Contents
Contents
Preface.................................................................................................................................................................... I
1 GR551x Overview................................................................................................................................................1
1.1 Features............................................................................................................................................................... 1
1.2 Block Diagram......................................................................................................................................................3
2 Pinout................................................................................................................................................................. 5
2.1 GR5515IGND QFN56............................................................................................................................................5
2.2 GR5515I0ND QFN56............................................................................................................................................ 8
2.3 GR5515RGBD BGA68 (NRND)............................................................................................................................12
2.4 GR5515GGBD BGA55.........................................................................................................................................15
2.5 GR5513BEND QFN40......................................................................................................................................... 18
3 Minimal Design for GR551x SoC........................................................................................................................22
3.1 Schematic Design Guideline.............................................................................................................................. 22
3.1.1 Power Supply............................................................................................................................................ 22
3.1.1.1 Introduction......................................................................................................................................22
3.1.1.2 Power Supply Scheme......................................................................................................................23
3.1.1.3 I/O LDO.............................................................................................................................................25
3.1.2 Clock..........................................................................................................................................................27
3.1.2.1 Introduction......................................................................................................................................27
3.1.2.2 32 MHz Clock (XO)........................................................................................................................... 27
3.1.2.3 32.768 kHz Clock..............................................................................................................................28
3.1.3 RF.............................................................................................................................................................. 29
3.1.3.1 Introduction......................................................................................................................................29
3.1.3.2 RF Scheme........................................................................................................................................29
3.1.4 I/O Pins..................................................................................................................................................... 30
3.1.5 SWD Interfaces..........................................................................................................................................30
3.1.6 External Flash............................................................................................................................................31
3.2 PCB Design and Layout Guideline..................................................................................................................... 31
3.2.1 PCB Layer Stackup.................................................................................................................................... 32
3.2.2 Components Layout.................................................................................................................................. 32
3.2.3 Power Supply............................................................................................................................................ 33
3.2.3.1 DC-DC Switching Regulator.............................................................................................................. 33
3.2.3.2 RF Input Power Supply.....................................................................................................................34
3.2.4 Clock..........................................................................................................................................................35
3.2.5 RFIO Port...................................................................................................................................................36
3.2.6 Grounding................................................................................................................................................. 37
3.2.7 ESD Protection Design.............................................................................................................................. 37
3.2.7.1 System-level ESD Design.................................................................................................................. 38
3.2.7.2 ESD Considerations in Production, Transport, and Debugging........................................................ 43
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