Contents
About This Document.....................................................................................................................v
1 Overview.........................................................................................................................................7
1.1 Product Overview.........................................................................................................................................................7
1.2 Product Features ...........................................................................................................................................................8
2 System Architechture .................................................................................................................10
2.1 Three-Bus Architecture...............................................................................................................................................10
2.2 Heat Dissipation System.............................................................................................................................................11
2.3 Power Supply System.................................................................................................................................................13
2.4 Management System...................................................................................................................................................16
2.5 Networking Solution...................................................................................................................................................17
3 Hardware Description................................................................................................................19
3.1 Cabinet........................................................................................................................................................................20
3.2 Management Module..................................................................................................................................................21
3.2.1 RM210.....................................................................................................................................................................21
3.3 Server Node................................................................................................................................................................22
3.3.1 DH141C V5.............................................................................................................................................................22
3.4 Switching Node ..........................................................................................................................................................23
3.4.1 Out-of Band Management Switching Node.............................................................................................................23
3.4.2 Service Switching Node...........................................................................................................................................23
3.5 Network Interface Card (NIC)....................................................................................................................................24
3.5.1 Ethernet NICs ..........................................................................................................................................................24
3.6 Power Supply..............................................................................................................................................................25
3.6.1 Power Shelf..............................................................................................................................................................25
3.6.2 PSU..........................................................................................................................................................................27
3.6.3 PDU .........................................................................................................................................................................29
3.7 Leakage Detection Modules .......................................................................................................................................32
3.7.1 Photoelectric Leakage Sensor..................................................................................................................................32
3.7.2 Liquid Leakage Detection on the Secondary Loop..................................................................................................33
4 Specifications...............................................................................................................................34
4.1 Technical Specifications .............................................................................................................................................34
4.2 Environmental Specifications.....................................................................................................................................35