GOSUNCN WeLink ME3616 User manual

HARDWARE DEVELOPMENT GUIDE
ME3616
Version: V1.2
Date: 2018-05-29
NB-IoT Module
Website: www.gosuncnwelink.com
E-mail: [e-mail]

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Hardware Development Guide
ME3616
REVISION HISTORY
Version
Release Date
Type of Revision
1.0
2018-04-13
First version
1.1
2018-04-30
Update the format of document
1.2
2018-05-29
Update PID information and the test data.
ABOUT THIS DOCUMENT
A. Application Range
This document is the Product Technical Specification for the ME3616 NB-IoT module. It defines the high level product features
and illustrates the interface for these features. This document is intended to cover the hardware aspects of the product, including
electrical and mechanical.
B. Reading Note
The symbols below are the reading notes you should pay attention on:
: WARNING or ATTENTION : NOTE or REMARK
C. Purpose
This document provides the hardware solutions and development fundamentals for a product with the module. By reading this
document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this
document, the user can successfully fulfill the application and development of wireless Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests and related
testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design
reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality.
D. Abbreviations
Table below is a list of abbreviations involved in this document, as well as the English full names.
Abbreviations
Full Name
3GPP
Third Generation Partnership Project
AP
Another name of DTE
CHAP
Challenge Handshake Authentication Protocol
CE
European Conformity
CMOS
Complementary Metal Oxide Semiconductor
DCE
Data Communication Equipment
DL
Downlink

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ME3616
DTE
Data Terminal Equipment
EIA
Electronic Industries Association
EMC
Electromagnetic Compatibility
ESD
Electro-Static discharge
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplex
GPIO
General-purpose I/O
LCC
Leadless Chip Carrier
LDO
Low-Dropout
LED
Light Emitting Diode
LTE
Long Term Evolution
ME
Mobile Equipment
MO
Mobile Origination Call
MT
Mobile Termination Call
MSB
Most Significant Bit
PC
Personal Computer
PCB
Printed Circuit Board
PDA
Personal Digital Assistant
PDU
Protocol Data Unit
PAP
Password Authentication Protocol
PPP
Point to Point Protocol
RTC
Real Time Clock
SMS
Short Messaging Service
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
TBD
To Be Determined
TCP
Transmission Control Protocol
TIS
Total Isotropic Sensitivity
TRP
Total Radiated Power
TVS
Transient Voltage Suppressor
UART
Universal Asynchronous Receiver-Transmitter
UDP
User Datagram Protocol
UL
Up Link
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
URC
Unsolicited result code
VIH
Logic High level of input voltage
VIL
Logic Low level of input voltage
VOH
Logic High level of output voltage
VOL
Logic Low level of output voltage

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Hardware Development Guide
ME3616
SAFETY INFORMATION
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any
cellular terminal or mobile incorporating ME3616 module. Manufacturers of the cellular terminal should send the following safety
information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not
so, GOSUNCN does not take on any liability for customer failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a
mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must
comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The
operation of wireless appliances in an aircraft is forbidden to prevent interference with communication
systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device
offers a Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care facilities. These
requests are designed to prevent possible interference with sensitive medical equipment.
GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and
cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While
you are in this condition and need emergent help, please remember using emergency call. In order to make
or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and
transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or
other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices
such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air
contains chemicals or particles such as grain, dust or metal powders.

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Hardware Development Guide
ME3616
CONTENT
REVISION HISTORY ...................................................................................................................................................................I
ABOUT THIS DOCUMENT ..........................................................................................................................................................I
SAFETY INFORMATION ...........................................................................................................................................................III
CONTENT .......................................................................................................................................................................... IV
TABLES............................................................................................................................................................................... VI
FIGURES........................................................................................................................................................................... VIII
1. PRODUCT OVERVIEW .................................................................................................................................................10
1.1. GENERAL DESCRIPTION.........................................................................................................................................................................10
1.2. KEY FEATURES ....................................................................................................................................................................................... 10
1.3. FUNCTION DIAGRAM ............................................................................................................................................................................11
2. APPLICATION INTERFACE..........................................................................................................................................12
2.1. GENERAL DESCRIPTION.........................................................................................................................................................................12
2.2. PIN ASSIGNMENT ..................................................................................................................................................................................12
2.3. PIN DESCRIPTION ..................................................................................................................................................................................12
2.4. WORKING MODE ...................................................................................................................................................................................15
2.5. POWER SUPPLY...................................................................................................................................................................................... 16
2.5.1. Power Supply Pins.................................................................................................................................................................. 16
2.5.2. Decrease Voltage Drop ........................................................................................................................................................16
2.5.3. Reference Circuit of Power Supply...................................................................................................................................17
2.6. VCC1V8_OUT REFERENCE DESIGN .................................................................................................................................................... 17
2.7. POWER ON SCENARIO ...........................................................................................................................................................................18
2.8. TURN OFF SCENARIOS .................................................................................................................................................................................21
2.9. RESET SCENARIO ...................................................................................................................................................................................21
2.10. USIM INTERFACE ...............................................................................................................................................................................23
2.10.1. Description of PINs..............................................................................................................................................................23
2.10.2. Design Considerations for USIM Card Holder...........................................................................................................24
2.11. UART INTERFACE ............................................................................................................................................................................... 27
2.11.1. UART connection.................................................................................................................................................................. 27
2.11.2. UART LEVEL MATCH............................................................................................................................................................ 28
2.11.3. Use ic for level switch .........................................................................................................................................................32
2.12. NETWORK STATUS INDICATOR...........................................................................................................................................................34
2.13. ADC INTERFACE ................................................................................................................................................................................. 35
2.14. GPIO INTERFACE................................................................................................................................................................................35
2.15. WAKEUP_IN SIGNAL .......................................................................................................................................................................36
2.16. WAKEUP_OUT SIGNAL...................................................................................................................................................................37
2.17. USB INTERFACE .................................................................................................................................................................................. 38

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ME3616
3. ANTENNA INTERFACE ................................................................................................................................................39
3.1. PIN DEFINITION....................................................................................................................................................................................39
3.2. REFERENCE DESIGN............................................................................................................................................................................... 39
3.3. REFERENCE PCB LAYOUT OF ANTENNA .............................................................................................................................................. 39
3.4. SUGGESTIONS FOR EMC &ESD DESIGN ...........................................................................................................................................40
3.4.1. EMC Design Requirements..................................................................................................................................................40
3.4.2. ESD Design Requirements................................................................................................................................................... 40
3.5. TEST METHODS FOR WHOLE-SET ANTENNA OTA............................................................................................................................. 40
4. ELECTRICAL, RELIABILITY AND RADIO CHARACTERISTICS .................................................................................42
4.1. OPERATING TEMPERATURE ................................................................................................................................................................... 42
4.2. CURRENT CONSUMPTION.....................................................................................................................................................................42
4.3. RF OUTPUT POWER .............................................................................................................................................................................. 42
4.4. RF RECEIVING SENSITIVITY ...................................................................................................................................................................43
4.5. ELECTROSTATIC DISCHARGE .................................................................................................................................................................43
5. MECHANICAL DIMENSIONS......................................................................................................................................44
5.1. MECHANICAL DIMENSIONS OF THE MODULE .....................................................................................................................................44
5.2. RECOMMENDED PACKAGE SIZE............................................................................................................................................................ 46
6. RELATED TEST & TEST STANDARD ..........................................................................................................................47
6.1. TESTING REFERENCE..............................................................................................................................................................................47
6.2. DESCRIPTION OF TESTING ENVIRONMENT...........................................................................................................................................47
6.3. RELIABILITY TESTING ENVIRONMENT....................................................................................................................................................48
7. SMT PROCESS AND BAKING GUIDE.........................................................................................................................50
7.1. STORAGE REQUIREMENTS..................................................................................................................................................................... 50
7.2. MODULE PLAINNESS STANDARD .........................................................................................................................................................50
7.3. PROCESS ROUTING SELECTION............................................................................................................................................................. 50
7.3.1. Solder Paste Selection........................................................................................................................................................... 50
7.3.2. Design of module PAD’s steel mesh opening on main board............................................................................50
7.3.3. Module Board’s SMT process..........................................................................................................................................51
7.3.4. Module Soldering Reflow Curve .......................................................................................................................................53
7.3.5. Reflow method ........................................................................................................................................................................ 53
7.3.6. Maintenance of defects........................................................................................................................................................ 53
7.4. MODULE’S BAKING REQUIREMENTS ................................................................................................................................................. 54
7.4.1. Module’s Baking Environment........................................................................................................................................54
7.4.2. Baking device and operation procedure........................................................................................................................ 54
7.4.3. Module Baking Conditions..................................................................................................................................................54

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ME3616
TABLES
Table 1-1 ME3616 Supported Band.............................................................................................10
Table 1-2 ME3616 Key Features..................................................................................................10
Table 2-1 IO Parameters Definition..............................................................................................13
Table 2-2 Logic levels Description................................................................................................13
Table 2-3 Pin Description.............................................................................................................13
Table 2-4 Power Supply...............................................................................................................16
Table 2-5 VCC1V8_OUT pin definication.....................................................................................17
Table 2-6 Definition of POWER_ON.............................................................................................18
Table 2-7 Power-on Time ...............................................................................................................20
Table 2-8 Power-off Time...............................................................................................................21
Table 2-9 Definition of RESET .....................................................................................................22
Table 2-10 Resetting timing..........................................................................................................22
Table 2-11 Pin Description of Molex USIM Card Holder...............................................................25
Table 2-12 Pin Description of Amphenol USIM Card Holder.........................................................26
Table 2-13 Pin Definition of the Main UART Interface ..................................................................27
Table 2-14 Pin Definition of Network Indicator..............................................................................34
Table 2-15 Pin Definition of the ADC............................................................................................35
Table 2-16 Characteristic of the ADC...........................................................................................35
Table 2-17 Pin Definition of GPIO ................................................................................................35
Table 2-18 Pin definition of WAKEUP_IN.....................................................................................36
Table 2-19 Pin definition of WAKEUP_OUT.................................................................................37
Table 3-1 Pin Definition of Antenna..............................................................................................39
Table 4-1 Operating Temperature................................................................................................42
Table 4-2 Average current consumption.......................................................................................42
Table 4-3 RF Output power..........................................................................................................42
Table 4-4 RF Receiving Sensitivity...............................................................................................43
Table 4-5 ESD characteristic........................................................................................................43
Table 6-1 Testing Standard..........................................................................................................47
Table 6-2 Testing Environment ....................................................................................................48

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ME3616
Table 6-3 Testing Instrument & Device.........................................................................................48
Table 6-4 Reliability Features.......................................................................................................48
Table 7-1 Baking parameters.......................................................................................................50
Table 7-2 LCC module PAD’s steel mesh opening................................................................................51

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ME3616
FIGURES
Figure 1-1 System Connection Structure......................................................................................11
Figure 2-1 Pin Assignment...........................................................................................................12
Figure 2-2 working mode switch...................................................................................................16
Figure 2-3 The input reference circuit of VBAT.............................................................................17
Figure 2-4 Reference circuit of DC-DC.........................................................................................17
Figure 2-5 VCC1V8_OUT reference design .................................................................................18
Figure 2-6 Reference circuit of POWER_ON................................................................................20
Figure 2-7 Timing of Turning on Module.......................................................................................20
Figure 2-8 Timing of wakeup Module through pin POWER_ON ...................................................20
Figure 2-9 Timing of Turning off Mode .........................................................................................21
Figure 2-10 reference circuit to reset module...............................................................................22
Figure 2-11 Timing of Reset Mode...............................................................................................23
Figure 2-12 Pin Definition of the USIM Interface...........................................................................23
Figure 2-13 reference design of USIM interface...........................................................................24
Figure 2-14 Molex 91228 USIM Card Holder................................................................................25
Figure 2-15 Amphenol C707 10M006 512 2 USIM Card Holder...................................................26
Figure 2-16 Schematic of 3-wire UART Connection.....................................................................28
Figure 2-17 Schematic of 4-wire UART Connection.....................................................................28
Figure 2-18 Recommended TXD circuit........................................................................................29
Figure 2-19 Recommended RXD circuit.......................................................................................30
Figure 2-20 Recommended RTS circuit........................................................................................31
Figure 2-21 Recommended CTS circuit........................................................................................32
Figure 2-22 Recommended 4-wires UART level switch circuit......................................................33
Figure 2-23 Recommended 2-wires UART level switch circuit......................................................33
Figure 2-24 Debug UART interface definication ...........................................................................33
Figure 2-25 The test point of debug UART...................................................................................34
Figure 2-26 Connections of the SYS_STATE pin ............................................................................35
Figure 2-27 WAKEUP_IN input sequence....................................................................................36
Figure 2-28 Connections of the WAKEUP_IN pin.........................................................................37
Figure 2-29 WAKEUP_OUT output sequence..............................................................................37

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ME3616
Figure 2-30 Connections of the WAKEUP_OUT pin .........................................................................37
Figure 2-31 USB interface connection..........................................................................................38
Figure 3-1 Reference Circuit of Antenna Interface........................................................................39
Figure 3-2 The OTA test system of CTIA......................................................................................41
Figure 5-1 ME3616 Top Dimensions（tolerance：±0.1mm）.....................................................44
Figure 5-2 ME3616 Bottom Dimensions (perspective view)..........................................................45
Figure 5-3 Recommended Package Size（Unit：mm）..............................................................46
Figure 7–1 Module Board’s Steel Mesh Diagram .........................................................................51
Figure 7–2 Material Module Pallet................................................................................................52
Figure 7–3 Tape Reel Dimension.................................................................................................52
Figure 7–4 Module Furnace Temperature Curve Reference Diagram..........................................53

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Hardware Development Guide
ME3616
1. PRODUCT OVERVIEW
1.1. GENERAL DESCRIPTION
ME3616 is a ultra-packet NB-IoT module, The dimensions of ME3616 is 16*18mm, it is fully compatible with
3GPP R14 standard, it can support eSIM, that means it can support mobility and lower power consumption, these
three advantages make it more popular in Smart meter, Smart city, wearable devices and tracker industries.
ME3616 is designed for low-power, wide-area, massive IoT connection, multiple protocols including CoAP、
TCP/UDP、MQTT、OMA-LWM2M、oneNET are embedded in it. ME3616 can support PSM and eDRX low-power
working mode.
Table 1-1 ME3616 Supported Band
PID
RF Support
RF Band
Transmit Frequency (TX)
Receive Frequency (RX)
ME3616
E1A
NB-IoT
B1
B3
B5
B8
B20
B28
1920 to 1980 MHz
1710 to 1785 MHz
824 to 849 MHz
880 to 915 MHz
832 to 862 MHz
703 to 748 MHz
2110 to 2170 MHz
1805 to 1880 MHz
869 to 894 MHz
925 to 960 MHz
791 to 821 MHz
758 to 803 MHz
1.2. KEY FEATURES
The table below describes the detailed features of the ME3616 module.
Table 1-2 ME3616 Key Features
Feature
Description
Pysical
16mm × 18 mm × 2.3mm
40 pins LCC package
Power Supply
The range of voltage supply is2.85V-3.6V, typical value is 3.0V
Network
protocol
Embedded TCP /UDP /CoAP /MQTT
OMA LWM2M
USIM interface
1.8V/3V support (Actual support voltage is related to VBAT. If 3V SIM is to be supported, VBAT must provide
3.3-3.6V)
Support SIM and USIM
UART interface
Support two UART interface: main UART interface and debug UART interface
Main UART interface:
4- lines on main UART interface, Support RTS and CTS hardware flow control. Used for AT command, data
transmission
Debug UART interface:
2- lines on debug UART interface, can be used for software debug, firmware upgrade
Antenna Interface
Include main antenna
AT Command
GOSUNCN extended AT commands

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ME3616
Temperature
Range
Normal operation: -30°C to +75°C
Restricted operation: -40°C~ -30°C and +75°C~ +85°C1)
Storage temperature: -40°C to +85°C
1.3. FUNCTION DIAGRAM
The figure below shows a block diagram of the ME3616 and illustrates the major functional parts.
Power management
Baseband
Memory
RF send-receive
Peripheral interface
--UART interface
--USIM card interface
--SPI interface(master mode)
--I2C interface
--ADC interface
--Status interface (LED)
--GPIO
Baseband
USIM
UART
I2C
SPI
ADC
Flash&
PSRAM
RF
Transceiver
RF PA Duplexer Switch
Tx
Rx
MAIN_ANT
LCC
GPIO
SYS_STATE
Power
Management
Figure 1-1 System Connection Structure

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ME3616
2. APPLICATION INTERFACE
2.1. GENERAL DESCRIPTION
ME3616 is the module equipped with an 40-pins LCC package that connect to customer’s cellular application platform.
Sub-interface included in these pads is described in detail in the following chapters:
2.2. PIN ASSIGNMENT
The following figure shows the pin assignment of the ME3616 module.
Figure 2-1 Pin Assignment
Note：Keep all NC pins unconnected.
2.3. PIN DESCRIPTION
The following table shows the IO Parameters Definition.
PIN1

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ME3616
Table 2-1 IO Parameters Definition
Type
Description
IO
Bidirectional input/output
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
The logic levels are described in the following table.
Table 2-2 Logic levels Description
Parameter
Min
Max
Unit
VIH
0.65*VDD_IO
VDD_IO+0.3
V
VIL
-0.3
0.35* VDD_IO
V
VOH
VDD_IO-0.45
VDD_IO
V
VOL
0
0.45
V
NOTE:
VDD_IO is the voltage level of pins.
The following tables show the ME3616’s pin definition.
Table 2-3 Pin Description
Power Supply
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
VBAT
31
PI
Power supply for module
2.85V-3.6V，typical
value is 3.0V
Required.
This pin is strongly related
to the SIM card voltage. If
you want to support 3V SIM,
VBAT supply must between
3.3-3.6V
VBAT
32
PI
Power supply for module，
2.85V-3.6V，typical
value is 3.0V
VCC1V8_OUT
20
PO
Provide 1.8V for
external circuit
only used for level
match ,left unconnected
when not used
GND
22,23,25,26,28,29,30
Ground
POWRER_ON/OFF
POWER_ON
19
DI
Turn on/off module
VBAT Power
domain
Active low
RESET
17
DI
Reset module
VBAT Power
domain
Active low
Status Indication
SYS_STATE
21
DO
Indicate the module
1.8V Power
There are 4 status:

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ME3616
network registration
mode
domain
1. power off（the same as
there is no power supply）
2. offline（Frequency 1Hz，
Duty cycle 50%）
3. online（Frequency 0.3Hz，
Duty cycle 10%）
4. data sending（Frequency
10Hz，Duty cycle 50%）
USIM Interface
USIM_VCC
15
PO
Power supply for
USIM card
Actual support voltage is
related to VBAT. If 3V SIM is
to be supported, VBAT must
provide 3.3-3.6V
USIM_DATA
14
IO
Data signal of USIM
card
Module has pull up this pin
with 20K internally.
USIM_CLK
13
DO
Clock signal of USIM card
USIM_RESET
12
DO
Reset signal of USIM card
ADC Interface
ADC
38
AI
Analog to digital
0V to 1.4V
External sensor signal
detection with 10bit
accuracy
Main UART Interface
UART1_TXD
9
DO
Transmit data
1.8V
UART1_RXD
10
DI
Receive data
1.8V
UART1_RTS
8
DO
Request to send
1.8V
UART1_CTS
7
DI
Clear to send
1.8V
Debug UART Interface
UART_DEBUG_
TXD
1
DO
UART2 transmit data
1.8V
Required, please Reserve
test point
UART_DEBUG_
RXD
2
DI
UART2 receive data
1.8V
Required, please Reserve
test point
RF Interface
MAIN_ANT
27
IO
Main antenna
50Ωimpedance
I2C Interface
I2C_SCL
36
IO
I2C serial clock
1.8V
Pull-up to 1.8V through
external 2.2K resistance. If
not used, NC
I2C_SDA
37
IO
I2C serial data
1.8V
Pull-up to 1.8V through
external 2.2K resistance. If
not used, NC
SPI Interface（only support master mode）
SPI_MISO
4
I
SPI main input slave
1.8V
If not used, NC

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ME3616
output
SPI_MOSI
5
O
SPI main output slave
input
1.8V
If not used, NC
SPI_SCLK
6
O
SPI clock
1.8V
If not used, NC
SPI_CS
3
O
SPI segment
1.8V
If not used, NC
USB Interface（Used for debug, recommended to NC）
USB_VBUS
33
PI
USB Power
3.3V
Optional, used for debug
USB_DM
39
IO
USB differential data
bus
Require differential
impedance of 90Ω
USB_DP
40
IO
USB differential data
bus
Require differential
impedance of 90Ω
Other pins
WAKEUP_IN
18
DI
External device
wakeup module
VBAT voltage
domain
Used for MCU to wakeup
module. If module in PSM
status, Falling edge can
wakeup the module
WAKEUP_OUT
16
DO
Output wakeup signal,
wake up the external
devices
1.8V
Used for module to wakeup
MCU(such as this pin will
give signal when there is
downlink data )
AP_READY
11
DI
AP is Ready
1.8V
GPIO
34,35
IO
General input/output
1.8V
If not used, NC
NC
24
Not connected
No need connection
external
2.4. WORKING MODE
There is three working mode for module ME3616：
1. Connected mode ：Network connection is ongoing, and you can send/receive data, the power
consumption is decided by network setting and data transfer rate. Module can enter Idle/PSM mode in this status.
2. Idle mode：Module is in idle mode, has registered to network, can receive paging information. Module
can enter Connected/PSM mode in this status.
3. PSM(Power save mode)：Only module’s RTC works in this mode. In this PSM mode, module does not
connect to network, and can’t receive any network paging information. The current consumption of the module
will be reduced to the minimal level. For the network side, the module UE is in an unreachable offline state at this
time. The UE will exit the PSM mode only when the TAU period request timer (T3412) times out or the UE has MO
service to process
The mode switch is shown in the figure below:

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ME3616
Figure 2-2 working mode switch
2.5. POWER SUPPLY
2.5.1. POWER SUPPLY PINS
The ME3616 is supplied through the VBAT signal with the following characteristics.
Table 2-4 Power Supply
Pin Name
Pin NO.
Description
Minimum
Typical
Maximum
Unit
VBAT
31,32
Power supply for module
2.85
3.0
3.6
V
GND
22,23,25,26,28,29,30
Ground
-
-
GND signal is the power and signal ground of the module, which needs to be connected to the ground on the system board. If
the GND signal is not connected completely, the performance of module will be affected.
2.5.2. DECREASE VOLTAGE DROP
Power supply range of the module is 2.85V~3.6V. So we recommended to add Energy storage capacitor ( C6:
100μF). Filter capacitors(10µF, 0.1µF, 33pF) need to be added to reduce interference. The capacitors should be
placed close to the ME3616’s V_BAT pins. The following figure shows structure of the power supply.
Periodic TAU
expired
Active Timer
expired
Serving Req
or TAU
RRC connection release
(start Active timer)

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ME3616
Figure 2-3 The input reference circuit of VBAT
In poor situation of the network is, the antenna will transmit at the maximum power. and the transient
maximum peak current can reach as high as 800mA.
2.5.3. REFERENCE CIRCUIT OF POWER SUPPLY
DC-DC switching power supply
The over-current capability requirement of DC/DC switching power supply needs to be above 800mA. When
the input and output voltage difference is large, you need to select Buck circuit to improve translate efficiency.
Two reference power supply circuit design with DC-DC is shown as figure below. The output voltage can be
adjusted by through the resistance of R1, R2. For details, refer to the user's manual of TPS6208833
Figure 2-4 Reference circuit of DC-DC
2.6. VCC1V8_OUT REFERENCE DESIGN
Table 2-5 VCC1V8_OUT pin deification
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
VCC1V8_OUT
20
PO
Provide 1.8V for
external circuit
1.8V
only used for level
match ,left unconnected
when not used

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Hardware Development Guide
ME3616
The test circuit is shown in the figure below. It is recommended to add electrostatic protection near the VCC1V8_OUT
module pin.
Figure 2-5 VCC1V8_OUT reference design
2.7. POWER ON SCENARIO
The table below is the information of power-on/off pin
Table 2-6 Definition of POWER_ON
Pin Name
Pin NO.
I/O
Description
Comment
POWER_ON
19
DI
Turn on/off the
module
low active., the voltage level is VBAT, Please pay
attention to level matching
When MCU can provide high/low level pulse with adjustable length, the reference circuit to turn-on/off
module is as shown in the following figure below.
The resistors in Figures below are only the recommended value and they need to adjust according to the
actual situation.
1. Power-on by dynatron, the circuit ①connect ON/OFF to high level to power-on the module, the
circuit ②can connect ON/OFF to low level to power-on the module

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Hardware Development Guide
ME3616