GOSUNCN WeLink ME3616 User manual

HARDWARE DEVELOPMENT GUIDE
ME3616
Version: V1.2
Date: 2018-05-29
NB-IoT Module
Website: www.gosuncnwelink.com
E-mail: [e-mail]

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Hardware Development Guide
ME3616
REVISION HISTORY
Version
Release Date
Type of Revision
1.0
2018-04-13
First version
1.1
2018-04-30
Update the format of document
1.2
2018-05-29
Update PID information and the test data.
ABOUT THIS DOCUMENT
A. Application Range
This document is the Product Technical Specification for the ME3616 NB-IoT module. It defines the high level product features
and illustrates the interface for these features. This document is intended to cover the hardware aspects of the product, including
electrical and mechanical.
B. Reading Note
The symbols below are the reading notes you should pay attention on:
: WARNING or ATTENTION : NOTE or REMARK
C. Purpose
This document provides the hardware solutions and development fundamentals for a product with the module. By reading this
document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this
document, the user can successfully fulfill the application and development of wireless Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests and related
testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design
reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality.
D. Abbreviations
Table below is a list of abbreviations involved in this document, as well as the English full names.
Abbreviations
Full Name
3GPP
Third Generation Partnership Project
AP
Another name of DTE
CHAP
Challenge Handshake Authentication Protocol
CE
European Conformity
CMOS
Complementary Metal Oxide Semiconductor
DCE
Data Communication Equipment
DL
Downlink

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Hardware Development Guide
ME3616
DTE
Data Terminal Equipment
EIA
Electronic Industries Association
EMC
Electromagnetic Compatibility
ESD
Electro-Static discharge
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplex
GPIO
General-purpose I/O
LCC
Leadless Chip Carrier
LDO
Low-Dropout
LED
Light Emitting Diode
LTE
Long Term Evolution
ME
Mobile Equipment
MO
Mobile Origination Call
MT
Mobile Termination Call
MSB
Most Significant Bit
PC
Personal Computer
PCB
Printed Circuit Board
PDA
Personal Digital Assistant
PDU
Protocol Data Unit
PAP
Password Authentication Protocol
PPP
Point to Point Protocol
RTC
Real Time Clock
SMS
Short Messaging Service
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
TBD
To Be Determined
TCP
Transmission Control Protocol
TIS
Total Isotropic Sensitivity
TRP
Total Radiated Power
TVS
Transient Voltage Suppressor
UART
Universal Asynchronous Receiver-Transmitter
UDP
User Datagram Protocol
UL
Up Link
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
URC
Unsolicited result code
VIH
Logic High level of input voltage
VIL
Logic Low level of input voltage
VOH
Logic High level of output voltage
VOL
Logic Low level of output voltage

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Hardware Development Guide
ME3616
SAFETY INFORMATION
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any
cellular terminal or mobile incorporating ME3616 module. Manufacturers of the cellular terminal should send the following safety
information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not
so, GOSUNCN does not take on any liability for customer failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a
mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must
comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The
operation of wireless appliances in an aircraft is forbidden to prevent interference with communication
systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device
offers a Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care facilities. These
requests are designed to prevent possible interference with sensitive medical equipment.
GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and
cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While
you are in this condition and need emergent help, please remember using emergency call. In order to make
or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and
transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or
other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices
such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air
contains chemicals or particles such as grain, dust or metal powders.

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Hardware Development Guide
ME3616
CONTENT
REVISION HISTORY ...................................................................................................................................................................I
ABOUT THIS DOCUMENT ..........................................................................................................................................................I
SAFETY INFORMATION ...........................................................................................................................................................III
CONTENT .......................................................................................................................................................................... IV
TABLES............................................................................................................................................................................... VI
FIGURES........................................................................................................................................................................... VIII
1. PRODUCT OVERVIEW .................................................................................................................................................10
1.1. GENERAL DESCRIPTION.........................................................................................................................................................................10
1.2. KEY FEATURES ....................................................................................................................................................................................... 10
1.3. FUNCTION DIAGRAM ............................................................................................................................................................................11
2. APPLICATION INTERFACE..........................................................................................................................................12
2.1. GENERAL DESCRIPTION.........................................................................................................................................................................12
2.2. PIN ASSIGNMENT ..................................................................................................................................................................................12
2.3. PIN DESCRIPTION ..................................................................................................................................................................................12
2.4. WORKING MODE ...................................................................................................................................................................................15
2.5. POWER SUPPLY...................................................................................................................................................................................... 16
2.5.1. Power Supply Pins.................................................................................................................................................................. 16
2.5.2. Decrease Voltage Drop ........................................................................................................................................................16
2.5.3. Reference Circuit of Power Supply...................................................................................................................................17
2.6. VCC1V8_OUT REFERENCE DESIGN .................................................................................................................................................... 17
2.7. POWER ON SCENARIO ...........................................................................................................................................................................18
2.8. TURN OFF SCENARIOS .................................................................................................................................................................................21
2.9. RESET SCENARIO ...................................................................................................................................................................................21
2.10. USIM INTERFACE ...............................................................................................................................................................................23
2.10.1. Description of PINs..............................................................................................................................................................23
2.10.2. Design Considerations for USIM Card Holder...........................................................................................................24
2.11. UART INTERFACE ............................................................................................................................................................................... 27
2.11.1. UART connection.................................................................................................................................................................. 27
2.11.2. UART LEVEL MATCH............................................................................................................................................................ 28
2.11.3. Use ic for level switch .........................................................................................................................................................32
2.12. NETWORK STATUS INDICATOR...........................................................................................................................................................34
2.13. ADC INTERFACE ................................................................................................................................................................................. 35
2.14. GPIO INTERFACE................................................................................................................................................................................35
2.15. WAKEUP_IN SIGNAL .......................................................................................................................................................................36
2.16. WAKEUP_OUT SIGNAL...................................................................................................................................................................37
2.17. USB INTERFACE .................................................................................................................................................................................. 38

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Hardware Development Guide
ME3616
3. ANTENNA INTERFACE ................................................................................................................................................39
3.1. PIN DEFINITION....................................................................................................................................................................................39
3.2. REFERENCE DESIGN............................................................................................................................................................................... 39
3.3. REFERENCE PCB LAYOUT OF ANTENNA .............................................................................................................................................. 39
3.4. SUGGESTIONS FOR EMC &ESD DESIGN ...........................................................................................................................................40
3.4.1. EMC Design Requirements..................................................................................................................................................40
3.4.2. ESD Design Requirements................................................................................................................................................... 40
3.5. TEST METHODS FOR WHOLE-SET ANTENNA OTA............................................................................................................................. 40
4. ELECTRICAL, RELIABILITY AND RADIO CHARACTERISTICS .................................................................................42
4.1. OPERATING TEMPERATURE ................................................................................................................................................................... 42
4.2. CURRENT CONSUMPTION.....................................................................................................................................................................42
4.3. RF OUTPUT POWER .............................................................................................................................................................................. 42
4.4. RF RECEIVING SENSITIVITY ...................................................................................................................................................................43
4.5. ELECTROSTATIC DISCHARGE .................................................................................................................................................................43
5. MECHANICAL DIMENSIONS......................................................................................................................................44
5.1. MECHANICAL DIMENSIONS OF THE MODULE .....................................................................................................................................44
5.2. RECOMMENDED PACKAGE SIZE............................................................................................................................................................ 46
6. RELATED TEST & TEST STANDARD ..........................................................................................................................47
6.1. TESTING REFERENCE..............................................................................................................................................................................47
6.2. DESCRIPTION OF TESTING ENVIRONMENT...........................................................................................................................................47
6.3. RELIABILITY TESTING ENVIRONMENT....................................................................................................................................................48
7. SMT PROCESS AND BAKING GUIDE.........................................................................................................................50
7.1. STORAGE REQUIREMENTS..................................................................................................................................................................... 50
7.2. MODULE PLAINNESS STANDARD .........................................................................................................................................................50
7.3. PROCESS ROUTING SELECTION............................................................................................................................................................. 50
7.3.1. Solder Paste Selection........................................................................................................................................................... 50
7.3.2. Design of module PAD’s steel mesh opening on main board............................................................................50
7.3.3. Module Board’s SMT process..........................................................................................................................................51
7.3.4. Module Soldering Reflow Curve .......................................................................................................................................53
7.3.5. Reflow method ........................................................................................................................................................................ 53
7.3.6. Maintenance of defects........................................................................................................................................................ 53
7.4. MODULE’S BAKING REQUIREMENTS ................................................................................................................................................. 54
7.4.1. Module’s Baking Environment........................................................................................................................................54
7.4.2. Baking device and operation procedure........................................................................................................................ 54
7.4.3. Module Baking Conditions..................................................................................................................................................54

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Hardware Development Guide
ME3616
TABLES
Table 1-1 ME3616 Supported Band.............................................................................................10
Table 1-2 ME3616 Key Features..................................................................................................10
Table 2-1 IO Parameters Definition..............................................................................................13
Table 2-2 Logic levels Description................................................................................................13
Table 2-3 Pin Description.............................................................................................................13
Table 2-4 Power Supply...............................................................................................................16
Table 2-5 VCC1V8_OUT pin definication.....................................................................................17
Table 2-6 Definition of POWER_ON.............................................................................................18
Table 2-7 Power-on Time ...............................................................................................................20
Table 2-8 Power-off Time...............................................................................................................21
Table 2-9 Definition of RESET .....................................................................................................22
Table 2-10 Resetting timing..........................................................................................................22
Table 2-11 Pin Description of Molex USIM Card Holder...............................................................25
Table 2-12 Pin Description of Amphenol USIM Card Holder.........................................................26
Table 2-13 Pin Definition of the Main UART Interface ..................................................................27
Table 2-14 Pin Definition of Network Indicator..............................................................................34
Table 2-15 Pin Definition of the ADC............................................................................................35
Table 2-16 Characteristic of the ADC...........................................................................................35
Table 2-17 Pin Definition of GPIO ................................................................................................35
Table 2-18 Pin definition of WAKEUP_IN.....................................................................................36
Table 2-19 Pin definition of WAKEUP_OUT.................................................................................37
Table 3-1 Pin Definition of Antenna..............................................................................................39
Table 4-1 Operating Temperature................................................................................................42
Table 4-2 Average current consumption.......................................................................................42
Table 4-3 RF Output power..........................................................................................................42
Table 4-4 RF Receiving Sensitivity...............................................................................................43
Table 4-5 ESD characteristic........................................................................................................43
Table 6-1 Testing Standard..........................................................................................................47
Table 6-2 Testing Environment ....................................................................................................48

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Hardware Development Guide
ME3616
Table 6-3 Testing Instrument & Device.........................................................................................48
Table 6-4 Reliability Features.......................................................................................................48
Table 7-1 Baking parameters.......................................................................................................50
Table 7-2 LCC module PAD’s steel mesh opening................................................................................51

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Hardware Development Guide
ME3616
FIGURES
Figure 1-1 System Connection Structure......................................................................................11
Figure 2-1 Pin Assignment...........................................................................................................12
Figure 2-2 working mode switch...................................................................................................16
Figure 2-3 The input reference circuit of VBAT.............................................................................17
Figure 2-4 Reference circuit of DC-DC.........................................................................................17
Figure 2-5 VCC1V8_OUT reference design .................................................................................18
Figure 2-6 Reference circuit of POWER_ON................................................................................20
Figure 2-7 Timing of Turning on Module.......................................................................................20
Figure 2-8 Timing of wakeup Module through pin POWER_ON ...................................................20
Figure 2-9 Timing of Turning off Mode .........................................................................................21
Figure 2-10 reference circuit to reset module...............................................................................22
Figure 2-11 Timing of Reset Mode...............................................................................................23
Figure 2-12 Pin Definition of the USIM Interface...........................................................................23
Figure 2-13 reference design of USIM interface...........................................................................24
Figure 2-14 Molex 91228 USIM Card Holder................................................................................25
Figure 2-15 Amphenol C707 10M006 512 2 USIM Card Holder...................................................26
Figure 2-16 Schematic of 3-wire UART Connection.....................................................................28
Figure 2-17 Schematic of 4-wire UART Connection.....................................................................28
Figure 2-18 Recommended TXD circuit........................................................................................29
Figure 2-19 Recommended RXD circuit.......................................................................................30
Figure 2-20 Recommended RTS circuit........................................................................................31
Figure 2-21 Recommended CTS circuit........................................................................................32
Figure 2-22 Recommended 4-wires UART level switch circuit......................................................33
Figure 2-23 Recommended 2-wires UART level switch circuit......................................................33
Figure 2-24 Debug UART interface definication ...........................................................................33
Figure 2-25 The test point of debug UART...................................................................................34
Figure 2-26 Connections of the SYS_STATE pin ............................................................................35
Figure 2-27 WAKEUP_IN input sequence....................................................................................36
Figure 2-28 Connections of the WAKEUP_IN pin.........................................................................37
Figure 2-29 WAKEUP_OUT output sequence..............................................................................37

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Hardware Development Guide
ME3616
Figure 2-30 Connections of the WAKEUP_OUT pin .........................................................................37
Figure 2-31 USB interface connection..........................................................................................38
Figure 3-1 Reference Circuit of Antenna Interface........................................................................39
Figure 3-2 The OTA test system of CTIA......................................................................................41
Figure 5-1 ME3616 Top Dimensions（tolerance：±0.1mm）.....................................................44
Figure 5-2 ME3616 Bottom Dimensions (perspective view)..........................................................45
Figure 5-3 Recommended Package Size（Unit：mm）..............................................................46
Figure 7–1 Module Board’s Steel Mesh Diagram .........................................................................51
Figure 7–2 Material Module Pallet................................................................................................52
Figure 7–3 Tape Reel Dimension.................................................................................................52
Figure 7–4 Module Furnace Temperature Curve Reference Diagram..........................................53