Freescale Semiconductor Energy Efficient Solutions Xtrinsic MMA8452Q Instruction Manual

Freescale Semiconductor Document Number: MMA8452Q
Data Sheet: Technical Data Rev. 9, 07/2014
An Energy Efficient Solution by Freescale
© 2010-2014 Freescale Semiconductor, Inc. All rights reserved.
Xtrinsic MMA8452Q 3-Axis,
12-bit/8-bit Digital Accelerometer
The MMA8452Q isasmart,low-power,three-axis, capacitive,micromachined
accelerometer with 12 bitsofresolution.This accelerometeris packedwith
embedded functions with flexible user programmable options, configurable to two
interruptpins.Embeddedinterruptfunctions allowfor overallpower savings
relieving the host processor from continuously polling data.
The MMA8452Q has user selectable full scales of ±2g/±4g/±8g with high-pass
filter filtered data as well as non-filtered data available real-time. The device can
be configured to generate inertial wakeup interrupt signals from any combination
of the configurable embedded functions allowing the MMA8452Q to monitor
events and remain in a low power mode during periods of inactivity. The
MMA8452Q is available in a 3 mm x 3 mm x 1 mm QFN package.
Features
• 1.95V to 3.6V supply voltage
• 1.6V to 3.6V interface voltage
• ±2g/±4g/±8g dynamically selectable full-scale
• Output Data Rates (ODR) from 1.56 Hz to 800 Hz
• 99 μg/√Hz noise
• 12-bit and 8-bit digital output
•I
2Cdigital output interface
• Two programmable interrupt pins for six interrupt sources
• Three embedded channels of motion detection
— Freefall or Motion Detection: 1 channel
— Pulse Detection: 1 channel
— Transient Detection: 1 channel
– Orientation (Portrait/Landscape) detection with set hysteresis
– Automatic ODR change for Auto-WAKE and return to SLEEP
– High-Pass Filter Data available real-time
–Self-Test
– RoHS compliant
– Current Consumption: 6 μA to 165 μA
Typical Applications
• E-Compass applications
• Static orientation detection (Portrait/Landscape, Up/Down, Left/Right, Back/
Front position identification)
• Notebook, e-reader, and Laptop Tumble and Freefall Detection
• Real-time orientation detection (virtual reality and gaming 3D user position feedback)
• Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)
• Motion detection for portable product power saving (Auto-SLEEP and Auto-WAKE for cell phone, PDA, GPS, gaming)
• Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)
•User interface (menu scrolling by orientation change, pulse detection for button replacement)
ORDERING INFORMATION
Part Number Temperature Range Package Description Shipping
MMA8452QT -40°C to +85°C QFN-16 Tray
MMA8452QR1 -40°C to +85°C QFN-16 Tape and Reel
MMA8452Q
16 PIN QFN
3 mm x 3 mm x 1 mm
CASE 2077-02
Top and Bottom View
Top View
Pin Connections
1
2
3
4
59
10
11
12
13
141516
876
NC
VDD
NC
VDDIO
BYP
DNC
SCL
GND
NC
GND
INT1
GND
INT2
SA0
NC
SDA

MMA8452Q
Sensors
2Freescale Semiconductor, Inc.
Related Documentation
The MMA8452Q device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at: http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MMA8452Q.
3. In the Refine Your Result pane on the left, click on the Documentation link.
Contents
1 Block Diagram and Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Mechanical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Zero-g Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 System Modes (SYSMOD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Device Calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.2 8-bit or 12-bit Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.3 Low-Power Modes vs. High-Resolution Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Auto-WAKE/SLEEP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5 Freefall and Motion Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.6 Transient Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.7 Pulse Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.8 Orientation Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.9 Interrupt Register Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.10 Serial I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2 Portrait/ Landscape Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.3 Motion and Freefall Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.4 Transient (HPF) Acceleration Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.5 Single, Double and Directional Pulse-Detection Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.6 Auto-WAKE/SLEEP Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.7 Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.8 User Offset Correction Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7 Printed Circuit Board Layout and Device Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.1 Printed Circuit Board Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.2 Overview of Soldering Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.3 Halogen Content. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.1 Product identification markings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.2 Tape and reel information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.3 Package Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

MMA8452Q
Sensors
Freescale Semiconductor, Inc. 3
1 Block Diagram and Pin Description
Figure 1. Block Diagram
Figure 2. Direction of the Detectable Accelerations
12-bit SDA
SCL
I2C
Embedded
DSP
Functions
C to V
Internal
OSC Clock
GEN
ADC
Converter
VDDIO
VSS
X-axis
Transducer
Y-axis
Transducer
Z-axis
Transducer
Freefall
and Motion
Detection
Transient
Detection
(i.e., fast motion,
transient)
Orientation with
Set Hysteresis
and Z-lockout
Shake Detection
through
Motion
Threshold
Auto-WAKE/Auto-SLEEP Configurable with debounce counter and multiple motion interrupts for control
Auto-WAKE/SLEEP ACTIVE Mode
SLEEP
VDD
INT1
INT2
ACTIVE Mode
WAKE
Single, Double
and Directional
Tap Detection
MODE Options
Low Power
Low Noise + Low Power
High Resolution
Normal
MODE Options
Low Power
Low Noise + Low Power
High Resolution
Normal
1
DIRECTION OF THE
DETECTABLE ACCELERATIONS
(BOTTOM VIEW)
5
9
13
X
Y
Z
1
(TOP VIEW)
Earth Gravity

MMA8452Q
Sensors
4Freescale Semiconductor, Inc.
Figure 3 shows the device configuration in the six different orientation modes. These orientations are defined as the following:
PU = Portrait Up, LR = Landscape Right, PD = Portrait Down, LL = Landscape Left, BACK and FRONT side views. There are
several registers to configure the orientation detection and are described in detail in the register setting section.
Figure 3. Landscape/Portrait Orientation
Figure 4. Application Diagram
Top View
PU
Earth Gravity
Pin 1
Xout @ 0g
Yout @ -1g
Zout @ 0g
Xout @ 1g
Yout @ 0g
Zout @ 0g
Xout @ 0g
Yout @ 1g
Zout @ 0g
Xout @ -1g
Yout @ 0g
Zout @ 0g
LL
PD
LR Side View
FRONT
Xout @ 0g
Yout @ 0g
Zout @ 1g
BACK
Xout @ 0g
Yout @ 0g
Zout @ -1g
0.1μF
1.6V-3.6V
VDDIO
VDDIO
VDDIO
4.7kΩ4.7kΩ
1
GND
VDDIO
SCL
NC
INT2
INT1
GND
GND
SDA
SA0
VDD
NC
NC
NC
BYP
NC
MMA8452Q
2
16
12
13
1415
11
10
3
4
5
678
9
4.7μF
INT1
INT2
SA0
0.1μF
1.95V - 3.6V
VDD
SCL
SDA
DNC

MMA8452Q
Sensors
Freescale Semiconductor, Inc. 5
The device power is supplied through VDD line. Power supply decoupling capacitors (100 nF ceramic plus 4.7 µF bulk, or a
single 4.7 µF ceramic) should be placed as near as possible to the pins 1 and 14 of the device.
The control signals SCL, SDA, and SA0 are not tolerant of voltages more than VDDIO + 0.3V. If VDDIO is removed, the control
signals SCL, SDA, and SA0 will clamp any logic signals with their internal ESD protection diodes.
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) are user programmable through the I2C
interface. The SDA and SCL I2C connections are open drain and therefore require a pullup resistor as shown in the application
diagram in Figure 4.
1.1 Soldering Information
The QFN package is compliant with the RoHS standard. Please refer to AN4077.
Table 1. Pin Descriptions
Pin # Pin Name Description
1 VDDIO Internal Power Supply (1.62V - 3.6V)
2 BYP Bypass capacitor (0.1 μF)
3 DNC Do not connect to anything, leave pin isolated and floating.
4SCL
I2C Serial Clock, open drain
5 GND Connect to Ground
6SDA
I2C Serial Data
7SA0
I2C Least Significant Bit of the Device I2C Address, I2C 7-bit address = 0x1C (SA0=0), 0x1D (SA0=1).
8 NC Internally not connected
9 INT2 Inertial Interrupt 2, output pin
10 GND Connect to Ground
11 INT1 Inertial Interrupt 1, output pin
12 GND Connect to Ground
13 NC Internally not connected
14 VDD Power Supply (1.95 V to 3.6 V)
15 NC Internally not connected
16 NC Internally not connected (can be GND or VDD)

MMA8452Q
Sensors
6Freescale Semiconductor, Inc.
2 Mechanical and Electrical Specifications
2.1 Mechanical Characteristics
Table 2. Mechanical Characteristics @ VDD = 2.5V, VDDIO = 1.8V, T = 25°C unless otherwise noted.
Parameter Test Conditions Symbol Min Typ Max Unit
Measurement Range(1)
1. Dynamic Range is limited to 4g when the Low-Noise bit in Register 0x2A, bit 2 is set.
FS[1:0] set to 00
2g Mode
FS
±2
g
FS[1:0] set to 01
4g Mode ±4
FS[1:0] set to 10
8g Mode ±8
Sensitivity
FS[1:0] set to 00
2g Mode
So
1024
counts/g
FS[1:0] set to 01
4g Mode 512
FS[1:0] set to 10
8g Mode 256
Sensitivity Accuracy(2)
2. Sensitivity remains in spec as stated, but changing Oversampling mode to Low Power causes 3% sensitivity shift. This behavior is also seen
when changing from 800 Hz to any other data rate in the Normal, Low Noise + Low Power or High Resolution mode.
Soa ±2.64 %
Sensitivity Change vs. Temperature
FS[1:0] set to 00
2g Mode
TCSo ±0.008 %/°C
FS[1:0] set to 01
4g Mode
FS[1:0] set to 10
8g Mode
Zero-g Level Offset Accuracy(3)
3. Before board mount.
FS[1:0] 2g, 4g, 8g TyOff ±17 mg
Zero-g Level Offset Accuracy Post Board Mount(4)
4. Post Board Mount Offset Specifications are based on an 8 Layer PCB, relative to 25°C.
FS[1:0] 2g, 4g, 8g TyOffPBM ±20 mg
Zero-g Level Change vs. Temperature -40°C to 85°C TCOff ±0.15 mg/°C
Self-Test Output Change(5)
X
Y
Z
5. Self-Test is one direction only.
FS[1:0] set to 0
4g Mode Vst +44 +61
+392
LSB
ODR Accuracy
2 MHz Clock ±2 %
Output Data Bandwidth BW ODR/3 ODR/2 Hz
Output Noise Normal Mode ODR = 400 Hz Noise 126 µg/√Hz
Output Noise Low-Noise Mode(1) Normal Mode ODR = 400 Hz Noise 99 µg/√Hz
Operating Temperature Range Top -40 +85 °C

MMA8452Q
Sensors
Freescale Semiconductor, Inc. 7
2.2 Electrical Characteristics
Table 3. Electrical Characteristics @ VDD = 2.5V, VDDIO = 1.8V, T = 25°C unless otherwise noted.
Parameter Test Conditions Symbol Min Typ Max Unit
Supply Voltage VDD(1)
1. There is no requirement for power supply sequencing. The VDDIO input voltage can be higher than the VDD input voltage.
1.95 2.5 3.6 V
Interface Supply Voltage VDDIO(1) 1.62 1.8 3.6 V
Low-Power Mode
ODR = 1.56 Hz
IddLP
6
μA
ODR = 6.25 Hz 6
ODR = 12.5 Hz 6
ODR = 50 Hz 14
ODR = 100 Hz 24
ODR = 200 Hz 44
ODR = 400 Hz 85
ODR = 800 Hz 165
Normal Mode
ODR = 1.56 Hz
Idd
24
μA
ODR = 6.25 Hz 24
ODR = 12.5 Hz 24
ODR = 50 Hz 24
ODR = 100 Hz 44
ODR = 200 Hz 85
ODR = 400 Hz 165
ODR = 800 Hz 165
CurrentduringBoot Sequence, 0.5 mSec max
duration using recommended Bypass Cap VDD = 2.5V Idd Boot 1mA
Value of Capacitor on BYP Pin -40°C 85°C Cap 75 100 470 nF
STANDBY Mode Current @ 25°C VDD = 2.5V, VDDIO = 1.8V
STANDBY Mode IddStby 1.8 5 μA
Digital High Level Input Voltage
SCL, SDA, SA0 VIH 0.7*VDDIO V
Digital Low-Level Input Voltage
SCL, SDA, SA0 VIL 0.3*VDDIO V
High Level Output Voltage
INT1, INT2 IO= 500 μA VOH 0.9*VDDIO V
Low-Level Output Voltage
INT1, INT2 IO= 500 μA VOL 0.1*VDDIO V
Low-Level Output Voltage
SDA IO= 500 μA VOLS 0.1*VDDIO V
Power on Ramp Time 0.001 1000 ms
Boot time Time from VDDIO on and
VDD > VDD min until I2C is ready
for operation, Cbyp = 100 nF Tbt 350 500 µs
Turn-on time(2)
2. Note the first sample is typically not very precise. Depending on ODR/MODS setting, a minimum of three samples is recommended for full
precision.
Time to obtain valid data from
STANDBY mode to ACTIVE mode. Ton1 2/ODR + 1 ms s
Turn-on time Time to obtain valid data from valid
voltage applied. Ton2 2/ODR + 2 ms
Operating Temperature Range Top -40 +85 °C

MMA8452Q
Sensors
8Freescale Semiconductor, Inc.
2.3 I2C interface characteristics
Figure 5. I2C slave timing diagram
Table 4. I2C slave timing values(1)
1.All values referred to VIH(min) (0.3VDD) and VIL(max) (0.7VDD) levels.
Parameter Symbol I2C Fast Mode Unit
Min Max
SCL clock frequency fSCL 0 400 kHz
Bus-free time between STOP and START condition tBUF 1.3 μs
(Repeated) START hold time tHD;STA 0.6 μs
Repeated START setup time tSU;STA 0.6 μs
STOP condition setup time tSU;STO 0.6 μs
SDA data hold time tHD;DAT 0.05 0.9 (2)
2.This device does not stretch the LOW period (tLOW) of the SCL signal.
μs
SDA setup time tSU;DAT 100 ns
SCL clock low time tLOW 1.3 μs
SCL clock high time tHIGH 0.6 μs
SDA and SCL rise time tr20 + 0.1 Cb(3)
3.Cb= total capacitance of one bus line in pF.
300 ns
SDA and SCL fall time tf20 + 0.1 Cb(3) 300 ns
SDA valid time (4)
4.tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
tVD;DAT 0.9(2) μs
SDA valid acknowledge time (5)
5.tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
tVD;ACK 0.9(2) μs
Pulse width of spikes on SDA and SCL that must be suppressed by
internal input filter tSP 050ns
Capacitive load for each bus line Cb 400 pF
VIL = 0.3VDD
VIH = 0.7VDD

MMA8452Q
Sensors
Freescale Semiconductor, Inc. 9
2.4 Absolute Maximum Ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Exposure to
maximum rating conditions for extended periods may affect device reliability.
3 Terminology
3.1 Sensitivity
The sensitivity is represented in counts/g. In 2g mode the sensitivity is 1024 counts/g. In 4g mode the sensitivity is
512 counts/g and in 8g mode the sensitivity is 256 counts/g.
3.2 Zero-g Offset
Zero-gOffset (TyOff)describesthedeviationof anactualoutputsignal from the ideal output signal if the sensor is stationary. A
sensorstationaryonahorizontalsurfacewill measure0ginX-axis and0g in Y-axiswhereas theZ-axiswill measure1g. The output
is ideally in the middle of the dynamic range of the sensor (content of OUT Registers 0x00, data expressed as 2's complement
number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress on the MEMS
sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to
extensive mechanical stress.
3.3 Self-Test
Self-Test checksthetransducerfunctionalitywithout externalmechanicalstimulus. WhenSelf-Test isactivated,an electrostatic
actuation force is applied to the sensor, simulating a small acceleration. In this case, the sensor outputs will exhibit a change in
their DC levels which are related to the selected full scale through the device sensitivity. When Self-Test is activated, the device
outputlevel isgiven bythealgebraicsumof the signalsproduced bythe accelerationacting onthe sensorand bythe electrostatic
test-force.
Table 5. Maximum Ratings
Rating Symbol Value Unit
Maximum Acceleration (all axes, 100 μs) gmax 5,000 g
Supply Voltage VDD -0.3 to + 3.6 V
Input voltage on any control pin (SA0, SCL, SDA) Vin -0.3 to VDDIO + 0.3 V
Drop Test Ddrop 1.8 m
Operating Temperature Range TOP -40 to +85 °C
Storage Temperature Range TSTG -40 to +125 °C
Table 6. ESD and Latchup Protection Characteristics
Rating Symbol Value Unit
Human Body Model HBM ±2000 V
Machine Model MM ±200 V
Charge Device Model CDM ±500 V
Latchup Current at T = 85°C —±100 mA
This device is sensitive to mechanical shock. Improper handling can cause permanent damage of the part or
cause the part to otherwise fail.
This device is sensitive to ESD, improper handling can cause permanent damage to the part.

MMA8452Q
Sensors
10 Freescale Semiconductor, Inc.
4 System Modes (SYSMOD)
Figure 6. MMA8451Q Mode Transition Diagram
All register contents are preserved when transitioning from ACTIVE to STANDBY mode. Some registers are reset when
transitioning from STANDBY to ACTIVE. These are all noted in the device memory map register table. The SLEEP and WAKE
modes are ACTIVE modes. For more information on how to use the SLEEP and WAKE modes and how to transition between
these modes, please refer to the functionality section of this document.
Table 7. Mode of Operation Description
Mode I2C Bus State VDD Function Description
OFF Powered Down <1.8V
VDDIO Can be > VDD
• The device is powered off.
• All analog and digital blocks are shutdown.
•I
2C bus inhibited.
STANDBY I2C communication is possible >1.8V
• Only digital blocks are enabled.
Analog subsystem is disabled.
• Internal clocks disabled.
• Registers accessible for Read/Write.
• Device is configured in STANDBY mode.
ACTIVE
(WAKE/SLEEP) I2C communication is possible >1.8V • All blocks are enabled (digital, analog).
OFF
WAKESTANDBY
OFF
ACTIVE
SYSMOD = 00
SYSMOD = 10
SYSMOD = 01
Auto SLEEP/WAKE
Condition
VDD > 1.8 V
VDD < 1.8 V
CTRL_REG1
Active bit = 1
CTRL_REG1
Active bit = 0
CTRL_REG1
Active bit = 0