Hewlett Packard Enterprise Aruba 6300F Assembly instructions
MF877-00 Page 1
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
JL667A: Aruba 6300F 48G 4SFP56 Swch
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Batteries
All types including standard alkaline and lithium
coin or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torque Driver (Standard)
T10 & T25
Torque Bit
T10-70 mm
Torque Bit
T25-89mm
Torque Bit
M4 Philip Head
Cutter
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove PULL OUT
2. Unscrew and remove - SCREW-MACHINE ASSEMBLY M5 X 0.8 10M ROHS
3. Unscrew and remove - SCREW-THD-RLG M3 X 0.5 5MM-LG ROHS at 14 Locations and CHASSIS COVER
4. Remove INSULATOR, PSU TOP nPoE FXD from CHASSIS COVER
5. Cut and remove – CABLE TIE at 1 location
6. Unplug - AC connector from POWER SUPPLY
7. Unplug – Cable connect between POWER SUPPLY and ASSY, 48NP FIXED PCA + MECH
8. Unplug – FAN connector from ASSY, 48NP FIXED PCA + MECH
9. Unplug – 0.5mm CENTRE FFC CABLE 24 CKTS from PCA, USABILITY LED BOARD
10. Remove – FAN CABLE from COVER, COMMON DIVERTER NP
11. Unscrew and remove - SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 4 locations and POWER SUPPLY
12. Unscrew and remove - SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 2 Locations and SHIELD PSU CABLE
13. Unplug – 0.5mm CENTRE FFC CABLE 24 CKTS from ASSY, 48NP FIXED PCA + MECH
14. Unscrew and remove - SCREW T10 M3X6 at 2 locations
15. Remove - PCA, USABILITY LED BOARD
16. Remove - PUSHBUTTON, SMT, MODE SWITCH
17. Unscrew and remove - SCREW-MACHINE M4X0.7 6MM LG
18. Unscrew and remove - SCREW-TAPPING PL FH M4X1.75 8MM LG at 6 Locations and FAN
19. Unplug and remove - AC socket from CHASSIS
20. Unscrew and remove - SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 11 Locations and ASSY, 48NP FIXED PCA +
MECH
21. Remove - INSULATOR, PSU BOTTOM nPoE FXD from CHASSIS
22. Remove - INSULATOR, PULL TAB GUIDE from CHASSIS
23. Remove – COVER, COMMON DIVERTER NP from CHASSIS
MF877-00 Page 3
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1
3
3
3
2
3
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1
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