rate (< 9 Hz)
•SPI video interface
•Two-wire I2C serial control interface
1
Radiometric Leptons are 2.5 and 3.5.
•Uses standard cell-phone-compatible
power supplies: 2.8 V to sensor, 1.2 V to
digital core, and flexible IO from 2.8 V
to 3.1 V
•Fast time to image (< 1.2 sec)
•Low operating power
oNominally 160 mW
o800mW typical during shutter
event (~1s)
oLow power mode 5 mW
•RoHS compliant
•32- pin socket interface to standard
Molex or similar side-contact connector
Applications
•Mobile phones
•Gesture recognition
•Building automation
•Thermal imaging
•Night vision
2
All specifications subject to change without notice

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
2
Contents
1INTRODUCTION .............................................................................................................................................................6
1.1 REVISION HISTORY.............................................................................................................................................................6
1.2 CONTACT US.....................................................................................................................................................................6
1.3 REFERENCES .....................................................................................................................................................................6
1.4 DEVICE OVERVIEW.............................................................................................................................................................8
1.5 KEY SPECIFICATIONS...........................................................................................................................................................9
1.6 SYSTEM ARCHITECTURE ....................................................................................................................................................11
2FUNCTIONAL DESCRIPTION .........................................................................................................................................12
2.1 FPA INTERFACE MODULE..................................................................................................................................................12
2.2 SYSTEM CONTROL (SYS CTRL)MODULE ...............................................................................................................................12
2.3 POWER MANAGEMENT MODULE .......................................................................................................................................13
2.4 SOFTWARE-BASED VIDEO PROCESSING (SVP CORE)MODULE..................................................................................................13
2.5 MEMORY SYSTEM (MEMORY SYS)MODULE.........................................................................................................................13
2.6 GENERAL PURPOSE PROCESSOR (GPP)................................................................................................................................13
2.7 VIDEO INTERFACE MODULE (VIDEO IF)................................................................................................................................13
2.8 ONE-TIME PROGRAMMABLE MEMORY (OTP)......................................................................................................................13
2.9 STATIC RANDOM-ACCESS MEMORY (SRAM) .......................................................................................................................13
2.10 GPIO INTERFACE MODULE (GPIO IF).................................................................................................................................14
2.11 VIDEO PIPELINE...............................................................................................................................................................14
2.11.1 NUC ....................................................................................................................................................................14
2.11.2 Defect Replacement...........................................................................................................................................14
2.11.3 Spatial / Temporal Filtering ...............................................................................................................................14
2.11.4 AGC ....................................................................................................................................................................15
2.11.5 Colorize ..............................................................................................................................................................15
2.12 MASTER CLOCK...............................................................................................................................................................15
3OPERATING STATES AND MODES ................................................................................................................................15
3.1 POWER STATES ...............................................................................................................................................................15
3.2 FFC STATES....................................................................................................................................................................18
3.3 GAIN STATES ..................................................................................................................................................................22
3.4 TELEMETRY MODES .........................................................................................................................................................23
3.5 RADIOMETRY MODES.......................................................................................................................................................29

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
3
3.5.1 Radiometry Enabled - TLinear ................................................................................................................................30
3.5.2 Radiometry Enabled –Flux linear...........................................................................................................................30
3.5.3 Radiometry Disabled ..............................................................................................................................................31
3.5.4 Radiometric Accuracy –Module.............................................................................................................................32
3.5.5 Radiometric Accuracy –System Considerations.....................................................................................................32
3.6 AGC MODES..................................................................................................................................................................34
3.7 VIDEO OUTPUT FORMAT MODES .......................................................................................................................................36
3.8 GPIO MODES.................................................................................................................................................................39
4INTERFACE DESCRIPTIONS...........................................................................................................................................40
4.1 COMMAND AND CONTROL INTERFACE .................................................................................................................................40
4.1.1 User Defaults Feature.............................................................................................................................................42
4.2 VOSPI CHANNEL .............................................................................................................................................................44
4.2.1 VoSPI Physical Interface .........................................................................................................................................45
4.2.2 VoSPI Protocol –Lepton 1.5, 1.6, 2.0 and 2.5.........................................................................................................46
4.2.3 VoSPI Protocol –Lepton 3.0 and 3.5 ......................................................................................................................54
4.2.4 VoSPI Protocol –Lepton 2 vs. Lepton 3 ..................................................................................................................62
5THERMAL CAMERA BASICS..........................................................................................................................................63
6MOUNTING SPECIFICATIONS .......................................................................................................................................65
6.1 SOCKET INFORMATION .....................................................................................................................................................66
6.2 MECHANICAL CONSIDERATIONS .........................................................................................................................................68
6.3 THERMAL CONSIDERATIONS...............................................................................................................................................69
6.4 OPTICAL CONSIDERATIONS ................................................................................................................................................69
7IMAGE CHARACTERISTICS............................................................................................................................................69
8SPECTRAL RESPONSE ...................................................................................................................................................71
9ELECTRICAL SPECIFICATIONS .......................................................................................................................................73
9.1 LEPTON PIN-OUT .............................................................................................................................................................73
9.2 DC AND LOGIC LEVEL SPECIFICATIONS .................................................................................................................................76
9.3 AC ELECTRICAL CHARACTERISTICS.......................................................................................................................................77
9.4 ABSOLUTE MAXIMUM RATINGS .........................................................................................................................................78
9.5 ELECTRONIC INTEGRATION CONSIDERATIONS.........................................................................................................................78
10 ENVIRONMENTAL SPECIFICATIONS .............................................................................................................................79
10.1 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVES..................................................................................................................80
11 ABBREVIATIONS AND ACRONYMS...............................................................................................................................82

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
4
Table of Figures
Figure 1. Lepton with shutter Camera (with and without socket).............................................................................8
Figure 2 - Lepton Architecture.................................................................................................................................. 11
Figure 3 - Lepton Detailed Block Diagram................................................................................................................ 12
Figure 4 - Lepton Video Pipeline Block Diagram...................................................................................................... 14
Figure 5 - State Diagram Showing Transitions among the Five Power States ........................................................ 16
Figure 6 - Lepton Power Sequencing........................................................................................................................ 18
Figure 7 - Examples of Good Uniformity, Graininess, and Blotchiness................................................................... 19
Figure 8 - FFC States.................................................................................................................................................. 21
Figure 9 - Relative Spatial Noise after FFC vs. Number of Integrated Frames ((defaults is 8) ............................... 22
Figure 10 - Hypothetical Illustration of Camera Output in counts vs. Camera Temperature in Radiometry-
enabled Mode ........................................................................................................................................................... 31
Figure 11 - Hypothetical Illustration of Camera Output vs. Camera Temperature in Radiometry-disabled Mode
................................................................................................................................................................................... 32
Figure 12 - Illustration of a Histogram for a 3x3 Pixel Area..................................................................................... 35
Figure 13 - Comparison of Linear AGC and Classic/Lepton Variant of Histogram Equalization............................. 36
Figure 14 - Built-in Color Palette .............................................................................................................................. 38
Figure 15 - Comparison of an Identical Image with Grayscale and a False-color Palette ...................................... 39
Figure 16 - VoSPI Flexible Clock Rate ....................................................................................................................... 45
Figure 17 - VoSPI I/O................................................................................................................................................. 45
Figure 18 - SPI Mode 3 (CPOL=1, CPHA=1) ............................................................................................................... 46
Figure 19 - SPI Bit Order (transmission of 0x8C08).................................................................................................. 46
Figure 20 - Generic VoSPI Packet.............................................................................................................................. 47
Figure 21 - Video Packet ........................................................................................................................................... 48
Figure 22 - Discard Packet......................................................................................................................................... 48
Figure 23 - Raw14 Mode: 1 video line per 160-byte payload.................................................................................. 49
Figure 24 - RGB888 Mode: 1 video line per 240-byte payload................................................................................ 49
Figure 25 - Frame Counter for Successive 80x60 Frames ........................................................................................ 51
Figure 26 - Valid Frame Timing (no loss of synchronization)................................................................................... 52
Figure 27 -Clock Too Slow - Failure to Read an Entire Frame Within the Frame Period ........................................ 53
Figure 28 - Intra-Frame Delay Too Long - Failure to Read Out an Entire Frame Before the Next is Available...... 53

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
5
Figure 29 - Failure to Read Out an Available Frame ................................................................................................ 53
Figure 30 - Generic VoSPI Packet.............................................................................................................................. 55
Figure 31 - Segment and Packet Relationship to the 160x120 video image........................................................... 55
Figure 32 - Packet Header Encoding and an Example.............................................................................................. 56
Figure 33 - Discard Packet......................................................................................................................................... 57
Figure 34 - Raw14 Mode: 1 video line per 160-byte payload.................................................................................. 58
Figure 35 - RGB888 Mode: 1 video line per 240-byte payload................................................................................ 58
Figure 36 - Location of Telemetry Lines ................................................................................................................... 58
Figure 37 - Frame Counter for Successive Frames.................................................................................................... 60
Figure 38 - Valid Frame Timing (no loss of synchronization)................................................................................... 61
Figure 39 - Clock Too Slow - Failure to Read an Entire Frame Within the Frame Period ....................................... 61
Figure 40 - Intraframe Delay Too Long - Failure to Read Out an Entire Frame Before the Next is Available........ 62
Figure 41 - Failure to Read Out an Available Frame ................................................................................................ 62
Figure 42 - Illustration of Lepton Detector Time Constant...................................................................................... 64
Figure 43 - Lepton with Radiometry Camera Mounting Dimensions...................................................................... 65
Figure 44 - Two Commercially-available Sockets (both from Molex) Compatible with Lepton ............................ 66
Figure 45 - Both Sockets Mounted on a PCB............................................................................................................ 67
Figure 46 - Recommended Approach to Retaining Lepton in the end Application................................................ 68
Figure 47 - Normalized Response as a Function of Signal Wavelength for Lepton 1.5, 2.0 and 2.5 ...................... 71
Figure 48 - Normalized Response as a Function of Signal Wavelength for Lepton 3.0 and 3.5 ............................. 72
Figure 49 - Pinout Diagram (viewed from bottom of camera module) .................................................................. 73
Figure 50. Example of Lepton schematic. ................................................................................................................ 78

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
6
1Introduction
1.1 Revision History
Revision
Date
Description of Change
100
05/03/2016
Lepton with Radiometry release
110
11/12/2016
Updates to include low gain mode feature details
200
03/21/2018
Consolidating all Lepton current configurations into one
datasheet. Older document numbers are 500-0771-01-09, 500-
0763-01-09, 500-0726-01-09.
201
04/06/2018
Corrected part number for Lepton 1.5. Minor editorial changes.
Added document number.
202
07/02/2018
Updated dimensions and weight.
203
08/28/2018
Clarified validity of scene dynamic range.
Updated EAR statement.
Clarified that THousing in telemetry is only supported for Lepton
2.5 and 3.5.
1.2 Contact Us
email:SBA[email protected]
http://www.FLIR.com
1.3 References
110-0144-04 Lepton Software Interface Description Document (pdf)
80x60 Lepton VoSPI Developer Guide (pdf)
110-0144-50 Lepton VoSPI Developers Guide (pdf) (For 160x120)
Lepton_Example_Schematic_CAD_r100.DSN (Cadence-Capture schematic CAD file)
Lepton_Example_Schematic_CAD_r100.pdf (Cadence-Capture schematic PDF file)
Lepton_Example_Schematic_CAD_r100.brd (Cadence-Allegro PCB layout CAD file)
102-PS245-75 Advanced Radiometry App Note (pdf)
Configuration
Mechanical IDD
1.5
500-0643-41.pdf
1.6
500-0690-41.pdf

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
7
2.0
500-0659-41.pdf
2.5
500-0763-41.pdf
3.0
500-0726-41.pdf
3.5
500-0771-41.pdf

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
8
Figure 1. Lepton with shutter Camera (with and without socket)
1.4 Device Overview
Lepton is an infrared camera system that integrates a fixed-focus lens assembly, an 80x60 or 160x120 long-wave
infrared (LWIR) microbolometer sensor array, and signal-processing electronics. Some configurations are also
provided with an integral shutter assembly that is used to automatically optimize image uniformity on a periodic
basis. Easy to integrate and operate, Lepton is intended for mobile devices as well as any other application
requiring very small footprint, very low power, and instant-on operation. Lepton can be operated in its default
mode or configured into other modes through a command and control interface (CCI).
Figure 1 shows a view of the Lepton with Radiometry camera as standalone and mounted in a socket.

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
9
1.5 Key Specifications
Table 1- Key Specifications
All numbers are nominal unless tolerances are specified.
Available configurations
Part number
Array format
Horizontal field of view
Shutter
Thermal radiometry
Distortion (barrel)
Scene Dynamic range3-
High gain (Low gain)
Pixel pitch
Lepton 1.5: 500-0643-00
80 x 60
50°
No
-
<8%
-10 °C to +140 °C
17 μm
Lepton 1.6: 500-0690-00
80 x 60
25°
No
-
<3%
-10 °C to +140 °C
17 μm
Lepton 2.0: 500-0659-01
80 x 60
50°
Yes
-
<8%
-10 °C to +140 °C
17 μm
Lepton 2.5: 500-0763-01
80 x 60
50°
Yes
Yes
<8%
-10 °C to +140 °C
(-10°C to 450°C)
17 μm
Lepton 3.0: 500-0726-01
160 x 120
57°
Yes
-
<13%
-10 °C to +140 °C
12 μm
Lepton 3.5: 500-0771-01
160 x 120
57°
Yes
Yes
<13%
-10 °C to +140 °C
(-10°C to 400°C)
12 μm
Overview
Sensor technology
Uncooled VOx microbolometer
Spectral range
Longwave infrared, 8 μm to 14 μm
Video scan
Progressive
Effective frame rate4
8.7 Hz (exportable)
Thermal sensitivity
<50 mK (0.050°C)
Temperature compensation
Automatic. Output image independent of camera
temperature.
3
Scene Dynamic Range is specified at room temperature and may vary over ambient temperature. It is typically somewhat
reduced at lower operating temperature.
4
Lepton 1.5, 1.6, 2.0, 2.5 stream video at 26Hz with every 3 frames repeated (effectively 8.7Hz). Lepton 3.0 and 3.5 stream
segments of the images with effectively full frames at 8.7Hz. In this document, when referring to number of frames the
frame rate 26Hz is understood.

FLIR LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
10
Output format
User-selectable 14-bit, 8-bit (AGC applied), or 24-bit RGB
(AGC and colorization applied)
Solar protection
Integral
Thermal radiometric
accuracy (Lepton 2.5 and 3.5)
-High gain mode: Greater of ±5 °C or 5% (typical)
-Low gain mode: Greater of ±10 °C or 10% (typical)
Electrical
Input clock
25-MHz nominal, CMOS IO Voltage Levels in accordance with
Electrical Specifications, page 73.
Video data interface
Video over SPI
Control port
CCI (I2C-like), CMOS IO Voltage Levels in accordance with
Electrical Specifications, page 73.
Input supply voltage
(nominal)
2.8 V, 1.2 V, 2.5 V to 3.1 V IO
Power dissipation
Nominally 150 mW at room temperature (operating), 5 mW
(standby). For 2.0, 2.5, 3.0 and 3.5 650mW during shutter
event.
Mechanical
Dimensions [mm] (w × l × h)
Lepton 1.5 (without shutter): 8.47 × 9.67 × 5.62
Lepton 1.6 (without shutter): 8.47 × 9.69 × 8.84
Lepton 2.0 (with shutter): 10.50 x 11.70 x 6.37
Lepton 2.5, 3.0, 3.5 (with shutter): 11.50 x 12.70 x 6.835
Dimensions with socket
105028-101 [mm] (w × l × h)
Lepton 1.5 (without shutter): 10.78 × 10.60 × 5.92
Lepton 1.6 (without shutter): 10.78 × 10.60 × 9.15
Lepton 2.0 (with shutter): 10.78 x 11.70 x 6.68
Lepton 2.5, 3.0, 3.5 (with shutter): 11.50 x 12.70 x 7.14
Weight (typical)
Lepton 1.5, 2.0: 0.68 grams
Lepton 2.5: 1.02 grams
Lepton 3.0, 3.5: 0.91 grams
Environmental
Camera operating
temperature range
Lepton 1.5, 1.6, 2.0, 2.5, 2.0, 3.5: -10 °C to +80 °C
Lepton 2.0, 3.0: Shutter operation limited to -10 °C to +65 °C
Non-operating temperature
range
-40 °C to +80 °C
Shock
1500 G @ 0.4 ms