Fusion FusionServer XH628 V5 User manual

FusionServer XH628 V5 Server Node
Technical White Paper
Issue
05
Date
2023-02-28
xFusion Digital Technologies Co., Ltd.

2023-02-28
ii
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xFusion Digital Technologies Co., Ltd.
Address:
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Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website:
https://www.xfusion.com

FusionServer XH628 V5 Server Node
Technical White Paper
Contents
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Contents
About This Document........................................................................................................v
1 Production Introduction.................................................................................................7
2 Features...........................................................................................................................8
3 Physical Structure ........................................................................................................11
4 Logical Structure ..........................................................................................................14
5 Hardware Description...................................................................................................15
5.1 Front Panel...........................................................................................................................................15
5.1.1 Appearance .......................................................................................................................................15
5.1.2 Indicators and Buttons........................................................................................................................17
5.1.3 Ports..................................................................................................................................................21
5.1.4 Installation Positions...........................................................................................................................23
5.2 Processors............................................................................................................................................24
5.3 Memory.................................................................................................................................................25
5.3.1 DDR4 Memory...................................................................................................................................25
5.3.1.1 Memory Identifier ............................................................................................................................25
5.3.1.2 Memory Subsystem Architecture .....................................................................................................26
5.3.1.3 Memory Compatibility......................................................................................................................26
5.3.1.4 DIMM Installation Rules...................................................................................................................28
5.3.1.5 Memory Installation Positions..........................................................................................................29
5.3.1.6 Memory Protection Technologies.....................................................................................................30
5.4 Storage.................................................................................................................................................30
5.4.1 Drive Configuration ............................................................................................................................30
5.4.2 Drive Numbering................................................................................................................................31
5.4.3 Drive indicators..................................................................................................................................35
5.4.4 RAID Controller Card .........................................................................................................................37
5.5 Network ................................................................................................................................................37
5.5.1 LOMs.................................................................................................................................................37
5.6 I/O Expansion .......................................................................................................................................42
5.6.1 PCIe Cards........................................................................................................................................42
5.6.2 PCIe Slots..........................................................................................................................................42
5.6.3 PCIe Slot Description.........................................................................................................................44

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5.7 Boards..................................................................................................................................................45
5.7.1 Mainboard..........................................................................................................................................45
6 Product Specifications.................................................................................................47
6.1 Technical Specifications ........................................................................................................................47
6.2 Environmental Specifications.................................................................................................................50
6.3 Physical Specifications..........................................................................................................................52
7 Software and Hardware Compatibility.........................................................................53
8 Safety Instructions........................................................................................................54
8.1 Security.................................................................................................................................................54
8.2 Maintenance and Warranty....................................................................................................................57
9 System Management ....................................................................................................58
AAppendix.......................................................................................................................60
B Glossary........................................................................................................................73
C Acronyms and Abbreviations......................................................................................76

FusionServer XH628 V5 Server Node
Technical White Paper
About This Document
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About This Document
Purpose
This document describes the FusionServer XH628 V5 server node in terms of
features, structure, specifications, and component hardware and software
compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol
Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.

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Technical White Paper
About This Document
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Change History
Issue
Date
Description
05
2023-02-28
Added A.4 Sensor List.
04
2022-11-11
Updated 8.1 Security.
03
2022-08-12
⚫Optimized 6.3 Physical Specifications .
⚫Added A.1 Node Label.
02
2022-06-25
⚫Added a figure that shows how to measure
dimensions.
⚫Updated 5.4.1 Drive Configuration and 5.4.2
Drive Numbering.
01
2021-12-20
This issue is the first official release.

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1 Production Introduction
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1 Production Introduction
The FusionServer XH628 V5 (XH628 V5) is a server node designed for X6800
servers. An X6800 can house up to four XH628 V5 server nodes in a 4U chassis.
The XH628 V5 delivers supreme performance and high storage density in limited
space through innovative design. It is easy to manage and maintain.
The XH628 V5 can be configured with 12 3.5-inch or 2.5-inch drives through the HDD
drawer, up to 16 DDR4 memory modules, and four PCIe standard cards.
The XH628 V5 is ideal for data center, cloud computing, Big Data, and Internet
applications.
Figure 1-1 XH628 V5

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2 Features
Performance and Scalability
⚫Powered by two Intel®Xeon®Scalable Skylake or Cascade Lake processors, the
server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and two
10.4 GT/s UPI links between the processors, which deliver supreme processing
performance.
−It supports two processors with 56 cores and 88 threads to maximize the
concurrent execution of multithreaded applications.
−An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and
at least 1.375 MB of L3 cache.
−Intel Turbo Boost Technology 2.0 allows processor cores to run faster than
the frequency specified in the Thermal Design Power (TDP) configuration if
they are operating below power, current, and temperature specification
limits.
−Intel Hyper-Threading Technology enables each processor core to run up to
two threads, improving parallel computation capability.
−The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address
virtualization workloads.
−Intel®Advanced Vector Extensions (Intel AVX 2.0 and Intel AVX-512)
significantly accelerate floating-point performance for computing-intensive
applications.
−The Cascade Lake processors support Intel® Deep Learning Boost vector
neural network instructions (VNNI) to improve the performance of deep
learning applications.
⚫The 1.2 V DDR4 memory modules consume 20% less power than 1.35 V DDR3L
memory modules used by the previous-generation platform.
⚫The server node supports double data rate 4 (DDR4) registered dual in-line
memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error
checking and correcting (ECC). Aserver node fully configured with sixteen 2933
MT/s memorymodules (only available with Cascade Lake processors) provides 2
TB memory space and the maximum theoretical memory bandwidth of 274.97
GB/s.
⚫With Intel integrated I/O, the Intel®Xeon®Scalable processors integrate the PCIe
3.0 controller to shortens I/O latency and improve overall system performance.

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⚫It supports 12 SATA/SAS HDDs or SSDs. The SSDs deliver higher I/O
performance than HDDs. An SSD supports approximately 100 times more I/O
operations per second (IOPS) than a typical HDD.
⚫Four half-height half-length (HHHL) PCIe SSD cards can be configured to
support high-bandwidth low-delay data access.
Availability and Serviceability
⚫Carrier-class components with process expertise ensure high system reliability
and availability.
⚫The server node supports twelve 2.5-inch or 3.5-inch hot-swappable drives. It
supports RAID 0, 1, 1E, 5, 6, 10, 50, and 60, depending on the RAID controller
card used. It also uses a supercapacitor to protect the RAID cache data against
power failures.
⚫The server provides simplified O&M and efficient troubleshooting through the
UID/HLYLED indicators on the front panel, fault diagnosis LED, and iBMC
WebUI.
⚫The SSDs offer better reliability than HDDs, ensuring continued system
performance.
⚫The iBMC monitors system parameters in real time, triggers alarms, and
performs recovery actions in case of failures, minimizing system downtime.
⚫For more information about the warranty in the Chinese market, see Warranty.
Manageability and Security
⚫The built-in iBMC monitors server operating status and provides remote
management.
⚫The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
⚫The Advanced Encryption Standard–New Instruction (AES NI) algorithm allows
faster and stronger encryption.
⚫Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer
overflow attacks when working with a supported OS.
⚫The Network Controller Sideband Interface (NC-SI) allows a network port to
serve as a management port and a service port for maximized return on
investment (ROI) for customers. The NC-SI feature is disabled by default and can
be enabled through the iBMC or BIOS.
⚫The trusted platform module (TPM) 2.0 provides advanced encryption functions,
such as digital signatures and remote authentication.
The service port with NC-SI enabled supports the following configuration:
⚫Configuring the LOM port (NIC Mezz) of the server as the service port with NC-SI enabled.
LOM port 1 is configured by default.
⚫Enabling, disabling, and setting avirtual local area network (VLAN) ID for this port. The VLAN
ID is 0and disabled by default.
⚫Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses
(IPv6 address, prefix length, and gateway) for this port.

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Energy Efficiency
⚫The Intel® Xeon® Scalable processors outperform the previous-generation
processors while fitting into the same TDP.
⚫Efficient voltage regulator-down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
⚫Intel® Intelligent Power Capability allows a processor to be powered on or off
based on requirements.
⚫Low-voltage Intel®Xeon®Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
⚫Staggered spin-up for drives reduces the server boot power consumption.
⚫The 1.2 V DDR4 RDIMMs consume 20% less energy than 1.5 V DDR3 RDIMMs.
⚫SSDs consume 80% less power than HDDs.
⚫The server supports intelligent frequency scaling of processors for energy
conservation and consumption reduction.
⚫The quadrilateral ventilation holes on the node panel provide higher ventilation
density than round holes, increasing the system cooling efficiency.

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3 Physical Structure
⚫2 x 2.5" drive configuration
Figure 3-1 XH628 V5 physical structure
1
Front drives
2
Front-drive backplane
3
Server node case
4
DIMMs
5
Screw-in RAID controller
card
6
Mainboard
7
Processors
8
Heat sinks

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9
Vertical adapter
10
Horizontal adapter
11
TPM
12
Drives in a drawer
13
10-drive backplane for the
drive drawer
14
2-drive backplane for the
drive drawer
15
Drive drawer enclosure
-
-
⚫XH628 V5 with two HHHL PCIe cards
Figure 3-2 XH628 V5 physical structure
1
Front PCIe card bracket
2
Riser card
3
Front HHHL PCIe card
4
Server node case
5
Memory modules
6
RAID controller card
7
Mainboard
8
Processors

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9
Heat sinks
10
Vertical adapter
11
Horizontal adapter
12
TPM
13
Drives in a drawer
14
10-drive backplane for the
drive drawer
15
2-drive backplane for the
drive drawer
16
Drive drawer enclosure

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4 Logical Structure
Figure 4-1 XH628 V5 logical structure
⚫The server supports two Intel®Xeon®Scalable processors.
⚫The server supports up to 16 memory modules.
⚫The CPUs (processors) interconnect with each other through two UPI links at a
speed of up to 10.4 GT/s.
⚫The PCIe cards connected to the processors provide service ports.
⚫The storage module, consisting of a RAID controller card and a 12-HDD
backplane, connects to the processors through PCIe bus.
⚫The BMC chipset interconnects with the PCH through PCIe and LPC buses to
provide a management interface.
⚫The BMC integrates the graphics card, video compression, and virtual media
component to provide device management functions, such as power control, slot
ID acquisition, power supply detection, and KVM over IP.

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5 Hardware Description
5.1 Front Panel
5.2 Processors
5.3 Memory
5.4 Storage
5.5 Network
5.6 I/O Expansion
5.7 Boards
5.1 Front Panel
5.1.1 Appearance
⚫2 x 2.5" drive configuration

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Figure 5-1 Front view
1
Drives
2
Ejector lever
3
Ejector release latch
4
Slide-out label plate (with
an SN label)
5
Drive drawer
6
Drive drawer latch
7
Drive drawer handle
-
-
⚫2 x HHHL PCIe card configuration

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Figure 5-2 Front view
1
Standard PCIe card
2
Ejector lever
3
Ejector release latch
4
Slide-out label plate (with
an SN label)
5
Drive drawer
6
Drive drawer latch
7
Drive drawer handle
-
-
5.1.2 Indicators and Buttons
Indicator and Button Positions
⚫2 x 2.5" drive configuration

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Figure 5-3 Indicators and buttons on the front panel
1
LOM port indicator
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
LOM port indicator
6
Management network port
data transmission status
indicator
7
Management network port
connection status indicator
-
-
⚫2 x HHHL PCIe card configuration

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Figure 5-4 Indicators and buttons on the front panel
1
LOM port indicator
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
LOM port indicator
6
Management network port
data transmission status
indicator
7
Management network port
connection status indicator
8
Network port activity
indicator
9
Network port link indicator
-
-
Indicator and Button Descriptions
Table 5-1 Indicators and buttons on the front panel
Silkscreen
Indicator/Butt
on
Description
-
LOM port
indicator
For details, see 5.5.1 LOMs .
Power
button/indicato
Power indicator:
⚫Off: The device is not powered on.

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Silkscreen
Indicator/Butt
on
Description
r
⚫Steady green: The device is powered on.
⚫Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is steady
yellow.
⚫Steady yellow: The device is standby.
Power button:
⚫When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the OS
as prompted.
⚫When the device is powered on, holding down
this button for 6 seconds will forcibly power off
the device.
⚫When the power indicator is steady yellow,
you can press this button to power on the
device.
HLY
Health status
indicator
⚫Off: The device is powered off or is faulty.
⚫Blinking red at 1 Hz: A major alarm has been
generated on the system.
⚫Blinking red at 5 Hz: A critical alarm has been
generated on the system.
⚫Steady green: The device is operating
properly.
UID
button/indicato
r
The UID button/indicator helps identify and
locate a device.
UID indicator:
⚫Off: The device is not being located.
⚫Blinking or steady blue: The device is being
located.
UID button description:
⚫You can control the UID indicator status by
pressing the UID button or using the iBMC.
⚫You can press this button to turn on or off the
UID indicator.
⚫You can press and hold down this button for 4
to 6 seconds to reset the iBMC.
-
Management
network port
data
transmission
status
⚫Off: No data is being transmitted.
⚫Blinking yellow: Data is being transmitted.