HF HF-LPS170 User manual

HF-LPS170 Wi-Fi&BLE User Manual
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 1 -
HF-LPS170
Low Power SDIO Wi-Fi + BLE Module
User Manual
V 1.3
Overview of Characteristic
Support Wi-Fi IEEE802.11b/g/n and BLE5.0 Wireless Standards
Based on RISC SOC, 160MHz CPU, 276KB RAM, 2MB Flash
Support SDIO Interface, Provide Linux Driver(Kernel Require 3.10 Above)
Single +3.3V Power Supply，Selective 1.8V or 3.3V SDIO Voltage
Size: 12mm x 12mm, SMT44
FCC ID:2ACSVHF-LPS170

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TABLE OF CONTENTS
LIST OF FIGURES...................................................................................................................................3
LIST OF TABLES ....................................................................................................................................4
HISTORY..................................................................................................................................................5
1. PRODUCT OVERVIEW ................................................................................................................6
1.1. General Description.................................................................................................................6
1.1.1 Wireless..............................................................................................................................6
1.1.2 MCU Subsystem.................................................................................................................7
1.1.3 Memory...............................................................................................................................7
1.1.4 Security...............................................................................................................................7
1.1.5 Peripheral............................................................................................................................7
1.1.6 Power MSecurity.................................................................................................................8
1.1.7 Clock...................................................................................................................................8
1.1.8 Device Paremeters.............................................................................................................8
1.2. Hardware Introduction.............................................................................................................9
1.2.1. HF-LPS170 Pins Definition...............................................................................................10
1.2.2. Electrical Characteristics ..................................................................................................12
1.2.3. HF-LPS170 Mechanical Size............................................................................................13
1.2.4. External Antenna..............................................................................................................13
APPENDIX A: CONTACT INFORMATION ......................................................................................16

HF-LPS170 Wi-Fi&BLE User Manual
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LIST OF FIGURES
Figure 1. HF-LPS170 Block Diagram....................................................................................................6
Figure 2. HF-LPS170 Appearance........................................................................................................9
Figure 3. HF-LPS170 Pins Map...........................................................................................................10
Figure 4. HF-LPS170 Mechanical Dimension .....................................................................................13

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LIST OF TABLES
Table1. HF-LPS170 Module Technical Specifications........................................................................8
Table2. HF-LPS170 Pins Definition...................................................................................................10
Table3. Electrical Characteristics......................................................................................................12
Table4. External Antenna Parameters..............................................................................................13

HF-LPS170 Wi-Fi&BLE User Manual
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HISTORY
Ed. V1.0 07-21-2020 First Version.
Ed. V1.1 07-27-2020 Update IO voltage.
Ed. V1.2 11-03-2020 Update Kernel requirement, update GPIO_8 description.
Ed. V1.3 01-04-2021 Update GPIO8 description

HF-LPS170 Wi-Fi&BLE User Manual
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1.PRODUCT OVERVIEW
1.1. General Description
The HF-LPS170 module is a Wi-Fi and BLE combo module for ultra-low-power application
Wireless subsystem contains 2.4G radio, Wi-Fi 802.11bgn and BLE5.0 baseband/MAC designs.
Microcontroller subsystem contains a low-power 32-bit RISC CPU, high-speed cache and memories.
Power Management Unit controls low-power modes. Moreover, variety of security features are
supported.
Peripheral interfaces include SDIO, SPI, UART I2C, IR remote, PWM, ADC and GPIOs.
Provice Linux driver for external MCU integrate using SDIO interface.
Figure 1. HF-LPS170 Block Diagram
1.1.1 Wireless
2.4G RF transceiver
Wi-Fi 802.11bgn

HF-LPS170 Wi-Fi&BLE User Manual
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BLE 5.0, Channel Selection#2 is supported, 2M PHY / Coded PHY / ADC extension is not
supported.
Wi-Fi 20MHz bandwidth
Wi-Fi Security WEP / WPA / WPA2 Personal / WPA2 Enterprise / WPS
STA, softAP and Sniffer modes
Multi-cloud connectivity
Wi-Fi and BLE coexistence
Integrated balun, PA/LNA
1.1.2 MCU Subsystem
32-bit RISC CPU with FPU
Level-1 Cache
One RT timer up to one year
Two 32b general purpose timers
Four DMA channels
DFS from 1MHz to 192MHz
The HF-LPS170 module is a Wi-Fi and BLE combo module for ultra-low-power application
Wireless subsystem contains 2.4G radio, Wi-Fi 802.11bgn and BLE5.0 baseband/MAC designs.
1.1.3 Memory
276KB SRAM
128KB ROM
1Kb eFuse
2MB Flash
1.1.4 Security
Secure boot
Secure debug ports
AES 128/192/256 bits
SHA01/224/256
TRNG
PKA
1.1.5 Peripheral
One SDIO 2.0 slave
One SPI master/slave
Two UART
One I2CC master/slave
Five PWM
10-bit DAC
12-bit ADC
Two general analog comparators

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PIR detection
IR remote HW accelerator
16 GPIOs
1.1.6 Power MSecurity
Off
Hibernate
Power Down Sleep
Active
1.1.7 Clock
Support XTAL 40MHz
Internal RC 32KHz oscillator
Internal System PLL
Hibernate
Power Down Sleep
Active
1.1.8 Device Paremeters
Table1. HF-LPS170 Module Technical Specifications
Class
Item
Parameters
Wi-Fi
Parameters
Wireless standard
802.11 b/g/n
Frequency range
2.412GHz-2.462GHz
Transmit Power
802.11b: +16 +/-2dBm (@11Mbps)
802.11g: +14 +/-2dBm (@54Mbps)
802.11n: +13 +/-2dBm (@HT20, MCS7)
Receiver Sensitivity
802.11b: -87 dBm (@11Mbps ,CCK)
802.11g: -73 dBm (@54Mbps, OFDM)
802.11n: -71 dBm (@HT20, MCS7)
BLE
Parameters
Wireless standard
BLE5.0
Frequency range
2.402GHz-2.480GHz
Transmit Power
Max 9dBm
Receiver Sensitivity
-90dBm
Hardware
Parameters
Antenna Option
antenna Pad
Data Interface
UART
GPIO, SPI, PWM
Operating Voltage(TBD)
2.6~3.6V
Operating Current(TBD)
Peak (Continuous TX): 350mA
Average(STA, No data): 30mA
Average(STA, Continuous TX): 85mA
Average(AP): 110mA
Standby: 300uA(Reset Pin set to low)
Operating Temp.
-40℃- 85℃
Storage Temp.
-40℃- 125℃

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Humidity
<85%
Dimensions and Size
12mm x 12mm
Software
Parameters
Driver
Linux
1.2. Hardware Introduction
HF-LPS170 Wi-Fi module appearance is as following.
Figure 2. HF-LPS170 Appearance

HF-LPS170 Wi-Fi&BLE User Manual
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1.2.1. HF-LPS170 Pins Definition
Figure 3. HF-LPS170 Pins Map
Table2. HF-LPS170 Pins Definition
Pin
Description
Net Name
Signal Type
Comments
1, 3, 20,
31, 33，
36
Ground
GND
Power
2
RF_O
Analog
Antenna Signal
5
GPIO_8
IPD
3.3V Voltage
default 10K pull-down, Boot Select:
Low: boot from internal flash.
High: boot from external UART or
SDIO, firmware can be programmed
into internal flash via UART.
Due to internal 10K pull-down, add 1K
pull-up resistor if need set to High.

HF-LPS170 Wi-Fi&BLE User Manual
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Pin
Description
Net Name
Signal Type
Comments
6
BT_HOST_WAK
E_DEV
I/O
3.3V Voltage
GPIO12
SPI, I2C, PWM, ADC
7
BT_DEV_WAKE
_HOST
I/O
3.3V Voltage
GPIO11
SPI, I2C, PWM, ADC
8
Module
Reset
EXT_RESET
I,PU
3.3V Voltage
“Low” effective reset input. There is RC
reset circuit internally. No need of
external RC reset circuit.
9
+3.3V Power
VDD
Power
12
WL_DIS#
I/O
VDDIO Voltage (1.8V/3.3V)
GPIO21
SPI, I2C, PWM
13
WL_DEV_WAKE
_HOST
I/O
VDDIO Voltage (1.8V/3.3V)
GPIO20
SPI, I2C, PWM
14
SD_D2
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO DATA2, GPIO4
15
SD_D3
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO DATA3, GPIO5
16
SD_CMD
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO CMD, GPIO1
17
SD_CLK
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO CLK, GPIO0
18
SD_D0
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO DATA0, GPIO2
19
SD_D1
I/O
VDDIO Voltage (1.8V/3.3V)
SDIO DATA1, GPIO3
22
IO Power
VDDIO
Power
3.3V or 1.8V Power Input
24
32L_IN
Analog
32.768K clock in, leave it open if not
use
34
BT_DIS#
I/O
VDDIO Voltage (1.8V/3.3V)
GPIO22
SPI, I2C, PWM
41
UART_RTS
UART_RTS
I/O
VDDIO Voltage (1.8V/3.3V)
GPIO17
SPI, I2C, PWM
42
UART_TX
UART_TX
I/O
VDDDIO Voltage (1.8V/3.3V) UART
Communication Output
GPIO16
43
UART_RX
UART_RX
I/O
3.3V UART Communication Input
GPIO7
44
UART_CTS
UART_CTS
I/O
3.3V Voltage
GPIO14
SPI, I2C, PWM, ADC, DAC
Note:
VDDIO：Some IO use this IO voltage, if input 1.8V, then these IO all use 1.8V voltage.
NC：means no connection. it is unconnected and useless.

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UART_TX, UART_RX and GPIO_8 is also used for firmware download, must connect these three pins
out. If VDDIO is 1.8V input, then UART_TX is 1.8V TTL, UART_RX is 3.3V TTL, GPIO8 is 3.3V TTL.
If GPIO_8 default low, module boot from internal Flash, VDDIO must input 3.3V, otherwise, module
will fail to bootup. Wi-Fi and BLE driver firmware need to programmed into module, see driver for more
detail.
If GPIO_8 set to High(3.3V), module boot from external, module only support Wi-Fi function and no
power save function.
1.2.2. Electrical Characteristics
Table3. Electrical Characteristics
Parameter
Condition
Min.
Typ.
Max.
Unit
Work temperature range
-40
85
°C
VDD
2.6
3.3
3.6
V
VDDIO
2.6/1.62
3.3/1.8
3.6/1.98
V
Maximum soldering temperature
IPC/JEDEC J-STD-020
260
°C
ESD (Human Body Model HBM)
TAMB=25°C
2.5
KV
ESD (MM)
TAMB=25°C
0.25
KV

HF-LPS170 Wi-Fi&BLE User Manual
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1.2.3. HF-LPS170 Mechanical Size
HF-LPS170 modules physical size （Unit: mm）as follows:
Figure 4. HF-LPS170 Mechanical Dimension
1.2.4. External Antenna
HF-LPS170 module supports external antenna(PAD) option for user dedicated application.
If user select external antenna, HF-LPS170 Wi-Fi modules must be connected to the 2.4G antenna
according to IEEE 802.11b/g/n standards. We can provide external antenna if needed. Contact with
our salesman.
The antenna parameters required as follows:
Table4. External Antenna Parameters
Item
Parameters
Frequency range
2.4~2.5GHz
Impedance
50 Ohm
VSWR
2 (Max)
Return Loss
-10dB (Max)
Antenna Type
Dipole antenna
Maximum Gain
3.0dBi

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Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
MODULE HINT :
1.The module is limited to OEM installation only.
2.The module is limited to installation in mobile or fixed application.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.

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FCC Radiation Exposure Statement:
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and
it also complies with Part 15 of the FCC RF Rules.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna,
3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for
2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the
end-user regarding to Regulatory Domain change.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization is no longer considered valid and the
FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
End Product Labelling
The final end product must be labelled in a visible area with the following:
“Contains FCC ID: 2ACSVHF-LPS170”.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module.

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APPENDIX A: CONTACT INFORMATION
------------------------------------------------------------------------------------------------------------
Address: Room 1002,Building 1,No.3000,Longdong Avenue,Pudong New
Area,Shanghai,China,201203
Web: www.hi-flying.com
Service Online: 400-189-3108/18616078755
Sales Contact: [e-mail]
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For more information about High-Flying modules, applications, and solutions, please visit our web site
http://www.hi-flying.com/en/
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